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Leading Semiconductor IDM Company in Russia
Corporate Presentation
Mikron in brief
Founded in 1964, as “Research Institute for Molecular Electronics” and manufacturing facility “Mikron”
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 2
Mikron plant under construction , circa 1964
Mikron today
Today Mikron group of companies consolidates experience and know-how of 7 business units: leading scientific research institutions and high-tech enterprises
R&D and design 1) Research Institute for Molecular Electronics 2) Research Institute for Precise
Mechanical Engineering 3) Sitronics Microdesign
Corporate structure of Mikron Group of companies
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 3
JSFC SISTEMA, listed on:
RTI JSC
Mikron Group of companies
Front-end 1) Mikron JSC 2) Voronezh Manufacturing Facility
Back-end 1) Sitronics Smart Technologies 2) Assembly Fab (Shenzhen)
Sales and distribution: regional representations 1) Denver, USA 2) Munich, Germany 3) Hong Kong 4) Shanghai 5) Taipei
Industry leader
Largest semiconductor company in Russia and the CIS by revenue and production volume
• 500+ IC items and discretes in the product portfolio
• 30+ new products added annually
• Russia’s principal SIM-card supplier for all leading cellular operators
• Russia’s leading RFID tag and inlay manufacturer
• East Europe’s largest semiconductor vendor by export volume: up to 50 million ICs exported monthly (≈ 10% of revenues come from export)
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 4
Facts and figures
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 5
Moscow
Voronezh Munich
Denver
Hong Kong
Shenzhen
Shanghai
Taipei
• Headquarters: Zelenograd, Moscow (Russia)
• Manufacturing facilities: Zelenograd, Voronezh, Shenzhen (assembling fab)
• Sales offices: Denver (USA), Munich (Germany), Hong Kong, Taipei, Shanghai
• Revenue 2013: $314 million
• 21% of the Russian market*
• Among top 10 European IDM companies by revenue
Team:
3000 employees in the group of companies
1700 employees at Mikron * Of the total Russian microelectronics market in relevant market segments
Technology partners
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 6
• Market leader in payment, secure communication and identity management products and solutions
– Technology transfer and joint venture in creating the manufacturing facility for smart-cards (bank and identity) and SIM-cards in Zelenograd (now Sitronics Smart Technologies)
• One of the global top 10 semiconductor vendors by sales volume
– Technology transfer for launch of the 180 and 90 nm production lines at Mikron manufacturing facilities
• World leader in protecting, verifying and managing digital identities and interactions
– Collaboration in SIM-cards manufacturing
• Semiconductors vendor for automotive and industrial electronics and chip card and security applications
– Collaboration for RFID-tags and inlays manufacturing, as well as for smart-cards (bank and identity)
Certificates & associations
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 7
• International certifications: Quality Management, Environmental Management, Energy Management
• Member of: Global Semiconductor Association, Silicon Trust Alliance, Semi, OSPT Alliance, GS1 Russia, Stanford Center for Integrated Systems
• Product certification by EMVCo (with Visa and MasterCard as members), and by Russian, as well as internationally authorized government agencies and industry organizations
Customers
All Russia’s top cellular carriers
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 8
400+ customers in Russia
+ 100 abroad
Leading banks, including:
Transport companies, including:
Governmental bodies and agencies:
Main export directions: Southeast Asia (China, Taiwan, Hong Kong), Europe, USA
Main export products: AC-DC & DC-DC converters, LED drivers, analog ICs, DA/AD converters, voltage regulators, interface ICs, operational amplifiers, ASICs, RFID inlays.
OEMs, electronic components distributors, system integrators and design houses
Main product groups
• Microprocessors for cards and ID documents
– 300+ million SIM-cards produced
– 400, 000 ICs for Universal Electronic Card (UEC – Russian ID-card) produced
– 3+ million ICs for new biometric passport produced
– 15+ million bank cards manufactured yearly
• RFID tags, inlays and cards
– 50 million tags and inlays manufactured monthly
– 400+ million transport cards manufactured yearly
– 3+ billion transport cards produced
• Power management & power electronics ICs, discretes and ICs for harsh environments (aerospace, nuclear power generation industry)
– 400, 000 ICs manufactured monthly
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 9
Research & development
• 15% of revenues are invested in R&D
• 40 R&D projects in progress for 91 new products
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 10
• Designing and testing ICs and discrete semiconductor devices
• Process development: CMOS, HV CMOS, Bipolar, Planar, HV Planar, BCD, Trench MOS, EEPROM, Flash memory
• Development of semiconductor structures
• CAD tools mastering and development
• Processing and extraction of data for photo-masking
• IP and libraries development, SPICE extraction, layout optimization
• RFID test lab
• Development of specialized product software:
– Embedded software for smart-card microcontrollers
– Operation system of LSIC for ID documents / SIM-cards
– Universal OS
Research areas
R&D of the low cost chip for HF RFID tag
Smallest passive NVM HF RFID chip on the market (MIK64PTASX)
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 11
Developed IP blocks libraries enable HF chip modification within 3-6 months (including production of testing samples)
NFC chip ID MIK64PTASX MIK64PTAS (MIK640D)
MIK1KMCM MIK1K5PTAC MIK1312ED MIK203ND MIK213ND MIK216ND
NVM (EEPROM) 640 bit 640 bit 8192 bit 1536 bit 1312 bit 1792 bit 1792 bit 8192 bit
Cryptography None None Proprietary 3DES Password Password Password Password
Input cap, pF 16,9 16,9 16,9 16,9 16,9 16,9 50 50
ISO certificate In progress + (2012) + (2012) + (2013) + (2014) In progress In progress ---
Chip area 0.19 mm2 0.32 mm2 0.35 mm2 0.38 mm2 0.23 mm2 0.23 mm2 0.27 mm2 0.34 mm2
Status Market ready
Mass production
Mass production
Mass production
Mass production
Market ready
Mass production
Under development
Patent Patent pending
Patent pending
Patent pending
Patent pending
• Tag specification development for specific tasks and materials such as glass, plastic, wood, etc., as well as for general purposes; technology, materials, shape, dimensions, etc.
• Tag and antenna development for HF and UHF tags in various applications
• Certified development software (CST Studio Suite, Ansoft HFSS, AWR Design Environment)
• Testing via usage environment simulation
• Best of class measuring and testing equipment (Agilent, Micropross, Voyantic, R&S)
• Broad experience in product design using a wide range of crystals: • HF: NXP – Mifare Ultralight, ICode, Mifare 1K, NTag (NFC);
Infenion – Mydmove;
• UHF: Impinj Monza 3/4/5, NXP UCODE G2XL, G2iL, 7;
• Full RFID production cycle for additional security and fast time-to-market
Mikron RFID lab: consulting & development
Over 100 different RFID products have already been developed by Mikron to save customers development expenses and verification time
12 www.mikron-semi.com |+7 (495) 229 72 99 |[email protected]
Full cycle manufacturer
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected]
Mikron’s expertise and top of the line manufacturing facilities allow the company to be in control of the entire IC and smart-card production cycle
Front end production (wafers)
Back end production (ICs, smart-cards)
Supply IC design
System design, applications
13
Manufacturing facilities
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 14
Front end production • 8” line in Zelenograd (Moscow, Russia)
CMOS with embedded NVM 180 and 90nm for smart-card ICs, RFID and logic
• 6” line in Zelenograd Bipolar for power management ICs
• 6” line in Voronezh (Russia) Planar for Schottky diodes and power management ICs
• 4” line in Voronezh Planar for TVS diodes and fast recovery diodes
Back end production • Shenzhen (China)
Assembling facilities for power management ICs and discrete semiconductor devices
• Zelenograd (Russia) RFID assembly & personalization for plastic and paper chip cards and tags
Voronezh
Zelenograd
Manufacturing statistics
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 15
30 000
Wafers manufactured monthly:
16 000 3 000 4” 6” 8”
Supported topology:
3-0,25 µm 180 nm 90 nm 65 nm
≈ 90 000 microcontrollers
for transport cards (180 nm)
8”
Wafer capacity:
8” Fab. Technologies
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected]
Technology Base technology Voltage, V (core / I/O)
#Me Options Design rules and libraries IP
HCMOS8D CMOS 0.18 µm
HCMOS8D_6M_3.3V 3,3 / 3,3 6 HIPO, MIM PDK, Stdcells, I/O, RAM compiler (single port), ROM compiler
+
HCMOS8D_6M_5V 1,8/5 / 3,3 6 HIPO, MIM, OTP
PDK, Stdcells, I/O, RAM compiler (single port), ROM compiler
+
HCMOS8D_6M_36V* 1,8/36 6 HIPO, MIM PDK
CMOSF8 CMOS + EPROM 0.18 µm
CMOSF8_4M_5V 1,8 / 5 4 EEPROM PDK, Stdcells, I/O, RAM compiler (single port), ROM compiler
+
CMOSF8_6M_5V 1,8 / 5 6 HIPO, MIM, EEPROM
PDK, Stdcells, I/O, RAM compiler (single port), ROM compiler
+
HCMOS10_LP CMOS 90 nm
HCMOS10_LP_7M_2.5V
1,2 / 2,5 7 Cu + 1Al
Thick Me, MIM
PDK, Stdcells, I/O, RAM compiler (single port, dual port), ROM compiler
+
CMOS 65* nm cmos065 1,2 / 2.5 8 Cu + 1Al
PDK, Stdcells, I/O
16
* Available Q4 2014
8” Fab. Products
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected]
CMOS + EEPROM (5 Ме; 0,18 µm)
• RFID products (transport tickets, etc.)
• ICs for smart-cards (ID documents)
• Microcontrollers and specialized VLSIs with low power consumption
CMOS (base) (6 Ме; 0,18 µm)
• High performance universal microcontrollers and microprocessors
• Memory VLSIs, GLONASS navigation and digital TV VLSIs
• High performance DA/AD converters, etc.
CMOS (base) (7 Ме 90 nm )
• High performance universal microcontrollers and microprocessors
• Memory VLSIs, GLONASS navigation and digital TV VLSIs
• High performance FPGAs, etc.
BiCMOS (SiGe)
• SHF ICs up to 5 GHz
• APA
• Communication
• GLONASS receivers and digital TV
17
6” Fab. Technologies and products
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected]
Technology Voltage, V #Me Products
Bipolar, 2 µm Trench - option
10V, 20V, 30V, 45V, 60V
1/2 DC-DC / AC-DC converters; voltage regulators; comparators and operational amplifiers; reference voltage sources; voltage and current control; rad-hard ICs
CMOS, 1.6-2 µm 7V, 15V, 30V 1 Me, 1 polySi LDOs, AC-DC converters, mixed signal ICs
HV-CMOS (ВСD) 700V 1 Me, 1 polySi LED-drivers
Planar: Pt (IF: 1A - 100A); Mo (IF: 3A - 60A); Cr (IF: 0.5A - 30A); Ti (IF: 1A)
Pt (Vrrm: 45V - 250V) Mo Vrrm: 30V - 60V) Cr (Vrrm: 15V - 40V) Ti (Vrrm: 8V - 20V)
Schottky diodes, RC filters, TVS diodes and arrays, EMI filters, fast recovery diodes
Planar HV 400V - 1800V 2500V - 6500V*
Ultra fast recovery Schottky diodes, IGBTs
BCD 40V DC-DC converters
Thin film resistors RCDL arrays, resistors, reactors, inductance diodes
Trench MOS* Trench Schottky diodes, trench MOSFET, trench IGBTs
18
* in development
Product portfolio
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 19
Microprocessors for smart-cards
Power management ICs
RFID tags, inlays and cards
ICs for harsh environments
Standard: ISO 18000 (F=856 MHz); ISO15693 (F=13.56 MHz); ISO 14443 (F=13.56 MHz)
Applications • Retail
• Logistics
• Mail delivery
• Pharmaceutical
• SCM
• Transportation
Power electronics • Fast Recovery diodes
• Schottky diodes
• LC-EMI / RS-EMI filters
• TVS
• ESD
Standard: ISO14443 (F=13.56 MHz)
Applications: • Biometric passport
• Citizen cards
• Bank cards
• SIM cards with e-signature
• Social cards, etc.
Discrete semiconductor devices
Power management • DC-DC / AC-DC converters
• Voltage regulators (LDO, standard)
• Pulse-width-modulation controllers
• Comparators and operational amplifiers
• LED drivers
Aerospace , nuclear power generation industry • Memory
• Logic, etc.
RFID products: microprocessors
• MIK51SC72D
• MIK51AB72D
• MIK640D (K5016XC1H4)
• MIK1312M1ED
• MIK1K5PTAC
• MIK203ND / MIK213ND
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 20
• Dual interface (contact ISO 7816, contactless ISO 14443A, B); ROM 384 Kb; RAM 8 Kb; EEPROM 72 Kb; Java Card 3.0.4 Classic Edition, M/Chip 4, MoC Technology; DES, 3DES, AES, RSA, EC-DSA, Russian GOST 28147; 34-11; Р34.10-2001
• Currently in use in Russian Universal Electronic Card (UEC – Russian ID-card)
• Contactless interface (ISO 14443В ); ROM 160 Kb; RAM 6 Kb; EEPROM 72 Kb; DES, 3DES, AES, RSA, EC-DSA, Russian GOST 28147; Р34.10-2001; 34-11
• Currently in use in Russian biometric foreign pass
• Contactless interface ISO/IEC 14443A; EEPROM 640 bits,
• Applications: single trip tickets for public transport systems; event ticketing, access control systems
• Contactless interface ISO/IEC 14443A; EEPROM 1312 bits; 32-byte digital signature
• Applications: single trip tickets for public transport systems; event ticketing, access control systems
• Contactless interface ISO/IEC 14443A; EEPROM 1536 bits; 3DES
• Applications: single trip tickets for public transport systems; event ticketing, access control systems
• Contactless interface ISO/IEC 14443A; EEPROM 1792 bits;
• Applications: NFC tags
Microprocessors for smart-cards: ID documents
• For banking smart-cards, multi-purpose national cards, ID cards, protected identification systems, access systems
• Dual interface: contact ISO 7816, contactless ISO 14443A/B
• ROM 384 Kbyte; RAM 8 Kbyte; EEPROM 72 Kbyte; Java Card 3.0.4 Classic Edition, M/Chip 4, MoC technology
• Both international and Russian crypto standards supported (DES, 3DES, AES-128, AES-256, RSA up to 2048-bit, EC-DSA, GOST 28147; 34-11; Р34.10-2001)
• Electronic digital signature support
• EMVco & MasterCard certified
21
MIK51SC72D: dual interface one-chip microprocessor with cryptography support
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected]
Already used in Russian universal
electronic citizen card
22
Already used in Russian biometric
foreign pass
Microprocessors for smart-cards: ID documents (2)
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected]
MIK51AB72D: one-chip microprocessor with cryptography support and contactless interface
• Contactless interface (ISO 14443В)
• 160 Kbyte ROM, 6 Kbyte RAM, 72 Kbyte EEPROM
• Cryptography: both international and Russian crypto standards can be supported (DES, 3DES, AES, RSA, EC-DSA, GOST 28147, GOST Р34.10-2001, GOST 34-11) according to customer requirements
• Certified by authorized Russian agencies for data protection
Dual interface security cryptocontroller
based on partner chip
• Interfaces: contact ISO 7816, contactless ISO 14443 A/В, Mifare
compatible
• 404 Kbyte solid Flash, 8 Kbyte RAM
• Dual 16-bit CPU
• Cryptography: both international and Russian crypto standards (DES,
3DES, AES up to 256-bit; RSA up to 4096-bit, ECC up to 521-bit, etc.)
can be supported according to customer requirements
• CC EAL6+ and EMVCo certified
• Original OS
23
Availability: Q4 2014
Applications • National eID
• ePassport
• eHealth Card
• eDriver License
• eResidence Permit
• eSignature
Microprocessors for smart-cards: ID documents (3)
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected]
24
Availability: Q4 2014
Microprocessor for SIM-cards
• 32-bit RISC-based CPU (KM32) with hardware program memory protection and user-data protection against unauthorized access
• User memory: flash, 64 Kbyte with hardware data integrity support
• Program memory: flash, 32 Kbyte
• SRAM: 10 Kbyte (2560x32)
• Interface: ISO 7816 type T0 & T1
• Cryptography: both international and Russian crypto standards can be supported (DES, 3DES, GOST) according to customer requirements
• Electronic digital signature support
• Original OS
Microprocessors for smart-cards: SIM-cards
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected]
Dual interface one-chip microprocessor with cryptography support
• Dual interface: contact ISO 7816, contactless ISO 14443A/B
• ROM 384 Kbyte; RAM 8 Kbyte; EEPROM 72 Kb
• Java Card 3.0.4 Classic Edition, M/Chip 4, MoC Technology
• Cryptography: both international and Russian crypto standards can be supported (DES, 3DES, AES-128, AES-256, RSA up to 2048-bit, EC-DSA, GOST 28147; 34-11; Р34.10-2001) according to customer requirements
• Electronic digital signature support
• MasterCard and EMVco certified
25
Availability: now
Microprocessors for smart-cards: bank cards
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected]
Security cryptocontroller based on partner chip
• Interface: contact ISO 7816
• 156 Kbyte solid Flash, 6 Kbyte RAM
• 16-bit CPU
• Cryptography: both international and Russian crypto standards (DES,
3DES, AES up to 256-bit; RSA up to 4096-bit, ECC up to 521-bit, etc.)
can be supported according to customer requirements
• Typical applications: EMV DDA, EMV CDA, Global Platform / Java,
Loyalty, ePurse
• CC EAL5+ and EMVCo certified
26
Availability: Q4 2014
Applications • Contact bank cards
• Loyalty cards
• eHealth Card
• eDriver License
• eResidence Permit
Microprocessors for smart-cards: bank cards (2)
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected]
Dual interface security cryptocontroller based on partner chip • Interface: contact ISO 7816, contactless 14443 A/B, Mifare compatible
• 240 Kbyte solid Flash, 6 Kbyte RAM
• 16-bit CPU
• Cryptography: both international and Russian crypto standards (DES,
3DES, AES up to 256-bit; RSA up to 4096-bit, ECC up to 521-bit, etc.)
can be supported according to customer requirements
• Typical applications: EMV DDA, EMV CDA, Global Platform / Java,
Loyalty, ePurse
• CC EAL5+ and EMVCo certified
27
Availability: Q4 2014
Applications • Contactless bank cards
• eHealth Card
• eDriver License
• eResidence Permit
• eSocial Card
Microprocessors for smart-cards: bank cards (3)
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected]
Dual interface cryptocontroller MIK32DA512
28
Availability: Q2 2015
Cryptocontroller MIK32CA512
• Interface: contact ISO 7816, Type T0 & T1
• Cryptography: both international and Russian standards (DES, 3DES, AES-128, AES-256; RSA up to 4096 bit, GOST) can be supported according to customer requirements
• Electronic digital signature support
• Flash memory 512 Kbyte
• Embedded protection algorythms for EMVco certification
• Original OS
• Interface: contact ISO 7816 (Type T0 & T1), contactless ISO 14443A
• Cryptography: both international and Russian standards (DES, 3DES, AES-128, AES-256; RSA up to 4096 bit, GOST) can be supported according to customer requirements
• Crypto accelerator
• Electronic digital signature support
• Flash memory 512 Kbyte
• Embedded protection algorythms for EMVco certification
• Original OS
Microprocessors for smart-cards: bank cards (4)
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected]
CIPURSE support
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 29
Several CIPURSE-compliant products under development:
• Application-rich smart-card based on partner-chip and/or own MIK32DA512 product
• Regular RFID card (single-trip tickets, event tickets): test samples available Q3 2015
Mikron also offers development of chip operation system according to specific customer requirements, embedding of Mikron-developed or any other OS at any production stage, as well as packaging services
RFID tags and inlays
General specifications
• Supported standards: HF RFID ISO 14443, 15693; UHF RFID EPC Class1 Gen2; NFC 14443A,B
• Frequencies: HF RFID 13.56 MHz; UHF RFID 860-960 MHz; NFC 13.56 MHz
• Packaging: dry/wet inlays, PET and paper cards and tags, adhesive tags, tamper proof labels
• Delivered in rolls or cut
• Operating temperatures: inlays and cards: -25° …. +70°C; adhesive labels: -20° …. +80°C; tags: -40° …. +85°C
• Antenna material: aluminum
• Testing: 100% UID
• ESD: +/- 2KV
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 30
UHF RFID tags and inlays
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 31
• Read range: 11.5 m
• Antenna size: 50х50 mm
• 2 chip options: EPC Class1 Gen2/Monza 4D (Impinj) or EPC Class1 Gen2/Monza 4QT (Impinj)
• Supplied as: dry / wet inlays or adhesive labels
• Read range: 9-11.5 m
• Antenna size: 95х10.5 mm
• 4 chip options: EPC Class1 Gen2/G2XL (NXP), EPC Class1 Gen2/G2iL (NXP), EPC Class1 Gen2/G2xM (NXP), EPC Class1 Gen2/G2iM (NXP)
• Supplied as: dry / wet inlays or adhesive labels
M-3D
M-FLAT
M-BOX • Read range: 11 m
• Antenna size: 50х44 mm
• 2 chip options: EPC Class1 Gen2/G2iL (NXP), EPC Class1 Gen2/G2iM (NXP)
• Supplied as: dry / wet inlays or adhesive labels
UHF RFID tags and inlays (2)
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 32
• Read range: 2/4 m
• Antenna size: 34.0x14.0 mm
• 2 chip options: EPC Class1 Gen2/G2iL (NXP), EPC Class1 Gen2/G2iM (NXP)
• Supplied as: dry / wet inlays or adhesive labels
• Read range: 0.5 m
• Antenna size: 17.0x14.0 mm
• 3 chip options: EPC Class1 Gen2/G2iL (NXP), EPC Class1 Gen2/G2iM (NXP), EPC Class1 Gen2/UCODE7 (NXP)
• Supplied as: dry / wet inlays or adhesive labels
MINI-UHF
NEAR-UHF
FSTORE-ID • Read range: 12 / 14 m
• Antenna size: 19.0x94.0 mm
• 2 chip options: EPC Class1 Gen2/G2iL (NXP), EPC Class1 Gen2/UCODE7 (NXP)
• Supplied as: dry / wet inlays or adhesive labels
HF RFID tags and inlays
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 33
• Read range: 0.7-1.5 m
• Antenna size: 45.0x76.0 mm
• 6 chip options (Mikron own chip, NXP, Infineon) with memory from 512 to 1536 bit
• Supplied as: dry / wet inlays, smart-cards or adhesive labels
• Read range: 0.7-1.5 m
• Antenna size: 45.0x45.0 mm
• 6 chip options (Mikron own chip, NXP, Infineon) with memory from 512 to 1536 bit
• Supplied as: dry / wet inlays, smart-cards or adhesive labels
M-PASS
M-BOOK
MINI-ID • Read range: ≤0.03m
• Antenna size: 34.0x14.8mm
• 5 chip options (Mikron own chip, NXP, Infineon) with memory from 512 to 1536 bit
• Supplied as: dry / wet inlays or adhesive labels
0
NFC RFID tags and inlays
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 34
• Read range: ≤0.06m
• Antenna size: 45.0x76.0 mm
• Standard / chip: ISO 14443/NXP NTAG203 (NT2H0301G0DUD)
• Supplied as: dry / wet inlays or adhesive labels
• Read range: ≤0.03m
• Antenna size: 34.0x14.8 mm
• Standard / chip: ISO 14443/NXP NTAG203 (NT2H0301G0DUD)
• Supplied as: dry / wet inlays or adhesive labels
NFC-PASS
NFC-MINI
NFC-BOOK • Read range: ≤0.06m
• Antenna size: 45.0x45.0 mm
• Standard / chip: ISO 14443/NXP NTAG203 (NT2H0301G0DUD)
• Supplied as: dry / wet inlays or adhesive labels
NFC-ROUND • Read range: ≤0.10m
• Diameter: 45.0±0.2 mm
• Standard / chip: ISO 14443/NXP NTAG203 (NT2H0301G0DUD)
• Supplied as: dry / wet inlays or adhesive labels
Tamper proof UHF labels
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 35
М2040/151 Р
• Antenna technology: conducting ink printing
• Dimension: 34.0x14.0 mm
• Read range: 4 meters
• Frequency: 860-960 MHz
• EPC - 128 bit
• TID - 64 bit
• Access password – 32 bit
• Kill password - 32 bit
• Antenna technology: laser-beam cutting of the aluminum leaf
• Dimension: 19.0x94.0 mm
• Read range: 14 meters
• Frequency: 860-960 MHz
• EPC - 128 bit
• TID - 96 bit
• Access password – 32 bit
• Kill password - 32 bit
М2498/186 Р
Both labels have successfully passed verification testing at Mikron RFID-lab
Breakable labels on paper substrate for integrity control
Case study: RFID tickets for Moscow underground
Moscow Metro is one of the largest underground systems in the world
• Began operations in 1935
• 12 lines, 190 stations, 317 km of rail network
• 2.4 billion passengers yearly
• Around 7 million passengers daily
www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 36
• In 2008 all Moscow Metro tickets were replaced with RFID-based smart-cards
• Since that time Mikron has remained the official supplier of RFID tickets for the Moscow Metro
• In 2013 a new generation of contactless tickets (Troyka card) was rolled out – one of the biggest transport card applications in Europe
• During the project productive collaboration with the official system integrator of the Moscow underground was established
• Mikron produces up to 32 mln. contactless tickets for Moscow Metro per month
Troyka tickets are plastic contactless smart-cards for fare payment
Mikron chip for transport cards; 180 nm, chip size 0,6x.0,6 cm
Power management ICs
• DC-DC converters
• Voltage regulators
– Positive voltage regulators
– Adjustable positive voltage regulators
– Adjustable precise shunt regulators
– Negative voltage regulators
– LDOs
• Pulse-width modulation controllers
• LED drivers (AC-DC / DC-DC)
• Current and voltage controllers
• Comparators and operational amplifiers
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• 100+ IC types
• Available both packaged and as a wafer
Power management portfolio
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Product group Part numbers Output voltage, Vout, V
Output current, Iout, A
Positive voltage regulators 78xx, 78xxn.d.4, 78Lxx, 78Lxxn.d., 78Lxxn.d.3,
78Mxxn.d.3 3-27 0,1 - 1,5
Negative voltage regulators 79xx, 79xxn.d., 79Lxxn.d., 79Lxx, 79Mxx 5-27 0,1 - 1,5
Positive adjustable voltage regulators LM317n.d., LM317L 1.2 - 37.0 0,1 - 1,5
Adjustable precision shunt and reset regulators AS431D+, 431M, 431DMK, SC431LM, XC61C-xx 1.2 - 36 0.001 - 0.1
Low dropout voltage regulators
MIC5213-xx, 2951M1K-xx, LP2950M-xx, MIC5205-xx,
XC62FPK-xx, TC1108MK-xx, AME8801-xx, 9007-xx, L48-
xx, AME8805-xx, S1117MMK-xx, AMS1117S-XX,
MIC2940-xx, MIC39100M-xx, 1086M1K-xx,
MIC2915xMK-xx, 1085M1K-xx, 39300MK-xx,
AMS1084MMK-xx, AMS1084M-xx, MIC39500M-xx
0.9 - 15, Adj. 0.08 - 5
DC-DC converters 2576M1K-xx, 2576M3K-xx, 2C76K, 2C76M1K, 2HV76-xx,
3HV76-xx, 3TL76K, 2596M4K-xx, CS5171, 34063CM3K,
34063M3K, 34063n.d.2
3.3 – 40, Adj.
1.2, 1.5, 2, 3
Power management portfolio (2)
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Product group Part numbers Vio, mV: Vcc, V
Operational amplifiers LM324M, LM324n.d., 324M2K LM358M, LM358n.d.3,
358M4K, 4558M4K, OP07C, AP430X 0.015 - 7
5 – 30
Audio power amplifiers LM386M 4-12
Comparators LM339M, LM339n.d.2, 339MK, LM393M, 393MK 5 5-30
Product group Part numbers Vst, V Vmin, V D (max), %
Pulse-width modulation controllers 3842-BW2K 3843-BW2K 3844-BW2K 3845-BW2K
16 8.4 16 8.4
10 7.6 10 7.6
97 97 48 48
Discrete semiconductor devices
• Fast recovery diodes
• Schottky diodes (Pt Barrier, Mo Barrier, Cr Barrier, Ti Barrier)
• LS and RS EMI filters
• TVS diodes and arrays
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• Large Schottky diodes portfolio with leading technical characteristics
• Available both packaged and as a wafer
Discretes portfolio
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Barrier IF, A VR, V IRMAX@TJ= 25OC, mA VFMAX@TJ= 25OC, V TJMAX, OC
PtSi 1 – 100 45 - 250 0.003 - 0.025 0.6 - 0.9 +175
PtNi* 3 – 10 100 - 250 0.003 - 0.005 0.75 - 0.78 +175
NiSi 1 – 40 20 - 60 0.04 - 0.45 0.41 – 0.68 +150
Mo 1-60 15-60 0.03 - 0.50 0.40 – 0.66 +150
Cr 0,5 – 20 15 - 40 0.4 - 12.0 0.29 – 0.38 +125
Ti 1 - 60 8 - 20 2.0 - 80 0,25 – 0.31 +100
Schottky diodes
Fast recovery diodes
*PtNi Barrier Schottky Diodes under new technology: Low IR, Reduced VF
VR, V IF, A IRMAX @TJ= 25OC, mA VFMAX @TJ= 25OC, V TJMAX, OC Trr MAX, ns
400 100 0.05 1.3 +150 70
600 5, 8, 10, 15, 25, 50 0.01 1.3 - 1.5 +150 50 - 70
1200 10, 25, 50, 75, 100, 150 0.10 1.7 – 2.3 +150 40 - 65
1800 50, 100 0.10 2.4 +150 500
2000 75 0.10 2.4 +150 500
2500 50, 100 0.10 2.4 +150 500
3300 75 0.10 2.6 +150 600
4500 75 0.10 2.6 +150 900
TVS and ESD protection
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Item TVS diodes and arrays
Low CJ TVS diodes and arrays
RC-EMI Filters
LC- EMI Filters
Uni-directional / Bi-directional +/+ +/+ +/- +/-
Rated operating voltage, V. 2,8 ÷ 24,0 2,8 ÷ 12,0 5,0 5,0
Max. peak power at tp = 8/20uS, W 25 ÷ 500 25 ÷ 2500 - -
Max. peak current at tp = 8/20uS, A 2,5 ÷ 24 2,5 ÷ 95 - -
Quantity of protected communication lines 1 ÷ 5 1 ÷ 4 2 ÷ 8 4 ÷ 6
Total input capacitance, pF 4 ÷ 300 0,3 ÷ 25 20 ÷ 160 23,5
Rating value of resistor resistance, ohm - - 10 ÷ 200 -
Rating value of inducting, nH - - - 17
Rating ESD, IEC61000-4-2, level 4, contact, kV 8 ÷ 30 8 ÷ 30 8 ÷ 12 15
Max. junction temperature, ºC 150 125 ÷ 150 85 ÷ 125 125
Mikron services
Development of new designs for ICs, application specific ICs and discrete semiconductor devices IC design
Probe testing equipment for wafers and reliability testing equipment for packaged devices Testing
Full cycle RFID tag and antenna development, from design to mass production. Prototypes developed within 6-8 weeks
RFID prototyping, antenna design
Mikron production lines can be used for mass manufacturing of IC designs developed by independent design houses. 8’, 6’ and 4’ wafer lines available.
Foundry services
Contract packaging services of ICs and discrete semiconductor devices Packaging
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Thank you!
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Headquarters 12/1, 1-y Zapadny Proezd, Zelenograd, Moscow, 124460, Russia
Tel: +7 495 229 7286; Email: [email protected]
www.mikron.ru | www.mikron-semi.com | www.mikron-rfid.com
Germany Mikron GmbH Arnpeckstr.9, 81545 Munich +49 8106 35 16 46
Taiwan 5F-B., No.16, Lane 345, Yang-guang St., Taipei, 11491 +886 2 8752 6698
Shanghai 4F, Zi Jin Han Place Building 6, 1035, North Nan Quanroad Pudong, Shanghai +86 1522 130 2009
Hong Kong Room 1014, 10/F, Manhattan Centre, 8 Kwai Cheong Road, Kwai Chung, Hong Kong +86 1522 130 2009
USA Mikron America, Inc. Denver CO USA +1 303 524 1199
Russia VSPP Mikron Leninsky prospekt 119а, 394033 Voronezh, Russia +7 473 223 1109