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Leading Semiconductor IDM Company in Russia Corporate Presentation

Mikron corporate presentation

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Page 1: Mikron corporate presentation

Leading Semiconductor IDM Company in Russia

Corporate Presentation

Page 2: Mikron corporate presentation

Mikron in brief

Founded in 1964, as “Research Institute for Molecular Electronics” and manufacturing facility “Mikron”

www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 2

Mikron plant under construction , circa 1964

Mikron today

Today Mikron group of companies consolidates experience and know-how of 7 business units: leading scientific research institutions and high-tech enterprises

Page 3: Mikron corporate presentation

R&D and design 1) Research Institute for Molecular Electronics 2) Research Institute for Precise

Mechanical Engineering 3) Sitronics Microdesign

Corporate structure of Mikron Group of companies

www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 3

JSFC SISTEMA, listed on:

RTI JSC

Mikron Group of companies

Front-end 1) Mikron JSC 2) Voronezh Manufacturing Facility

Back-end 1) Sitronics Smart Technologies 2) Assembly Fab (Shenzhen)

Sales and distribution: regional representations 1) Denver, USA 2) Munich, Germany 3) Hong Kong 4) Shanghai 5) Taipei

Page 4: Mikron corporate presentation

Industry leader

Largest semiconductor company in Russia and the CIS by revenue and production volume

• 500+ IC items and discretes in the product portfolio

• 30+ new products added annually

• Russia’s principal SIM-card supplier for all leading cellular operators

• Russia’s leading RFID tag and inlay manufacturer

• East Europe’s largest semiconductor vendor by export volume: up to 50 million ICs exported monthly (≈ 10% of revenues come from export)

www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 4

Page 5: Mikron corporate presentation

Facts and figures

www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 5

Moscow

Voronezh Munich

Denver

Hong Kong

Shenzhen

Shanghai

Taipei

• Headquarters: Zelenograd, Moscow (Russia)

• Manufacturing facilities: Zelenograd, Voronezh, Shenzhen (assembling fab)

• Sales offices: Denver (USA), Munich (Germany), Hong Kong, Taipei, Shanghai

• Revenue 2013: $314 million

• 21% of the Russian market*

• Among top 10 European IDM companies by revenue

Team:

3000 employees in the group of companies

1700 employees at Mikron * Of the total Russian microelectronics market in relevant market segments

Page 6: Mikron corporate presentation

Technology partners

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• Market leader in payment, secure communication and identity management products and solutions

– Technology transfer and joint venture in creating the manufacturing facility for smart-cards (bank and identity) and SIM-cards in Zelenograd (now Sitronics Smart Technologies)

• One of the global top 10 semiconductor vendors by sales volume

– Technology transfer for launch of the 180 and 90 nm production lines at Mikron manufacturing facilities

• World leader in protecting, verifying and managing digital identities and interactions

– Collaboration in SIM-cards manufacturing

• Semiconductors vendor for automotive and industrial electronics and chip card and security applications

– Collaboration for RFID-tags and inlays manufacturing, as well as for smart-cards (bank and identity)

Page 7: Mikron corporate presentation

Certificates & associations

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• International certifications: Quality Management, Environmental Management, Energy Management

• Member of: Global Semiconductor Association, Silicon Trust Alliance, Semi, OSPT Alliance, GS1 Russia, Stanford Center for Integrated Systems

• Product certification by EMVCo (with Visa and MasterCard as members), and by Russian, as well as internationally authorized government agencies and industry organizations

Page 8: Mikron corporate presentation

Customers

All Russia’s top cellular carriers

www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 8

400+ customers in Russia

+ 100 abroad

Leading banks, including:

Transport companies, including:

Governmental bodies and agencies:

Main export directions: Southeast Asia (China, Taiwan, Hong Kong), Europe, USA

Main export products: AC-DC & DC-DC converters, LED drivers, analog ICs, DA/AD converters, voltage regulators, interface ICs, operational amplifiers, ASICs, RFID inlays.

OEMs, electronic components distributors, system integrators and design houses

Page 9: Mikron corporate presentation

Main product groups

• Microprocessors for cards and ID documents

– 300+ million SIM-cards produced

– 400, 000 ICs for Universal Electronic Card (UEC – Russian ID-card) produced

– 3+ million ICs for new biometric passport produced

– 15+ million bank cards manufactured yearly

• RFID tags, inlays and cards

– 50 million tags and inlays manufactured monthly

– 400+ million transport cards manufactured yearly

– 3+ billion transport cards produced

• Power management & power electronics ICs, discretes and ICs for harsh environments (aerospace, nuclear power generation industry)

– 400, 000 ICs manufactured monthly

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Page 10: Mikron corporate presentation

Research & development

• 15% of revenues are invested in R&D

• 40 R&D projects in progress for 91 new products

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• Designing and testing ICs and discrete semiconductor devices

• Process development: CMOS, HV CMOS, Bipolar, Planar, HV Planar, BCD, Trench MOS, EEPROM, Flash memory

• Development of semiconductor structures

• CAD tools mastering and development

• Processing and extraction of data for photo-masking

• IP and libraries development, SPICE extraction, layout optimization

• RFID test lab

• Development of specialized product software:

– Embedded software for smart-card microcontrollers

– Operation system of LSIC for ID documents / SIM-cards

– Universal OS

Research areas

Page 11: Mikron corporate presentation

R&D of the low cost chip for HF RFID tag

Smallest passive NVM HF RFID chip on the market (MIK64PTASX)

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Developed IP blocks libraries enable HF chip modification within 3-6 months (including production of testing samples)

NFC chip ID MIK64PTASX MIK64PTAS (MIK640D)

MIK1KMCM MIK1K5PTAC MIK1312ED MIK203ND MIK213ND MIK216ND

NVM (EEPROM) 640 bit 640 bit 8192 bit 1536 bit 1312 bit 1792 bit 1792 bit 8192 bit

Cryptography None None Proprietary 3DES Password Password Password Password

Input cap, pF 16,9 16,9 16,9 16,9 16,9 16,9 50 50

ISO certificate In progress + (2012) + (2012) + (2013) + (2014) In progress In progress ---

Chip area 0.19 mm2 0.32 mm2 0.35 mm2 0.38 mm2 0.23 mm2 0.23 mm2 0.27 mm2 0.34 mm2

Status Market ready

Mass production

Mass production

Mass production

Mass production

Market ready

Mass production

Under development

Patent Patent pending

Patent pending

Patent pending

Patent pending

Page 12: Mikron corporate presentation

• Tag specification development for specific tasks and materials such as glass, plastic, wood, etc., as well as for general purposes; technology, materials, shape, dimensions, etc.

• Tag and antenna development for HF and UHF tags in various applications

• Certified development software (CST Studio Suite, Ansoft HFSS, AWR Design Environment)

• Testing via usage environment simulation

• Best of class measuring and testing equipment (Agilent, Micropross, Voyantic, R&S)

• Broad experience in product design using a wide range of crystals: • HF: NXP – Mifare Ultralight, ICode, Mifare 1K, NTag (NFC);

Infenion – Mydmove;

• UHF: Impinj Monza 3/4/5, NXP UCODE G2XL, G2iL, 7;

• Full RFID production cycle for additional security and fast time-to-market

Mikron RFID lab: consulting & development

Over 100 different RFID products have already been developed by Mikron to save customers development expenses and verification time

12 www.mikron-semi.com |+7 (495) 229 72 99 |[email protected]

Page 13: Mikron corporate presentation

Full cycle manufacturer

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Mikron’s expertise and top of the line manufacturing facilities allow the company to be in control of the entire IC and smart-card production cycle

Front end production (wafers)

Back end production (ICs, smart-cards)

Supply IC design

System design, applications

13

Page 14: Mikron corporate presentation

Manufacturing facilities

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Front end production • 8” line in Zelenograd (Moscow, Russia)

CMOS with embedded NVM 180 and 90nm for smart-card ICs, RFID and logic

• 6” line in Zelenograd Bipolar for power management ICs

• 6” line in Voronezh (Russia) Planar for Schottky diodes and power management ICs

• 4” line in Voronezh Planar for TVS diodes and fast recovery diodes

Back end production • Shenzhen (China)

Assembling facilities for power management ICs and discrete semiconductor devices

• Zelenograd (Russia) RFID assembly & personalization for plastic and paper chip cards and tags

Voronezh

Zelenograd

Page 15: Mikron corporate presentation

Manufacturing statistics

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30 000

Wafers manufactured monthly:

16 000 3 000 4” 6” 8”

Supported topology:

3-0,25 µm 180 nm 90 nm 65 nm

≈ 90 000 microcontrollers

for transport cards (180 nm)

8”

Wafer capacity:

Page 16: Mikron corporate presentation

8” Fab. Technologies

www.mikron-semi.com |+7 (495) 229 72 99 |[email protected]

Technology Base technology Voltage, V (core / I/O)

#Me Options Design rules and libraries IP

HCMOS8D CMOS 0.18 µm

HCMOS8D_6M_3.3V 3,3 / 3,3 6 HIPO, MIM PDK, Stdcells, I/O, RAM compiler (single port), ROM compiler

+

HCMOS8D_6M_5V 1,8/5 / 3,3 6 HIPO, MIM, OTP

PDK, Stdcells, I/O, RAM compiler (single port), ROM compiler

+

HCMOS8D_6M_36V* 1,8/36 6 HIPO, MIM PDK

CMOSF8 CMOS + EPROM 0.18 µm

CMOSF8_4M_5V 1,8 / 5 4 EEPROM PDK, Stdcells, I/O, RAM compiler (single port), ROM compiler

+

CMOSF8_6M_5V 1,8 / 5 6 HIPO, MIM, EEPROM

PDK, Stdcells, I/O, RAM compiler (single port), ROM compiler

+

HCMOS10_LP CMOS 90 nm

HCMOS10_LP_7M_2.5V

1,2 / 2,5 7 Cu + 1Al

Thick Me, MIM

PDK, Stdcells, I/O, RAM compiler (single port, dual port), ROM compiler

+

CMOS 65* nm cmos065 1,2 / 2.5 8 Cu + 1Al

PDK, Stdcells, I/O

16

* Available Q4 2014

Page 17: Mikron corporate presentation

8” Fab. Products

www.mikron-semi.com |+7 (495) 229 72 99 |[email protected]

CMOS + EEPROM (5 Ме; 0,18 µm)

• RFID products (transport tickets, etc.)

• ICs for smart-cards (ID documents)

• Microcontrollers and specialized VLSIs with low power consumption

CMOS (base) (6 Ме; 0,18 µm)

• High performance universal microcontrollers and microprocessors

• Memory VLSIs, GLONASS navigation and digital TV VLSIs

• High performance DA/AD converters, etc.

CMOS (base) (7 Ме 90 nm )

• High performance universal microcontrollers and microprocessors

• Memory VLSIs, GLONASS navigation and digital TV VLSIs

• High performance FPGAs, etc.

BiCMOS (SiGe)

• SHF ICs up to 5 GHz

• APA

• Communication

• GLONASS receivers and digital TV

17

Page 18: Mikron corporate presentation

6” Fab. Technologies and products

www.mikron-semi.com |+7 (495) 229 72 99 |[email protected]

Technology Voltage, V #Me Products

Bipolar, 2 µm Trench - option

10V, 20V, 30V, 45V, 60V

1/2 DC-DC / AC-DC converters; voltage regulators; comparators and operational amplifiers; reference voltage sources; voltage and current control; rad-hard ICs

CMOS, 1.6-2 µm 7V, 15V, 30V 1 Me, 1 polySi LDOs, AC-DC converters, mixed signal ICs

HV-CMOS (ВСD) 700V 1 Me, 1 polySi LED-drivers

Planar: Pt (IF: 1A - 100A); Mo (IF: 3A - 60A); Cr (IF: 0.5A - 30A); Ti (IF: 1A)

Pt (Vrrm: 45V - 250V) Mo Vrrm: 30V - 60V) Cr (Vrrm: 15V - 40V) Ti (Vrrm: 8V - 20V)

Schottky diodes, RC filters, TVS diodes and arrays, EMI filters, fast recovery diodes

Planar HV 400V - 1800V 2500V - 6500V*

Ultra fast recovery Schottky diodes, IGBTs

BCD 40V DC-DC converters

Thin film resistors RCDL arrays, resistors, reactors, inductance diodes

Trench MOS* Trench Schottky diodes, trench MOSFET, trench IGBTs

18

* in development

Page 19: Mikron corporate presentation

Product portfolio

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Microprocessors for smart-cards

Power management ICs

RFID tags, inlays and cards

ICs for harsh environments

Standard: ISO 18000 (F=856 MHz); ISO15693 (F=13.56 MHz); ISO 14443 (F=13.56 MHz)

Applications • Retail

• Logistics

• Mail delivery

• Pharmaceutical

• SCM

• Transportation

Power electronics • Fast Recovery diodes

• Schottky diodes

• LC-EMI / RS-EMI filters

• TVS

• ESD

Standard: ISO14443 (F=13.56 MHz)

Applications: • Biometric passport

• Citizen cards

• Bank cards

• SIM cards with e-signature

• Social cards, etc.

Discrete semiconductor devices

Power management • DC-DC / AC-DC converters

• Voltage regulators (LDO, standard)

• Pulse-width-modulation controllers

• Comparators and operational amplifiers

• LED drivers

Aerospace , nuclear power generation industry • Memory

• Logic, etc.

Page 20: Mikron corporate presentation

RFID products: microprocessors

• MIK51SC72D

• MIK51AB72D

• MIK640D (K5016XC1H4)

• MIK1312M1ED

• MIK1K5PTAC

• MIK203ND / MIK213ND

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• Dual interface (contact ISO 7816, contactless ISO 14443A, B); ROM 384 Kb; RAM 8 Kb; EEPROM 72 Kb; Java Card 3.0.4 Classic Edition, M/Chip 4, MoC Technology; DES, 3DES, AES, RSA, EC-DSA, Russian GOST 28147; 34-11; Р34.10-2001

• Currently in use in Russian Universal Electronic Card (UEC – Russian ID-card)

• Contactless interface (ISO 14443В ); ROM 160 Kb; RAM 6 Kb; EEPROM 72 Kb; DES, 3DES, AES, RSA, EC-DSA, Russian GOST 28147; Р34.10-2001; 34-11

• Currently in use in Russian biometric foreign pass

• Contactless interface ISO/IEC 14443A; EEPROM 640 bits,

• Applications: single trip tickets for public transport systems; event ticketing, access control systems

• Contactless interface ISO/IEC 14443A; EEPROM 1312 bits; 32-byte digital signature

• Applications: single trip tickets for public transport systems; event ticketing, access control systems

• Contactless interface ISO/IEC 14443A; EEPROM 1536 bits; 3DES

• Applications: single trip tickets for public transport systems; event ticketing, access control systems

• Contactless interface ISO/IEC 14443A; EEPROM 1792 bits;

• Applications: NFC tags

Page 21: Mikron corporate presentation

Microprocessors for smart-cards: ID documents

• For banking smart-cards, multi-purpose national cards, ID cards, protected identification systems, access systems

• Dual interface: contact ISO 7816, contactless ISO 14443A/B

• ROM 384 Kbyte; RAM 8 Kbyte; EEPROM 72 Kbyte; Java Card 3.0.4 Classic Edition, M/Chip 4, MoC technology

• Both international and Russian crypto standards supported (DES, 3DES, AES-128, AES-256, RSA up to 2048-bit, EC-DSA, GOST 28147; 34-11; Р34.10-2001)

• Electronic digital signature support

• EMVco & MasterCard certified

21

MIK51SC72D: dual interface one-chip microprocessor with cryptography support

www.mikron-semi.com |+7 (495) 229 72 99 |[email protected]

Already used in Russian universal

electronic citizen card

Page 22: Mikron corporate presentation

22

Already used in Russian biometric

foreign pass

Microprocessors for smart-cards: ID documents (2)

www.mikron-semi.com |+7 (495) 229 72 99 |[email protected]

MIK51AB72D: one-chip microprocessor with cryptography support and contactless interface

• Contactless interface (ISO 14443В)

• 160 Kbyte ROM, 6 Kbyte RAM, 72 Kbyte EEPROM

• Cryptography: both international and Russian crypto standards can be supported (DES, 3DES, AES, RSA, EC-DSA, GOST 28147, GOST Р34.10-2001, GOST 34-11) according to customer requirements

• Certified by authorized Russian agencies for data protection

Page 23: Mikron corporate presentation

Dual interface security cryptocontroller

based on partner chip

• Interfaces: contact ISO 7816, contactless ISO 14443 A/В, Mifare

compatible

• 404 Kbyte solid Flash, 8 Kbyte RAM

• Dual 16-bit CPU

• Cryptography: both international and Russian crypto standards (DES,

3DES, AES up to 256-bit; RSA up to 4096-bit, ECC up to 521-bit, etc.)

can be supported according to customer requirements

• CC EAL6+ and EMVCo certified

• Original OS

23

Availability: Q4 2014

Applications • National eID

• ePassport

• eHealth Card

• eDriver License

• eResidence Permit

• eSignature

Microprocessors for smart-cards: ID documents (3)

www.mikron-semi.com |+7 (495) 229 72 99 |[email protected]

Page 24: Mikron corporate presentation

24

Availability: Q4 2014

Microprocessor for SIM-cards

• 32-bit RISC-based CPU (KM32) with hardware program memory protection and user-data protection against unauthorized access

• User memory: flash, 64 Kbyte with hardware data integrity support

• Program memory: flash, 32 Kbyte

• SRAM: 10 Kbyte (2560x32)

• Interface: ISO 7816 type T0 & T1

• Cryptography: both international and Russian crypto standards can be supported (DES, 3DES, GOST) according to customer requirements

• Electronic digital signature support

• Original OS

Microprocessors for smart-cards: SIM-cards

www.mikron-semi.com |+7 (495) 229 72 99 |[email protected]

Page 25: Mikron corporate presentation

Dual interface one-chip microprocessor with cryptography support

• Dual interface: contact ISO 7816, contactless ISO 14443A/B

• ROM 384 Kbyte; RAM 8 Kbyte; EEPROM 72 Kb

• Java Card 3.0.4 Classic Edition, M/Chip 4, MoC Technology

• Cryptography: both international and Russian crypto standards can be supported (DES, 3DES, AES-128, AES-256, RSA up to 2048-bit, EC-DSA, GOST 28147; 34-11; Р34.10-2001) according to customer requirements

• Electronic digital signature support

• MasterCard and EMVco certified

25

Availability: now

Microprocessors for smart-cards: bank cards

www.mikron-semi.com |+7 (495) 229 72 99 |[email protected]

Page 26: Mikron corporate presentation

Security cryptocontroller based on partner chip

• Interface: contact ISO 7816

• 156 Kbyte solid Flash, 6 Kbyte RAM

• 16-bit CPU

• Cryptography: both international and Russian crypto standards (DES,

3DES, AES up to 256-bit; RSA up to 4096-bit, ECC up to 521-bit, etc.)

can be supported according to customer requirements

• Typical applications: EMV DDA, EMV CDA, Global Platform / Java,

Loyalty, ePurse

• CC EAL5+ and EMVCo certified

26

Availability: Q4 2014

Applications • Contact bank cards

• Loyalty cards

• eHealth Card

• eDriver License

• eResidence Permit

Microprocessors for smart-cards: bank cards (2)

www.mikron-semi.com |+7 (495) 229 72 99 |[email protected]

Page 27: Mikron corporate presentation

Dual interface security cryptocontroller based on partner chip • Interface: contact ISO 7816, contactless 14443 A/B, Mifare compatible

• 240 Kbyte solid Flash, 6 Kbyte RAM

• 16-bit CPU

• Cryptography: both international and Russian crypto standards (DES,

3DES, AES up to 256-bit; RSA up to 4096-bit, ECC up to 521-bit, etc.)

can be supported according to customer requirements

• Typical applications: EMV DDA, EMV CDA, Global Platform / Java,

Loyalty, ePurse

• CC EAL5+ and EMVCo certified

27

Availability: Q4 2014

Applications • Contactless bank cards

• eHealth Card

• eDriver License

• eResidence Permit

• eSocial Card

Microprocessors for smart-cards: bank cards (3)

www.mikron-semi.com |+7 (495) 229 72 99 |[email protected]

Page 28: Mikron corporate presentation

Dual interface cryptocontroller MIK32DA512

28

Availability: Q2 2015

Cryptocontroller MIK32CA512

• Interface: contact ISO 7816, Type T0 & T1

• Cryptography: both international and Russian standards (DES, 3DES, AES-128, AES-256; RSA up to 4096 bit, GOST) can be supported according to customer requirements

• Electronic digital signature support

• Flash memory 512 Kbyte

• Embedded protection algorythms for EMVco certification

• Original OS

• Interface: contact ISO 7816 (Type T0 & T1), contactless ISO 14443A

• Cryptography: both international and Russian standards (DES, 3DES, AES-128, AES-256; RSA up to 4096 bit, GOST) can be supported according to customer requirements

• Crypto accelerator

• Electronic digital signature support

• Flash memory 512 Kbyte

• Embedded protection algorythms for EMVco certification

• Original OS

Microprocessors for smart-cards: bank cards (4)

www.mikron-semi.com |+7 (495) 229 72 99 |[email protected]

Page 29: Mikron corporate presentation

CIPURSE support

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Several CIPURSE-compliant products under development:

• Application-rich smart-card based on partner-chip and/or own MIK32DA512 product

• Regular RFID card (single-trip tickets, event tickets): test samples available Q3 2015

Mikron also offers development of chip operation system according to specific customer requirements, embedding of Mikron-developed or any other OS at any production stage, as well as packaging services

Page 30: Mikron corporate presentation

RFID tags and inlays

General specifications

• Supported standards: HF RFID ISO 14443, 15693; UHF RFID EPC Class1 Gen2; NFC 14443A,B

• Frequencies: HF RFID 13.56 MHz; UHF RFID 860-960 MHz; NFC 13.56 MHz

• Packaging: dry/wet inlays, PET and paper cards and tags, adhesive tags, tamper proof labels

• Delivered in rolls or cut

• Operating temperatures: inlays and cards: -25° …. +70°C; adhesive labels: -20° …. +80°C; tags: -40° …. +85°C

• Antenna material: aluminum

• Testing: 100% UID

• ESD: +/- 2KV

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Page 31: Mikron corporate presentation

UHF RFID tags and inlays

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• Read range: 11.5 m

• Antenna size: 50х50 mm

• 2 chip options: EPC Class1 Gen2/Monza 4D (Impinj) or EPC Class1 Gen2/Monza 4QT (Impinj)

• Supplied as: dry / wet inlays or adhesive labels

• Read range: 9-11.5 m

• Antenna size: 95х10.5 mm

• 4 chip options: EPC Class1 Gen2/G2XL (NXP), EPC Class1 Gen2/G2iL (NXP), EPC Class1 Gen2/G2xM (NXP), EPC Class1 Gen2/G2iM (NXP)

• Supplied as: dry / wet inlays or adhesive labels

M-3D

M-FLAT

M-BOX • Read range: 11 m

• Antenna size: 50х44 mm

• 2 chip options: EPC Class1 Gen2/G2iL (NXP), EPC Class1 Gen2/G2iM (NXP)

• Supplied as: dry / wet inlays or adhesive labels

Page 32: Mikron corporate presentation

UHF RFID tags and inlays (2)

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• Read range: 2/4 m

• Antenna size: 34.0x14.0 mm

• 2 chip options: EPC Class1 Gen2/G2iL (NXP), EPC Class1 Gen2/G2iM (NXP)

• Supplied as: dry / wet inlays or adhesive labels

• Read range: 0.5 m

• Antenna size: 17.0x14.0 mm

• 3 chip options: EPC Class1 Gen2/G2iL (NXP), EPC Class1 Gen2/G2iM (NXP), EPC Class1 Gen2/UCODE7 (NXP)

• Supplied as: dry / wet inlays or adhesive labels

MINI-UHF

NEAR-UHF

FSTORE-ID • Read range: 12 / 14 m

• Antenna size: 19.0x94.0 mm

• 2 chip options: EPC Class1 Gen2/G2iL (NXP), EPC Class1 Gen2/UCODE7 (NXP)

• Supplied as: dry / wet inlays or adhesive labels

Page 33: Mikron corporate presentation

HF RFID tags and inlays

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• Read range: 0.7-1.5 m

• Antenna size: 45.0x76.0 mm

• 6 chip options (Mikron own chip, NXP, Infineon) with memory from 512 to 1536 bit

• Supplied as: dry / wet inlays, smart-cards or adhesive labels

• Read range: 0.7-1.5 m

• Antenna size: 45.0x45.0 mm

• 6 chip options (Mikron own chip, NXP, Infineon) with memory from 512 to 1536 bit

• Supplied as: dry / wet inlays, smart-cards or adhesive labels

M-PASS

M-BOOK

MINI-ID • Read range: ≤0.03m

• Antenna size: 34.0x14.8mm

• 5 chip options (Mikron own chip, NXP, Infineon) with memory from 512 to 1536 bit

• Supplied as: dry / wet inlays or adhesive labels

0

Page 34: Mikron corporate presentation

NFC RFID tags and inlays

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• Read range: ≤0.06m

• Antenna size: 45.0x76.0 mm

• Standard / chip: ISO 14443/NXP NTAG203 (NT2H0301G0DUD)

• Supplied as: dry / wet inlays or adhesive labels

• Read range: ≤0.03m

• Antenna size: 34.0x14.8 mm

• Standard / chip: ISO 14443/NXP NTAG203 (NT2H0301G0DUD)

• Supplied as: dry / wet inlays or adhesive labels

NFC-PASS

NFC-MINI

NFC-BOOK • Read range: ≤0.06m

• Antenna size: 45.0x45.0 mm

• Standard / chip: ISO 14443/NXP NTAG203 (NT2H0301G0DUD)

• Supplied as: dry / wet inlays or adhesive labels

NFC-ROUND • Read range: ≤0.10m

• Diameter: 45.0±0.2 mm

• Standard / chip: ISO 14443/NXP NTAG203 (NT2H0301G0DUD)

• Supplied as: dry / wet inlays or adhesive labels

Page 35: Mikron corporate presentation

Tamper proof UHF labels

www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 35

М2040/151 Р

• Antenna technology: conducting ink printing

• Dimension: 34.0x14.0 mm

• Read range: 4 meters

• Frequency: 860-960 MHz

• EPC - 128 bit

• TID - 64 bit

• Access password – 32 bit

• Kill password - 32 bit

• Antenna technology: laser-beam cutting of the aluminum leaf

• Dimension: 19.0x94.0 mm

• Read range: 14 meters

• Frequency: 860-960 MHz

• EPC - 128 bit

• TID - 96 bit

• Access password – 32 bit

• Kill password - 32 bit

М2498/186 Р

Both labels have successfully passed verification testing at Mikron RFID-lab

Breakable labels on paper substrate for integrity control

Page 36: Mikron corporate presentation

Case study: RFID tickets for Moscow underground

Moscow Metro is one of the largest underground systems in the world

• Began operations in 1935

• 12 lines, 190 stations, 317 km of rail network

• 2.4 billion passengers yearly

• Around 7 million passengers daily

www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 36

• In 2008 all Moscow Metro tickets were replaced with RFID-based smart-cards

• Since that time Mikron has remained the official supplier of RFID tickets for the Moscow Metro

• In 2013 a new generation of contactless tickets (Troyka card) was rolled out – one of the biggest transport card applications in Europe

• During the project productive collaboration with the official system integrator of the Moscow underground was established

• Mikron produces up to 32 mln. contactless tickets for Moscow Metro per month

Troyka tickets are plastic contactless smart-cards for fare payment

Mikron chip for transport cards; 180 nm, chip size 0,6x.0,6 cm

Page 37: Mikron corporate presentation

Power management ICs

• DC-DC converters

• Voltage regulators

– Positive voltage regulators

– Adjustable positive voltage regulators

– Adjustable precise shunt regulators

– Negative voltage regulators

– LDOs

• Pulse-width modulation controllers

• LED drivers (AC-DC / DC-DC)

• Current and voltage controllers

• Comparators and operational amplifiers

www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 37

• 100+ IC types

• Available both packaged and as a wafer

Page 38: Mikron corporate presentation

Power management portfolio

www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 38

Product group Part numbers Output voltage, Vout, V

Output current, Iout, A

Positive voltage regulators 78xx, 78xxn.d.4, 78Lxx, 78Lxxn.d., 78Lxxn.d.3,

78Mxxn.d.3 3-27 0,1 - 1,5

Negative voltage regulators 79xx, 79xxn.d., 79Lxxn.d., 79Lxx, 79Mxx 5-27 0,1 - 1,5

Positive adjustable voltage regulators LM317n.d., LM317L 1.2 - 37.0 0,1 - 1,5

Adjustable precision shunt and reset regulators AS431D+, 431M, 431DMK, SC431LM, XC61C-xx 1.2 - 36 0.001 - 0.1

Low dropout voltage regulators

MIC5213-xx, 2951M1K-xx, LP2950M-xx, MIC5205-xx,

XC62FPK-xx, TC1108MK-xx, AME8801-xx, 9007-xx, L48-

xx, AME8805-xx, S1117MMK-xx, AMS1117S-XX,

MIC2940-xx, MIC39100M-xx, 1086M1K-xx,

MIC2915xMK-xx, 1085M1K-xx, 39300MK-xx,

AMS1084MMK-xx, AMS1084M-xx, MIC39500M-xx

0.9 - 15, Adj. 0.08 - 5

DC-DC converters 2576M1K-xx, 2576M3K-xx, 2C76K, 2C76M1K, 2HV76-xx,

3HV76-xx, 3TL76K, 2596M4K-xx, CS5171, 34063CM3K,

34063M3K, 34063n.d.2

3.3 – 40, Adj.

1.2, 1.5, 2, 3

Page 39: Mikron corporate presentation

Power management portfolio (2)

www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 39

Product group Part numbers Vio, mV: Vcc, V

Operational amplifiers LM324M, LM324n.d., 324M2K LM358M, LM358n.d.3,

358M4K, 4558M4K, OP07C, AP430X 0.015 - 7

5 – 30

Audio power amplifiers LM386M 4-12

Comparators LM339M, LM339n.d.2, 339MK, LM393M, 393MK 5 5-30

Product group Part numbers Vst, V Vmin, V D (max), %

Pulse-width modulation controllers 3842-BW2K 3843-BW2K 3844-BW2K 3845-BW2K

16 8.4 16 8.4

10 7.6 10 7.6

97 97 48 48

Page 40: Mikron corporate presentation

Discrete semiconductor devices

• Fast recovery diodes

• Schottky diodes (Pt Barrier, Mo Barrier, Cr Barrier, Ti Barrier)

• LS and RS EMI filters

• TVS diodes and arrays

www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 40

• Large Schottky diodes portfolio with leading technical characteristics

• Available both packaged and as a wafer

Page 41: Mikron corporate presentation

Discretes portfolio

www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 41

Barrier IF, A VR, V IRMAX@TJ= 25OC, mA VFMAX@TJ= 25OC, V TJMAX, OC

PtSi 1 – 100 45 - 250 0.003 - 0.025 0.6 - 0.9 +175

PtNi* 3 – 10 100 - 250 0.003 - 0.005 0.75 - 0.78 +175

NiSi 1 – 40 20 - 60 0.04 - 0.45 0.41 – 0.68 +150

Mo 1-60 15-60 0.03 - 0.50 0.40 – 0.66 +150

Cr 0,5 – 20 15 - 40 0.4 - 12.0 0.29 – 0.38 +125

Ti 1 - 60 8 - 20 2.0 - 80 0,25 – 0.31 +100

Schottky diodes

Fast recovery diodes

*PtNi Barrier Schottky Diodes under new technology: Low IR, Reduced VF

VR, V IF, A IRMAX @TJ= 25OC, mA VFMAX @TJ= 25OC, V TJMAX, OC Trr MAX, ns

400 100 0.05 1.3 +150 70

600 5, 8, 10, 15, 25, 50 0.01 1.3 - 1.5 +150 50 - 70

1200 10, 25, 50, 75, 100, 150 0.10 1.7 – 2.3 +150 40 - 65

1800 50, 100 0.10 2.4 +150 500

2000 75 0.10 2.4 +150 500

2500 50, 100 0.10 2.4 +150 500

3300 75 0.10 2.6 +150 600

4500 75 0.10 2.6 +150 900

Page 42: Mikron corporate presentation

TVS and ESD protection

www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 42

Item TVS diodes and arrays

Low CJ TVS diodes and arrays

RC-EMI Filters

LC- EMI Filters

Uni-directional / Bi-directional +/+ +/+ +/- +/-

Rated operating voltage, V. 2,8 ÷ 24,0 2,8 ÷ 12,0 5,0 5,0

Max. peak power at tp = 8/20uS, W 25 ÷ 500 25 ÷ 2500 - -

Max. peak current at tp = 8/20uS, A 2,5 ÷ 24 2,5 ÷ 95 - -

Quantity of protected communication lines 1 ÷ 5 1 ÷ 4 2 ÷ 8 4 ÷ 6

Total input capacitance, pF 4 ÷ 300 0,3 ÷ 25 20 ÷ 160 23,5

Rating value of resistor resistance, ohm - - 10 ÷ 200 -

Rating value of inducting, nH - - - 17

Rating ESD, IEC61000-4-2, level 4, contact, kV 8 ÷ 30 8 ÷ 30 8 ÷ 12 15

Max. junction temperature, ºC 150 125 ÷ 150 85 ÷ 125 125

Page 43: Mikron corporate presentation

Mikron services

Development of new designs for ICs, application specific ICs and discrete semiconductor devices IC design

Probe testing equipment for wafers and reliability testing equipment for packaged devices Testing

Full cycle RFID tag and antenna development, from design to mass production. Prototypes developed within 6-8 weeks

RFID prototyping, antenna design

Mikron production lines can be used for mass manufacturing of IC designs developed by independent design houses. 8’, 6’ and 4’ wafer lines available.

Foundry services

Contract packaging services of ICs and discrete semiconductor devices Packaging

www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 43

Page 44: Mikron corporate presentation

Thank you!

www.mikron-semi.com |+7 (495) 229 72 99 |[email protected] 44

Headquarters 12/1, 1-y Zapadny Proezd, Zelenograd, Moscow, 124460, Russia

Tel: +7 495 229 7286; Email: [email protected]

www.mikron.ru | www.mikron-semi.com | www.mikron-rfid.com

Germany Mikron GmbH Arnpeckstr.9, 81545 Munich +49 8106 35 16 46

Taiwan 5F-B., No.16, Lane 345, Yang-guang St., Taipei, 11491 +886 2 8752 6698

Shanghai 4F, Zi Jin Han Place Building 6, 1035, North Nan Quanroad Pudong, Shanghai +86 1522 130 2009

Hong Kong Room 1014, 10/F, Manhattan Centre, 8 Kwai Cheong Road, Kwai Chung, Hong Kong +86 1522 130 2009

USA Mikron America, Inc. Denver CO USA +1 303 524 1199

Russia VSPP Mikron Leninsky prospekt 119а, 394033 Voronezh, Russia +7 473 223 1109