Technical Data 4083Effective June 2017 Supersedes May 2010

Product features

PS04LTVA1 ESD suppressor

• Low trigger voltage and clamping voltage deliversenhanced ESD protection of very sensitive ICs

• Ultra-low capacitance (0.05pF typ.) ideal for high speeddata applications

• Provides ESD protection with fast response time(<1ns) allowing equipment to pass IEC 61000-4-2 level4 test

• Single line, bidirectional device for placement flexibility• Low profile 0402/1005 design for board space savings• Low leakage current (<0.1nA typ.) reduces power

consumption• RoHS compliant, halogen free and lead free for global

acceptance• Tested to meet automotive specifications (AEC-Q200)

PbHALOGEN

HFFREE

Applications

• Satellite / digital radio• Mobile phones• GSM Modules• HDTV Equipment• A/V Equipment• DMB Modules• Test and measurement

equipment• Portable game systems• Personal media players

Packaging

• 10,000 pieces in paper tape on 7 inch diameter(178mm) reel.

Surface Mount Device

• Security equipment• Broadband network

equipment• Other RF applications• High speed data ports

o USB 2.0/3.0o IEEE 1394o DVIo High speed

ethernet

PS04LTVA1 SpecificationsPerformance Characteristics Value

Rated voltage 5Vdc typical, 12Vdc maximum

Clamping voltage1 25V typical

Trigger voltage2 150V typical

Capacitance @ 1MHz 0.05pF typical, 0.15pF maximum

Attenuation change (0-20GHz) -0.2dB typical

Leakage current @ 12Vdc <0.1nA typical

ESD Capability8kV typical15kV typical

ESD pulse withstand 1

- IEC 61000-4-2 Direct Discharge- IEC 61000-4-2 Air Discharge

>1000 pulses typical

1. Per IEC61000-4-2, Level 4 waveform (8kV direct, 30A) measured 30nS after initiation of pulse.2. Trigger measurement made using Transmission Line Pulse (TLP) method.3. Minor shifting in characteristics may be observed over multiple ESD pulses at very rapid rate.

Device Marking

PS04LTVA1 ESD Suppressors are marked on the tape and reel packages, not individually. Since the product is bi-directional and

symmetrical, no orientation marking is required.

Design Consideration

The location in the circuit for the PS04LTVA has to be carefully determined. For better performance, the device should be placed as close to the signal input as possible and ahead of any other component. Due to the high current associated with an ESD event, it is recommended to use a “0-stub” pad design (pad directly on the signal/data line and second pad directly on common ground).

EatonElectronics Division1000 Eaton BoulevardCleveland, OH 44122United Stateswww.eaton.com/electronics

© 2017 EatonAll Rights Reserved Printed in USA Publication No. 4083 BU-SB10613 June 2017

Eaton is a registered trademark.

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Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.

Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin.

Technical Data 4083Effective June 2017

PS04LTVA1 ESD suppressor

Dimensions - mm (in)

0.40(0.016)

2.20(0.087)

0.70(0.028)

Recommended Pad Layout - mm (in)

Soldering Recommendations• Compatible with lead and lead-free solder reflow processes• Peak reflow temperatures and durations:

- IR Reflow = 260°C max for 10 sec. max- Wave Solder = 260°C max. for 10 sec. max

• Recommended IR Reflow Profile:

Environmental Specifications:• High Temperature Exposure: MIL-STD-202 Method 108• Temperature Cycling: 1000 Air to Air cycles -40°C to +125°C JESD22

Method JA-104• Moisture Resistance Test: MIL-STD-202 Method 106G, 10 cycles• Biased Humidity: MIL-STD-202 Method 103, 1,000hours +85°C, 85%RH• Thermal Shock: MIL-STD-202, Method 107G Air-to-Air -55°C to +125°C,

10 cycles• Vibration Test and Mechanical Shock Test: MIL-STD-202 Method 204 and

Method 213• Resistance to Solvent: MIL-STD-202 Method 215• Operating and Storage Temperature Range: -55°C to +125°C