05 A.Pot Session 1 New Packaging Technology Enabling ... · PDF fileStanyl® ForTii Nkithl bliittifMtidNew packaging technology enabling integration of Magnetics and Semiconductors

Stanyl® ForTiiy

N k i t h l bli i t ti f M ti dNew packaging technology enabling integration of Magnetics and Semiconductors in one component

Abel F. Pot, Dr. Rob R. Janssen, Dr. Tamim P. Sidiki, Dr. Horst Röhm, , , , ,

DSM Engineering Plastics g gAugust, 2010

DSM Engineering Plastics

Content

• World’s smallest SiP• EMI filtering • Miniaturization & integrationatu at o & teg at o• Market Need for new package concept• Global, cross industry collaboration of disciplines• One package integrated solution

P t– Process steps– Design solutions– Package moulding– Stanyl ForTiiy– LDS technology– Plating of fine line LDS structures

C l i• Conclusion


World’s smallest SiP

1.01 mm

Stanyl ForTii offers excellent processing characteristicssuitable also for micro-molding.

42 m

m

suitable also for micro molding. Laser direct structuring gradeprovides designer highest flexibility and new structural

t h SiP MEM

3.77 mm

2.4 concepts such as SiP or MEMs

packages with tough polyamides.

Traditional materials such as

World’s smallest SiP

Traditional materials such as LCPs are limited due to weld line strength and leakage due to delamination.


Miniaturisation & integration

ESD protection scales ith the area of the diodes it cannot follo the scaling of theESD protection scales with the area of the diodes, it cannot follow the scaling of the chip size

An optimised ESD protection would blow up the chip above any acceptable cost limit. CMOS t ti l l i f i 2kV HBM t ll b l 500VCMOS protection levels are moving from previous 2kV HBM to well below 500V

External ESD protection becomes a must !


ESD protection and EMI shielding

It is obvious that high speed digital (hot plug) interfaces like:

- HDMI, ,- USB,- Display port

d b t ESD t ti d EMI hi ldineed robust ESD protection and EMI shielding

OEM’s additionally focus on :

- Total cost reduction- High integration- Reliability (no degradation, low line capacitance, fast diode reaction time)

F ll t h i l li (HDMI USB DP)- Full technical compliance (HDMI, USB, DP)- Miniaturisation


Market need for new package concept

Current solution for a typical external interface in Consumer Electronics is often using two individual components for ESD protection and EMI shielding

OEM’s in electronic industry seek for increased functional integration and reduction of form factor to focus on:

- PCB space - Component count

Traditional integration concepts such as SIP, integrated passives,.. are applied, but do not always offer the flexibility to react fast on design changes A tunable and affordablealways offer the flexibility to react fast on design changes. A tunable and affordable package design which can be quickly adopted to different platform requirements is therefore desired.


Market need for new package concept

Current solution for a typical external interface in Consumer Electronics is often using two individual components for ESD protection and EMI shielding

OEM’s in electronic industry seek for increased functional integration and reduction of form factor to focus on:

– PCB space– Component count

Traditional integration concepts such as SIP, integrated passives,.. are applied, but do not always offer the flexibility to react fast on design changes. A tunable and affordable package design which can be quickly adopted to different platform requirements is therefore desired.


Global, cross industry collaboration of disciplines

In order to generate a new packaging solution integrating ESD protection and EMI shielding four companies have been working closely together:

-NXP : Semiconductor technology-Nano technology Mfg. Pte. Ltd : Micromoulding-Laser Micronics : LaseringE th Pl ti-Enthone : Plating

-DSM : Plastic material and packaging design


One package integrated solution

• Footprint 3.77mm x 2.42 mm x 1.01 mm• Equivalent space reduction on the PCB >75%qu a e t space educt o o t e C 5%


Process steps

The involved manufacturing process steps are:

- Package moulding with Stanyl ForTiiac age ou d g t Sta y o- Selective plating with LDS- Assembling of components


Design solutions

The design demonstrated three new design solutions:

- A spool around a ferrite coil formed between the cover and base

b tt i f P iti f itb tt i f P iti f it

spoo a ou d a e te co o ed bet ee t e co e a d base- Contact / soldering pads with only one side lasering- Mechanical fixation of cover and base

Topview of base part bottomview of cover Position feriteTopview of base part bottomview of cover Position ferite


Design solutions


- A spool around a ferrite coil formed between the cover and basespoo a ou d a e te co o ed bet ee t e co e a d base- Contact / soldering pads with only one side lasering- Mechanical fixation of cover and base


Design solutions


- A spool around a ferrite coil formed between the cover and basespoo a ou d a e te co o ed bet ee t e co e a d base- Contact / soldering pads with only one side lasering- Mechanical fixation of cover and base

Mechanical fixation


Package moulding

The parts are micro-moulded in Stanyl ForTii, at Nano Technology in Singapore. They also designed the tool for it.

St l F Tii i hi h t t l id t i l D t it T f 135 ºCStanyl ForTii is a high temperature polyamide material. Due to its Tg of 135 ºC and Tm of 320 ºC, maintaining it mechanical properties at high temperatures, lead-free reflow soldering is not problem for this material.


Stanyl ForTii

The material requirements for micro-moulding such a package fit for lead free soldering are:

- A high melt temperature- A high Tg- Good reological properties to fill the micro-mould

M i t i i h i l ti t 260 288°C f fl ld i (- Maintaining mechanical properties at 260-288°C for reflow soldering (no distortion of the parts).


LDS technology

Selective metallization of thermoplastic injection molded parts byLaser-Direct-Structuring

Laser processed area:adhesive `anchoring` of plated Cu

Cu

plated Cu

modified polymer


Plating of fine line LDS-structures

3,77 mm

Results of laser and plating trails

2,42 mmtrails



With conventional Two Step Technology:

Process Step Process Type FunctionProcess Step Process - Type FunctionCleaning ENPLATE® LDS

CLEANER 100 / 300Removes laser debris

E - less Copper ENPLATE LDS CU 100

Builds up Copper seed layer

E - less Copper ENPLATE LDS CU 200

Builds up desired Copper thickness200 thickness

Final E-less plating systems (Ni / Au)

ENPLATE LDS … Builds up desired metal system

Advantages

• Excellent InitiationDisadvantages

• Two process steps • Good selectivity

• High plating rate

p p



With new One Step Technology:

Process Step Process - Type FunctionCleaning ENPLATE® LDS

CLEANER 100 / 300Removes laser debris

E-less Copper ENPLATE LDS CU 400

Builds up Copper seed layer and desired Copper thickness in one Step

Final E-less plating systems (Ni / Au)

ENPLATE LDS … Builds up desired metal system

Advantages

• Excellent Initiation

Disadvantages

• None

• Good selectivity

• High plating rate


Conclusion

We have demonstrated the integration of Semi conductor ICs and magnetics in one thermoplastic package, leading to

- Aggressive space reduction on PCB’s- PCB size- Additional functionality

R d t t- Reduce component count- Cost reduction

The enablers are:

- Stanyl ForTii (DSM Engineering plastics)- LDS

Mi ldi- Micro-moulding


Questions


DSM Engineering PlasticsDSM Engineering Plastics

Living Solutions for People, Planet and Profit Page 7

DSM Engineering PlasticsDSM Engineering Plastics

Living Solutions for People, Planet and Profit Page 8

Documents

05 A.Pot Session 1 New Packaging Technology Enabling ... · PDF fileStanyl® ForTii Nkithl bliittifMtidNew packaging technology enabling integration of Magnetics and Semiconductors