1401 Martin Avenue • Santa Clara, CA 95050 • 408.727.1418 www.streamlinecircuits.com

Let us know how we can help your company get your product to market

faster and more efficiently at the best possible quality & price.

Capabilities

Streamline Circuits Standard Advanced Emerging

Conductor Finishes

HASL Yes Yes Yes

Solder with Reflow Yes Yes Yes

White Tin Yes Yes Yes

Carbon Ink (touch pads) Yes Yes Yes

All Body Gold or Selective Yes Yes Yes

Lead Free

Electroless Nickel Yes Yes Yes

Immersion Gold Yes Yes Yes

Immersion Silver Yes Yes Yes

Entek I06A HT Yes Yes Yes

HASL Yes Yes Yes

ENEPIG Yes Yes Yes

Tolerances

Drilled Hole To Copper .008" .005" <.005"

Plated Hole Tolerances [+/-] .003" .002" <.002''

Non Plated Hole Tolerances [+/-] .001" .001" <.001"

Fabrication Tolerances[+/-] .005" .003" <.003"

Via Hole Finish

Laser Micro Vias .004 .002 <.002

Blind I Buried Vias .004 .002 <.002

Via Under Pad Yes Yes Yes

Castellation Yes Yes Yes

Laser Drill .004 .002 <.002

Micro Via Mechanical .0059 .0047 <.0047

Tented LPI Coated With LPI Coated/plugged Coated/plugged

Plugged UV Curable [no solvent]Maximum .020" Yes Yes

Copper Via Fill Yes Yes Yes

Silver Conductive Via Fill Yes Yes Yes

Non-conductive Via Fill Yes Yes Yes

Soldermask and Legend

Minimum Mask Clearance [LPI] .003" .002" <.002"

Minimum Soldermask Thickness 0.0004 0.0004 0.0004

Soldermask Type LPI Dry Film N/A

Soldermask Color Green Any Color N/A

Soldermask Web Minimum .004'" .003"' <.003"

Legend Color White Any Color Any Color

Legend Feature Size .008"Wide X .030" High Min. .006" Wide X .030" High Min. .003" Wide X .020" High Min.

Flatness (Symmetrical construction) IPC Standard IPC Standard IPC Standard

Flatness (Aymmetrical construction) IPC Standard Review required Review required

1 4 01 Martin Avenue • Santa Clara, CA 95050 • 408.727.1 4 1 8 www.streamli necircuits.com

Streamline Circuits is proud to promote that we are always striving to make advanced

technologies at a standard cost for our customers.

Capabilities

Streamline Circuits Standard Advanced Emerging

Layer Count 2 to 36 48+ 60+

Laminate Material

FR4Tg 140 Yes Yes Yes

FR4 Tg 1 70 Yes Yes Yes

Rogers - All High Frequencies Yes Yes Yes

PTFE Double Sided Yes Yes Yes

BT Double Sided Yes Yes Yes

Polyi mide Yes Yes Yes

Duroid Yes Yes Yes

RoHs Materials

Polyclad 370 HR Yes Yes Yes

Isola IS 410 Yes Yes Yes

TUC Yes Yes Yes

Halogen Free Yes Yes Yes

Exotic Material Types 25+ 25+ 25+

Finished Thickness

Finished Thickness (Double sided) .005" to .350" >.350" See Advanced

Finished Thickness (Multilayer) .005" to .220" .220"-.250" Greater than .250"

Minimum Core Thickness .002" .002" .001"

Finished Thickness Tolerance [+/-] 10% 7% 5%

Multiple Laminations 5 9 12+

Copper Foil Weights Internal 1 /4 to 2 oz. 4 to 5 oz. > 5 oz.

Copper Foil Weights External 1/8 to 3 4 to S oz. > 6 oz.

Lines, Spaces & Pad Diameter

Internal Line Width .0035" .002" < .002"

Internal Spacing .0035" .002" < .002"

External Line Width .0035" .002" < .002"

External Spacing .0035" .002" < .002"

Int. Pad Size-AIR Per Side (Fin.-.00 I ) .005" .004" Less than .004"

Ext. Pad Size-AIR Per Side (Fin.-.002) .003" .003" Less than .003"

SMT Pitch .011" .010" Less than .0 I O"

Impedance 10% 5% < 5%

Electroplating

Tin Lead Plating Thickness .0003 - .0005 >.0005 >.0005

Tin Nickel Plating Thickness 1 50 Microinches 250 Microinches >250 Microinches

Low Stress Nickel I 00 Microinches 250 Microinches >250 Microi nches

Gold Plating Thickness 30 Microinches As Specified As Specified

Minimum Drilled Hole Size .0010" .0059" < .0059"

Hole Aspect Ratio 1 0 to 1 1 5 to 1 >20 to 1

PREPRODUCTION ENGINEERING Frontline Genesis 2000 Cam Systems (Multiple Seats) In Plan Automated Rule Based Traveler System (Multiple Seats) Xact Predictive Modeling Software, Full Integration with InCam In Cam Advanced Engineering Cam System (Multiple Seats) InFlex Advanced Engineering Cam System (Multiple Seats) Insight Auto-DFM Analysis Infinite Graphics (Test Preparation Software) GCA (with Repair Stations) Pentalogix Board Test Fixturing & Verification System Multiple Seats) Internet FTP File Transfer Site-Full TI Connection Fully Integrated Quality/Engineering/Floor Tracking System (2) Oce Electrostatic D Size printer scanner Oce Scanner D Size Printer

PHOTO

Nuarc Diazo Fliptop Diazo Imager

DRY FILM IMAGING Clean Room Orbotech 8800 (LDI) Paragon Laser Direct Imaging System (2) Orbotech SM20 (LDI) Paragon Laser Direct Imaging System (1)Nuvago Duel Drawer LDI

McDermid 410 Pre-Clean-Ultra Thin Core CapabilityExpress Duel Drawer LDI

IS Pumiflex Scrub System Teknek Clean Machines (3) Morton Cut-Sheet Laminator 1600D (Inner & Outers) (2) Hakuto Cut-Sheet Laminator Dynachem Vacuum Laminator Dupont Magnum Laminator (2) Dynachem Preheat Transport Vertical Developer Outer Layer Schmid Conveyorized Develop Etch Strip Inner layer Line

LAMINATION OEM Hot Oil lam Press automated 8 Cavity (Hot & Cold) system (4) Environmentally Controlled Prepreg Storage Room Excellon Mark V Flash Router Pluritec Inspecta Plotter Diamond High Resolution Post Lamination X-Ray JJA Spot Facer Layer Drying Oven Walbash Press

DRILL/ROUT Excellon Century 2001 Drills High Velocity Excellon 29 High Speed Micro Drill with Vision and Routing Capablity

Hitachi ND-4L18E High speed Drilling, Vision & Depth Drilling (2) Hitachi ND-5L21E Drill (4) Capacitance & Linear Scale Drilling Network-

Window Based Accu Score Jump Score Barnaby Bevel Master Glennbrook Real time X-Ray (2) Excellon Mark VI Drill Routers (2) Excellon Mark V Drill Router Excellon EX-200 Drill RouterSchmoll LM Series Linear barring drills (2)Excellon Uline Single Spindle Router

PLATING IPS Automated Cuposit/Electroless Copper Line Deep Au/Ni Plate Line (Soft Bondable & Hard Gold) Copper/Tin Plate Line Integrated Processing Systems Au/Ni Immersion Line with ENEPIG Silver immersion Line IS Conveyorized Dryfilm Resist Stripper IS Conveyorized Tin Lead Stripper

SILKSCREEN/SOLDERMASK Orbotech InkJet Automated Legend Printing System Sprint 8

Orbotech Discovery Micro Technology

DP 1500-Automatic Screening System (1) Palomar screening tables (2) Assorted Cure Ovens (3) Vertical Developer Soldermask LPI

IS Pumiflex Scrub System Lunaire Final Cure Ovens (3)

QUALITY ASSURANCE SUPPORT

QPulse Integrated Software Quality Management System Orbotech Fusion 22 AOI Systems (2)

Dyna-Scope Verification System (2) Micro Craft Flying Probe Feather Touch Tester (2) ATG A6 16 Head High Speed Flying Probe Tester (soft Gold) ATG A2 16 Head High Speed Flying Probe Tester (Resistor Test Capability

500V) (4) ATG E6 Eliminator High Speed Scanner head (Mil-spec)

Polar TDR Machine-CITS 500, Embedded Stripline, Microstrip,ATG A7 8 Head High Speed Flying Probe Tester (high voltage 1000 watts) (2)Autoload ATG A7 8 Head High Speed Flying Probe Tester (high voltage 1000 watts)

Zmetrix ST600 TDR System

MicroVu Metrology CMM with XYZ Capability (Fully Automatic)

Oxford CM1900 XRX-XRF Coating Measurement InstrumentOxford X-Strata XRX-XRF Coating Measurement Instrument

Axiovert Metallurgical 600X Microscope with Digital Camera Unico 2800 Uv/Vis Spectrophotometer BioRad Smartspec 3000 Spectrophotometer Perkin Elmer AA Atomic Absorbtion Spectrometer Hi-Pot Tester Stereo Microscopes Calipers, Hole and Plug Gauges, Optical Comparators True Chem Software

HDI (High Density Interconnect) EQUIPMENT ITC Via Plug System (conductive and non-conductive) 100% copper via filling (processing system) - ( 2 lines) Mass SV100 Plannerization System WISE FlatStar, Automated Surface Planarizer CMI PTX200 Eddy Current Copper Thickness Meter (2) ESI 5220 Laser High Speed Drilling/Routing System (4 )

Dyanachem Vacuum Laminator

ENVIRONMENTAL CONTROL Continuous Flow Pollution Control System 4 Closed Loop Water Cooling System Reverse Osmosis Water Recycling System 47 GPM Continuous Flow Ion Exchange 45 GPM Dioninzed Water System (40 GPM)

QUALITY CERTIFICATIONS ISO 9001:2008 Registered Military Mil-PRF-55110 Certified International Traffic in Arms Regulations (ITAR) UL Approved for Lead Free, RoHs and Halogen Free Materials Aerospace AS9100C NADCAP Chemical Processing Medical ISO13485: 2003

REV2017

1401 Martin Avenue • Santa Clara, CA 95050 • 408.727.1418 www.streamlinecircuits.com

IS Conveyorized EtcherIS Deburr with high pressure and ultrasonic micro hole cleaning Entek106A Plus Line HT (Lead Free Process) Pulse Plating Square Wave and Complex Wave Integrated Processings Systems Alternative Oxide Inner Layer AdhesionAdvanced Plasma System 2400 Plasma Etch System

Complete Laboratory Fully Equiped on SiteFull in-house Wet Chemical AnalysisFull Cross-Section Dry LabBuehler Minimet Polishers Dry Lab

1401 Martin Avenue • Santa Clara, CA 95050 • 408.727.1418 www.streamlinecircuits.com

“Our strong executive team, state of the art facility and extensive engineering support provide a comprehensive approach to printed circuit board manufacturing that is unparalleled.”

- Chuck Dimick / CEO and Founder of Streamline Circuits Previously Founder and CEO of Dynamic Details Inc.

Management Team

With over 300 cumulative years of time sensitive PCB experience, our management team knows what it takes to build and sustain a quality facility that can produce the most advanced technology product in the most ef�cient way. Our team’s reputation for advanced technology leadership and superior quality is widely recognized throughout the industry.

Chuck Dimick CEO and Founder

With over years of industry experience, Chuck Dimick has ultimate responsibility for all areas of the company strategy including operations, �nance, product engineering, marketing, and business development. Chuck is the former Chairman and Co-CEO of Dynamic Details Inc. and co-founded the company’s prede- cessor, Dynamic Circuits Inc. DCI was the fastest growing Printed Circuit Board facility of all time, until Stream- line Circuits took the title. He holds a Bachelor of Science in Business Administration from California State University, Chico.

Greg Halvorson President and Founder

Greg Halvorson brings over 34 years of industry experience to Streamline Circuits. As President and Founder of the company, he is responsible for Engineering Support, Quality and Manufacturing Process Control, while driving the long-term company vision. Prior to joining Streamline Circuits, Greg was the former VP of Operations for Dynamic Details Inc., as well as the Senior Vice President of Operations of Dynamic Circuits, Inc. His expertise includes operations, quality, and engineering, and new product development of cost-effec- tive supply procurement. He holds a Bachelor of Science degree in business Administration from Bemidji State University.

Tom Doslak Sr. Vice President of Sales and Marketing and Founder

Tom Doslak brings more than 27 years of PCB sales experience to Streamline Circuits where he is responsible for driving worldwide sales and marketing. Tom joins Streamline Circuits from Braztek, where he was the Director of Worldwide Sales. Prior to that, Tom was Western Regional Sales Manager for Dynamic Details Inc. and was Account Executive for Dynamic Circuits Inc. His responsibilities in addition to driving sales included technical and sales recruiting and training programs. He holds a Bachelor of Science degree in Organizational Communication with a Minor in Marketing from California State University, Chico.

Gary Greenberg Vice President of Operations

Gary Greenberg brings more than 33 years of experience in PCB fabrication, assembly and system integration. Gary joins Streamline Circuits from Sanmina Corporation, where he was Vice President of West Coast Operations for the EMS Division. He has also had roles in Operations, Engineering and Quality at DDI, Teradyne, and Raytheon. Gary holds a Bachelor of Science in Chemical Engineering from the University of Michigan, and an MBA from Rivier University.

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1401 Martin Avenue • Santa Clara, CA 95050 • 408.727.1418 www.streamlinecircuits.com

Management Team (cont.)

Mike Trammel Director of Engineering

Mike Trammel brings over 29 years of experience to the PCB industry. Former Director of Engineering for many successful companies including DDI and Dynavision. 12 years of Materials Application Engineering and R&D experience with Morton International / Dynachem, Shipley Ronal, Insulectro and Integral Technology. Glen Holland Director of Quality

Glenn Holland brings over 33 years of PCB industry experience to Streamline Circuits. Glen has worked in Operations, Assembly, Engineering and Quality. Prior to joining Streamline, he held the position of Director of Quality at TTM / Via Systems starting in 2007. He held the same position before that at Sanmina / SCI beginning in 1997. He graduated in 1984 from East Carolina University. Lorraine Hook Director of Quality Systems

With over 48 years of industry experience in the quality arena, Lorraine Hook is responsible for the Quality Management Systems of Streamline Circuits. She has contributed to the success of many successful companies including Dynamic Circuits and Dynamic Details. Lorraine has held dual positions as Corporate Quality Systems Manager and Director of Quality. JR Ramirez Production Manager and Founder

JR Ramirez brings over 35 years of experience to Streamline Circuits. As Production manager he is responsible for all of the day-to-day manufacturing throughout the facility. Prior to joining Streamline Circuits, JR was the former Production Manager for Dynamic Details Inc. as well as Dynamic Circuits Inc. His expertise includes real time production management and process control. Louis Oliveira Pre-Production Engineering Manager

Louis Oliveira brings over 30 years of CAM “Computer Aided Manufacturing” experience to Streamline Circuits. He joined Streamline Circuits in September 2006 as Pre-Production Engineering Manager. From 1998 to 2006, he was Pre-Production Engineering at Dynamic Details, a leading global provider of PCB manufacturing services. From 1987 to 1998, Mr. Oliveira held various key positions at Davila International Circuits.