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2/9/04 1 LBNL LC-TPC Activities International LC-TPC R&D Physics and Detector Simulations Micromegas-based TPC R&D US-Japan TPC R&D Proposal American Large TPC Detector Design I n t e r n a t i o n a l L C -

2/9/04 1 LBNL LC-TPC Activities ● International LC-TPC R&D ● Physics and Detector Simulations ● Micromegas-based TPC R&D ● US-Japan TPC R&D Proposal ●

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Page 1: 2/9/04 1 LBNL LC-TPC Activities ● International LC-TPC R&D ● Physics and Detector Simulations ● Micromegas-based TPC R&D ● US-Japan TPC R&D Proposal ●

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LBNL LC-TPC Activities

● International LC-TPC R&D

● Physics and Detector Simulations

● Micromegas-based TPC R&D

● US-Japan TPC R&D Proposal

● American Large TPC Detector Design

● International LC-TPC R&D

● Micromegas-based TPC R&D

● US-Japan Proposal

● Americal Large TPC Detector

Page 2: 2/9/04 1 LBNL LC-TPC Activities ● International LC-TPC R&D ● Physics and Detector Simulations ● Micromegas-based TPC R&D ● US-Japan TPC R&D Proposal ●

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International LC-TPC R&D

US – Japan – Europe LC-TPC R&D coordination: Takeshi Matsuda KEK Mike Ronan LBNL Ron Settles DESY/MPI

Organize international LC-TPC R&D meetings, e.g. Jan. 2001 Carleton - following American LC Chicago meeting Sep. 2002 KEK - following International LCWS meeting at Jeju Is., Korea Oct. 2003 LBNL - following Berkeley TPC Symposium Apr. 2004 Paris - before International LCWS in Paris

American Large TPC Detector Layed out conceptual design and wrote LCD reconstruction software. Studied physics performance and LC background sensitivity.

TESLA-TPC Contributed to TPC design in TESLA TDR. Member of European LC-TPC R&D Steering Committee.

Ongoing LC-TPC R&D Collaborations: Micromegas-based TPC R&D (Berkeley, Orsay & Saclay) GEM-based TPC R&D (Berkeley, CERN, Karlsruhe & MPI) TPC DAQ and Analysis software (Berkeley, Carleton, Montreal & Victoria) TPC Simulation software (Berkeley, Cornell, SLAC & Victoria) US-Japan LC-TPC R&D (Berkeley, KEK, MPI & Tokyo)

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LCD Modules:

Hit smearing

TPC Pattern recognition

Event display

...

LCIO

JAS histograms

AIDA tuples

American Large TPC Detector Simulations

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Micromegas-based TPC R&D

2x10 mm2 pads

1024 pads

1x10 mm2 pads

Readout anode pad plane

Berkeley Saclay OrsayChamber

diameter 50 cm length 50 cm

Mesh

50 m pitch

50 m gap

Page 5: 2/9/04 1 LBNL LC-TPC Activities ● International LC-TPC R&D ● Physics and Detector Simulations ● Micromegas-based TPC R&D ● US-Japan TPC R&D Proposal ●

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Online Event Display

Ar-Iso 5%, Vmesh = 300 VB = 1 Tesla wT ~ 2

Page 6: 2/9/04 1 LBNL LC-TPC Activities ● International LC-TPC R&D ● Physics and Detector Simulations ● Micromegas-based TPC R&D ● US-Japan TPC R&D Proposal ●

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Gas Argon CF4 3% E field 200 V/cm v

drift9-10 cm/sec

diffusion ~400 m @ 1 cm

Micromegas Vmesh 340 V

Expected transverse diffusion

For B = 3 T and d = 50 cm 1 m 2.5 m 188 266 421 m

Position resolution limits (1 cm pads) 19 27 42 m

B field Diff. ( m/sqrt(cm)) 0 T 0 400 0.5 T 2.5 150 1 T 5 80 2 T 10 40 3 T 15 27 4 T 20 20

Transverse Diffusion Measurement

Measure Diff. (B=1T) = 64 +- 13 +- 10 m/sqrt(cm)

Diffusion [mm^2]

Distance

B = 1 Tesla

Page 7: 2/9/04 1 LBNL LC-TPC Activities ● International LC-TPC R&D ● Physics and Detector Simulations ● Micromegas-based TPC R&D ● US-Japan TPC R&D Proposal ●

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Attenuation vs. drift timeAr-CF4 attenuation check: Use all 10 pad rows.

Calculate truncated mean.

Plot average track TrMean in several drift time bins.

Find no significant attenuation in low field (200V/cm) drift volume.

Attenuation Measurement

TrMean

0 cm 50 cm

Att. Length > 243 cm (@ 95% conf. level)

Page 8: 2/9/04 1 LBNL LC-TPC Activities ● International LC-TPC R&D ● Physics and Detector Simulations ● Micromegas-based TPC R&D ● US-Japan TPC R&D Proposal ●

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US-Japan Proposal

Phase I KEK TPC Testing w/ MPI Munich MPI TPC Chamber dimensions dia. 25 cm readout options: Wire or GEM Electronics STAR FEE cards 256 channels New VME readout module Magnet thin coil 1.2 T large bore 80 cm KEK test beam

Phase II New composite TPC New large-area composite TPC dimensions dia. 80 cm, length 80 cm Electronics ALTRO chip zero suppression, ...

Phase III New electronics Next generation RO electronics new chip design New versions of MPGD's

1mm/kVSurfaceStandoff

Rohacell Foam ~25mm

EMI Foil ~50-100 Al

G10 doubler (thin)

Termination Ring (Al)

Termination Ring (Al)

G10 insulator—thickness to stand-off required HV

HV

S

tripe

Ground

Stripe

Carbon Structural Shell (2-3mm)

Plated Thru HolesShorts Outer Stripes to corresponding inner stripes

Field Cage Bonded Assembly

Cu-Kapton Double sided flex circuit printed with field degradation stripes backside art helps to ‘pull-down’ charge collected on insulator between stripes in active volume

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American Large TPC Detector DesignLarge (TPC) reference detector Large TPC Chamber dimensions dia. 2 m, half-length 2.5 m pad layout 144-256 pad rows readout options: Wire or GEM or Micromegas Electronics Next generation over 1M channels Magnet outside cal. 3-4 T

Reconstruction 3D Pattern Recognition LCD Java Framework modular design

TPC Simulation smear space points with 100-140 m resolution no-detector effects

Tracking efficiency ~ 99%

Z() + H(jets) event

Hits: TPC (cyan), EM Cal (blue)Tracks (red), Clusters (green)