3D silicon biomedical devices

© CEA. All rights reserved

Yann LAMY - Progam line manager 3D section

Gilles SIMON – Head of 3D packaging laboratory

3D silicon for smart biomedical devices


Healthcare and

medicine

Population aging –

elderly people wellness

Monitoring and

diagnosis

Advanced and secure

surgery

Overcoming handicaps

and disabilities

Heathcare: new societal challenges

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New advanced medical devices need


Which devices for which medicine?

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External and/or disposable devices

Temporarly implanted devices

Long-term implantable devices

Intervention catheters / endoscopes / drug delivery systems…

Smart pills / intraocular pressure sensors…

CRT (Pacemaker), Vagusnerve stimulation…


Implantable devices for new medicine

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Hearth stimulation

Deep Brain Stimulation

Retina implants

Cochlear implant

Brain activity sensing

Electrophysilogy monitoring

Vagus nerve stimulation

Bladder stimulation

Localized drug delivery

EPoSS 2012 | 3D silicon for smart biomedical devices| YannLAMY - LETI

Many diverse and specific challenges


Medical devices communication

Wireless monitoring Wearable monitoring devices

Example: capture the patient gesture and analyze it through

a dedicated software.

Implantable or embedded antenna in devices

New Infrastructure for medical networking


Source: IEEE biomedecine, Corchado et al. 2010

Wearable full body sensors, source: MOVEA

Antenna radiation in hearing aid device, L. HUITEMA et al. CEA LETI 2012


Requests from clinicians: Efficacy

Localized and live monitoring

Fast data analysis

Reliability

Price


Applications challenge the technology

… with translate in complex technological needs

Small form factor

NO leads

Easily placed and targeted

Autonomous and communicating

Fabricated in facilities with high degree of reproducibility and reliability



3D technology assets for biomedical More Moore vs More-than-Moore

Source: ITRS, 2010

High level heterogeneous

integration

3D silicon integration opportunities

- Low form factor - High reliability - Low Power - Existing supply chains

Source: OPEN3D, LETI


3D Si integration assets and specs

1. Sensing & actuation

2. Computing & communicating

3. Power management

4. Biopackaging


Source: John Lau, ITRI, InterPACK 2011

Put all functionalities on a Si interposer with:

Silicon Wafer Level Packaging (WLP)

Heterogeneous materials integration

Multiple dies sourcing

Use of z-direction for ultra miniaturization & density

Keys parameters to

address

Yole report, 2010

Through-Silicon-Vias


Medical image sensing

Ultra miniaturized camera for endoscopy with TSVs


Source: I-Micronews May 2011

- Through-Silicon-Vias (TSV) packaging - 180nm TowerJazz CMOS image sensor - 0.99mm diameter endoscop - Camera image sensor size: 0.66mmx0.66 mm - 45k pixels

Ultra small camera will enable new medical diagnostic and therapeutic markets. Disposable devices, 4M units annually increasing to 7M units in 2015

Medigus and Towerjazz, May 2011 CMOS sensor

TSV

Glass


Biomedical sensing

9mmHg <P< 21 mmHg

Psystolique < 15 cmHg. Pdiastolique < 9cmHg

Intra-brain

pressure

2mmHg <P< 20 mmHg

Blood

pressure

Ocular pressure

EPoSS 2012 | 3D silicon for smart biomedical devices| YannLAMY - LETI

Bladder

pressure

Different applications, environment, duration and range One technology

0mmHg <P< 15 mmHg

Representative case: pressure sensing


Sensing: pressure monitoring


3D packaging allows a compact integration of a MEMS & RF antenna

« In 2010, 60 millions worldwide suffers from Glaucoma come from high intra ocular

pressure ». Quigley et al, 2006

Source: D. Ha et al. Purdue university IMS 2010 Integration in mouse’s eye

3D IC and MEMS stacking


Sensing: acceleration monitoring


Source: A. Rippart INEMI, May 2011

3D MEMS wafer level packaging on IC wafer

CRT ex: pacemaker


Computing and communicating

IC dies integration in biomedical Advanced node emergence (<65nm)

Small I/O pads

Multiple dies sourcing

Low CTE mismatch

Ultra low-loss antenna

ICs dies in contact with blood


IC RF

interposer

3D Silicon interposer can overcome IC integration limitations

CRT ex: pacemaker

Cascaded & communicating hemodynamic

IC & sensors for diagnosis and treatment

Source: A. Rippart INEMI, May 2011

TSV

antenna



Smart miniature low-power wireless microsystem for Body Area Network

3D integration: a key technology for mixing functionalities for ultra miniaturization and low energy

Computing and communicating

Source:


550nF/mm2 demonstrated using

high-k dielectrics in 3D

Power management


Efficient energy management: use the 3D in silicon

Source: Roozeboom, Lamy et al. , NXP, Power SOC 2008

DRIE etched pores DRIE etched pillars 3D integrated capacitors

or

Source: website

Press release – 10th of April 2012

&

PICS: Passives Integrated Connective Substrate


Power management


~1.2mm ~900um

RF Die PICS

3D Si capacitors integration in implantable module

SiP Package for pacemaker: •RF Transceiver •XO •SAW Filter •400MHz & 2.4GHz Matching network with integrated coils •Decoupling capacitances

3D capacitors allow the RF module realization 40% smaller than the PCB realization.

- 40 % area decrease - 25 % height decrease

14mm

8m

m

Source: Vivarès, Voiron, Lamy, et al. LETI –IPDIA-SORIN -Minapad 2011

Collaboration between:

6.4

5m

m

11.2mm

Si interposer


3 key factors: Biocompatibiliy

“The ability of a material to perform with an appropriate host response in a specific application” (Buddy Ratner in Biomaterials Science)

Hermiticity: prevent fluids leakage

- Toxic susbtances from device (ex: cu) Body

- Corrosive body fluids (ex: blood) Device

Shape

- Soft rounded shape to prevent Foreign Body Reaction (FBR)

3 categories:


Biopackaging

Exposition Long term Middle term Shot term

Implantation definitive temporary Externale/ disposable

Examples pacemaker Intraocular pressure sensor endoscop

Biocompatibility requirements on implants (ISO 10993).

Biocompatibility of silicon is still subject to controversy

Potentially high volume, low cost opportunities for 3D electronic

devices


Wafer-level 3D chip biopackaging:


Biopackaging

Biocompatibility is a surface-mediated property 3D surface passivation

Wafer-level processing allows cost effective, miniaturized and biocompatible packaging

Electrode deposition: Gold, Platinium

3D inorganic passivation: SiOx, SiNy…

CMOS standard passivation and aluminium pads

Wafer level 3D shaping:top and bottom

3D polymer passivation: PDMS, Parylen…

Parylene-C

SiO2

Au USGS / TEOS/SIN

AlCu SiO2 th


Opportunities: Disposable devices

Ultra miniaturization

Mixing of many functionalities & technologies

Process standardization

Reliability from microelectronics Fabs

3D silicon biomedical devices

Coming challenges: Reach critical mass in volume production

New supply chains to set

Reliable in-vitro and in-vivo tests

Reduce costs

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US implantable devices market has a 7,7% market groth rate, and will exceed $50 Billion by 2015

LETI BioBOX concept


Thank you


Documents

3D silicon biomedical devices