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2System-Level ESD/EMI Protection Guide TexasInstruments2010
➔
System-Level ESD/EMI Protection Guide
Table of Contents/Introduction
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
WhyExternalESD? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
ESDProtectionforUSBChargerInterface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
ESDProtectionforHigh-SpeedUSB2 .0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
ESDProtectionforSuper-SpeedUSB3 .0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
ESDProtectionforVGAandDVI-IPorts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
ESDProtectionforHDMI/DVI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
ESDProtectionforPortableHDMI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
ESDProtectionforHigh-SpeedVideoandDataInterface . . . . . . . . . . . . . . . . . . 11
ESDProtectionfor1394Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
ESDProtectionforKeypads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
EMIFilters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
ResourcesPackagingSolutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
ESD/EMIProtectionDeviceList . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
TIWorldwideTechnicalSupport . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
IntroductionSystem-levelelectrostaticdischarge(ESD)protectionhasbecomeveryimportantintoday’sworldasdevicesbecomeportable,containmultipleinterfaceconnectors,havetouch-screens,andarecontinuallyexposedtotheexternalworld .ItonlytakesoneESDstriketopermanentlydamageaproduct,makingESDprotectionacriticalcomponentofsystemdesign .
Electromagneticinterference(EMI)isanotherchallengeoftenfacedinsystemdesign .EMIisaradiofrequency(RF)(800MHzto2GHz)disturbancethataffectsanelectricalcircuitduetoelectromagneticconductionfromanexternalsource .EMIcanbeavoidedbyusingEMIfiltersthateliminateRFnoiseandmaintainsignalintegrity .
ESD/EMI Protection Solutions
TIproducesESD/EMIdeviceswithsolutionsthatprotectthemajorityofexternalconnectionstotheoutsideworld .LearnmoreaboutourESD/EMIproductportfolio .
Applications • USB2 .0/3 .0*
• HDMI*
• DVI*
• DisplayPort
• eSATA
• 1394*
• LVDS
• GigabitEthernet*
• Audioheadphones
• Microphoneports
• Speakerports
• SDIO
• SIM
*Featured section within this guide.
www.ti.com/esd
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3System-Level ESD/EMI Protection Guide TexasInstruments2010
Pad
Pad
System-Level ESD/EMI Protection Guide
Why External ESD?Semiconductordevicesbasedoffofadvancedprocessesonlyofferdevice-levelESDspecificationslikethechargedevicemodel(CDM)andthehumanbodymodel(HBM)shownbelow .Device-levelESDspecificationsarenotsufficienttoprotectdevicesinasystem .
Theenergyassociatedwithasystem-levelESDstrikeismuchhigherthanadevice-levelESDstrike .Inordertoprotectagainstthisexcessenergy,amorerobustdesignisrequired .Thesiliconarearequiredtodesignsystem-levelESDprotectionismuchlargerthanisrequiredforHBMor
CDM .Thisdifferenceinsiliconareatranslatestoadditionalcost .Astechnologynodesbecomesmaller,itbecomesmoredifficultandcostlytointegraterobustsystem-levelESDprotectionwithmicrocontrollerorcorechipsets .Thisisillustratedbelow .
System-levelESDprotectioncanbeimplementedusingdiscretediodesorcapacitors .However,inmanyapplications,discretesolutionsconsumeboardspace,complicatelayout,andcompromisesignalintegrityathighdatarates .TexasInstrumentsstand-aloneESDdevicesprovidespace-saving,
cost-effectivesolutionstoprotectsysteminterconnectsfromexternalESDstrikeswhilemaintainingsignalintegrity .
OftenESDprotectionisconsideredatthelastphaseofsystemdesign .DesignersneedflexibilitytoselectanESDcomponentthatdoesnotcompromisethePCBlayoutorconsumeadditionalboardspace .TexasInstrumentsESDsolutionswithflow-throughpackagingallowdesignerstoaddESDcomponentsinthefinalstagesofadesignwithoutanychangeintheboardlayout .
GND
V
CH N-1CH N
CH6 CH4 CH2 CH1 CH3 CH5
CC
Typical circuit diagram for N number of channels.
Silicon die areas for system-level ESD (IEC 8-KV contact).
Silicon die areas for device-level ESD (I2 KV HBM).
Legend
Human Body Model (HBM)Charge Device Model (CDM)
System Level IECStandard Model
50 ns 100 ns
24 A
48 A
ESD models.
➔
4System-Level ESD/EMI Protection Guide TexasInstruments2010
Voltage (V)
Cur
rent
(A)
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
00 5 10 15 20 25 30
TheTPD4S012isasingle-chipESDprotectionsolutionfortheUSBchargerinterface .Manyafter-marketchargersgeneratemorethan5VattheUSBVBUSpin .Acommonindustrysolutionistouseahigh-voltageclampfortheVBUSline .TheTPD4S012offersacombinationoftwoseparateclamps:a6-VclampfortheD+,D–andIDpinsanda20-VclampfortheVBUSpin .
TheTPD4S012allowssingle-layerflow-throughPCBlayout .ThissimplifiesPCBdesignandallowsforflexibledesignwithasmallformfactor .Itsupportsdataratesinexcessof480Mbps .Snap-backtechnologyallowshigh-voltagetoleranceduringnormaloperationwhilereducingtheclampvoltageduringsystem-levelESDstress .
System-Level ESD/EMI Protection Guide
ESD Protection for USB Charger Interface
4-Channel USB ESD Solution with Power Clamp
TPD4S012
Getsamples,datasheetsandevaluationmodulesatwww.ti.com/sc/device/TPD4S012
Key Features• IntegratedESDclampsforD+,
D–,VBUSandIDpinstoprovidesingle-chipESDprotection
• IEC61000-4-2(level4)system-levelESDcompliancemeasuredattheD+,D–andIDPins
±10-kVcontactdischarge
±10-kVair-gapdischarge
• 3ampspeakpulsecurrent(8/20-µspulse)
• USBsignalpins(D+,D–,ID)
0 .8-pFlinecapacitance
Tolerates6-Vsignal
• VBUSline(VBUS)
11-pFlinecapacitance
Tolerates20-Vsignal
Applications• Cellularphones
• Digitalcameras
• Globalpositioningsystems(GPS)
• Portabledigitalassistants(PDAs)
VBUS = 20 V
GND
IO
IO
IO
VBUS
D+
D-
GND
USBCharger/Controller
VBUS
GNDCore PMU
Chip/USB Controller
D-
D+
ID
TPD4S012 DRY Package(Top View)
D+
D–
ID
VBUS
N.C.
GND
1
2
3
6
5
4
TPD4S012 YFP Package(Top View)
D+
D–
VBUSVBUS
ID
GNDA1 A2
B1 B2
C1 C2
TPD4S012 in a USB charger application.
VBUS clamp voltage under ESD event.
➔
5System-Level ESD/EMI Protection Guide TexasInstruments2010
TheTPD2E001,TPD3E001,TPD4E001andTPD6E001aredesignedtoprotectI/OlinesbearingthesensitivecapacitiveloadsofUSB2 .0,EthernetLAN,FireWireTMandvideoVGAinterfaceswithrail-to-raildiodes .TheyarecompliantwithIEC61000-4-2,witha±15-kVHBM,a±8-kVcontactdischargeanda±15-kVair-gapdischarge .
TheTPDxE001isalow-capacitanceESDprotectiondiodearraydesignedtoprotectsensitiveelectronicsattachedtocommunicationlines .EachchannelconsistsofapairofdiodesthatsteersESDcurrentpulsestoVCCorGND .TheTPDxE001protectsagainstESDpulsesupto±15-kVhuman-bodymodel(HBM),±8-kVcontactdischarge,and±15-kVair-gapdischarge,asspecifiedinIEC61000-4-2 .Thisdevicehasatypical1 .5-pFcapacitanceperchannel,makingitidealforuseinhigh-speeddataI/Ointerfaces .TheTPDxE001comesintwo-,three-,four-orsix-channelsolutionsmakingitidealforEthernetandFireWireTMapplications .
System-Level ESD/EMI Protection Guide
ESD Protection for High-Speed USB 2.0
Low-Capacitance, Multiple-Channel ESD Protection Arrays for High-Speed Interfaces
TPD2E001, TPD3E001, TPD4E001, TPD6E001
Getsamples,datasheetsandevaluationmodulesatwww.ti.com/sc/device/PARTnumber
Key Features• 2-,3-,4-and6-channelESD
solutions
• IEC61000-4-2(level4)ESDprotection
±8-kVcontactdischarge
±15-kVair-gapdischarge
±15-kVhumanbodymodel
• Low1 .5-pFinputcapacitance
• Low1-nAsupplyandleakagecurrents
• 0 .9Vto5 .5Vsupplyvoltagerange
Applications• USB2 .0
• Ethernet
• FireWireTM(IEEE1394)
• Video
• Cellphones
• SVGAconnections
• Bloodglucosemeters
USBController
USBController/µProcessor
R-
Vcc
Vcc
VBUS
RT
.1µF
D+
D-
GNDIO2
IO1
IO4
IO3 IO2
IO1
GND
GND
.1µF
TPD2E001
TPD4E001
VBUS
D+
D-
GND
VBUS
D+
D-
GNDTPD4E001 in USB 2.0 (480-Mbps) applications protecting two ESD.
TPD2E001 DRY Package(Top View) TPD6E001 RSE Package
(Top View)Vcc
N.C.
IO1
IO2
N.C.
GND
1
2
1
2
3
4
5
9
10
8
7
6
3
6
5
4
TPD4E001 DRL Package(Top View)
IO1
IO2
IO1
IO2
IO3
N.C
GND GN
D
Vcc
Vcc
IO4
IO3
IO5
IO4
N.C.
IO6
1
2
3
6
5
4
TPD4E001 Ethernet ESD protection.
EthernetTransceiver
TX+
RJ 45
TX-
RX+
RX-
TPD4E001
.1µFIO1
IO2 IO3
IO4GND
VCC
+VCC
➔
6System-Level ESD/EMI Protection Guide TexasInstruments2010
TheTPD2S017isatwo-channelESDsolutionwithseriesresistorisolationtoprovidetwo-stageESDprotectionforultra-ESD-sensitiveIOs .Thisarchitectureallowsthedevicetogenerateverylowclampvoltageduringsystem-levelESDstrikesandprovidesacontrolledfilterroll-offforspuriousEMIsuppressionandsignalintegrity .Thisdeviceoffersflow-throughpinmappingforeaseofboardlayout .Themonolithicsilicontechnologyallowsmatchingcomponentvalues,includingclampcapacitanceandseriesresistormatchingbetweenthedifferentialsignalpairs .TightmatchingofthelinecapacitanceandseriesresistorsensurethatthedifferentialsignaldistortionduetotheaddedESDclampremainsminimal,whilealsoallowingtheparttooperateathigh-speeddifferentialdatarates(inexcessof1 .5Gbps) .
System-Level ESD/EMI Protection Guide
ESD Protection for High-Speed USB 2.0
2-Channel ESD Solution with Series-Resistor Isolation
TPD2S017
Getsamples,datasheetsandevaluationmodulesatwww.ti.com/sc/device/TPD2S017
Key Features• Ultra-lowclampvoltageensures
theprotectionoflowvoltagecorechipsetsduringESDevents
• ExceedsIEC61000-4-2(level4)ESDProtection
±11-kVcontactdischarge
±15-kVhumanbodymodel
• 0 .02pF(typ)differentialchannelinputcapacitance
• ±1%deviationofseriesresistors(±8mΩ)
Applications• High-speedUSB
• IEEE1394
• LVDS
• MobileDigitalDisplayInterface(MDDI)/MobileIndustryProcessorInterface(MIPI)
0
-1
-2
-3
-4
-5
-6
-7
-8
-9
1.000E+06 1.000E+07 1.000E+08 1.000E+09 1.000E+10
Ch2_Out
Vcc
Ch2_In
Ch1_Out
GND
Ch1_In
USBController
TPD2S017
1 Ω
1 Ω
Vcc
VBUS
D+
D-
GND
-3-dB data = 2.74G Hz
Frequency (Hz)
6-DBV(Top View)
Usage model for TPD2S017.
TPD2S017DBVR insertion loss data (S21).
➔
7System-Level ESD/EMI Protection Guide TexasInstruments2010
System-Level ESD/EMI Protection Guide
ESD Protection for Super-Speed USB 3.0
2- or 4-Channel ESD Solution for Super-Speed USB 3.0 Interface TPDxEUSB30
Getsamples,datasheetsandevaluationmodulesat:www.ti.com/sc/device/PARTnumber
Key Features• Single-pairdifferentiallinesto
protectthedifferentialdataandclocklinesoftheUSB3 .0,eSATA,orLVDinterface
• ESDprotectionmeetsorexceedsIEC61000-4-2(level4)
±8-kVcontactdischarge
±8-kVair-gapdischarge
• 5-Apeakpulsecurrent(8/20-µspulse)forD+,D–lines
• 0 .05-pFmatchingcapacitancebetweenthedifferentialsignalpair
• Supportsdataratesinexcessof6Gbps
Applications• USB3 .0high-speed
• eSATA
• HDMI
• LVDS
TheTPDxEUSB30providestwoESDclampcircuitswithflow-throughpinmappingforeaseofboardlayout .Thisdevicehasbeendesignedtoprotectsensitivecomponentsthatareconnectedtoultrahigh-speeddataandtransmissionlines .TheTPDxEUSB30offersprotectionfromstresscausedbyESD .Thisdevicealsooffers5-A(8/20-µs)peakpulsecurrentratingsperIEC61000-4-5(lightning)specification .
Thisdevicehas0 .05-pFmatchingcapacitancebetweendifferentiallinesandpincapacitancelessthan0 .7pF .ThesefeaturesenabletheTPDxEUSB30tosupportdataratesinexcessof6GbpssupportingapplicationssuchasUSB3 .0,eSATAorLVDSinterface .
TheTPDxEUSB30conformstoIEC61000-4-2(level4)ESDprotection .
8 mm
8 mm1.05 mm
2.5 mm
1.05 mm
1 mm
1
3
2
D+
D-
D1+
D1-
D2+
D2-
GND
GND GND
N.C.
N.C.
N.C.
N.C.
USB 3.0Host/
Controller
TX+
TX-
VRUS
D-
D+
GND
GND
RX+
RX-
TX+
TX-
VRUS
D-
D+
GND
GND
RX+
RX-
USB 3.0Host/
Controller
Three TPD2EUSB30 to protect USB 3.0 Class A connector (requires only one layer of routing).
One TPD4EUSB30 and one TPD2EUSB30 to protect USB 3.0 Class A connector (two-layer routing).TPD4EUSB30 package.
➔
8System-Level ESD/EMI Protection Guide TexasInstruments2010
System-Level ESD/EMI Protection Guide
ESD Protection for VGA and DVI-I Ports
Integrated 7-Channel ESD Solution for the VGA Port
TPD7S019
Getsamples,datasheetsandevaluationmodulesatwww.ti.com/sc/device/TPD7S019
Key Features• Integrated7-channelESDsolution
withlevelshifting,bufferingandsyncimpedance
•ExceedsIEC61000-4-2(level4)ESDprotection
±8-kVcontactdischarge
±15-kVhumanbodymodel
•4-pFloadingcaponvideolines
•BufferandimpedancematchingresistoroptionforSYNCsignals
15Ω
65Ω
55Ω
Applications• VGAandDVI-Iportsin:
PCs
Graphicscards
Settopboxes
TVs
TheTPD7S019isTI’sfirstintegratedESDsolutionfortheVGAport .ThedeviceincorporatesallofthenecessaryitemsforVGAlines:levelshifting,ESDprotection,bufferingandimpedancematching .Allofthiscombinedgivesthedesignerasingle-chipdevicefortheVGAport,eliminatingtheneedforadditionalICstocompletethesamefunctionsthattheTPD7S019performs .
LevelShifting
ESDProtection
ImpedanceMatching
SignalBuffering
LevelShifting
EDSProtection
ImpedanceMatching
SignalBuffering
TPD7S019
SYNC_Out2
SYNC_IN2
SYNC_Out1
SYNC_Out1
SYNC_Out2SYNC_IN1
SYNC_IN1
SYNC_IN2DDC_Out2
DDC_IN2
DDC_IN1
DDC_IN1
DDC_IN2
DDC_Out1
DDC_Out1
DDC_Out2
VCC_SYNC
VCC_DDC
VBYNC
VCC_VIDEO
VCC_VIDEO
VIDEO1
VIDEO1 VIDEO2 VIDEO3
VIDEO2
VIDEO3
GND
GND
VCC_DDC
BYP
BYP
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
Preview: TPD7S019-15 RSV Package
(Top View)
VC
C_ S
YN
C
VC
C_ V
IDE
O
SY
NC
_Out
2
SY
NC
_IN
2
VIDEO1
VIDEO2
VIDEO3
GND
SYNC_Out1
SYNC_IN1
DDC_Out2
DDC_IN2
VC
C_ D
DC
BY
P
DD
C_I
N1
DD
C_O
ut1
1
2
3
4
12
11
10
9
5 6 7 8
16 15 14 13
➔
9System-Level ESD/EMI Protection Guide TexasInstruments2010
System-Level ESD/EMI Protection Guide
ESD Protection for HDMI/DVI
VCC VCC
Connectorand
Cable
OffV = 0CC
I (Backdrive)
HDMI
Power Down
HDMI(Active)
Power On
Ioff (backdrive protection) is very important for any data-cable connection where one side may be in power-on mode while the other is in power-down mode. This prevents the current back-flows to the power-down circuit from any damage, eliminating the need for an external diode.
TheTPD12S520andTPD12S521aresingle-chipESDsolutionsforHDMIreceiverandtransmitterports .Inmanycases,thecoreICs,suchasthescalarchipset,maynothaverobustESDcellstosustainsystem-levelESDstrikes .Inthesecases,theTPD12S520andTPD12S521providethedesiredsystem-levelESDprotection,suchastheIEC61000-4-2(level4)ESD,byabsorbingtheenergyassociatedwiththeESDstrike .
WhileprovidingESDprotection,thesedevicesaddlittletonoglitchinthehigh-speeddifferentialsignalsduetothelowI/Ocapacitance .BothofthesedevicesofferapinlayoutthatismappedtoanHDMIconnector,eliminatingroutingandreducingboardlayoutcomplexityandcost .ThesedevicesalsosupportIoff(backdrive)protectionforcurrentin-rushevents .
TheTPD12S521fortransmitterportsprovidesanon-chipregulatorwithcurrentoutputratingsof55mAforpin38 .ThiscurrentenablesHDMIreceiverdetectionevenwhenthereceiverdeviceispoweredoff .ThisenablestheTPD12S521toprovideESDprotectionandline-drivecapabilitiesonasingle-chipsolution .
HDMI Receiver/Transmitter Port Protection and Interface Devices
TPD12S520/1
Getsamples,datasheetsandevaluationmodulesatwww.ti.com/sc/device/PARTnumber
Key Features• TPD12S520:single-chipESD
solutionforHDMIreveiverports
• TPD12S521:single-chipESDsolutionforHDMItransmitterports;offerson-chipregulatorwith55-mAcurrentlimitfeature
• MeetsIEC61000-4-2(Level4)ESDprotection
±8-kVcontactdischarge
• IntegratedlevelshiftingforcontrolpinswithadditionalLVsupply
• SupportsHDMI1 .3datarate
• 0 .8-pFultra-lowcapforI/O
• 0 .05-pFmatchingcapbetweenTMDS
• Backdriveprotection
Applications• PCs
• Consumerelectronics
• Set-topboxes
• DVDRWplayers
• HDTVs
TPD12S520/1 electrical schematic.
TMDS_GND
TMDS_CK+TMDS_D2+
TMDS_D2–
TMDS_D1+
TMDS_GND
TMDS_D1–
TMDS_D0+
TMDS_GND
TMDS_D0–
TMDS_GND
TMDS_CK–
DDC_DAT_OUT
HOTPLUG_DET_OUT
ESD_BYP
CE_REMOTE_IN CE_REMOTE_OUT
DDC_CLK_IN DDC_CLK_OUT HOTPLUG_DET_IN
LV Supply
DDC_DAT_IN
5-V_SUPPLY
Ioff
LV Supply LV Supply
LV Supply
1 38
20
TPD12S520
HDMIConnector
19
D2+GNDD2–D1+GNDD1–D0+GNDD0–
CLK+GNDCLK–CE_R
NCD_CKD_DTGND5OUTHTDT
HDMI Core Chip
Board layout example for TPD12S520.
➔
10System-Level ESD/EMI Protection Guide TexasInstruments2010
TheTPD12S015integratesauniquecombinationofeightlow-capacitanceESDclamps,I2Clevelshifters,andapower-savingDC/DCconverter,savingsystemdesignersalmostthreetimestheboardspaceandsignificantlyreducingoverallsystemcost .TheintegratedESDclampsandresistorsprovidegoodmatchingbetweeneachdifferentialsignalpairtoprovideanadvantageoverdiscreteESDclampsolutions,wherevariationsbetweenESDclampsdegradethedifferentialsignalquality .TheTPD12S015allowsHDMI1 .3dataratesandprovidesIEC61000-4-2(level4)ESDprotection .
TheTPD12S015hasaninternalboostconvertercircuit .ThisDC/DCconvertergeneratesasteady5-Voutputfroma2 .3to5 .5-VsourcetodrivetheHDMI5V_Outpin .ThiseliminatestheneedforanexternalDC/DCconverterforportableapplications .TheTPD12S015alsohasadirectionlesslevelshifterwithintegratedpull-upresistorsandone-shotcircuits .Therearethreenon-invertingbidirectionaltranslationcircuitsfortheSDA,SCLandCEClines .Eachhasacommonpowerrail(VCCA)ontheAsidefrom1 .1Vto3 .6V .OntheBside,theSCL_BandSDA_Beachhaveaninternal1 .75kΩpullupconnectedtotheregulated5-Vrail(5VOUT) .TheSCLandSDApinsmeettheI2Cspecificationanddriveupto750-pFloads .TheCEC_Bpinhasaninternal27kΩpulluptoaninternal3 .3V .
+5-V Power
+5-V Power
3.3 V (internal)
HPD_B
10 kΩ
5-VVCCA
HPD_A
LS_OE*
CT_CP_HPD*
VBAT
GND
LDO
CLK- CLK+ D2- D2+ D1- D1+ D0+D0-
1.75 kΩ
1.75 kΩ
26 kΩ±15%
CEC_BCEC_ASCL_BSCL_A
SDA_BSDA_A
DC/DCConverter
5 V
5 V 3.5 V (internal)
ERC
ERCERC
System-Level ESD/EMI Protection Guide
ESD Protection for Portable HDMI
YFF Package(Top View)
A
1 2 3 4
B
C
D
E
F
G
TPD12S015 directionless level shifter with integrated pull-ups and one-shot circuits.
TPD12S015 internal boost converter circuit.
HDMI Companion Chip with Step-Up Converter, I2C Level Shifter and High-Speed ESD Clamps
TPD12S015
Getsamples,datasheetsandevaluationmodulesatwww.ti.com/sc/device/TPD12S015
Key Features• IntegrationofDC/DCchargepump,
voltagetranslationlevelshifterandESDprotectionreduces76%boardspaceand30%costcomparedtodiscretesolutions .
• PinlayoutmatchesHDMItypeC/Dconnectorwhichallowsforsingle-boardlayoutdesign
• TheDDCandCECcontrollinescandrivea750-pFload,resultinginlongercablelengths
• MeetsIEC61000-4-2(level4)system-levelESDprotection
±8-kVcontactdischarge
• 1-pFI/Ocapacitancefor8-channelESDprotection
• Differentialmatchingcapacitanceof .05pF
Applications• Smartphones
• Multimediaphones
• Digitalcamcorders
• Digitalstillcameras
• Portablegameconsoles
YFF Package Pin Mapping
1 2 3 4
A LS_OE VCCA D2+ D2–
B SCL_A CEC_A GND D1+
C SDA_A HPD_A GND D1–
D CT_CP_HPD GND CEC_B D0+
E FB GND SCL_B D0–
F 5VOUT SW SDA_B CLK+
G PGND VBAT HPD_B CLK–
➔
11System-Level ESD/EMI Protection Guide TexasInstruments2010
Key Features• ComplieswiththeHDMI1 .3and
DisplayPortdatarate
• System-levelIEC-61000-4-2(level4)ESDprotection
±8-kVcontactdischarge
• Differentialmatchingoflessthan0 .05pF
• Pincapacitancelessthan0 .8pF
• IofffeatureforTPD8S009andTPD4S009
Applications• LVDS
• HDMI/DVI
• DisplayPort
• eSATAinterface
• Seriallink
• Ethernet
• PCIExpress®
TheTPD8S009,TPD4S009andTPD4S010provideESDprotectionforhigh-speeddifferentialbusinterfaces .Thesedevicesareidealforanyhigh-speedapplicationupto6Gbps .
TheseinterfacesprovideESDprotectionwithultra-low,0 .8-pFcapacitanceforlessdistortionduringdatatransfer .Theyalsoprovideultra-lowmatchingcapacitancetohelpimprovethesignalquality .AllofthesedevicesexceptfortheTPD4S010supportIoff(backdrive)protectioncircuitswithanadditionaldiodeontheVCCline .
System-Level ESD/EMI Protection Guide
ESD Protection for High-Speed Video and Data Interface
Package options.
TPD8S009 (DSM)
TPD4S009 (PGV or DCK)TPD4S009 (DGS)
TPD4S010 (DQA)
TPD4S009 (DRY)
D0+
GND
D0–
D1+
GND
D1–
D2+
GND
D2–
D3+
GND
D3–
D1+
D1–
GND
D2+
D2–
D1+
D1–
GND
D2+
D2–
N.C.
N.C.
VCC
N.C.
N.C.
N.C.
N.C.
GND
N.C.
N.C.
VCC
N.C.
VCC
D1–
VCC
D2–
D1–
VCC
D2–
1
2
3
1
2
3
D1+
GND
D2+
D1+
GND
D2+
6
5
4
6
5
4
15
14
13
1
2
3
4
5
6
7
8
9
10
11
12
1
2
3
4
5
1
2
3
4
5
10
9
8
7
6
10
9
8
7
6
TPD8S009
TPD4S010
2
1
3
5
7
9
11
13
15
17
19
4
6
8
10
12
14
16
18
20
Core Scalar/Switch
Ultra-Low, 0.8-pF Capacitance for High-Speed Differential Interface ApplicationsTPD8S009, TPD4S009, TPD4S010
Getsamples,datasheetsandevaluationmodulesat:www.ti.com/sc/device/PARTnumber
TPD8S009 and TPD4S010 in DisplayPort application.
➔
12System-Level ESD/EMI Protection Guide TexasInstruments2010
1394 Connector.
System-Level ESD/EMI Protection Guide
ESD Protection for 1394 Ports
Firewire ESD Clamp with Live-Insertion Detection Circuit
TPD4S1394
Getsamples,datasheetsandevaluationmodulesatwww.ti.com/sc/device/TPD4S1394
Key Features• IntegratedlateVgdetection
mechanismgeneratesFWPWR_ENflag
• System-levelIEC61000-4-2ESDprotectionforhigh-speedapplications
Passes8KVin1394system interface
±15-kVhumanbodymodel
• LowI/Ocapacitance
1 .5pFpincapacitance
• On-chip600-mstimerdelaymechanism
• Flow-through,single-in-linepinmapping
Applications• IEEE1394liveinsertionprotection
• LVDS
TheTPD4S1394providesarobustsystem-levelESDsolutionfortheIEEE1394portalongwithaliveinsertiondetectionmechanismforhigh-speedlinesinterfacingalow-voltage,ESD-sensitivecorechipset .Thisdeviceprotectsandmonitorsuptotwodifferentialinputpairs .Theoptimizedlinecapacitanceallowsittoprotectthedatalineswithdataratesinexcessof1 .6GHzwithoutdegradingsignalintegrity .
TheTPD4S1394incorporatesaliveinsertioncircuitwhoseoutputstatechangeswhenimpropervoltagelevelsarepresentontheinputdatalines .TheFWPWR_ENsignalcontrolsanexternalFireWireTMportpowerswitch .Duringtheliveinsertionevent,ifthereisafloatingGNDorahigh-levelsignalattheD+,D–pins,theinternalcomparatorwilldetectthechangesandpulltheFWPWR_ENsignaltolowstate .WhenFWPWR_ENisdrivenlow,thereisaninternaldelaymechanismpreventingitfrombeingdriventothehighstateregardlessoftheinputstothecomparator .
Additionally,itperformsESDprotectiononthefourinputpins:D1+,D1–,D2+andD2– .ItconformstotheIEC61000-4-2(level4)ESDprotectionand±15-kVHBMESDprotection .TheTPD4S1394ischaracterizedforoperationoverambientairtemperaturesof–40°Cto85°C .
Vcc
GND
VCLMP
FWPWR_EN
D1+
D1–
D2+
D2–
1394Controller TPD4S1394
➔
13System-Level ESD/EMI Protection Guide TexasInstruments2010
System-Level ESD/EMI Protection Guide
ESD Protection for Keypads
8-Channel ESD Clamp Array
TPD8E003
Getsamples,datasheetsandevaluationmodulesatwww.ti.com/sc/device/TPD8E003
Key Features• Eight-channelESDclamparrayto
enhancesystem-levelESDprotection
• ExceedsIEC61000-4-2(level4)ESDprotection
±12-kVcontactdischarge
±15-kVair-gapdischarge
• 3 .5-Apeakpulsecurrent(8/20µsec)
• Lowbreakdownvoltageof6V
Applications• Keypad
• Touch-screeninterface
• Memoryinterface
• Dockingconnectorinterface
TheTPD8E003isanarrayofeightESDclampsinaspace-savingSON(DQD)package .Thisintegratedtransientvoltagesuppressordeviceisdesignedforapplicationsrequiringsystem-levelESDrobustness .Itisintendedforuseinspace-constrainedequipmentsuchasportablecomputers,cellphones,communicationkeypadsystemsandotherapplications .ItsintegrateddesignofferssuperiormatchingbetweenmultiplelinesoverdiscreteESDclampsolutions .
TheTPD8E003includesESDprotectioncircuitrythatpreventsdamagetotheapplicationwhensubjectedtoESDstressexceedingIEC61000-4-2(level4) .TheTPD8E003isspecifiedfor–40°Cto85°Coperation .
D2+
D2–
KeypadController
Through via (6 mils)
GND via (6 mils)
Top layer trace (4 mils wide)
Bottom layer trace (4 mils wide)
A
C
E
G
I
K
M
O
B
D
F
H
J
L
N
P
YZ
DQD Package(Top View)
IO1
IO2
IO3
IO4
IO8
IO7
IO5
IO6
1
2
GND3
4
8
7
6
5
TPD8E003DQDR at keypad interface.
➔
14System-Level ESD/EMI Protection Guide TexasInstruments2010
System-Level ESD/EMI Protection Guide
EMI Filters
2-Channel EMI Filter for Audio Headphones
TPD2F702
Getsamples,datasheetsandevaluationmodulesatwww.ti.com/sc/device/TPD2F702
Key Features• 2-channelEMIfilteringforaudio
ports
AVIFconnector,headphone
• Exceedslevel4ESDprotectiononconnector
±30-kVcontactdischarge
±30-kVair-gapdischarge
• Pi-style(C-R-C)filterconfigurationwith-3-dBbandwidthat1 .2MHz(R=15Ω,CTOTAL=5000pF)
• Low10-nAleakagecurrent
• WCSPpackagesandflow-throughpinout
Applications• Mobilephones
• Headsets
• PDAs
• Portablegaming
TheTPD2F702isatwo-channelEMIfilterforaudiointerfaceapplications .Withtheintegrationofa5000-pFcapacitorinaspace-savinglow-noiseWCSPpackage,theTPD2F702offerssuperiorEMInoisesuppression(2MHzto6GHz)comparedtodiscreteimplementation .ThedeviceisoptimizedforAVIFconnectororspeakerportinterfaces .Thislow-passfilterarrayalsoprovidessystemlevelESDprotectiontoeliminatetheneedforexternalESDclamps .TheTPD2F702exceeds±30-kVratingsperIEC61000-4-2contactandair-gapspecifications .
TheTPD2F702isahighlyintegrateddevicedesignedtosuppressEMI/RFInoiseinallsystemssubjectedtoelectromagneticinterferences .ThisfilterincludesESDprotectioncircuitry,whichpreventsdamagetotheapplicationwhensubjectedtoESDsurgesfarexceedingIEC61000-4-2(level4) .
TPD2F702
Out R
Out L
SGND
5000 pf
5000 pf
Audio Amp/Audio Codec
Sample TPD2F702 application.
Frequency vs. dB for TPD2F702.
1.3 mm
0.625 mm
0.9 mm
0.9 mm
TPD2F702 YFK Package(Top View)
0.0
-5.0
-10.0
-15.0
-20.0
-25.0
-30.0
-35.0
-40.0
-45.0
-50.01.00E+05 1.00E+06 1.00E+07
Frequency (Hz)
Inse
rtio
n Lo
ss (d
B)
1.00E+08 1.00E+09
3dB drop/bias of 0.0V-3dB = 1.18 MHz
3dB drop/bias of 2.5V-3dB = 1.28 MHz
(DC Bias @ 2.5V)
Legend(DC Bias @ 0.0V)
➔
15System-Level ESD/EMI Protection Guide TexasInstruments2010
System-Level ESD/EMI Protection Guide
EMI Filters
Space-Saving EMI Filters
TPDxF003
Getsamples,datasheetsandevaluationmodulesatwww.ti.com/sc/device/PARTnumber
Key Features• 4-,6-,or8-channelEMIfilterwith
greaterthan25-dBattenuationat1GHz
• System-levelIEC61000-4-2ESDprotection
±12-kVcontactdischarge
±20-kVair-gapdischarge
±15-kVhumanbodymodel
• Pi-styleC-R-Ctopologywith-3-dbbandwidthat200MHz(R=100Ω,CTOTAL=17pF)
• Flow-throughpackagelayout
• OperatingI/Ovoltagerangeupto5 .5V
• Low10-nAleakagecurrent
Applications• LCDdisplayinterface
• Keypad
• Memoryinterface
• Cellphones
• SVGAvideoconnections
• PDAs
TheTPD4F003,TPD6F003andTPD8F003arefour-,six-,andeight-channelEMIfiltersinspace-saving0 .4-mmpitchDQDpackages .Thelow-passfilterarraysreduceEMIemissionsandprovidesystem-levelESDprotection .
Becauseofitssmallpackageandeasy-to-usepinassignments,TPDxF003filtersaresuitableforawidearrayofapplications,suchasmobilehandsets,PDAs,videoconsoles,notebookcomputers,etc .Inparticular,thesefiltersareidealforEMIfilteringandprotectingdatalinesfromESDattheLCDdisplay,keypadandmemoryinterfaces .
75 mm 24 mm15 mm
34 mm 32 mm 11 mm
MemoryController
MemoryConnector
GND
SD Card26 PinMicroSD Card
ExpressCard | 34
1
GND
Ch1_Out
Ch2_Out
Ch3_Out
Ch4_Out
Ch1_In
Ch2_In
Ch3_In
Ch4_In
TPD4F003 (DQD)
1.7mm x 1.35mm x 0.75mm(0.4mm pitch)
2
3
4
8
7
6
5
1
GND
Ch1_Out
Ch2_Out
Ch3_Out
Ch4_Out
Ch1_In
Ch2_In
Ch3_In
Ch4_In
Ch5_Out
Ch6_Out
Ch5_In
Ch6_In
TPD6F003 (DQD)
2.5 mm x 1.35 mm x 0.75 mm(0.4 mm pitch)
2
3
4
12
11
10
9
5
6
8
7
1
GND
Ch1_Out
Ch2_Out
Ch3_Out
Ch4_Out
Ch1_In
Ch2_In
Ch3_In
Ch4_In
Ch5_Out
Ch6_Out
Ch7_Out
Ch8_Out
Ch5_In
Ch6_In
Ch7_In
Ch8_In
TPD8F003 (DQD)
3.3 mm x 1.35 mm x 0.75 mm(0.4 mm pitch)
2
3
4
16
15
14
13
5
6
7
8
12
11
10
9
Functional TPDxF003 board.
TPDxF003 typical use circuit.
➔
16System-Level ESD/EMI Protection Guide TexasInstruments2010
Top view of TPD6F202 usage example.
System-Level ESD/EMI Protection Guide
EMI Filters
4- and 6-Channel EMI Filters for LCD Display
TPDxF202
Getsamples,datasheetsandevaluationmodulesatwww.ti.com/sc/device/PARTnumber
Key Features• Low10-nAleakagecurrent
• Ultra-thinYFUpackage
1 .06mmx1 .57mmx0 .3mm
• ExceedsIEC61000-4-2system-levelESDprotection
±25-kVcontactdischarge
±25-kVair-gapdischarge
• Pi-style(C-R-C)filterconfigurationwithgreaterthan-32dBattenuationat1GHz(R=100Ω,CTOTAL=15pF)
• Cut-offfrequencyat108MHz
Applications• LCDinterface
• Cellphones
• SVGAvideoconnections
• PDAs
TheTPDxF202isafour-andsix-channelEMIfilterinspace-savingSONpackages .Thislow-passfilterarrayreducesEMIemissionsandprovidessystem-levelESDprotection .Itisusedonmobile-phoneLCDormemoryinterfaces .Thepi-style(C-R-C)filterprovidesatleast30-dBattenuationinthecarrierfrequencyrange(800to2700MHz) .
TheTPDxF202isahighlyintegrateddevicedesignedtosuppressEMI/RFInoiseinallsystemssubjectedtoelectromagneticinterferences .ThisfilterincludesanESDprotectioncircuitrythatpreventsdamagetotheapplicationwhensubjectedtoESDstrikesuptoIEC61000-4-2(level4) .
TheTPDxF202isspecifiedfor–40°Cto85°Coperation .
DisplayController
LCD
TPD4F202YFU Packaging
(Top View)
A
B
C
D
E
F
1 2 3
TPD6F202YFU Packaging
(Top View)
A
B
C
D
E
F
G
H
I
1 2 3Pin Mapping
Pin No. Name
A1 Ch1_In
A3 Ch1_Out
B2 GND
C1 Ch2_In
C3 Ch2_Out
D1 Ch3_In
D3 Ch3_Out
E2 GND
F1 Ch4_In
F3 Ch4_Out
Pin Mapping
Pin No. Name
A1 Ch1_In
A3 Ch1_Out
B2 GND
C1 Ch2_In
C3 Ch2_Out
D1 Ch3_In
D3 Ch3_Out
E2 GND
F1 Ch4_In
F3 Ch4_Out
G1 Ch5_In
G3 Ch5_Out
H2 GND
J1 Ch6_In
J3 Ch6_Out
17System-Level ESD/EMI Protection Guide TexasInstruments2Q2010
➔
TIoffersthemostrobustpackagingsolutionsforESD/EMIdevices .Withovereightpackagetypesrangingfrom0 .18mm2PicoStarTMpackagesto62mm2TSSOP,wehavepackagingsolutionsthatcanfitintoanydesign .FromthePicoStarTMpackagethatcanbeembeddedintothePCBto38-pinTSSOPdesignedforeasyboardlayout(seepage9),thereareoptionsforeverydesign .
PicoStarTM Package Solutions:Portableconsumerelectronicsdesignerscansaveboardspacewithintergratedcircuits(ICs)inthePicoStarTMpackagefromTexasInstruments .Theultra-thinpackage,aboutasthinasahumanhair,isthefirsttogivesystemdesignerstheoptiontoembedsiliconcomponentsinsidetheprintedcircuitboard(PCB)tomaximizeboardspace .Devicesinthisformfactorare50percentthinnerthansimilarchipsintraditionalpackagesandenablesmaller,thinnerendequipment .
ThePicoStarTMpackageisthinenoughtobeembeddedinsidethePCB,mountedunderaconnector,orplacedundersomediscretecomponents .Theimageshereshowthespace-savingcapabilitiesofthispackageforboard
layout .
PCB Metal Layers
<0.15 mm
1 mm
PicoStarTM Package
Normal top layer mounting
0.13 mm (height) PicoStarTM package under ceramic inductor.
0.3 mm (height) YFU package under the Zif connector.
PicoStarTM package embedded in PCB board. Height of the total PCB board is 1 mm.
TI packages for ESD/EMI solutions.
(0.8 mm x 0.8 mm)(0.6 mm x 0.3 mm)
(1 mm x 1 mm)
1
2
3
6
5
4A1 A2
B2
C2C1
(1 mm x 1 mm)
Bit Width
Pac
kag
e S
ize
(1.45 mm x 1 mm)
(1.053 mm x 2.35 mm)
(2.5 mm x 1.35 mm)
(6.5 mm x 2.5 mm)
1
2
3
12
11
10
4
5
6
9
8
7
Resources
Packaging Solutions
➔
18System-Level ESD/EMI Protection Guide TexasInstruments2010
General-Purpose ESD Protection
Device
IEC61000-4-2
DiagramNo. of
ChannelsSupply Voltage
(Vdd)VBR (min)
(V)
I/O Cap(pF)
PackagesLevel 4 Protection
*TPD1E14A4 Yes
GND
IO
1 n/a -8 to +15 4 2-0201 (YFW)
TPD2E001 Yes
GND
VCC
IO 1 IO 2 2 0.9 to 5.5 11 1.5 5-SOT, 6-SON, 4-SOP
TPD2E009 Yes
GND
IO 1 IO 22 –0.3 to 6 9 0.8 3-SOT, 6-SON
TPD3E001 Yes
GND
VCC
IO 1 IO 2 IO 33 0.9 to 5.5 11 1.5 5-SOT, 6-SON
TPD4E001 Yes
GND
VCC
IO 1 IO 2 IO 3 IO 44 0.9 to 5.5 11 1.5 6-SOT, 6-SON
TPD6E001 Yes
GND
VCC
IO 1 IO 2 IO 3 IO 4 IO 5 IO 66 0.9 to 5.5 11 1.5 10-/12-QFN
*Subject to change. Call Product Information Center. See page 24 for contact information.
Resources
ESD/EMI Protection Device List
Preview products are listed in bold blue.
➔
19System-Level ESD/EMI Protection Guide TexasInstruments2010
General-Purpose ESD Protection (continued)
Device
IEC61000-4-2
DiagramNo. of
ChannelsSupply Voltage
(Vdd)VBR (min)
(V)I/O Cap
(pF)PackagesLevel 4
Protection
TPD4E004 Yes
GND
VCC
IO 1 IO 2 IO 3 IO 46 0.9 to 5.5 6 1.6 6-SOT, 6-SON
TPD6E004 Yes
GND
VCC
IO 1 IO 2 IO 3 IO 4 IO 5 IO 66 0.9 to 5.5 6 1.6 8-QFN
TPD4S009 Yes D1+D2+
D1–D2–
GND
VCC
4 0.9 to 5.5 9 0.9 6-SOT, 6-SC70, 6-SON
TPD4S010 Yes
D1+
D1–
GND
D2+
D2– 4 0.9 to 5.5 9 0.9 10-QFN
TPD2E007 Yes
IO2IO1
GND
2 n/a ±14 10 4-DSLGA (YFM) 3-SC70 (3-DCK)
Resources
ESD/EMI Protection Device List
➔
20System-Level ESD/EMI Protection Guide TexasInstruments2010
General-Purpose ESD Protection (continued)
Device
IEC61000-4-2
DiagramNo. of
ChannelsSupply Voltage
(Vdd)VBR (min)
(V)I/O Cap
(pF)PackagesLevel 4
Protection
TPD2EUSB30 Yes
D+D-
GND
2 n/a 9 0.7 3-SOT
TPD2S017 Yes
Ch1_Out
Ch2_Out
Ch1_In
Ch2_In
Vcc (Optional)
GND
2 0 to 5 11 1 6-SOT-23
TPD4E002 Yes
IO1 IO2 IO3 IO4
4 n/a 6 11 5-SOT
*TPD4E281 Yes
IO1
IO2 IO3
IO4
GND
4 n/a 4.5 2.5 6-PicoStarTM Package
TPD4S012 Yes
GND
D+
D-
ID
VBUS
4 –0.3 to 20D+, D-, ID
= 6 VBUS = 20
0.8 6-SON
Resources
ESD/EMI Protection Device List
*Subject to change. Call Product Information Center. See page 24 for contact information. Preview products are listed in bold blue.
➔
21System-Level ESD/EMI Protection Guide TexasInstruments2010
General-Purpose ESD Protection (continued)
Device
IEC61000-4-2
DiagramNo. of
ChannelsSupply Voltage
(Vdd)VBR (min)
(V)I/O Cap
(pF)PackagesLevel 4
Protection
TPD4S1394 Yes
GND
D2+ D2- D1+ D1-VCMLP VCC FWPER_EN
4 0 to 4.6 4.2 1.5 8-SON
TPD8S009 Yes
GND
D0+D0-D1+D1-D2+D2-D3+D3-
Vcc
GND
8 –0.3 to 6 9 0.8 15-SON
Resources
ESD/EMI Protection Device List
General-Purpose EMI Protection
Device
IEC61000-4-2
DiagramNo. of
Channels
Supply Voltage
(Vdd)
VBR (min)(V)
I/O Cap(pF)
Packages-3-dB
BandwidthContact (kV)
TPD2F702 ±8IEC 6100-4-2(Level 4) ESD
IEC 6100-4-2(Level 1) ESD
30 pF
5000 pF
Ch_Out15 ΩCh_In
GND
2 ±14 15 5,000 5-WCSP 1.2 MHz
TPD4F003 ±88.5 pF
8.5 pF
Ch_Out100 Ω
Ch_In
GND
4 6 100 17 8-WSON 200 MHz
➔
22System-Level ESD/EMI Protection Guide TexasInstruments2010
General-Purpose EMI Protection (continued)
Device
IEC61000-4-2
DiagramNo. of
Channels
Supply Voltage
(Vdd)
VBR (min)(V)
I/O Cap(pF)
Packages-3-dB
BandwidthContact (kV)
TPD6F002 ±20 C1 = 17 pF
C2 = 17 pF
Ch_Out100 Ω
Ch_In
GND
6 6 100 34 12-SON 100 MHz
TPD6F003 ±88.5 pF
8.5 pF
Ch_Out100 Ω
Ch_In
GND
6 6 100 17 12-WSON 200 MHz
TPD8F003 ±88.5 pF
8.5 pF
Ch_Out100 Ω
Ch_In
GND
8 6 100 17 16-WSON 200 MHz
Resources
ESD/EMI Protection Device List
ESD Protection Device List
Device IEC61000-4-2 Contact (kV)
IEC61000-4-2 Level 4
No. Of Channels
Supply Voltage
VBR (min)(V)
I/O Capacitance (pF)
Pin/Package Application
*TPD1E14A4 ±15 Yes 1 n/a -8 to +15 4 2-0201 (YFW) Audio, industrial, portable computer, cell phones
TPD2E001 ±8 Yes 2 0.9 to 5.5 11 1.5 4-SOP (DZD) 5-SOT (DRL) 6-SON (DRS,DRY) USB 2.0, Ethernet, FireWireTM
TPD2E007 ±8 Yes 2 n/a ±14 10 4-DSLGA (YFM), 3-SC70 (3-DCK) RS-232/RS-485, audio port
TPD2E009 ±8 Yes 2 n/a 7 0.7 3-SOP (DBZ), 3-SOT (DRT) FirewireTM, eSATA, LVDS signaling
TPD2EUSB30 ±8 Yes 2 n/a 7 0.7 3-SOT (DRT) USB 3.0
TPD2S017 ±11 Yes 2 0 to 5 11 1 6-SOT-23 (DBV) USB 2.0 High Speed
TPD3E001 ±8 Yes 3 0.9 to 5.5 11 1.5 5-SOT (DRL) 6-SON (DRS,DRY) USB OTG
TPD4E001 ±8 Yes 4 0.9 to 5.5 11 1.5 6-SON (DRS), 6-SOT (DRL) USB 2.0, Ethernet, FireWireTM, eSATA
TPD4E002 ±15 Yes 4 n/a 6.1 11 5-SOT (DLR) USB 2.0 Full Speed
*Subject to change. Call Product Information Center. See page 24 for contact information. Preview products are listed in bold blue.
➔
23System-Level ESD/EMI Protection Guide TexasInstruments2010
ESD Protection Device List (continued)
Device IEC61000-4-2 Contact (kV)
IEC61000-4-2 Level 4
No. Of Channels
Supply Voltage
VBR (min)(V)
I/O Capacitance (pF)
Pin/Package Application
TPD4E004 ±8 Yes 4 0.9 to 5.5 6 1.6 6-SON (DRY) USB 2.0 High Speed, Ethernet, FireWireTM, eSATA
*TPD4E281 ±8 Yes 4 n/a 4.5 2.5 6-PicoStarTM Package (YFM) Memory, USB 2.0 High Speed
TPD4S009 ±8 Yes 4 0 to 5.5 9 0.810-MSOP (DGS)
6-SC-70 (DCK), 6-SON (DRY), 6-SOT-23 (DBV)
eSATA, LVDS signaling, HDMI
TPD4S010 ±8 Yes 4 n/a 9 0.8 6-SON (DQA) eSATA, LVDS signaling, HDMI
TPD4S012 ±10 Yes 4 0 to 20 D+, D-, ID = 6 VBUS = 20 0.8 6-SON (DRY) USB 2.0 High Speed (charging
applications)
TPD4S1394 **±8 Yes 4 0 to 4.6 4.2 1.5 8-X2SON (DQL) 1394/FireWireTM
TPD6E001 ±8 Yes 6 0.9 to 5.5 11 1.5 10-UQFN (RSE), 12-WQFN (RSF)
USB 2.0, Ethernet, FireWireTM, eSATA
TPD6E004 ±8 Yes 6 0.9 to 5.5 6 1.6 8-UQFN (RSE) USB 2.0, Ethernet, FireWireTM, eSATA
TPD7S019 ±8 Yes 7 0 to 5.5 9 2.5 16-SSOP (DBQ),16-UQFN (RSE) VGA DisplayPort
TPD8E003 ±12 Yes 8 n/a 6 7 8-WSON (DQD) Keypad, touch-screen interface,Memory, SDIO, SIM card
TPD8S009 ±8 Yes 8 0 to 55 9 0.8 15-SON (DSM) HDMI, DisplayPort, LVDS signaling
TPD12S015 ±8 Yes 12 2.3 to 5.5 9 1.3 28-DSBGA (YFP) HDMI Class C/D connector
TPD12S520 ±8 Yes 12 0 to 5.5 9 0.8 38-TSSOP (DBT) HDMI receiver port
TPD12S521 ±8 Yes 12 0 to 5.5 9 0.8 38-TSSOP (DBT) HDMI transmit port
Resources
ESD/EMI Protection Device List
*Subject to change. Call Product Information Center. See page 24 for contact information. Preview products are listed in bold blue.**Passes 8 KV in 1394 system interface.
EMI Protection Device List
DeviceAir-Gap
(kV)Contact
(kV)No. of
ChannelsVBR (min)
(V)Rline (typ)
(Ohms) Ctotal (typ)
(pF) Pin/Package
-3-dB Bandwidth
Application
TPD2F702 ±30 ±30 2 ±14 15 5,030 5-WCSP (YFK) 1.2 MHz Audio
TPD4F003 ±20 ±12 4 6 100 17 WSON (8-DQD) 200 MHz Memory, LCD display, keypad
TPD4F202 ±25 ±25 4 6 100 30 DSBGA (10-YFU) 108 MHz Memory, LCD display, keypad
TPD6F002 ±30 ±20 6 6 100 34 SON (12-DSV) 100 MHz Memory, LCD display, keypad
TPD6F003 ±20 ±12 6 6 100 17 WSON (12-DQD) 200 MHz Memory, LCD display, keypad
TPD6F202 ±25 ±25 6 6 100 30 DSBGA (15-YFU) 108 MHz Memory, LCD display, keypad
TPD8F003 ±20 ±12 8 6 100 17 WSON (16-DQD) 200 MHz Memory, LCD display, keypad
TPD3F303 ±15 ±8 3 6 47 20 SON (8-DQD) 300 MHz SIM interface
TPD6F301 ±15 ±8 6 6 45 12 SON (16-DQD) 300 MHz SDIO interface
Preview products are listed in bold blue.
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B121709
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