25
System-Level ESD/EMI Protection Guide 2010 www.ti.com/esd

44963373 System Level ESD EMI Protection Guide

  • Upload
    thang

  • View
    46

  • Download
    3

Embed Size (px)

Citation preview

Page 1: 44963373 System Level ESD EMI Protection Guide

System-Level ESD/EMI Protection Guide

2010www.ti.com/esd

Page 2: 44963373 System Level ESD EMI Protection Guide

2System-Level ESD/EMI Protection Guide TexasInstruments2010

System-Level ESD/EMI Protection Guide

Table of Contents/Introduction

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

WhyExternalESD? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

ESDProtectionforUSBChargerInterface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

ESDProtectionforHigh-SpeedUSB2 .0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

ESDProtectionforSuper-SpeedUSB3 .0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

ESDProtectionforVGAandDVI-IPorts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

ESDProtectionforHDMI/DVI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

ESDProtectionforPortableHDMI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

ESDProtectionforHigh-SpeedVideoandDataInterface . . . . . . . . . . . . . . . . . . 11

ESDProtectionfor1394Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

ESDProtectionforKeypads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

EMIFilters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

ResourcesPackagingSolutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

ESD/EMIProtectionDeviceList . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

TIWorldwideTechnicalSupport . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

IntroductionSystem-levelelectrostaticdischarge(ESD)protectionhasbecomeveryimportantintoday’sworldasdevicesbecomeportable,containmultipleinterfaceconnectors,havetouch-screens,andarecontinuallyexposedtotheexternalworld .ItonlytakesoneESDstriketopermanentlydamageaproduct,makingESDprotectionacriticalcomponentofsystemdesign .

Electromagneticinterference(EMI)isanotherchallengeoftenfacedinsystemdesign .EMIisaradiofrequency(RF)(800MHzto2GHz)disturbancethataffectsanelectricalcircuitduetoelectromagneticconductionfromanexternalsource .EMIcanbeavoidedbyusingEMIfiltersthateliminateRFnoiseandmaintainsignalintegrity .

ESD/EMI Protection Solutions

TIproducesESD/EMIdeviceswithsolutionsthatprotectthemajorityofexternalconnectionstotheoutsideworld .LearnmoreaboutourESD/EMIproductportfolio .

Applications • USB2 .0/3 .0*

• HDMI*

• DVI*

• DisplayPort

• eSATA

• 1394*

• LVDS

• GigabitEthernet*

• Audioheadphones

• Microphoneports

• Speakerports

• SDIO

• SIM

*Featured section within this guide.

www.ti.com/esd

Page 3: 44963373 System Level ESD EMI Protection Guide

3System-Level ESD/EMI Protection Guide TexasInstruments2010

Pad

Pad

System-Level ESD/EMI Protection Guide

Why External ESD?Semiconductordevicesbasedoffofadvancedprocessesonlyofferdevice-levelESDspecificationslikethechargedevicemodel(CDM)andthehumanbodymodel(HBM)shownbelow .Device-levelESDspecificationsarenotsufficienttoprotectdevicesinasystem .

Theenergyassociatedwithasystem-levelESDstrikeismuchhigherthanadevice-levelESDstrike .Inordertoprotectagainstthisexcessenergy,amorerobustdesignisrequired .Thesiliconarearequiredtodesignsystem-levelESDprotectionismuchlargerthanisrequiredforHBMor

CDM .Thisdifferenceinsiliconareatranslatestoadditionalcost .Astechnologynodesbecomesmaller,itbecomesmoredifficultandcostlytointegraterobustsystem-levelESDprotectionwithmicrocontrollerorcorechipsets .Thisisillustratedbelow .

System-levelESDprotectioncanbeimplementedusingdiscretediodesorcapacitors .However,inmanyapplications,discretesolutionsconsumeboardspace,complicatelayout,andcompromisesignalintegrityathighdatarates .TexasInstrumentsstand-aloneESDdevicesprovidespace-saving,

cost-effectivesolutionstoprotectsysteminterconnectsfromexternalESDstrikeswhilemaintainingsignalintegrity .

OftenESDprotectionisconsideredatthelastphaseofsystemdesign .DesignersneedflexibilitytoselectanESDcomponentthatdoesnotcompromisethePCBlayoutorconsumeadditionalboardspace .TexasInstrumentsESDsolutionswithflow-throughpackagingallowdesignerstoaddESDcomponentsinthefinalstagesofadesignwithoutanychangeintheboardlayout .

GND

V

CH N-1CH N

CH6 CH4 CH2 CH1 CH3 CH5

CC

Typical circuit diagram for N number of channels.

Silicon die areas for system-level ESD (IEC 8-KV contact).

Silicon die areas for device-level ESD (I2 KV HBM).

Legend

Human Body Model (HBM)Charge Device Model (CDM)

System Level IECStandard Model

50 ns 100 ns

24 A

48 A

ESD models.

Page 4: 44963373 System Level ESD EMI Protection Guide

4System-Level ESD/EMI Protection Guide TexasInstruments2010

Voltage (V)

Cur

rent

(A)

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

00 5 10 15 20 25 30

TheTPD4S012isasingle-chipESDprotectionsolutionfortheUSBchargerinterface .Manyafter-marketchargersgeneratemorethan5VattheUSBVBUSpin .Acommonindustrysolutionistouseahigh-voltageclampfortheVBUSline .TheTPD4S012offersacombinationoftwoseparateclamps:a6-VclampfortheD+,D–andIDpinsanda20-VclampfortheVBUSpin .

TheTPD4S012allowssingle-layerflow-throughPCBlayout .ThissimplifiesPCBdesignandallowsforflexibledesignwithasmallformfactor .Itsupportsdataratesinexcessof480Mbps .Snap-backtechnologyallowshigh-voltagetoleranceduringnormaloperationwhilereducingtheclampvoltageduringsystem-levelESDstress .

System-Level ESD/EMI Protection Guide

ESD Protection for USB Charger Interface

4-Channel USB ESD Solution with Power Clamp

TPD4S012

Getsamples,datasheetsandevaluationmodulesatwww.ti.com/sc/device/TPD4S012

Key Features• IntegratedESDclampsforD+,

D–,VBUSandIDpinstoprovidesingle-chipESDprotection

• IEC61000-4-2(level4)system-levelESDcompliancemeasuredattheD+,D–andIDPins

±10-kVcontactdischarge

±10-kVair-gapdischarge

• 3ampspeakpulsecurrent(8/20-µspulse)

• USBsignalpins(D+,D–,ID)

0 .8-pFlinecapacitance

Tolerates6-Vsignal

• VBUSline(VBUS)

11-pFlinecapacitance

Tolerates20-Vsignal

Applications• Cellularphones

• Digitalcameras

• Globalpositioningsystems(GPS)

• Portabledigitalassistants(PDAs)

VBUS = 20 V

GND

IO

IO

IO

VBUS

D+

D-

GND

USBCharger/Controller

VBUS

GNDCore PMU

Chip/USB Controller

D-

D+

ID

TPD4S012 DRY Package(Top View)

D+

D–

ID

VBUS

N.C.

GND

1

2

3

6

5

4

TPD4S012 YFP Package(Top View)

D+

D–

VBUSVBUS

ID

GNDA1 A2

B1 B2

C1 C2

TPD4S012 in a USB charger application.

VBUS clamp voltage under ESD event.

Page 5: 44963373 System Level ESD EMI Protection Guide

5System-Level ESD/EMI Protection Guide TexasInstruments2010

TheTPD2E001,TPD3E001,TPD4E001andTPD6E001aredesignedtoprotectI/OlinesbearingthesensitivecapacitiveloadsofUSB2 .0,EthernetLAN,FireWireTMandvideoVGAinterfaceswithrail-to-raildiodes .TheyarecompliantwithIEC61000-4-2,witha±15-kVHBM,a±8-kVcontactdischargeanda±15-kVair-gapdischarge .

TheTPDxE001isalow-capacitanceESDprotectiondiodearraydesignedtoprotectsensitiveelectronicsattachedtocommunicationlines .EachchannelconsistsofapairofdiodesthatsteersESDcurrentpulsestoVCCorGND .TheTPDxE001protectsagainstESDpulsesupto±15-kVhuman-bodymodel(HBM),±8-kVcontactdischarge,and±15-kVair-gapdischarge,asspecifiedinIEC61000-4-2 .Thisdevicehasatypical1 .5-pFcapacitanceperchannel,makingitidealforuseinhigh-speeddataI/Ointerfaces .TheTPDxE001comesintwo-,three-,four-orsix-channelsolutionsmakingitidealforEthernetandFireWireTMapplications .

System-Level ESD/EMI Protection Guide

ESD Protection for High-Speed USB 2.0

Low-Capacitance, Multiple-Channel ESD Protection Arrays for High-Speed Interfaces

TPD2E001, TPD3E001, TPD4E001, TPD6E001

Getsamples,datasheetsandevaluationmodulesatwww.ti.com/sc/device/PARTnumber

Key Features• 2-,3-,4-and6-channelESD

solutions

• IEC61000-4-2(level4)ESDprotection

±8-kVcontactdischarge

±15-kVair-gapdischarge

±15-kVhumanbodymodel

• Low1 .5-pFinputcapacitance

• Low1-nAsupplyandleakagecurrents

• 0 .9Vto5 .5Vsupplyvoltagerange

Applications• USB2 .0

• Ethernet

• FireWireTM(IEEE1394)

• Video

• Cellphones

• SVGAconnections

• Bloodglucosemeters

USBController

USBController/µProcessor

R-

Vcc

Vcc

VBUS

RT

.1µF

D+

D-

GNDIO2

IO1

IO4

IO3 IO2

IO1

GND

GND

.1µF

TPD2E001

TPD4E001

VBUS

D+

D-

GND

VBUS

D+

D-

GNDTPD4E001 in USB 2.0 (480-Mbps) applications protecting two ESD.

TPD2E001 DRY Package(Top View) TPD6E001 RSE Package

(Top View)Vcc

N.C.

IO1

IO2

N.C.

GND

1

2

1

2

3

4

5

9

10

8

7

6

3

6

5

4

TPD4E001 DRL Package(Top View)

IO1

IO2

IO1

IO2

IO3

N.C

GND GN

D

Vcc

Vcc

IO4

IO3

IO5

IO4

N.C.

IO6

1

2

3

6

5

4

TPD4E001 Ethernet ESD protection.

EthernetTransceiver

TX+

RJ 45

TX-

RX+

RX-

TPD4E001

.1µFIO1

IO2 IO3

IO4GND

VCC

+VCC

Page 6: 44963373 System Level ESD EMI Protection Guide

6System-Level ESD/EMI Protection Guide TexasInstruments2010

TheTPD2S017isatwo-channelESDsolutionwithseriesresistorisolationtoprovidetwo-stageESDprotectionforultra-ESD-sensitiveIOs .Thisarchitectureallowsthedevicetogenerateverylowclampvoltageduringsystem-levelESDstrikesandprovidesacontrolledfilterroll-offforspuriousEMIsuppressionandsignalintegrity .Thisdeviceoffersflow-throughpinmappingforeaseofboardlayout .Themonolithicsilicontechnologyallowsmatchingcomponentvalues,includingclampcapacitanceandseriesresistormatchingbetweenthedifferentialsignalpairs .TightmatchingofthelinecapacitanceandseriesresistorsensurethatthedifferentialsignaldistortionduetotheaddedESDclampremainsminimal,whilealsoallowingtheparttooperateathigh-speeddifferentialdatarates(inexcessof1 .5Gbps) .

System-Level ESD/EMI Protection Guide

ESD Protection for High-Speed USB 2.0

2-Channel ESD Solution with Series-Resistor Isolation

TPD2S017

Getsamples,datasheetsandevaluationmodulesatwww.ti.com/sc/device/TPD2S017

Key Features• Ultra-lowclampvoltageensures

theprotectionoflowvoltagecorechipsetsduringESDevents

• ExceedsIEC61000-4-2(level4)ESDProtection

±11-kVcontactdischarge

±15-kVhumanbodymodel

• 0 .02pF(typ)differentialchannelinputcapacitance

• ±1%deviationofseriesresistors(±8mΩ)

Applications• High-speedUSB

• IEEE1394

• LVDS

• MobileDigitalDisplayInterface(MDDI)/MobileIndustryProcessorInterface(MIPI)

0

-1

-2

-3

-4

-5

-6

-7

-8

-9

1.000E+06 1.000E+07 1.000E+08 1.000E+09 1.000E+10

Ch2_Out

Vcc

Ch2_In

Ch1_Out

GND

Ch1_In

USBController

TPD2S017

1 Ω

1 Ω

Vcc

VBUS

D+

D-

GND

-3-dB data = 2.74G Hz

Frequency (Hz)

6-DBV(Top View)

Usage model for TPD2S017.

TPD2S017DBVR insertion loss data (S21).

Page 7: 44963373 System Level ESD EMI Protection Guide

7System-Level ESD/EMI Protection Guide TexasInstruments2010

System-Level ESD/EMI Protection Guide

ESD Protection for Super-Speed USB 3.0

2- or 4-Channel ESD Solution for Super-Speed USB 3.0 Interface TPDxEUSB30

Getsamples,datasheetsandevaluationmodulesat:www.ti.com/sc/device/PARTnumber

Key Features• Single-pairdifferentiallinesto

protectthedifferentialdataandclocklinesoftheUSB3 .0,eSATA,orLVDinterface

• ESDprotectionmeetsorexceedsIEC61000-4-2(level4)

±8-kVcontactdischarge

±8-kVair-gapdischarge

• 5-Apeakpulsecurrent(8/20-µspulse)forD+,D–lines

• 0 .05-pFmatchingcapacitancebetweenthedifferentialsignalpair

• Supportsdataratesinexcessof6Gbps

Applications• USB3 .0high-speed

• eSATA

• HDMI

• LVDS

TheTPDxEUSB30providestwoESDclampcircuitswithflow-throughpinmappingforeaseofboardlayout .Thisdevicehasbeendesignedtoprotectsensitivecomponentsthatareconnectedtoultrahigh-speeddataandtransmissionlines .TheTPDxEUSB30offersprotectionfromstresscausedbyESD .Thisdevicealsooffers5-A(8/20-µs)peakpulsecurrentratingsperIEC61000-4-5(lightning)specification .

Thisdevicehas0 .05-pFmatchingcapacitancebetweendifferentiallinesandpincapacitancelessthan0 .7pF .ThesefeaturesenabletheTPDxEUSB30tosupportdataratesinexcessof6GbpssupportingapplicationssuchasUSB3 .0,eSATAorLVDSinterface .

TheTPDxEUSB30conformstoIEC61000-4-2(level4)ESDprotection .

8 mm

8 mm1.05 mm

2.5 mm

1.05 mm

1 mm

1

3

2

D+

D-

D1+

D1-

D2+

D2-

GND

GND GND

N.C.

N.C.

N.C.

N.C.

USB 3.0Host/

Controller

TX+

TX-

VRUS

D-

D+

GND

GND

RX+

RX-

TX+

TX-

VRUS

D-

D+

GND

GND

RX+

RX-

USB 3.0Host/

Controller

Three TPD2EUSB30 to protect USB 3.0 Class A connector (requires only one layer of routing).

One TPD4EUSB30 and one TPD2EUSB30 to protect USB 3.0 Class A connector (two-layer routing).TPD4EUSB30 package.

Page 8: 44963373 System Level ESD EMI Protection Guide

8System-Level ESD/EMI Protection Guide TexasInstruments2010

System-Level ESD/EMI Protection Guide

ESD Protection for VGA and DVI-I Ports

Integrated 7-Channel ESD Solution for the VGA Port

TPD7S019

Getsamples,datasheetsandevaluationmodulesatwww.ti.com/sc/device/TPD7S019

Key Features• Integrated7-channelESDsolution

withlevelshifting,bufferingandsyncimpedance

•ExceedsIEC61000-4-2(level4)ESDprotection

±8-kVcontactdischarge

±15-kVhumanbodymodel

•4-pFloadingcaponvideolines

•BufferandimpedancematchingresistoroptionforSYNCsignals

15Ω

65Ω

55Ω

Applications• VGAandDVI-Iportsin:

PCs

Graphicscards

Settopboxes

TVs

TheTPD7S019isTI’sfirstintegratedESDsolutionfortheVGAport .ThedeviceincorporatesallofthenecessaryitemsforVGAlines:levelshifting,ESDprotection,bufferingandimpedancematching .Allofthiscombinedgivesthedesignerasingle-chipdevicefortheVGAport,eliminatingtheneedforadditionalICstocompletethesamefunctionsthattheTPD7S019performs .

LevelShifting

ESDProtection

ImpedanceMatching

SignalBuffering

LevelShifting

EDSProtection

ImpedanceMatching

SignalBuffering

TPD7S019

SYNC_Out2

SYNC_IN2

SYNC_Out1

SYNC_Out1

SYNC_Out2SYNC_IN1

SYNC_IN1

SYNC_IN2DDC_Out2

DDC_IN2

DDC_IN1

DDC_IN1

DDC_IN2

DDC_Out1

DDC_Out1

DDC_Out2

VCC_SYNC

VCC_DDC

VBYNC

VCC_VIDEO

VCC_VIDEO

VIDEO1

VIDEO1 VIDEO2 VIDEO3

VIDEO2

VIDEO3

GND

GND

VCC_DDC

BYP

BYP

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

Preview: TPD7S019-15 RSV Package

(Top View)

VC

C_ S

YN

C

VC

C_ V

IDE

O

SY

NC

_Out

2

SY

NC

_IN

2

VIDEO1

VIDEO2

VIDEO3

GND

SYNC_Out1

SYNC_IN1

DDC_Out2

DDC_IN2

VC

C_ D

DC

BY

P

DD

C_I

N1

DD

C_O

ut1

1

2

3

4

12

11

10

9

5 6 7 8

16 15 14 13

Page 9: 44963373 System Level ESD EMI Protection Guide

9System-Level ESD/EMI Protection Guide TexasInstruments2010

System-Level ESD/EMI Protection Guide

ESD Protection for HDMI/DVI

VCC VCC

Connectorand

Cable

OffV = 0CC

I (Backdrive)

HDMI

Power Down

HDMI(Active)

Power On

Ioff (backdrive protection) is very important for any data-cable connection where one side may be in power-on mode while the other is in power-down mode. This prevents the current back-flows to the power-down circuit from any damage, eliminating the need for an external diode.

TheTPD12S520andTPD12S521aresingle-chipESDsolutionsforHDMIreceiverandtransmitterports .Inmanycases,thecoreICs,suchasthescalarchipset,maynothaverobustESDcellstosustainsystem-levelESDstrikes .Inthesecases,theTPD12S520andTPD12S521providethedesiredsystem-levelESDprotection,suchastheIEC61000-4-2(level4)ESD,byabsorbingtheenergyassociatedwiththeESDstrike .

WhileprovidingESDprotection,thesedevicesaddlittletonoglitchinthehigh-speeddifferentialsignalsduetothelowI/Ocapacitance .BothofthesedevicesofferapinlayoutthatismappedtoanHDMIconnector,eliminatingroutingandreducingboardlayoutcomplexityandcost .ThesedevicesalsosupportIoff(backdrive)protectionforcurrentin-rushevents .

TheTPD12S521fortransmitterportsprovidesanon-chipregulatorwithcurrentoutputratingsof55mAforpin38 .ThiscurrentenablesHDMIreceiverdetectionevenwhenthereceiverdeviceispoweredoff .ThisenablestheTPD12S521toprovideESDprotectionandline-drivecapabilitiesonasingle-chipsolution .

HDMI Receiver/Transmitter Port Protection and Interface Devices

TPD12S520/1

Getsamples,datasheetsandevaluationmodulesatwww.ti.com/sc/device/PARTnumber

Key Features• TPD12S520:single-chipESD

solutionforHDMIreveiverports

• TPD12S521:single-chipESDsolutionforHDMItransmitterports;offerson-chipregulatorwith55-mAcurrentlimitfeature

• MeetsIEC61000-4-2(Level4)ESDprotection

±8-kVcontactdischarge

• IntegratedlevelshiftingforcontrolpinswithadditionalLVsupply

• SupportsHDMI1 .3datarate

• 0 .8-pFultra-lowcapforI/O

• 0 .05-pFmatchingcapbetweenTMDS

• Backdriveprotection

Applications• PCs

• Consumerelectronics

• Set-topboxes

• DVDRWplayers

• HDTVs

TPD12S520/1 electrical schematic.

TMDS_GND

TMDS_CK+TMDS_D2+

TMDS_D2–

TMDS_D1+

TMDS_GND

TMDS_D1–

TMDS_D0+

TMDS_GND

TMDS_D0–

TMDS_GND

TMDS_CK–

DDC_DAT_OUT

HOTPLUG_DET_OUT

ESD_BYP

CE_REMOTE_IN CE_REMOTE_OUT

DDC_CLK_IN DDC_CLK_OUT HOTPLUG_DET_IN

LV Supply

DDC_DAT_IN

5-V_SUPPLY

Ioff

LV Supply LV Supply

LV Supply

1 38

20

TPD12S520

HDMIConnector

19

D2+GNDD2–D1+GNDD1–D0+GNDD0–

CLK+GNDCLK–CE_R

NCD_CKD_DTGND5OUTHTDT

HDMI Core Chip

Board layout example for TPD12S520.

Page 10: 44963373 System Level ESD EMI Protection Guide

10System-Level ESD/EMI Protection Guide TexasInstruments2010

TheTPD12S015integratesauniquecombinationofeightlow-capacitanceESDclamps,I2Clevelshifters,andapower-savingDC/DCconverter,savingsystemdesignersalmostthreetimestheboardspaceandsignificantlyreducingoverallsystemcost .TheintegratedESDclampsandresistorsprovidegoodmatchingbetweeneachdifferentialsignalpairtoprovideanadvantageoverdiscreteESDclampsolutions,wherevariationsbetweenESDclampsdegradethedifferentialsignalquality .TheTPD12S015allowsHDMI1 .3dataratesandprovidesIEC61000-4-2(level4)ESDprotection .

TheTPD12S015hasaninternalboostconvertercircuit .ThisDC/DCconvertergeneratesasteady5-Voutputfroma2 .3to5 .5-VsourcetodrivetheHDMI5V_Outpin .ThiseliminatestheneedforanexternalDC/DCconverterforportableapplications .TheTPD12S015alsohasadirectionlesslevelshifterwithintegratedpull-upresistorsandone-shotcircuits .Therearethreenon-invertingbidirectionaltranslationcircuitsfortheSDA,SCLandCEClines .Eachhasacommonpowerrail(VCCA)ontheAsidefrom1 .1Vto3 .6V .OntheBside,theSCL_BandSDA_Beachhaveaninternal1 .75kΩpullupconnectedtotheregulated5-Vrail(5VOUT) .TheSCLandSDApinsmeettheI2Cspecificationanddriveupto750-pFloads .TheCEC_Bpinhasaninternal27kΩpulluptoaninternal3 .3V .

+5-V Power

+5-V Power

3.3 V (internal)

HPD_B

10 kΩ

5-VVCCA

HPD_A

LS_OE*

CT_CP_HPD*

VBAT

GND

LDO

CLK- CLK+ D2- D2+ D1- D1+ D0+D0-

1.75 kΩ

1.75 kΩ

26 kΩ±15%

CEC_BCEC_ASCL_BSCL_A

SDA_BSDA_A

DC/DCConverter

5 V

5 V 3.5 V (internal)

ERC

ERCERC

System-Level ESD/EMI Protection Guide

ESD Protection for Portable HDMI

YFF Package(Top View)

A

1 2 3 4

B

C

D

E

F

G

TPD12S015 directionless level shifter with integrated pull-ups and one-shot circuits.

TPD12S015 internal boost converter circuit.

HDMI Companion Chip with Step-Up Converter, I2C Level Shifter and High-Speed ESD Clamps

TPD12S015

Getsamples,datasheetsandevaluationmodulesatwww.ti.com/sc/device/TPD12S015

Key Features• IntegrationofDC/DCchargepump,

voltagetranslationlevelshifterandESDprotectionreduces76%boardspaceand30%costcomparedtodiscretesolutions .

• PinlayoutmatchesHDMItypeC/Dconnectorwhichallowsforsingle-boardlayoutdesign

• TheDDCandCECcontrollinescandrivea750-pFload,resultinginlongercablelengths

• MeetsIEC61000-4-2(level4)system-levelESDprotection

±8-kVcontactdischarge

• 1-pFI/Ocapacitancefor8-channelESDprotection

• Differentialmatchingcapacitanceof .05pF

Applications• Smartphones

• Multimediaphones

• Digitalcamcorders

• Digitalstillcameras

• Portablegameconsoles

YFF Package Pin Mapping

1 2 3 4

A LS_OE VCCA D2+ D2–

B SCL_A CEC_A GND D1+

C SDA_A HPD_A GND D1–

D CT_CP_HPD GND CEC_B D0+

E FB GND SCL_B D0–

F 5VOUT SW SDA_B CLK+

G PGND VBAT HPD_B CLK–

Page 11: 44963373 System Level ESD EMI Protection Guide

11System-Level ESD/EMI Protection Guide TexasInstruments2010

Key Features• ComplieswiththeHDMI1 .3and

DisplayPortdatarate

• System-levelIEC-61000-4-2(level4)ESDprotection

±8-kVcontactdischarge

• Differentialmatchingoflessthan0 .05pF

• Pincapacitancelessthan0 .8pF

• IofffeatureforTPD8S009andTPD4S009

Applications• LVDS

• HDMI/DVI

• DisplayPort

• eSATAinterface

• Seriallink

• Ethernet

• PCIExpress®

TheTPD8S009,TPD4S009andTPD4S010provideESDprotectionforhigh-speeddifferentialbusinterfaces .Thesedevicesareidealforanyhigh-speedapplicationupto6Gbps .

TheseinterfacesprovideESDprotectionwithultra-low,0 .8-pFcapacitanceforlessdistortionduringdatatransfer .Theyalsoprovideultra-lowmatchingcapacitancetohelpimprovethesignalquality .AllofthesedevicesexceptfortheTPD4S010supportIoff(backdrive)protectioncircuitswithanadditionaldiodeontheVCCline .

System-Level ESD/EMI Protection Guide

ESD Protection for High-Speed Video and Data Interface

Package options.

TPD8S009 (DSM)

TPD4S009 (PGV or DCK)TPD4S009 (DGS)

TPD4S010 (DQA)

TPD4S009 (DRY)

D0+

GND

D0–

D1+

GND

D1–

D2+

GND

D2–

D3+

GND

D3–

D1+

D1–

GND

D2+

D2–

D1+

D1–

GND

D2+

D2–

N.C.

N.C.

VCC

N.C.

N.C.

N.C.

N.C.

GND

N.C.

N.C.

VCC

N.C.

VCC

D1–

VCC

D2–

D1–

VCC

D2–

1

2

3

1

2

3

D1+

GND

D2+

D1+

GND

D2+

6

5

4

6

5

4

15

14

13

1

2

3

4

5

6

7

8

9

10

11

12

1

2

3

4

5

1

2

3

4

5

10

9

8

7

6

10

9

8

7

6

TPD8S009

TPD4S010

2

1

3

5

7

9

11

13

15

17

19

4

6

8

10

12

14

16

18

20

Core Scalar/Switch

Ultra-Low, 0.8-pF Capacitance for High-Speed Differential Interface ApplicationsTPD8S009, TPD4S009, TPD4S010

Getsamples,datasheetsandevaluationmodulesat:www.ti.com/sc/device/PARTnumber

TPD8S009 and TPD4S010 in DisplayPort application.

Page 12: 44963373 System Level ESD EMI Protection Guide

12System-Level ESD/EMI Protection Guide TexasInstruments2010

1394 Connector.

System-Level ESD/EMI Protection Guide

ESD Protection for 1394 Ports

Firewire ESD Clamp with Live-Insertion Detection Circuit

TPD4S1394

Getsamples,datasheetsandevaluationmodulesatwww.ti.com/sc/device/TPD4S1394

Key Features• IntegratedlateVgdetection

mechanismgeneratesFWPWR_ENflag

• System-levelIEC61000-4-2ESDprotectionforhigh-speedapplications

Passes8KVin1394system interface

±15-kVhumanbodymodel

• LowI/Ocapacitance

1 .5pFpincapacitance

• On-chip600-mstimerdelaymechanism

• Flow-through,single-in-linepinmapping

Applications• IEEE1394liveinsertionprotection

• LVDS

TheTPD4S1394providesarobustsystem-levelESDsolutionfortheIEEE1394portalongwithaliveinsertiondetectionmechanismforhigh-speedlinesinterfacingalow-voltage,ESD-sensitivecorechipset .Thisdeviceprotectsandmonitorsuptotwodifferentialinputpairs .Theoptimizedlinecapacitanceallowsittoprotectthedatalineswithdataratesinexcessof1 .6GHzwithoutdegradingsignalintegrity .

TheTPD4S1394incorporatesaliveinsertioncircuitwhoseoutputstatechangeswhenimpropervoltagelevelsarepresentontheinputdatalines .TheFWPWR_ENsignalcontrolsanexternalFireWireTMportpowerswitch .Duringtheliveinsertionevent,ifthereisafloatingGNDorahigh-levelsignalattheD+,D–pins,theinternalcomparatorwilldetectthechangesandpulltheFWPWR_ENsignaltolowstate .WhenFWPWR_ENisdrivenlow,thereisaninternaldelaymechanismpreventingitfrombeingdriventothehighstateregardlessoftheinputstothecomparator .

Additionally,itperformsESDprotectiononthefourinputpins:D1+,D1–,D2+andD2– .ItconformstotheIEC61000-4-2(level4)ESDprotectionand±15-kVHBMESDprotection .TheTPD4S1394ischaracterizedforoperationoverambientairtemperaturesof–40°Cto85°C .

Vcc

GND

VCLMP

FWPWR_EN

D1+

D1–

D2+

D2–

1394Controller TPD4S1394

Page 13: 44963373 System Level ESD EMI Protection Guide

13System-Level ESD/EMI Protection Guide TexasInstruments2010

System-Level ESD/EMI Protection Guide

ESD Protection for Keypads

8-Channel ESD Clamp Array

TPD8E003

Getsamples,datasheetsandevaluationmodulesatwww.ti.com/sc/device/TPD8E003

Key Features• Eight-channelESDclamparrayto

enhancesystem-levelESDprotection

• ExceedsIEC61000-4-2(level4)ESDprotection

±12-kVcontactdischarge

±15-kVair-gapdischarge

• 3 .5-Apeakpulsecurrent(8/20µsec)

• Lowbreakdownvoltageof6V

Applications• Keypad

• Touch-screeninterface

• Memoryinterface

• Dockingconnectorinterface

TheTPD8E003isanarrayofeightESDclampsinaspace-savingSON(DQD)package .Thisintegratedtransientvoltagesuppressordeviceisdesignedforapplicationsrequiringsystem-levelESDrobustness .Itisintendedforuseinspace-constrainedequipmentsuchasportablecomputers,cellphones,communicationkeypadsystemsandotherapplications .ItsintegrateddesignofferssuperiormatchingbetweenmultiplelinesoverdiscreteESDclampsolutions .

TheTPD8E003includesESDprotectioncircuitrythatpreventsdamagetotheapplicationwhensubjectedtoESDstressexceedingIEC61000-4-2(level4) .TheTPD8E003isspecifiedfor–40°Cto85°Coperation .

D2+

D2–

KeypadController

Through via (6 mils)

GND via (6 mils)

Top layer trace (4 mils wide)

Bottom layer trace (4 mils wide)

A

C

E

G

I

K

M

O

B

D

F

H

J

L

N

P

YZ

DQD Package(Top View)

IO1

IO2

IO3

IO4

IO8

IO7

IO5

IO6

1

2

GND3

4

8

7

6

5

TPD8E003DQDR at keypad interface.

Page 14: 44963373 System Level ESD EMI Protection Guide

14System-Level ESD/EMI Protection Guide TexasInstruments2010

System-Level ESD/EMI Protection Guide

EMI Filters

2-Channel EMI Filter for Audio Headphones

TPD2F702

Getsamples,datasheetsandevaluationmodulesatwww.ti.com/sc/device/TPD2F702

Key Features• 2-channelEMIfilteringforaudio

ports

AVIFconnector,headphone

• Exceedslevel4ESDprotectiononconnector

±30-kVcontactdischarge

±30-kVair-gapdischarge

• Pi-style(C-R-C)filterconfigurationwith-3-dBbandwidthat1 .2MHz(R=15Ω,CTOTAL=5000pF)

• Low10-nAleakagecurrent

• WCSPpackagesandflow-throughpinout

Applications• Mobilephones

• Headsets

• PDAs

• Portablegaming

TheTPD2F702isatwo-channelEMIfilterforaudiointerfaceapplications .Withtheintegrationofa5000-pFcapacitorinaspace-savinglow-noiseWCSPpackage,theTPD2F702offerssuperiorEMInoisesuppression(2MHzto6GHz)comparedtodiscreteimplementation .ThedeviceisoptimizedforAVIFconnectororspeakerportinterfaces .Thislow-passfilterarrayalsoprovidessystemlevelESDprotectiontoeliminatetheneedforexternalESDclamps .TheTPD2F702exceeds±30-kVratingsperIEC61000-4-2contactandair-gapspecifications .

TheTPD2F702isahighlyintegrateddevicedesignedtosuppressEMI/RFInoiseinallsystemssubjectedtoelectromagneticinterferences .ThisfilterincludesESDprotectioncircuitry,whichpreventsdamagetotheapplicationwhensubjectedtoESDsurgesfarexceedingIEC61000-4-2(level4) .

TPD2F702

Out R

Out L

SGND

5000 pf

5000 pf

Audio Amp/Audio Codec

Sample TPD2F702 application.

Frequency vs. dB for TPD2F702.

1.3 mm

0.625 mm

0.9 mm

0.9 mm

TPD2F702 YFK Package(Top View)

0.0

-5.0

-10.0

-15.0

-20.0

-25.0

-30.0

-35.0

-40.0

-45.0

-50.01.00E+05 1.00E+06 1.00E+07

Frequency (Hz)

Inse

rtio

n Lo

ss (d

B)

1.00E+08 1.00E+09

3dB drop/bias of 0.0V-3dB = 1.18 MHz

3dB drop/bias of 2.5V-3dB = 1.28 MHz

(DC Bias @ 2.5V)

Legend(DC Bias @ 0.0V)

Page 15: 44963373 System Level ESD EMI Protection Guide

15System-Level ESD/EMI Protection Guide TexasInstruments2010

System-Level ESD/EMI Protection Guide

EMI Filters

Space-Saving EMI Filters

TPDxF003

Getsamples,datasheetsandevaluationmodulesatwww.ti.com/sc/device/PARTnumber

Key Features• 4-,6-,or8-channelEMIfilterwith

greaterthan25-dBattenuationat1GHz

• System-levelIEC61000-4-2ESDprotection

±12-kVcontactdischarge

±20-kVair-gapdischarge

±15-kVhumanbodymodel

• Pi-styleC-R-Ctopologywith-3-dbbandwidthat200MHz(R=100Ω,CTOTAL=17pF)

• Flow-throughpackagelayout

• OperatingI/Ovoltagerangeupto5 .5V

• Low10-nAleakagecurrent

Applications• LCDdisplayinterface

• Keypad

• Memoryinterface

• Cellphones

• SVGAvideoconnections

• PDAs

TheTPD4F003,TPD6F003andTPD8F003arefour-,six-,andeight-channelEMIfiltersinspace-saving0 .4-mmpitchDQDpackages .Thelow-passfilterarraysreduceEMIemissionsandprovidesystem-levelESDprotection .

Becauseofitssmallpackageandeasy-to-usepinassignments,TPDxF003filtersaresuitableforawidearrayofapplications,suchasmobilehandsets,PDAs,videoconsoles,notebookcomputers,etc .Inparticular,thesefiltersareidealforEMIfilteringandprotectingdatalinesfromESDattheLCDdisplay,keypadandmemoryinterfaces .

75 mm 24 mm15 mm

34 mm 32 mm 11 mm

MemoryController

MemoryConnector

GND

SD Card26 PinMicroSD Card

ExpressCard | 34

1

GND

Ch1_Out

Ch2_Out

Ch3_Out

Ch4_Out

Ch1_In

Ch2_In

Ch3_In

Ch4_In

TPD4F003 (DQD)

1.7mm x 1.35mm x 0.75mm(0.4mm pitch)

2

3

4

8

7

6

5

1

GND

Ch1_Out

Ch2_Out

Ch3_Out

Ch4_Out

Ch1_In

Ch2_In

Ch3_In

Ch4_In

Ch5_Out

Ch6_Out

Ch5_In

Ch6_In

TPD6F003 (DQD)

2.5 mm x 1.35 mm x 0.75 mm(0.4 mm pitch)

2

3

4

12

11

10

9

5

6

8

7

1

GND

Ch1_Out

Ch2_Out

Ch3_Out

Ch4_Out

Ch1_In

Ch2_In

Ch3_In

Ch4_In

Ch5_Out

Ch6_Out

Ch7_Out

Ch8_Out

Ch5_In

Ch6_In

Ch7_In

Ch8_In

TPD8F003 (DQD)

3.3 mm x 1.35 mm x 0.75 mm(0.4 mm pitch)

2

3

4

16

15

14

13

5

6

7

8

12

11

10

9

Functional TPDxF003 board.

TPDxF003 typical use circuit.

Page 16: 44963373 System Level ESD EMI Protection Guide

16System-Level ESD/EMI Protection Guide TexasInstruments2010

Top view of TPD6F202 usage example.

System-Level ESD/EMI Protection Guide

EMI Filters

4- and 6-Channel EMI Filters for LCD Display

TPDxF202

Getsamples,datasheetsandevaluationmodulesatwww.ti.com/sc/device/PARTnumber

Key Features• Low10-nAleakagecurrent

• Ultra-thinYFUpackage

1 .06mmx1 .57mmx0 .3mm

• ExceedsIEC61000-4-2system-levelESDprotection

±25-kVcontactdischarge

±25-kVair-gapdischarge

• Pi-style(C-R-C)filterconfigurationwithgreaterthan-32dBattenuationat1GHz(R=100Ω,CTOTAL=15pF)

• Cut-offfrequencyat108MHz

Applications• LCDinterface

• Cellphones

• SVGAvideoconnections

• PDAs

TheTPDxF202isafour-andsix-channelEMIfilterinspace-savingSONpackages .Thislow-passfilterarrayreducesEMIemissionsandprovidessystem-levelESDprotection .Itisusedonmobile-phoneLCDormemoryinterfaces .Thepi-style(C-R-C)filterprovidesatleast30-dBattenuationinthecarrierfrequencyrange(800to2700MHz) .

TheTPDxF202isahighlyintegrateddevicedesignedtosuppressEMI/RFInoiseinallsystemssubjectedtoelectromagneticinterferences .ThisfilterincludesanESDprotectioncircuitrythatpreventsdamagetotheapplicationwhensubjectedtoESDstrikesuptoIEC61000-4-2(level4) .

TheTPDxF202isspecifiedfor–40°Cto85°Coperation .

DisplayController

LCD

TPD4F202YFU Packaging

(Top View)

A

B

C

D

E

F

1 2 3

TPD6F202YFU Packaging

(Top View)

A

B

C

D

E

F

G

H

I

1 2 3Pin Mapping

Pin No. Name

A1 Ch1_In

A3 Ch1_Out

B2 GND

C1 Ch2_In

C3 Ch2_Out

D1 Ch3_In

D3 Ch3_Out

E2 GND

F1 Ch4_In

F3 Ch4_Out

Pin Mapping

Pin No. Name

A1 Ch1_In

A3 Ch1_Out

B2 GND

C1 Ch2_In

C3 Ch2_Out

D1 Ch3_In

D3 Ch3_Out

E2 GND

F1 Ch4_In

F3 Ch4_Out

G1 Ch5_In

G3 Ch5_Out

H2 GND

J1 Ch6_In

J3 Ch6_Out

Page 17: 44963373 System Level ESD EMI Protection Guide

17System-Level ESD/EMI Protection Guide TexasInstruments2Q2010

TIoffersthemostrobustpackagingsolutionsforESD/EMIdevices .Withovereightpackagetypesrangingfrom0 .18mm2PicoStarTMpackagesto62mm2TSSOP,wehavepackagingsolutionsthatcanfitintoanydesign .FromthePicoStarTMpackagethatcanbeembeddedintothePCBto38-pinTSSOPdesignedforeasyboardlayout(seepage9),thereareoptionsforeverydesign .

PicoStarTM Package Solutions:Portableconsumerelectronicsdesignerscansaveboardspacewithintergratedcircuits(ICs)inthePicoStarTMpackagefromTexasInstruments .Theultra-thinpackage,aboutasthinasahumanhair,isthefirsttogivesystemdesignerstheoptiontoembedsiliconcomponentsinsidetheprintedcircuitboard(PCB)tomaximizeboardspace .Devicesinthisformfactorare50percentthinnerthansimilarchipsintraditionalpackagesandenablesmaller,thinnerendequipment .

ThePicoStarTMpackageisthinenoughtobeembeddedinsidethePCB,mountedunderaconnector,orplacedundersomediscretecomponents .Theimageshereshowthespace-savingcapabilitiesofthispackageforboard

layout .

PCB Metal Layers

<0.15 mm

1 mm

PicoStarTM Package

Normal top layer mounting

0.13 mm (height) PicoStarTM package under ceramic inductor.

0.3 mm (height) YFU package under the Zif connector.

PicoStarTM package embedded in PCB board. Height of the total PCB board is 1 mm.

TI packages for ESD/EMI solutions.

(0.8 mm x 0.8 mm)(0.6 mm x 0.3 mm)

(1 mm x 1 mm)

1

2

3

6

5

4A1 A2

B2

C2C1

(1 mm x 1 mm)

Bit Width

Pac

kag

e S

ize

(1.45 mm x 1 mm)

(1.053 mm x 2.35 mm)

(2.5 mm x 1.35 mm)

(6.5 mm x 2.5 mm)

1

2

3

12

11

10

4

5

6

9

8

7

Resources

Packaging Solutions

Page 18: 44963373 System Level ESD EMI Protection Guide

18System-Level ESD/EMI Protection Guide TexasInstruments2010

General-Purpose ESD Protection

Device

IEC61000-4-2

DiagramNo. of

ChannelsSupply Voltage

(Vdd)VBR (min)

(V)

I/O Cap(pF)

PackagesLevel 4 Protection

*TPD1E14A4 Yes

GND

IO

1 n/a -8 to +15 4 2-0201 (YFW)

TPD2E001 Yes

GND

VCC

IO 1 IO 2 2 0.9 to 5.5 11 1.5 5-SOT, 6-SON, 4-SOP

TPD2E009 Yes

GND

IO 1 IO 22 –0.3 to 6 9 0.8 3-SOT, 6-SON

TPD3E001 Yes

GND

VCC

IO 1 IO 2 IO 33 0.9 to 5.5 11 1.5 5-SOT, 6-SON

TPD4E001 Yes

GND

VCC

IO 1 IO 2 IO 3 IO 44 0.9 to 5.5 11 1.5 6-SOT, 6-SON

TPD6E001 Yes

GND

VCC

IO 1 IO 2 IO 3 IO 4 IO 5 IO 66 0.9 to 5.5 11 1.5 10-/12-QFN

*Subject to change. Call Product Information Center. See page 24 for contact information.

Resources

ESD/EMI Protection Device List

Preview products are listed in bold blue.

Page 19: 44963373 System Level ESD EMI Protection Guide

19System-Level ESD/EMI Protection Guide TexasInstruments2010

General-Purpose ESD Protection (continued)

Device

IEC61000-4-2

DiagramNo. of

ChannelsSupply Voltage

(Vdd)VBR (min)

(V)I/O Cap

(pF)PackagesLevel 4

Protection

TPD4E004 Yes

GND

VCC

IO 1 IO 2 IO 3 IO 46 0.9 to 5.5 6 1.6 6-SOT, 6-SON

TPD6E004 Yes

GND

VCC

IO 1 IO 2 IO 3 IO 4 IO 5 IO 66 0.9 to 5.5 6 1.6 8-QFN

TPD4S009 Yes D1+D2+

D1–D2–

GND

VCC

4 0.9 to 5.5 9 0.9 6-SOT, 6-SC70, 6-SON

TPD4S010 Yes

D1+

D1–

GND

D2+

D2– 4 0.9 to 5.5 9 0.9 10-QFN

TPD2E007 Yes

IO2IO1

GND

2 n/a ±14 10 4-DSLGA (YFM) 3-SC70 (3-DCK)

Resources

ESD/EMI Protection Device List

Page 20: 44963373 System Level ESD EMI Protection Guide

20System-Level ESD/EMI Protection Guide TexasInstruments2010

General-Purpose ESD Protection (continued)

Device

IEC61000-4-2

DiagramNo. of

ChannelsSupply Voltage

(Vdd)VBR (min)

(V)I/O Cap

(pF)PackagesLevel 4

Protection

TPD2EUSB30 Yes

D+D-

GND

2 n/a 9 0.7 3-SOT

TPD2S017 Yes

Ch1_Out

Ch2_Out

Ch1_In

Ch2_In

Vcc (Optional)

GND

2 0 to 5 11 1 6-SOT-23

TPD4E002 Yes

IO1 IO2 IO3 IO4

4 n/a 6 11 5-SOT

*TPD4E281 Yes

IO1

IO2 IO3

IO4

GND

4 n/a 4.5 2.5 6-PicoStarTM Package

TPD4S012 Yes

GND

D+

D-

ID

VBUS

4 –0.3 to 20D+, D-, ID

= 6 VBUS = 20

0.8 6-SON

Resources

ESD/EMI Protection Device List

*Subject to change. Call Product Information Center. See page 24 for contact information. Preview products are listed in bold blue.

Page 21: 44963373 System Level ESD EMI Protection Guide

21System-Level ESD/EMI Protection Guide TexasInstruments2010

General-Purpose ESD Protection (continued)

Device

IEC61000-4-2

DiagramNo. of

ChannelsSupply Voltage

(Vdd)VBR (min)

(V)I/O Cap

(pF)PackagesLevel 4

Protection

TPD4S1394 Yes

GND

D2+ D2- D1+ D1-VCMLP VCC FWPER_EN

4 0 to 4.6 4.2 1.5 8-SON

TPD8S009 Yes

GND

D0+D0-D1+D1-D2+D2-D3+D3-

Vcc

GND

8 –0.3 to 6 9 0.8 15-SON

Resources

ESD/EMI Protection Device List

General-Purpose EMI Protection

Device

IEC61000-4-2

DiagramNo. of

Channels

Supply Voltage

(Vdd)

VBR (min)(V)

I/O Cap(pF)

Packages-3-dB

BandwidthContact (kV)

TPD2F702 ±8IEC 6100-4-2(Level 4) ESD

IEC 6100-4-2(Level 1) ESD

30 pF

5000 pF

Ch_Out15 ΩCh_In

GND

2 ±14 15 5,000 5-WCSP 1.2 MHz

TPD4F003 ±88.5 pF

8.5 pF

Ch_Out100 Ω

Ch_In

GND

4 6 100 17 8-WSON 200 MHz

Page 22: 44963373 System Level ESD EMI Protection Guide

22System-Level ESD/EMI Protection Guide TexasInstruments2010

General-Purpose EMI Protection (continued)

Device

IEC61000-4-2

DiagramNo. of

Channels

Supply Voltage

(Vdd)

VBR (min)(V)

I/O Cap(pF)

Packages-3-dB

BandwidthContact (kV)

TPD6F002 ±20 C1 = 17 pF

C2 = 17 pF

Ch_Out100 Ω

Ch_In

GND

6 6 100 34 12-SON 100 MHz

TPD6F003 ±88.5 pF

8.5 pF

Ch_Out100 Ω

Ch_In

GND

6 6 100 17 12-WSON 200 MHz

TPD8F003 ±88.5 pF

8.5 pF

Ch_Out100 Ω

Ch_In

GND

8 6 100 17 16-WSON 200 MHz

Resources

ESD/EMI Protection Device List

ESD Protection Device List

Device IEC61000-4-2 Contact (kV)

IEC61000-4-2 Level 4

No. Of Channels  

Supply Voltage

VBR (min)(V)

I/O Capacitance (pF)

Pin/Package   Application

*TPD1E14A4 ±15 Yes 1 n/a -8 to +15 4 2-0201 (YFW) Audio, industrial, portable computer, cell phones

TPD2E001 ±8 Yes 2 0.9 to 5.5 11 1.5 4-SOP (DZD) 5-SOT (DRL) 6-SON (DRS,DRY) USB 2.0, Ethernet, FireWireTM

TPD2E007 ±8 Yes 2 n/a ±14 10 4-DSLGA (YFM), 3-SC70 (3-DCK) RS-232/RS-485, audio port

TPD2E009 ±8 Yes 2 n/a 7 0.7 3-SOP (DBZ), 3-SOT (DRT) FirewireTM, eSATA, LVDS signaling

TPD2EUSB30 ±8 Yes 2 n/a 7 0.7 3-SOT (DRT) USB 3.0

TPD2S017 ±11 Yes 2 0 to 5 11 1 6-SOT-23 (DBV) USB 2.0 High Speed

TPD3E001 ±8 Yes 3 0.9 to 5.5 11 1.5 5-SOT (DRL) 6-SON (DRS,DRY) USB OTG

TPD4E001 ±8 Yes 4 0.9 to 5.5 11 1.5 6-SON (DRS), 6-SOT (DRL) USB 2.0, Ethernet, FireWireTM, eSATA

TPD4E002 ±15 Yes 4 n/a 6.1 11 5-SOT (DLR) USB 2.0 Full Speed

*Subject to change. Call Product Information Center. See page 24 for contact information. Preview products are listed in bold blue.

Page 23: 44963373 System Level ESD EMI Protection Guide

23System-Level ESD/EMI Protection Guide TexasInstruments2010

ESD Protection Device List (continued)

Device IEC61000-4-2 Contact (kV)

IEC61000-4-2 Level 4

No. Of Channels  

Supply Voltage

VBR (min)(V)

I/O Capacitance (pF)

Pin/Package   Application

TPD4E004 ±8 Yes 4 0.9 to 5.5 6 1.6 6-SON (DRY) USB 2.0 High Speed, Ethernet, FireWireTM, eSATA

*TPD4E281 ±8 Yes 4 n/a 4.5 2.5 6-PicoStarTM Package (YFM) Memory, USB 2.0 High Speed

TPD4S009 ±8 Yes 4 0 to 5.5 9 0.810-MSOP (DGS) 

6-SC-70 (DCK), 6-SON (DRY), 6-SOT-23 (DBV)

eSATA, LVDS signaling, HDMI

TPD4S010 ±8 Yes 4 n/a 9 0.8 6-SON (DQA) eSATA, LVDS signaling, HDMI

TPD4S012 ±10 Yes 4 0 to 20 D+, D-, ID = 6 VBUS = 20 0.8 6-SON (DRY) USB 2.0 High Speed (charging

applications)

TPD4S1394 **±8 Yes 4 0 to 4.6 4.2 1.5 8-X2SON (DQL) 1394/FireWireTM

TPD6E001 ±8 Yes 6 0.9 to 5.5 11 1.5 10-UQFN (RSE), 12-WQFN (RSF)

USB 2.0, Ethernet, FireWireTM, eSATA

TPD6E004 ±8 Yes 6 0.9 to 5.5 6 1.6 8-UQFN (RSE) USB 2.0, Ethernet, FireWireTM, eSATA

TPD7S019 ±8 Yes 7 0 to 5.5 9 2.5 16-SSOP (DBQ),16-UQFN (RSE) VGA DisplayPort

TPD8E003 ±12 Yes 8 n/a 6 7 8-WSON (DQD) Keypad, touch-screen interface,Memory, SDIO, SIM card

TPD8S009 ±8 Yes 8 0 to 55 9 0.8 15-SON (DSM) HDMI, DisplayPort, LVDS signaling

TPD12S015 ±8 Yes 12 2.3 to 5.5 9 1.3 28-DSBGA (YFP) HDMI Class C/D connector

TPD12S520 ±8 Yes 12 0 to 5.5 9 0.8 38-TSSOP (DBT) HDMI receiver port

TPD12S521 ±8 Yes 12 0 to 5.5 9 0.8 38-TSSOP (DBT) HDMI transmit port

Resources

ESD/EMI Protection Device List

*Subject to change. Call Product Information Center. See page 24 for contact information. Preview products are listed in bold blue.**Passes 8 KV in 1394 system interface.

EMI Protection Device List

DeviceAir-Gap

(kV)Contact

(kV)No. of

ChannelsVBR (min)

(V)Rline (typ)

(Ohms)  Ctotal (typ)

(pF)  Pin/Package

-3-dB Bandwidth

Application

TPD2F702 ±30 ±30 2 ±14 15 5,030 5-WCSP (YFK) 1.2 MHz Audio

TPD4F003 ±20 ±12 4 6 100 17 WSON (8-DQD) 200 MHz Memory, LCD display, keypad

TPD4F202 ±25 ±25 4 6 100 30 DSBGA (10-YFU) 108 MHz Memory, LCD display, keypad

TPD6F002 ±30 ±20 6 6 100 34 SON (12-DSV) 100 MHz Memory, LCD display, keypad

TPD6F003 ±20 ±12 6 6 100 17 WSON (12-DQD) 200 MHz Memory, LCD display, keypad

TPD6F202 ±25 ±25 6 6 100 30 DSBGA (15-YFU) 108 MHz Memory, LCD display, keypad

TPD8F003 ±20 ±12 8 6 100 17 WSON (16-DQD) 200 MHz Memory, LCD display, keypad

TPD3F303 ±15 ±8 3 6 47 20 SON (8-DQD) 300 MHz SIM interface

TPD6F301 ±15 ±8 6 6 45 12 SON (16-DQD) 300 MHz SDIO interface

Preview products are listed in bold blue.

Page 24: 44963373 System Level ESD EMI Protection Guide

PRSRTSTDU .S .POSTAGE

PAIDDALLAS,TEXAS

PERMITNO .2758

14950F .A .A .Blvd .FortWorth,Texas76155

Addressservicerequested

SSZB130A

TI Worldwide Technical SupportInternetTI Semiconductor Product Information Center Home Pagesupport.ti.comTI E2ETM Community Home Pagee2e.ti.com

Product Information CentersAmericas Phone +1(972)644-5580

Brazil Phone 0800-891-2616

Mexico Phone 0800-670-7544

Fax +1(972)927-6377 Internet/Email support.ti.com/sc/pic/americas.htm

Europe, Middle East, and AfricaPhone

EuropeanFreeCall 00800-ASK-TEXAS (0080027583927)

International +49(0)8161802121

RussianSupport +7(4)959810701

Note:TheEuropeanFreeCall(TollFree)numberisnotactiveinallcountries.Ifyouhavetechnicaldifficultycallingthefreecallnumber,pleaseusetheinternationalnumberabove.

Fax +(49)(0)8161802045Internet support.ti.com/sc/pic/euro.htm

JapanPhone Domestic 0120-92-3326Fax International +81-3-3344-5317 Domestic 0120-81-0036Internet/Email International support.ti.com/sc/pic/japan.htm Domestic www.tij.co.jp/pic

AsiaPhone International +91-80-41381665 Domestic Toll-FreeNumber Australia 1-800-999-084 China 800-820-8682 HongKong 800-96-5941 India 1-800-425-7888 Indonesia 001-803-8861-1006 Korea 080-551-2804 Malaysia 1-800-80-3973 NewZealand 0800-446-934 Philippines 1-800-765-7404 Singapore 800-886-1028 Taiwan 0800-006800 Thailand 001-800-886-0010Fax +886-2-2378-6808Email [email protected]

[email protected] support.ti.com/sc/pic/asia.htm

B121709

Important Notice:TheproductsandservicesofTexasInstrumentsIncorporatedanditssubsidiariesdescribedhereinaresoldsubjecttoTI’sstandardtermsandconditionsofsale.CustomersareadvisedtoobtainthemostcurrentandcompleteinformationaboutTIproductsandservicesbeforeplacingorders.TIassumesnoliabilityforapplicationsassistance,customer’sapplicationsorproductdesigns,softwareperformance,orinfringementofpatents.Thepublicationofinformationregardinganyothercompany’sproductsorservicesdoesnotconstituteTI’sapproval,warrantyorendorsementthereof.

©2010TexasInstrumentsIncorporatedPrintedinU.S.A.by(Printer,City,State)

TheE2ECommunity,platformbarandPicoStararetrademarksofTexasInstruments.Allothertrademarksarethepropertyoftheirrespectiveowners.

Page 25: 44963373 System Level ESD EMI Protection Guide

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers shouldobtain the latest relevant information before placing orders and should verify that such information is current and complete. All products aresold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standardwarranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except wheremandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers should provideadequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license from TI to use such products or services or awarranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectualproperty of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompaniedby all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptivebusiness practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additionalrestrictions.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids allexpress and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is notresponsible or liable for any such statements.

TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonablybe expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governingsuch use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, andacknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their productsand any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may beprovided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products insuch safety-critical applications.

TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely atthe Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products aredesignated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designatedproducts in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Amplifiers amplifier.ti.com Audio www.ti.com/audio

Data Converters dataconverter.ti.com Automotive www.ti.com/automotive

DLP® Products www.dlp.com Communications and www.ti.com/communicationsTelecom

DSP dsp.ti.com Computers and www.ti.com/computersPeripherals

Clocks and Timers www.ti.com/clocks Consumer Electronics www.ti.com/consumer-apps

Interface interface.ti.com Energy www.ti.com/energy

Logic logic.ti.com Industrial www.ti.com/industrial

Power Mgmt power.ti.com Medical www.ti.com/medical

Microcontrollers microcontroller.ti.com Security www.ti.com/security

RFID www.ti-rfid.com Space, Avionics & www.ti.com/space-avionics-defenseDefense

RF/IF and ZigBee® Solutions www.ti.com/lprf Video and Imaging www.ti.com/video

Wireless www.ti.com/wireless-apps

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2010, Texas Instruments Incorporated