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June 2002 1 Illin ois Task 2: Modeling and Simulation of Conducted and Radiated EMI from HPM and UWB Sources on PCBs and ICs A. C. Cangellaris and E. Michielssen ECE Department Center for Computational Electromagnetics University of Illinois at Urbana- Champaign

A. C. Cangellaris and E. Michielssen ECE Department Center for Computational Electromagnetics

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Task 2: Modeling and Simulation of Conducted and Radiated EMI from HPM and UWB Sources on PCBs and ICs. A. C. Cangellaris and E. Michielssen ECE Department Center for Computational Electromagnetics University of Illinois at Urbana-Champaign. EMI to connectors & packages. Antennas Cracks - PowerPoint PPT Presentation

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Page 1: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 1

Illinois

Task 2: Modeling and Simulation of Conducted and Radiated EMI from HPM and UWB Sources on PCBs and ICs

A. C. Cangellaris and E. Michielssen ECE Department

Center for Computational ElectromagneticsUniversity of Illinois at Urbana-Champaign

Page 2: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 2Illinois

Accurately “propagate” the spurious signals (noise) through the packaging hierarchy (printed circuit boards, cards, connectors, interposer, package…) to the die.

HPM/UWBSources

AntennasCracks

AperturesCables

Propagationto interior

InternalCoupling

EMI to connectors &

packages

Internal fields as radiated EMI

Circuits

Spuriousbehavior

Objective

Page 3: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 3Illinois

Major Obstacle: Tackling System Complexity

Courtesy of Qualcomm

Page 4: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 4Illinois

EM Complexity– Geometric complexity and distributed nature of the

packaging hierarchy (“coupling path”)– Broad frequency bandwidth of the interfering signal– Non-linearity of the terminations

Tackling Complexity– Hierarchical approach to the modeling of

electromagnetic interactions• From lumped models, to transmission-line models, to

quasi-3D full-wave models, to 3D full-wave models Abstracting Complexity

– Systematic order reduction of numerical models of the coupling path

– Equivalent circuit representation of the coupling path for its seamless incorporation in network-oriented non-linear circuit simulators

System Complexity translates to EM Complexity

Page 5: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 5Illinois

Integrating Substrate

(PCB, MCM, …)

Packageddigital & analogdevices

Conducted& radiated

EMI

Radiated EMIVirtual couplingports

Physical coupling ports (e.g., connectors, cables…)

EM Modeling & Simulation

Model Order ReductionSynthesis

V

V

Network representation

of thecoupling

path

Sourcerepresentationof conductednoise at thephysical ports

Equivalent sourcerepresentation ofradiated EMI coupling

Non-linearlumped circuits

SUMMARY OF MODELING OBJECTIVE

Page 6: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 6Illinois

Specific Subtasks

Task 2.1 Development of a coupling path modeling methodology

Task 2.2 Development of a (EMI) source modeling methodology

Task 2.3 Non-linear Transient Simulation of the hybrid lumped-distributed non-linear network

Page 7: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 7Illinois

Subtask 1: Modeling of the Coupling Path

Printed Circuit Board

Package

Chip

IBM Corporation

Page 8: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 8Illinois

Our modeling approach is hierarchical– EM-Physics driven “divide and conquer” approach

Use suitable EM modeling approach for individual blocks– RLC models for short interconnect at chip & package level– Multi-conductor Transmission Lines (MTL)

• Balanced interconnects at the board level– Quasi-3D EM Modeling for PCB power delivery network– Full-wave modeling

•Unbalanced interconnects at the board level•Coupling through cables•RF/microwave packages & boards

Reduction of EM models to non-linear network simulator (e.g. SPICE)

– Direct model order reduction– Equivalent circuit synthesis

Subtask 1: Modeling of the Coupling Path (Cont)

Page 9: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 9Illinois

Block Diagram of EM Modeling Flow

Page 10: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 10Illinois

1

1( ( 1, ) ( , ))

( ( , 1) ( , ))

( , )z y y

x x

j xE H i j H i j

y H i j H i j

i j

( , ) ( , ) ( , 1)

( , ) ( , ) ( 1, )

z z

z z

x

y

j y

j x

H i j E i j E i j

H i j E i j E i j

Quasi-3D Modeling of Power Delivery Network

EM field between power/ground plane pairs exhibits, approximately, a two-dimensional variation• Use simple 2D FDTD Three-dimensional features (vias, pins,slots, voids, etc) require locally 3Dmodels to capture the correct physics

Page 11: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 11Illinois

I

V

-1

-1

( ) ( )( ),

( ) ( )

The multiport transfer function is:

( ) ,

( )

T

T

T

s ss s

s s

s s s where

s s

T

G D E C 0 EFU V = F X

D R H 0 L H

Y

C 0G -DV = F A + B FU( ) A = B =0 LD R

= F A + B F

The resulting discrete EM model

• Direct time-domain simulation is possible if desired• Could be synchronized with time-domain IE solver

• Alternatively, model order reduction of the transfer function using an Arnoldi-based subspace iteration method (PRIMA)

is used for the generation of a compact multiport

Page 12: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 12Illinois

11 1

1

( )

1 1

1 1

Nk k

k k

N NNk k

k k

R R

s

M M

k k

M M

k k

s P s P

R Rs P s P

Y

Multi-port representation of the reduced-order model is in terms of rational functions

Form compatible with circuit simulators that support rational function models (e.g. H-Spice, ADS)

Equivalent circuit synthesis is possible also

Page 13: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 13Illinois

0

0

01

For a passive, reciprocal multi-port, its admittance (or impedance)

matrix may be cast in the following form:

where it is:

Re{ } 0, 1,2, .

matrices

)

n

(

a d

Qq q

qq

q

q q

a as s

s

p q

s

Q

p p

C

H G C G

, 0,1, 2,..., , are real and

positive semi-definite

Re{ } 0, 1,2, .

0<Im{ }Im{ } Re{ }Re{ } , 1, 2, .

q

q

q q q q

q Q

a q Q

a p a p q Q

G

Passive synthesis through Foster forms

Page 14: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 14Illinois

Equivalent circuit for a two-port

Page 15: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 15Illinois

Two-port sub-circuit for use in H-SPICE

Page 16: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 16Illinois

3 ports 10 ports 36 ports

H-SPICE 0.7 sec 5.73 sec 21.2 min

Equivalent 2.3 sec676.55

sec>12

hours

3 ports 10 ports 36 ports

H-SPICE 25.9 KB 53.4 KB 172 KB

Equivalent 308.2 KB 269 MB >2 GB

Elapsed Simulation Time

Transient Data File Size

The advantages of the direct use of the rational function macro-model in the simulator

The secret is in the recursive convolution that is utilized for the interfacing of the macro-model with the rest of the circuit

Page 17: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 17Illinois

|Z21| From H-SPICE

8 cm X 4 cm, 4 layer board. A 2mm gap is present all the way across the top ground plane. A total of 58 pins are used.

Top view

Cross-sectional view

Application to a 4-layer PCB

Page 18: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 18Illinois

H-SPICE calculation of the transient response. Switching occurs at port 1 while port 2 is terminated with 50ohm. Voltage at port 1 is depicted by the solid line. Voltage at port 2 is depicted by the dotted line.

Application to a 4-layer PCB (cont’d)

Page 19: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 19Illinois

Intel 4-layer test board

1st layer: Power plane

2nd layer: Ground plane

3rd layer: Ground plane

4th layer: Power plane

Validation study in progress

Page 20: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 20Illinois

Samples of the generated mesh

Page 21: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 21Illinois

Generated multi-port for switching noise simulation in SPICE

Page 22: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 22Illinois

Rational function multi-port & equivalent circuit synthesis from raw data

Data either from measurements or EM field solvers Step 1: Rational function fitting

– Process guarantees stability but not passivity

– Check fitted multi-port for passivity• If not passive, constrain fitting using Foster

constraints

•Repeat fitting

Page 23: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 23Illinois

Validation of rational function fitting

PCB interconnect test structures courtesy of Intel

Page 24: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 24Illinois

Validation of fitting (cont’d)

Measured |Y61|* Synthesized |Y61|

(*) Measurements courtesy of Intel Corporation

Page 25: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 25Illinois

EM modeling flow for the coupling path established

Quasi-3D EM Model for power delivery network completed

– Validation in progress– Further enhancements include:

• Incorporation of hooks for balanced MTLs• Incorporation of hooks for matrix transfer functions in

Foster form Capability for SPICE-compatible broadband

multi-port macro-model generation in place

Task 2.1 Summary

Page 26: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 26Illinois

Subtask 2.3: Non-linear Transient Simulation

Full wave modeling of printed circuit boards (PCBs) with fine geometric features, finite (and possibly inhomogeneous) dielectrics, and nonlinear loads and circuits

Interfaces with SPICE solvers and models

Physics-oriented nonlinear transient simulator

17.5 cm

4.5 cm

25 cm

25 cm

10 cm

1 cm

20 cm

30 cm

30 cm

15 cm

15 cm

1 cm

Page 27: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 27Illinois

Introduction (cont.)

Time Domain Integral Equation (TDIE) based Marching-on-in-time (MOT) solvers

Have been known to the acoustics and electromagnetics communities since the sixties.

Compared to frequency domain solvers, they can solve nonlinear problems directly.

Liu and Tesche (1976), Landt and Miller (1983), Djordjevic and Sarkar (1985), Deiseroth and Singer (1995), Orlandi (1996)

25 cm

25 cm

5 cm

17.5 cm

10 cm

1 cm

20 cm

4.5 cm6 cm 0.5

cm

varistorvaristor

Page 28: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 28Illinois

Introduction (cont.)

Now, we can / should be able to rapidly solve large -scale, nonlinear problems using the PWTD technology!!!

Unstable: … But recently many proposals have surfaced for stabilizing these schemes (Davies, Rao and Sarkar, Walker, Smith, Rynne,…);

Slow: … Computational complexity has prohibited application to analysis of large scale problems! … PWTD technology removes this computational bottleneck

However TDIE - MOT solvers have long been conceived as

O N NT S2c h

2( log )T S SO N N N

Page 29: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 29Illinois

( , )exc tE r( , )r tE r

Formulation - Problem Definition

Given an of 3-D inhomogeneous dielectric

bodies (V ), and 3-D arbitrarily shaped PEC surfaces, wires, and surface-wire junctions (S ),

Multiple linear / nonlinear lumped circuits connected to

a temporally bandlimited excitation

ckt 1

ckt m

interconnect geometry

S V

S V

lumpedlumpeddistributeddistributed

Solve for all transient currents and voltages

induced on the interconnect geometry

and the the circuits (ckt 1, …, ckt m)

radiated electric and/or magneticfields if required

S V

Page 30: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 30Illinois

2

0

, , ,t

r t t c dt tt

E r A r A r

,R r r

0 ( ) ( )( , ) ( , ) ( , ) ,

4 PEC DIEL

S V

t R c t R ct ds t dv t

R R

A r J r J r

Assume spatially-variable, frequency independent permittivity and free-space permeability in V, and thin wires in S .

0( , ) ( ( ) ) ( , )totalDIEL t t

t

J r r E r

(1)(1)

(2)(2)

Formulation – Time Domain Electric Field

( , )exc tE r

0 ( ) r

( , )r tE r

V

0

0 S

PECPEC

( ) rRadiated electric field:

Page 31: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 31Illinois

Expand current as1 0

( , ) ( ) ( ), , , ,S TN N

j qn n j

n j

S PEC DIEL

t I T t q s w sw d

N N N

J r f r

Surface and Volume Spatial Basis Functions

np

np

nV

nV

na

Formulation - MOT Algorithm

The temporal basis functions are local cubic polynomials

n

rnp

np

nT

nT

1

ˆns 1ˆns

nu 1nu nr

1nr1nr

kp

1A2A3A

rkT

Page 32: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 32Illinois

1

01

jexc

j j l j ll

Z I V Z I

unknownstested

incident field

previously computed

delayed interactions

immediate interactions

Construct a system of equations by applying spatial Galerkin testing at each time step.

for the j’th time step:

Formulation - MOT Algorithm (cont.)

Page 33: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 33Illinois

Formulation - Transient Circuit Simulator

SPICE-like transient circuit simulator

Performs linear and nonlinear large-signal analysis using Modified nodal analysisNonlinear equations solved using multi-dimensional

Newton Incorporates the following circuit elements: Independent/dependent voltage and current sources Resistors, inductors, capacitors Diodes, BJTs, MOSFETs, MESFETs

AC

DC

Page 34: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 34Illinois

Circuit behavior described by time-domain nodal equations (using trapezoidal rule for the jth time step)

0 1 1exc

j j j G V I G V

Formulation - Transient Circuit Simulator (cont.)

For m circuits, the nonlinear system of equations is

1 1 1 1,10 1 1

0 1 1,

0 1 1

excj jj

excj j j

exc mm m m mjj j

G V G VI

G V I G V

IG V G V

immediate interactions interactions from

previous time stepsourcesunknowns

previously computed

Page 35: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 35Illinois

1

01

01 1

0

0

jexcj l j ljv

l

j j excij j

V Z IIZ C

V G VCI G V

Formulation - Coupled EM / Circuit Equations

Combine the EM and circuit nodal equations into a single consistent system to be solved for EM and circuit unknowns at each time step

Coupling between the circuits and the interconnect structure is accounted for by matrices and

vC iC

SN CN

Page 36: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 36Illinois

Formulation - the MLPWTD Algorithm

SS

Level

Source block

Observer block

Direct(0) 1 2:

:

:

2( log )T S SO N N N1

01

j

excj j l j l

l

Z I V Z I

for typical PCB for typical PCB structuresstructures

Page 37: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 37Illinois

Analysis of Active Nonlinear Microwave Amplifier

Geometry

Objective Simulation Parameters

Characterize structure from 2-10 GHz

1468, 7096

8564, 512

5.0 ps

s v

s v t

N N

N N N

t

5080

110

70

31

90180

150

Input port

Output portDevice region

Ground plane

Dielectric constant = 2.33

2 220 0( , ) cos( )inc tt V t e V r

90 2 6 10 rad/s

116 , 6.82 10 st t

Excitation pulse

Page 38: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 38Illinois

MESFET Circuit Model

2 30 1 2 3( , ) ( ) tanh( )ds gs ds gs gs gs dsI v v A A v A v A v v

0( )1 /

gsgs c

c b

CC v

v

G0 .5

C gs0

1 .0

0.2 p F0.05 nH

Ids 0.6 p F

0 .7

0 .5 0.05 nH

0.1 nH

D

S

Vc

Amplifier : Nonlinear circuitry

Page 39: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 39Illinois

MOT results*

0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2-1

-0.5

0

0.5

1

1.5

2

time (ns)

ampl

itude

(V

)

Input port voltage Output port voltage

Transient input/output waveforms

2 3 4 5 6 7 8 9 10-20

-15

-10

-5

0

5

10

15

20

Frequency (GHz)

dB

S21 - MOTS11 - MOTS21 - REFS11 - REF

* C. Kuo, B. Houshmand, and T. Itoh, “Full-wave analysis of packaged microwave circuits with active and nonlinear devices: an FDTD approach,” IEEE Trans. Microwave Theory Tech., vol. 45, pp. 819-826, May 1997.

Amplifier: Plane Wave Interference

Page 40: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 40Illinois

Geometry

Objective Simulation Parameters

Determine effect of shielding box on S-parameters

PEC shielding box(640x186x690mils

)

3288, 7096

10384, 700

6.25 ps

s v

s v t

N N

N N N

t

Amplifier + Shield: geometry

Page 41: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 41Illinois

2 3 4 5 6 7 8 9 10-20

-15

-10

-5

0

5

10

15

20

frequency (GHz)

dB

S21 - WITH SHIELDS11 - WITH SHIELDS21 - NO SHIELD S11 - NO SHIELD

Amplifier + Shield: S-parameters

Page 42: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 42Illinois

Amplifier + Shield: Plane Wave Interference

2 220 0( , ) cos( )exc tt t e E r E

0 ˆ ˆ500 500 V m E x y

ˆ6 ( )t t c z r

Transient response at transistor output

90 2 6 10 rad/s

118.68 10 s

excE

0 0.5 1 1.5 2 2.5 3-0.6

-0.4

-0.2

0

0.2

0.4

0.6

0.8

1

Vol

tage

(V

)

Time (ns)

DG ONLY DG+PLANE-WAVE DG+PLANE-WAVE+SHIELD

Page 43: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 43Illinois

Transient response at transistor output

excE

2 220 0( , ) cos( )exc tt t e E r E

ˆ6 ( )t t c k r

90 2 4 10 rad/s

1/ 4 ns

145, 0i i

ˆ ˆ ˆ0.5736 0.8192 k x y

500 V/m, 500 V/mE E

Amplifier + Shield: Plane Wave Interference

Page 44: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 44Illinois

Transient response at transistor output

excE

2 220 0( , ) cos( )exc tt t e E r E

90 2 3 10 rad/s

3/14 ns

115, 45i i ˆ ˆ ˆ ˆ0.6409( ) 0.4226 k x y z

500 V/m, 500 V/mE E

ˆ6 ( )t t c k r

Amplifier + Shield: Plane Wave Interference

Page 45: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 45Illinois

2 220 0( , ) cos( )exc tt t e E r E

ˆ6 ( )t t c k r

Transient response at transistor output

90 2 6 10 rad/s

3/11 ns

excE

180, 0i i ˆ ˆk z

500 V/m, 500 V/mE E

Amplifier + Shield: Plane Wave Interference

Page 46: A. C. Cangellaris and E. Michielssen  ECE Department Center for Computational Electromagnetics

June 2002 46Illinois

1) A MOT algorithm based on a hybrid surface/volume time domain integral equation has been developed for analysis of conducting/ inhomogeneous dielectric bodies,

2) This algorithm has been accelerated with the PWTD technology that rigorously reduces the computational complexity of the MOT solver to for typical PCB structures,

3) Linear/Nonlinear circuits in the system are modeled by coupling modified nodal analysis equations of circuits to MOT equations,

4) A nonlinear Newton-based solver is used at each time step to consistently solve for circuit and electromagnetic unknowns.

5) The proposed method can find extensive use in EMC/EMI and signal integrity analysis of PCB, interconnect and packaging structures with realistic complexity.

Task 2.3: Summary

2( log )T S SO N N N

2( )T SO N N