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Application oriented micro-nano electro me chanical systems Masayoshi Esashi New Industry Creation Hatchery Center, Tohoku University, Sendai, Japan . Introduction . Electrostatically levitated rotational gyrosc ope . MEMS relay . Multi probe data storage . Electron field emitter array using carbon nano tube for multi-column electron beam lithograph y . Monolithic stage . Micro Molding for Harsh Environment

Application oriented micro-nano electro mechanical systems Masayoshi Esashi

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Application oriented micro-nano electro mechanical systems Masayoshi Esashi New Industry Creation Hatchery Center , Tohoku University, Sendai , Japan Ⅰ. Introduction Ⅱ. Electrostatically levitated rotational gyroscope Ⅲ. MEMS relay Ⅳ. Multi probe data storage - PowerPoint PPT Presentation

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Page 1: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Application oriented micro-nano electro mechanical systems

Masayoshi Esashi

New Industry Creation Hatchery Center, Tohoku University, Sendai, Japan

Ⅰ. Introduction

Ⅱ. Electrostatically levitated rotational gyroscope

Ⅲ. MEMS relay

Ⅳ. Multi probe data storage

Ⅴ. Electron field emitter array using carbon nanotube for multi-column electron beam lithography

Ⅵ. Monolithic stage

Ⅶ. Micro Molding for Harsh Environment

A. Silicon lost mold process for SiC microstructure

B. SiC microstructures for glass press molding

Ⅷ.Conclusions

Page 2: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

MEMS process facility for 20 mm wafer

Page 3: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Vibrating gyroscope (yaw rate sensor) for vehicle stability control

Page 4: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Resonating gyroscope fabricated using Si deep RIE

Si deep RIE system(M.Takinami, 11th Sensor Symposium, (1992) p.15)

Page 5: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Ⅱ. Electrostatically levitated rotational gyroscope

Page 6: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Electrostatically levitating micromotor for rotational gyroscope (disk rotor type)

(T.Murakoshi (Tokimec Inc.) et.al., Transducers’99)

Page 7: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Electrostatically levitating micromotor for rotational gyroscope (disk rotor type)

(T.Murakoshi (Tokimec Inc.) et.al., Transducers’99)

Page 8: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

10mm

Electrostatically levitating micromotor for rotating gyroscope

Page 9: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Max 20,000 rpm5mm

Page 10: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Rotor position is capacitively detected and voltage is applied to electrode

(T.Matsubara et.al., Transducers’93, 50-53)

Page 11: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Electrostatically levitating micromotor for rotational gyroscope (ring rotor type) (Control voltage < 15 V)(T.Murakoshi et.al. : Jpn. J. Appli. Phys., 42, Part1 No.4B (2003) pp.2468-2472)

Page 12: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Structure of electrostatically levitated ring rotor gyroscope

Page 13: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Fabrication process of electrostatically levitating micromotor for rotational gyroscope (ring rotor type)

Rotor

Gap 5μm(100μm deep)

Lateral control electrode

Page 14: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

4mm ring : 12,000 rpm (1mm ring : 100,000 rpm)

Page 15: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Inertia measurement system for 2-axis rotation and 3-axis acceleration

Noise floor

Gyro : 0.002 deg/s/√Hz

Accelerometer : 10μG/ √Hz

Rotor

MESAG-1 (Micro Electrostatically Suspended Accelerometer Gyro)

Page 16: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Integrated capacitive pressure sensor

Circuit integration

(T.Kudoh et.al., Sensors and Actuators A,29 (1991) p.185-193)

Page 17: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

MEMS is value added but small volume

→ Hard to commercialize because of

the high cost.

(70% of the MEMS cost is packaging

and test)

Wafer level packaging

→ low cost (minimization of assembly

investment and loss in test)

→ small size (chip size encapsulation)

→ high yield (protection of MEMS

structures during dicing)

→ reliability (hermetic sealing)

Page 18: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

MEMS relay having electrical feedthrough made by RIE and electroplating (Y.Liu et.al., MEMS’01)

Page 19: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Partly removed

Micro spring contact

Packaged micro relay

High reliability (>107)

Page 20: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Application for LSI tester

(A.Nakamura et.al.,Advantest Technical Report, 22 (2004), 9-16)

5mm4mm

Driving power <160mW (6V)

On resistance <0.3Ω

Operation speed

<3ms

Life of contact 8×107( 3V-15mA)>20GHz

Page 21: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Multi probe data storage   Conventional hard disk

Ⅳ. Multi probe data storage

Page 22: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Structure of the multiprobe data storage (D.W.Lee et.al., J. of Microelectromechanical Systems, 11, 3 (2002), 215-219)

Recording media

Page 23: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Conductance image of the recorded bits on thin GeSbTe (phase change media) (2m2m)

Page 24: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Diamond Probe for Ultra-High-Density Data Storage Based on Scanning Nonlinear Dielectric Microscopy

(H.Takahashi (Pioneer Corp.), T.Ono, Y.Cho and M.Esashi (Tohoku Univ.) MEMS’04 (2004) p.536)

Page 25: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

N S + +-

Domain of ferromagnetics Domain of ferroelectrics

Pr

Pr

Pr

Bloch wall~50nm

Single lattice domain wall

Advantageous to record nano-size domain array

N

N

SNDM   (Scanning Nonlinear Dielectric Microscopy)

(Y.Cho, Rev. Sci. Instrum. 67, (1996) p.2297)

Page 26: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

The diamond probe array.

The end of the diamond probe. 800nm

Recording medium

LiTaO3 Thickness: 60nmWriting condition

DC Pulse: 15 V Width: 1 ms

Reading condition

AC voltage: 2.5V Frequency: 10kHz

FM signal frequency: around 1.3GHz

Page 27: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Conductance modification of conductive polymer

(T.Ono et.al., Nanotechnology, 14 (2003) pp.1051-1054)

Page 28: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

(T.Ono et.al., Nanotechnology, 14 (2003) pp.1051-1054)

・ Scan speed 10m/sec

・ Recording voltage 10V

・ Reading voltage  0.4V

Dot diameter 150nm

Recording on a conductive polymer (doped polyaniline) film

Conductance is decreased by 20 times after recording.

Current image (5m×5m)

Page 29: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Current after writing

Page 30: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Ⅴ. Electron field emitter array using carbon nanotube for multi-column electron beam lithography

Page 31: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Concept of Multi-Column Electron Beam Lithography

Page 32: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Electron field emitter array with electrostatic lens

(P.N.Minh, MEMS’04

(2004), p.430)

Page 33: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Fabrication of electron field emitter array with electrostatic lens

CNT electron field emitter

Page 34: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Hot filament CVD of carbon nano tube

(H.Miyashita et.al. MEMS'2001)

Page 35: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Electron field emitter with carbon nano tube deposited at the Si apex

(P.H.Minh et.al. , J. Vac. Sci. Technol. B 21, 4, (2003), 1705-1709)

Page 36: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Effect of hydrogen treartment (Fowler-Nordheim plot)

Page 37: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Stability of carbon nanotube field emitter

Page 38: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Ⅵ. Monolithic stage

Page 39: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Monolithic stage fabricated from a PZT plate

(D.-Y.Zhang et.al., Digest of Technical Papers, Transducers'03, Boston (2003) 1518-1521)

Monolithic X-Y stage

Page 40: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

X/Y Motion

Amplification factor L/W

Rotation around Z axis Z motion

Page 41: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Elongation vs. Applied Voltage of bimorph PZT actuator

0.0

0.5

1.0

1.5

2.0

2.5

3.0

0 20 40 60 80 100 120Applied Voltage (V)

Dis

pla

cem

ent

(um

)

L

Z

-12.0

-10.0

-8.0

-6.0

-4.0

-2.0

0.0

0 20 40 60 80 100 120

Dis

pla

cem

ent

(um

)

Applied Voltage (V)

Bending vs. Applied Voltage of bimorph PZT actuator

Page 42: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Ⅶ. Micro Molding for Harsh Environment

A. Silicon lost mold process for SiC microstructure

B. SiC microstructures for glass press molding

Page 43: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Si lost mold process for SiC microstructure.

(reaction sintering condition : 1700°C, 100MPa)(S.Sugimoto et.al., MEMS’2000)

Page 44: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

SiC micro turbine made by the Si lost mold process

Page 45: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Gray scale exposure by exposing with programmed multiple patterns Surface profile of resist

Mask less exposure system using DMD (Ball Semiconductor INC.)

Micro lens array fabricated

(K.Totsu et.al., Sensor Symposium, Late news (2004/10/14))Gray scale mask-less exposure

Page 46: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Fabrication of SiC mold for glass mold press (T.Itoh et.al., Transducers'03, (2003) p.25

4)

Page 47: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

SiC mold for glass mold press

(non-spherical lens)(K.-O.Min et.al.,The 21th Sensor Symposium, Kyoto (2004/10/14-15))

Page 48: Application oriented micro-nano electro mechanical systems Masayoshi Esashi

Wafer level packaging

Multiprobe data storage

Electrical feedthrough in glass

MEMS relay

SIP (System In Package) MEMS

Ⅷ.Conclusions

SiC mold for glass mold press

Electrostatically levitated rotational gyroscope

Monolithic stage