Electronics without silicon is unbelievable. Today, we are using silicon for the

manufacturing of Electronic Chip's. But, it has many disadvantages , when it is

used in power electronic applications, such as bulk in size, slow operating speed etc.

Silicon chip, which has supplied several decades’ worth of remarkable increases in computing power and speed, looks unlikely to be capable of sustaining this pace for more than another decade .

Carbon, Silicon and Germanium belong to the same group in the periodic table.

They have four valance electrons in their outer shell.

Pure Silicon and Germanium are semiconductors in normal temperature.

So in earlier days they were used widely for the manufacturing of electronic components.

But later it was found that Germanium has many disadvantages compared to silicon, such as large reverse current, less stability towards temperature etc.

So the industry focused in developing electronic components using silicon wafers.

Now research people found that Carbon has more advantages than Silicon.

By using carbon as the manufacturing material, we can achieve smaller, faster and stronger chips.

In single definition, Diamond Chip or carbon Chip is an Electronic Chip manufactured on a Diamond structural Carbon wafer.

OR It can also be defined as the Electronic

Chip manufactured using carbon as the wafer. 

Firstly, diamond structural carbon is non-conducting in nature.

To make it conducting - doping process is performed. Boron--as the p-type doping Agent Nitrogen--as the n-type doping agent.

This process is similar to Silicon chip manufacturing.

But this process will take more time compared with that of silicon because it is very difficult to diffuse through strongly bonded diamond structure. 

A diamond semiconductor operates on 81 GHz frequency, and is more than twice the speed of earlier devices.

Developed by the Nippon Telegraph and Telephone Corporation (NTT), Japan.

According to NTT, this latest development will allow amplification in the millimeter-wave band from 30 to 300 GHz possible for the first time.

Smaller Components Are Possible

It Works At Higher Temperature

Faster Than Silicon Chip

Larger Power Handling Capacity

Smaller Components Are Possible

As the size is smaller -- it is possible to cut very smaller lines through diamond structural carbon.

We can imagine a transistor whose size is one-hundredth of silicon transistor.

It Works At Higher TemperatureAt very high temperature, crystal structure

of the silicon will collapse.

But diamond chip can function well in these elevated temperatures.

Diamond has an extremely high thermal conductivity, can withstand high electric fields, and can be made into a semiconductor -- ideal for power devices.

It Works At Higher Temperature (contd..) They can work at a temperature of up to

1000 degrees Celsius, while silicon chips stop working above 150 degrees Celsius

Diamond can also resist voltages up to around 200 volts, compared to around 20 volts for a silicon chip.

Due to this power electronics, such as an inverter, can become made much smaller in size.

Faster Than Silicon Chip

Mobility of the electrons inside the doped diamond structural carbon is higher than that of in the silicon structure.

As the size of the silicon is higher than that of carbon, the chance of collision of electrons, with larger silicon atoms increases as compared to carbon chip.

Larger Power Handling CapacityDiamond has a strongly bonded crystal

structure. So carbon chip can work under high power environment.

It is assumed that a carbon transistor will deliver one watt of power at rate of 100 GHZ.

The inter phase between low power control circuit with a high power circuit will not be needed as we can directly connect high power circuits with a diamond chip.

Much more expensive than siliconA four-millimeter-square diamond substrate

costs several tens of thousands of yen compared to virtually nothing for silicon.

Electricity cannot travel smoothly through diamond Researches are seeking impurities that can be

added to aid electricity flow.

The chip would be most useful in devices located near hot-burning engines.

Thus Diamond Chip replaces the need of silicon chip in every aspect in future generations