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The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
the product:
ALPHA®
EF-8300 product guide
A higher activity flux that delivers excellent solderability and doesn’t compromise on and electrical reliability.
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 2
Welcome to the ALPHA®EF-8300 Product Guide
2. Soldering Performance 4 - 73. Post Reflow Cosmetics 84. Reliability/Product Data 9 - 10
7. Technical Bulletin & MSDS 13
CONTENTS Page #
8. Flux Portfolio 14
5. Application Guidelines 11
1. Introduction/Features 3
6. Summary 12
ALPHA® EF-8300 wave solder flux
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 3
Introduction
ALPHA® EF-8300 represents the latest offering in ALPHA®’s industry leading no-clean, alcohol based wave solder flux product line.
It is a newly formulated high activity, alcohol based, no-clean wave solder flux that uses the latest advances in flux formulation to deliver the best in class soldering performance without compromising electrical reliability. It is designed to perform with both standard and low-silver SAC alloys.
EF-8300 is an M-class flux designed with higher activity to meet the most challenging wave solder applications.
EF-8300 performs well under a variety of machine configurations and can be used with either conventional or ultrasonic sprayers.
EF-8300
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 4
Soldering Performance
EF-8300Test Vehicle - Designed to differentiate flux performance by “forcing failure “
Technical details• 4 layer board with 2 Copper interlayers• 2.4 mm (0.093”) thick• Black mask• Entek® Plus HT OSP pad finish
Top Side
Bottom Side0.25mm, 0.37mm, 0.5mm and 1.0mm
through holes
0.25mm, 0.37mm, 0.5mm and 1.0mm
through holes
Edge Connectors in the X and Y direction (No Solder Thieves)
Edge Connectors in the X and Y direction (No Solder Thieves)
Bottom Side Passives to Evaluate Dual Wave
vs. Single Wave Performance
Bottom Side Passives to Evaluate Dual Wave
vs. Single Wave Performance
.80mm, .65mm and .50mm pitch bottom side
QFP’s-Designed to create solder bridges
.80mm, .65mm and .50mm pitch bottom side
QFP’s-Designed to create solder bridges
The SAKT board can be fabricated single sided, double sided, andfinished with organic solder preservative (OSP), HASL, immersion
tin, immersion silver or ENIG finishes.
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 5
Soldering PerformanceBridging Performance
EF-8300
Superior Resistance to BridgingEF-8300 demonstrates up to 50% less bridging vs EF-8000 on various components
Alloy SACXTM0307Wave (Single/Dual) DualContact Time 5 secondsPWB type/Pad Finish FR4, Entek® Plus HTMask NANYA K60Thermal Profile Glue cure + 1 Lead-free reflow in airConveyor Speed 1.2 m/minute (4 ft/minute)Pot Temperature 265°CTop-side Preheat 92°CFlux Loading (µg/in2) 1200 µg/in2
Processing Conditions
0.00
2.00
4.00
6.00
8.00
10.00
12.00
14.00
Ave
rage
Num
ber o
f Brid
ges
Straight Header 0.65mm QFP 0.8mm QFP
Component Type
EF-8300
EF-8000
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 6
Soldering PerformanceSkips Performance
EF-8300
Excellent Resistance to SkipsEF-8300 shows no skips on various component types
Alloy SACXTM0307Wave (Single/Dual) DualContact Time 5 secondsPWB type/Pad Finish FR4, Entek® Plus HTMask NANYA K60Thermal Profile Glue cure + 1 Lead-free reflow in airConveyor Speed 1.2 m/minute (4 ft/minute)Pot Temperature 265°CTop-side Preheat 92°CFlux Loading (µg/in2) 1200 µg/in2
Processing Conditions
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Ave
rage
Num
ber o
f Ski
ps
Transistor 0805 chip 0603 chip
Component Type
EF-8300EF-8000
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 7
Soldering PerformanceHole Fill Performance
EF-8300
Improved Hole Fill PerformanceEF-8300 provides improved hole fill versus EF-8000 using the SACX™0307 alloy
Alloy SACXTM0307Wave (Single/Dual) DualContact Time 5 secondsPWB type/Pad Finish FR4, Entek® Plus HTMask NANYA K60Thermal Profile Glue cure + 1 Lead-free reflow in airConveyor Speed 1.2 m/minute (4 ft/minute)Pot Temperature 265°CTop-side Preheat 92°CFlux Loading (µg/in2) 1200 µg/in2
Processing Conditions
0.0
10.0
20.0
30.0
40.0
50.0
60.0
Ave
rage
Hol
e Fi
ll
Avg 35 mil Hole FillHole Size
EF-8300
EF-8000
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 8
Post-Reflow CosmeticsFlux Residue and Joint Cosmetics
EF-8300
Flux Residue• Clear, colorless• Uniform with no white
residue observed on black mask
• Non-tacky
Joint Cosmetics• Smooth joints typical of
both Lead-free and SnPbprocessing.
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 9
Reliability/Product Data
Reliability Test EF-8300
Silver Chromate PaperIPC-TM 650 Test Method 2.3.33
PASSNo detection of Halide
Copper Mirror TestsIPC-TM 650 Test Method 2.3.32 <50% removal (M-class)
Copper Corrosion TestIPC TM 650 Test Method 2.6.15
PASSNo evidence of corrosion
Bellcore GR-78-CORE SIR TestPASS
Comb Down, 2.4 x 1011ΏComb Up, 2.4 x 1011Ώ
IPC SIR (J-STD-004)PASS
Comb Down, 1.1 x 1010ΏComb Up, 2.4 x 1010Ώ
Summary Table
EF-8300
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 10
Reliability/Product DataProduct Data
EF-8300
PASSComb Down, 2.4 x 1011Ώ
Comb Up, 2.4 x 1011 Ώ
Bellcore SIR17°CFlash Point (T.C.C.)
ROM0IPC J-STD-004 Designation
34.5 ± 2.5 Acid Number (mg KOH/g)
12 monthsShelf Life0.804 ± 0.003 Specific Gravity @ 25°C (77°C)
ALPHA 425Recommended Thinner
6.3%Solids Content, wt/wt, %
3.0pH, 5% v/v aqueous solution
Clear, Pale Yellow Liquid
Appearance
Typical Values
Parameters/Test Method
EF-8300 Physical Properties
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
255-265°CSolder Pot Temperature:
These are general guidelines which have proven to yield excellent results; however, depending upon your equipment, components, and circuit boards, your optimal settings may be different. In order to optimize your process, it is recommended to perform a design experiment, optimizing the most important variables (amount of flux applied, conveyor speed, topside preheat temperature, solder pot temperature and board orientation).
2 - 7 seconds (3 – 5 seconds most common)Contact Time in the Solder (includes Chip Wave and Primary Wave)
1.5 – 2.0 meters/minute for single wave 1.8 - 2.2 meters/minute for dual waveEF-8300 is capable of running at a slower conveyor speed to accommodate certain types of Pb-free wave soldering process
Conveyor Speed
5 - 8° (6° most common recommended by equipment manufacturers)
Conveyor Angle
2°C/second (3.5°F/second) maximumMaximum Ramp Rate of Topside Temperature (to avoid component damage)
Straight ramp to desired top-side temperatureRecommended Preheat Profile
0 to +40°F (0 to +22°C) vs. Top-SideBottom side Preheat Temperature
80-110°C Top-Side Preheat Temperature
Spray: 800 to 1200µg/in2 of solids/in2 for dualwave and 700 to 1000µg/in2 of solids/in2 for single wave soldering
Amount of Flux Applied
TYPICAL LEVEL for ALPHA® EF-8300with SAC 305 or Low Ag SAC alloys
OPERATING PARAMETER
Application GuidelinesApplication Guidelines
EF-8300
11
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 12
SummaryEF-8300 delivers excellent residue cosmetics• Clear, colorless, tack free flux residue• No white residue
EF-8300 delivers improved hole fill and bridging Performance• Better hole fill on 35 mil diameter holes vs EF-8000
• Up to 50% less bridging than EF-8000 on most common components
EF-8300 delivers a wide reflow process window• SnPb or Pb-free alloys and compatible with Low Ag alloys• Spray fluxing• Single and Dual wave capable• Compatible with leading pad finishes including – Entek® Plus
and Entek® HT OSP, and Immersion Silver
EF-8300
EF-8300 delivers excellent reliability post reflow• Passes IPC and Bellcore SIR• Passes Copper Corrosion• Halide-free
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 13
Technical Bulletin and MSDS
EF-8300
For the most current version of the EF-8300 Technical Bulletin and MSDS, please visit www.alpha.cooksonelectronics.com
Technical Bulletin and MSDS
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 14
Flux Product Portfolio
EF-8300For more information on ALPHA®’s industry leading solvent based and VOC-free flux offering, please visit:
http://alpha.cooksonelectronics.com/products/flux/index.asp
Click on ALPHA’sOnline Flux Selectoricon to generate a prioritized list of fluxes for your application based on your process inputs.