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EMI filter with integrated ESD protection for micro-SD Card · This is information on a product in full production. October 2016 DocID025248 Rev 4 1/10 10 EMIF06-HSD03F3 EMI filter

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Page 1: EMI filter with integrated ESD protection for micro-SD Card · This is information on a product in full production. October 2016 DocID025248 Rev 4 1/10 10 EMIF06-HSD03F3 EMI filter

This is information on a product in full production.

October 2016 DocID025248 Rev 4 1/10

10

EMIF06-HSD03F3

EMI filter with integrated ESD protection for micro-SD Card™

Datasheet production data

Figure 1. Pin configuration (bump side)

Figure 2. Functional schematic

Features

Very low line capacitance to compensate long PCB tracks (2.5 pF typ.)

High efficiency in ESD suppression up to 18 kV (IEC 61000-4-2)

Very low PCB space consumption:

– 1.1 x 2.4 mm

Ultralow leakage current: 20 nA max.

Very thin package: 0.605 mm

Smart pinout for easier PCB layout

High reduction of parasitic elements through integration and wafer level packaging

Lead-free package

Complies with the following standards:

– IEC 61000-4-2 level 4:±15 kV (air discharge), ±8 kV (contact discharge)

Application

SD3.0, UHS-1 SDR104 (208 MHz)

Description

The EMIF06-HSD03F3 chip is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering.

The EMIF06-HSD03F3 Flip-Chip packaging means the package size is equal to the die size. That’s why EMIF06-HSD03F3 is a very small device. Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 18 kV.

Flip- hip packageC( bumps)17

Ix OxR = 1 ΩL 1 nH=

CLINE = 2.5 pF

DET VCC

www.st.com

Page 2: EMI filter with integrated ESD protection for micro-SD Card · This is information on a product in full production. October 2016 DocID025248 Rev 4 1/10 10 EMIF06-HSD03F3 EMI filter

Application diagram EMIF06-HSD03F3

2/10 DocID025248 Rev 4

1 Application diagram

Figure 3. Schema

Vcc

DET

CPUGND

µSD cardcontacts face down

DAT2

DAT3

CMD

VCC

CLK

DAT0

DAT1

µSD cardcontacts spring

Top layerSecond layer

I1 O1

Vcc

I3 O3

I5 O5

DET

I2 O2

GND

GND

GND

I4 O4

I6 O6

Maximum distance = 50 mm

Page 3: EMI filter with integrated ESD protection for micro-SD Card · This is information on a product in full production. October 2016 DocID025248 Rev 4 1/10 10 EMIF06-HSD03F3 EMI filter

DocID025248 Rev 4 3/10

EMIF06-HSD03F3 Characteristics

2 Characteristics

Figure 4. Electrical characteristics (definitions)

Table 1. Absolute maximum ratings (Tamb = 25 °C)

Symbol Parameter Value Unit

VPP

ESD discharge IEC 61000-4-2, level 4 for Ix pins:

Air dischargeContact discharge

ESD discharge IEC 61000-4-2, level 1 for Ox pins:

Air dischargeContact discharge

18

18

10

10

kV

Tj Maximum junction temperature 125 °C

TOP Operating temperature range - 30 to + 85 °C

Tstg Storage temperature range - 55 to +150 °C

Symbol ParameterV = Breakdown voltageI = Leakage current at V

V = Stand-off voltage

V = Clamping voltageI = Peak pulse current

BR

RM RM

RM

CL

PP

V

I

VCLVBR VRM

IF

VF

IRM

IPP

Slope: 1/Rd

R = Dynamic resistanced

Cline

R =I/O

= Line capacitance

Series resistance betweeninput and ouptput

Page 4: EMI filter with integrated ESD protection for micro-SD Card · This is information on a product in full production. October 2016 DocID025248 Rev 4 1/10 10 EMIF06-HSD03F3 EMI filter

Characteristics EMIF06-HSD03F3

4/10 DocID025248 Rev 4

Table 2. Electrical characteristics (Tamb = 25 °C)

Symbol Test conditions Min. Typ. Max. Unit

VBR Data lines, IR = 1 mA 5 9 V

IRM VRM = 3 V per line 20 nA

RI/O 1 Ω

Cline Vline = 0 V, Vosc = 30 mV, F = 1 MHz 2.5 3 pF

L 1 nH

Rd Dynamics resistance, tP = 100 nsIO-GND (positive polarity) 650

m ΩGND-IO (negative polarity) 320

VCC

VBR IR = 1 mA 5 9 V

IRM VRM = 3 V 20 nA

Cline Vline = 0 V, Vosc = 30 mV, F = 1 MHz 40 pF

DET

VBR IR = 1 mA 5 9 V

IRM VRM = 3 V 20 nA

Cline Vline = 0 V, Vosc = 30 mV, F = 1 MHz 40 pF

Page 5: EMI filter with integrated ESD protection for micro-SD Card · This is information on a product in full production. October 2016 DocID025248 Rev 4 1/10 10 EMIF06-HSD03F3 EMI filter

DocID025248 Rev 4 5/10

EMIF06-HSD03F3 Characteristics

Figure 5. Attenuation versus frequencyIX, OX

Figure 6. Attenuation versus frequencyVCC, DET

S21(dB)

100.0 k 1.0 M 10.0 M 100.0 M 1.0 G-10.00

- 9.00

- 8.00

- 7.00

- 6.00

- 5.00

- 4.00

- 3.00

- 2.00

- 1.00

0.00

I6 I2I3

I4I5I1

F(Hz)

S21(dB)

100.0k 1.0M 10.0M 100.0M 1.0G

-30.00

-22.50

-15.00

-7.50

0.00

VCC DET

F(Hz)

Figure 7. ESD response to IEC 61000-4-2(+8 kV contact discharge)

Figure 8. ESD response to IEC 61000-4-2(-8 kV contact discharge)

20.0 V / Div

20 ns / Div

V : Peak clamping voltageCL

V :clamping voltage @ 30 nsCL

V :clamping voltage @ 60 nsCL

V :clamping voltage @ 100 nsCL

12

34

19.2 V

109.6 V

13.9 V6.6 V2

1

34

10.0 V / Div

20 ns / Div

V : Peak clamping voltageCL

V :clamping voltage @ 30 nsCL

V :clamping voltage @ 60 nsCL

V :clamping voltage @ 100 nsCL

12

34

-5.1 V

-61.1 V

-4.1 V-2.4 V

2

1

34

Figure 9. Digital crosstalk I1-O2 Figure 10. Analog crosstalk versus frequency

10 ns / Div

1.0 V / Div

P2:rise(C1)1.99 ns P3: fall(C1)

1.93 ns

P1: top(C1)3.01 ns

P4: pkpk(C2)1.28 ns

XTalk(dB)

100.0 k 1.0 M 10.0 M 100.0 M 1.0 G-110.00

-100.00

-90.00

-80.00

-70.00

-60.00

-50.00

-40.00

-30.00

-20.00

-10.00

0.00

VCC- ClkI1-O2 I2-O3

F(Hz)

Page 6: EMI filter with integrated ESD protection for micro-SD Card · This is information on a product in full production. October 2016 DocID025248 Rev 4 1/10 10 EMIF06-HSD03F3 EMI filter

Characteristics EMIF06-HSD03F3

6/10 DocID025248 Rev 4

Figure 11. TLP measurement

y = -0.0078x 2 + 2.1203x - 13.887R2 = 0.9956

y = 0.0961x 2 + 2.1437x - 4.7641R2 = 0.9935

0

2

4

6

8

10

12

14

16

18

20

22

24

26

28

30

0 5 10 15 20 25 30 35 40

tP=100ns

TJ initial=25°C

Positive polarity

Negative polarity

Poly. (Positive polarity)

Poly. (Negative polarity)

VCL(V)

IPP(A)

Page 7: EMI filter with integrated ESD protection for micro-SD Card · This is information on a product in full production. October 2016 DocID025248 Rev 4 1/10 10 EMIF06-HSD03F3 EMI filter

DocID025248 Rev 4 7/10

EMIF06-HSD03F3 Package information

3 Package information

Epoxy meets UL94, V0

Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.

3.1 Flip-Chip package information

Figure 12. Flip-Chip package dimensions

40

0 ±

40

µm

400 ± 40 µm

1.10 mm ± 40 µm60 ± 60 µm5

2.4

0 m

m± 4

0 µ

m

Page 8: EMI filter with integrated ESD protection for micro-SD Card · This is information on a product in full production. October 2016 DocID025248 Rev 4 1/10 10 EMIF06-HSD03F3 EMI filter

Package information EMIF06-HSD03F3

8/10 DocID025248 Rev 4

Figure 15. Tape and reel specification

Note: More information is available in the application notes:

AN2348, “IPAD™ 400 µm Flip Chip: package description and recommendations for use”

AN1751, “EMI filters: recommendations and measurements”

AN4541: “EMI Filters for SD3.0 card: High speed SD card protection and filtering devices”

Figure 13. Footprint recommendations Figure 14. Marking

220 µm recommended

220 µm recommended260 µm maximum

Solder stencil opening:

Copper pad Diameter:

Solder mask opening:300 µm minimum x

y

x

w

z

w

Dot, ST logo

xx = markingz = manufacturing locationyww = datecode

(y = yearww = week)

ECOPACK® grade

Page 9: EMI filter with integrated ESD protection for micro-SD Card · This is information on a product in full production. October 2016 DocID025248 Rev 4 1/10 10 EMIF06-HSD03F3 EMI filter

DocID025248 Rev 4 9/10

EMIF06-HSD03F3 Ordering information

4 Ordering information

Figure 16. Ordering information scheme

5 Revision history

Table 3. Ordering information

Order code Marking Package Weight Base qty Delivery mode

EMIF06-HSD03F3 KK Flip Chip 3.4 mg 5000 Tape and reel (7”)

EMIF 06 - HSD 03 F3

EMI Filter

Number of lines

Application

HSD = High speed SD card

Version

Version = 3

Package

F = Flip Chipx = 3: Lead-free, pitch = 400 µm, bump = 255 µm

Table 4. Document revision history

Date Revision Changes

19-Nov-2013 1 Initial release

09-Jan-2014 2 Corrected typographical error.

06-Jan-2015 3 Added mention for new AN4541.

06-Oct-2016 Updated Figure 1.

Page 10: EMI filter with integrated ESD protection for micro-SD Card · This is information on a product in full production. October 2016 DocID025248 Rev 4 1/10 10 EMIF06-HSD03F3 EMI filter

EMIF06-HSD03F3

10/10 DocID025248 Rev 4

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