Environmentally Benign Manufacturing

WTEC Study sponsored by NSF

Delcie R. DurhamNational Science Foundation

December 2000

Manufacturing

The manufacturing enterprise requires the integration of the appropriate scientific, engineering, and mathematics disciplines with design objectives within a systems framework where the desired outcome is a viable product or service.

Product realization, integrated product and process development, concurrent engineering are all aspects of the manufacturing enterprise. Economics, energy and environmental issues define viability.

Industrial Ecology

Seeks to analyze and control materials flows across regional or national boundaries to reduce resource depletion and environmental effects.

is defined to encompass diverse disciplines such as engineering, environmental health sciences, life-cycle analysis (LCA), economics, social sciences, and public policy.

Is macro in nature.

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distributiondistribution

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recyclingrecycling

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PHYSICALPHYSICALPRODUCTIONPRODUCTION

REVERSEREVERSEPRODUCTIONPRODUCTION

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Suppliers of raw materials and componentsSuppliers of raw materials and components

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Environmentally Benign Manufacturing (EBM)

Environmentally benign manufacturing is involved with the technologies, the operational practices, the analytical methods and strategies for sustainable production within the industrial ecology framework. (Sheng, Durham, Wellek)

Specifically addresses the development and implementation of benign materials processing to meet the challenges of sustainable materials flow in a use and reuse environment

It also addresses systems consideration of re-manufacturing, reuse, and recycling in total waste-stream management.

Life Cycle Analysis

Product Development and Design

Recycling and Disposal

Produce Use

Product Packaging and Distribution

Acquisition of raw materials, components, andsub-assemblies

ProductManufacture

taken from Richards and Frosch, 1997

Product manufacture

• Minimize emissions• Minimize wastes (solid, fluid)• Conserve water, energy, materials• Reduce toxicity, exposure• Substitute more benign materials• Substitute more benign processes• Assure worker health and safety• Find new uses for wastestreams

Recycling and disposal

• Design for reusability• Design for remanufacturability• Design for separability• Design for disassembly• Design for recyclability• Design for diposability

State of International Environmental Performance Standards

In the electronic equipment manufacturing, IEC* has concerns with:

the primitive state of LCA pollution prevention environmental impact assessments design for disassembly

IEC - International Electrotechnical CommissionInformation from The Ecology of Industry, NAE, Manufacturing, Laudise & Gradel

EBM Panel Mission Advance understanding of EBM Establish baseline and document best

practices;– Policy, practice,and motivation

– infrastructure and technology,

– methodologies and metrics,

– goals and assessments

– research

Identify research opportunities Promote international cooperation

EBM Panelists

• Timothy Gutowski

(Chair)

• Cynthia Murphy

(Co-chair)

• David Allen

• Diana Bauer

• Bert Bras

• Thomas Piwonka

• Paul Sheng

• John Sutherland

• Deborah Thurston

• Egon Wolff

• Delcie Durham (NSF)

• Fred Thompson (NSF)

Focus Areas

Metal Processing

Polymer Processing

– thermoplastics and

thermosets,

– composites

Applications

– automobiles

– electronics

Sca

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Scale of Temporal Concern

Sin

gle

Pro

duct

Lif

e C

ycle

X Products

One Manufacturer

Society

Manufacturing

Use

Disposal

Product Life Cycle

Human Lifetime

Civilization Span

X Manufacturers

Manufacturing Use Disposal

1: Environmental Engineering 2: Pollution Prevention 3: Envir. Conscious D&M 4: Design for the Environment 5: Life Cycle Design 6: Industrial Ecology 7: Sustainable Development

21

3,4,5

6

7

Potential Scope of EBM

• So where and what is EBM?

Sites Visited: Japan

• Fuji Xerox• Hitachi PERL• Horiba, Ltd.• Kubota• MITI/Mechanical Eng.

Lab.• MITI/AIST/NIMC• Nagoya University• NEC Corporation• Nippon Steel

Corporation• NIRE

• New Earth Conference & Exhibition

• NRIM• PVC Industrial

Association• Sony Corporation• Toyo Seikan Kaisha• Toyota Motor

Corporation• University of Tokyo• Institute for Industrial

Science

Sites Visited: EuropeBelgium, Denmark, Netherlands, Germany,

Sweden, Switzerland

• Corus Holland• DaimlerChrysler• Denmark Tech. U.• EC Environmental

Directorate• EC Research and

Technical Development• Excello• Fraunhofer, Aachen• Fraunhofer, Berlin• Fraunhofer, Stuttgart

• ICAST • IVF• MIREC• Siemens• TU Aachen• TU Berlin• TU Delft (Ministry of

Environment, Lucent Tech., Phillips)

• Univ. of Stuttgart• Volvo

Sites Visited: U. S.

• Applied Materials• Caterpillar• CERP• Chaparral Steel/Cement• DaimlerChrysler• DRI• DuPont• Federal Mogul• Ford

• Interface

• GM• IBM• Interface• Johnson Controls• MBA Polymers• Metrics Workshop• Micro Metallics• NCMS

R & D ActivitiesPreliminary Assessment

ActivityRelevant Basic Research (>5 years out) Polymers Electronics Metals Automotive/Transportation SystemsApplied R&D ( 5 years out) Polymers Electronics Metals Automotive/ Transportation Systems

Japan

US

Europe

Industrial Activities -Relative Competitiveness

ActivityISO 14000 CertificationWater ConservationEngergy conservation/CO2 emissionsDecreased releases to air and waterPost Industrial solid waste reduction/recyclingPost-consumer recyclingMaterial and Energy inventoriesAlternative material developmentSupply chain involvementEBM as a business strategyLife-cycle activities

Japan

US

Europe

Government Activities Relative Competitiveness

Activity Japan US Europe

Take-back legislation — Landfill bans Material bans LCA tool and database development Recycling infrastructure Economic incentives Regulate by medium Cooperative /joint efforts with industry Financial and legal liability

Preliminary Findings of WTEC Study

Future needs: products designed for re-use better reprocessing technologies introduce EBM as part of being “lean” rather

than new integration of financial and environmental

systems re-use / life prediction modeling accounting system for the “value” of EBM in

processing / design selection

Design for Environment - Focus Areas

Materials of concern– Reduction– Elimination/substitution

Design for disassembly and reuse– Assembly technology and materials– Reduction in number of materials used– Reduction in use of coatings and other

inseparable materials configurations Volume reduction

– Manufacturing– Products (EOL disposition)

Japanese LCA Working Groups

Inventory Committee– Collect process emission data across industries for CO2, CH4,

HFC, PFC, N2O, SF6, NOx, SOx, particulate, BOD, COD, phosphorus, nitrogen, suspended solids.

– Develop methodology for attributing emissions for recycling and disposal.

Database Committee– Construct internet-accessible database with procedures for

maintenance and data updating. Assessment Committee

– Develop damage functions for category endpoints.– Develop a weighting methodology appropriate for Japan.

Reuse

US: Reuse is pursued primarily when it makes

business sense. Most reuse is done by third party

remanufacturers. Automobile parts, manufacturing equipment

are well established remanufacturing infrastructures.

Electronic industry does not have a reuse mindset (yet).

Reuse Cont’dJapan: “Inverse Manufacturing” seems to be well known

phrase in many companies. Electronic companies are thinking about using “inverse

manufacturing” and service industry paradigm (rather than being product sales oriented) to their advantage.

Still, “classical” remanufacture and reuse problems persist

• set-up of reverse logistics network is challenging• need for better reprocessing technologies• products not designed for reuse - designers need re-

education• radical new concepts still in laboratory stage• Profitability can still be a problem

Silicon Valley Encourages Chemical Reduction

The Silicon Valley Manufacturing Group has created a pilot program for area manufacturers to reduce the amount of chemicals they are using in their factories. The group will demonstrate a business model that uses third party "chemical management services" (CMS) firms to help manufacturers cut costs and optimize the use of chemicals.

One semiconductor company using a chemical service provider cut its chemical use by 50 percent, adds Chemical Strategies Partnership, a non-profit organization that promotes third-party chemical services. "When managers appreciate the hidden costs of chemical use - inventory, liability, waste, tracking, disposal -- they see how CMS can benefit them."

SOURCE: Manufacturing News Daily, October 20, 2000

Electronics - Overview

• Electronics industry tends to be proactive (worldwide)– Life-cycle Assessment (LCA)– Design for Environment (DFE)– End-of-Life Management (ELM)

• Industry culture of minimization, cost-reduction, and increased efficiency are all compatible with EBM

Electronics - Overview cont’d

• Used to inserting and integrating new designs, technologies, and equipment– Average product life span of 18 to 24 months– Complete capital equipment turn-over every 5

years

• Expert at managing and analyzing large amounts of data (legacy of quality movement)

Component and PWB Manufacture

Wafer fabrication– Reduction in water use– PFC (perfluoro compound) emissions

IC Packaging and assembly– Pb solder– Flame retardants– Material waste (especially thermosets)

PWBs– Water reduction– Plating solutions– Flame retardants

Materials and Environmental Concerns -

Integrated Circuits

Wafer fabrication

Product materials: Si, SiO2, Al, ± CuEBM Issues: Water, energy, gas

emissions (especially PFCs - perfluoro compunds)

Chip packaging

Product materials: Polymers, Ceramics, Ni/Au alloys, Cu, Au

EBM Issues: Energy, metal-bearing liquid waste, flame retardants,

material waste

Wafer Fabrication

Large, highly capital intensive manufacturers Equipment driven Small feature size (sub-micron) requires

extremely clean processes Deposition of very thin layers is done using

gaseous processes Key concerns are qualification of new materials,

reduction in PFC emissions, reduction in energy and water usage (SIA Roadmap)

NSF Engineering Center, SEMATECH

Materials and Environmental Concerns - Printed Wiring

Boards

PWB fabrication

PWB (board-level) assembly

Product materials: Ceramic, epoxy-glass, or other polymers;

Cu, Pd, Pb, AuEBM Issues: Water, energy,

flame retardants, Pb finishes, plating solutions

Product materials: Pb/SnEBM Issues: Energy, Pb

PWB Fabrication Many manufacturers of varying size, both independent

and captive; moderately capital intensive Material and process driven Relatively small features (3 to 4 mils) require clean

environment Plating baths use large amounts of water and complex

chemistries (organic and inorganic compounds) Lamination of multiple layers is very energy intensive Several PWB projects under EPA’s DfE Program and

DARPA’s Environmentally Conscious Manufacturing Program

PWB (Board-level) Assembly

Capital intensive Use of Pb solder dominates

environmental concerns Soldering processes can be very energy

intensive and are higher for Pb-free solders

Trim waste (epoxy-glass ± copper) can be 50% of the total material budget

Materials and Environmental Concerns - Computer System

Product materials: NiCdEBM Issues: Cd, life/efficiency

CRT

Batteries

Storage Media

Final Assembly

Product materials: Glass, Pb, phosphors, steel, Al, CuEBM Issues: Energy, Pb

Product materials: Al or glass, Ni, Mg

EBM Issues: recyclability

Product materials: Al or glass, Ni, Mg

EBM Issues: recyclability

Displays Large units are manufactured overseas Glass formation is energy intensive Biggest concern is end of life, due to Pb

content in glass Flat panel displays (FPDs) are replacing

cathode ray tubes (CRTs) and may introduce new issues

Study is currently underway under EPA’s DfE program

Final Assembly Materials and design are biggest issues Take-back legislation in Europe is helping

define needed infrastructure for recycling Desire to increase recycled content in

housings - typically formed using thermal plastics such as ABS, PC, or PC/ABS

Non-brominated flame retardants for ABS a challenge

End of Life Management Interest being driven by

– Take back legislation in Europe– Material bans in Europe (Pb, halogenated FRs)– Landfill bans and labeling laws in US (e.g., CRTs, Hg)– Leasing agreements (increased producer responsibility)

Reuse– Limited to systems less than 36 - 60 months old– Component harvesting economic only in tight markets

Three primary materials commodities / issues– Plastics / separation, contamination, high cost-to-value

ratio– Glass / Pb and FPDs– Metals / decreasing volume, especially precious metals

Japan Findings Highly responsive to activities in Europe

– Elimination of halogenated flame retardants– Pb-free solders

ISO 14000 certification is a focus New recycling law to require 50% recycling

of computers starting April, 2000 Using alternative PWB technologies

(microvias) that are inherently less water, energy, and material intensive processes while providing better performance

Sites visited: Hitachi , Sony

Europe Findings Take-back legislation and WEEE (Waste

Electrical and Electronic Equipment) Directive– Recycling– Material alternatives (Pb and non-brominated FRs)

Dutch have a well-developed infrastructure for collecting and recycling computers– Glass and metals are re-introduced into the material stream– Plastic is incinerated

“Green” products offered in parallel with conventional, but with a price differential

Sites visited: MIREC, Siemens

United States Findings Responding to activities in Europe

– Take-back– Pb-free solder– Non-brominated flame retardants

Emphasis on metrics and supply chain management Recycling activities in partnership with OEMs (HP,

IBM) or sponsored by government agencies (DoC, DoE, and DoD

Focus on recycling rather than incineration of plastic

Sites visited: IBM, Applied Materials, DuPont (electronic materials), MBA polymers, Micro Metallics

US Activities

Professional associations and consortiums– IEEE - ISEE - esp. LCA, DFE, EOL– IPC - PWBs – EIA (focused on industry-wide DFE and on

unified responses to policy and legislation - esp. WEEE)

– MCC (Environmental programs - roadmap, PWBs, software)

– SIA / SEMATECH (roadmap, ESH as a major thrust area)

US Activities Cont’d

Government programs– NSF - EBM center (ICs), current EBM panel– DARPA - ECM program - focus on PWBs

including bio-laminate, fully-additive circuitry, permanent resists

– EPA DfE - PWB z-axis metallization, computer displays

– DoE, DoD, DoC, EPA - Electronics recycling

Challenges - Pb-free Solder

Pb-free solders require higher temperatures– Need capacitors and resistors that can withstand

increased temperatures– Need substrates that withstand increased temperatures– More energy intensive and lower yield (higher waste)

Much more complex alloys– More difficult to maintain uniform composition– May be more difficult to recycle or disassemble to allow

recycling of boards

Challenges - Pb-free Solder

Unclear that Pb-free solders are actually more environmentally friendly– material extraction, increased processing difficulties,

ease of recycling

Best solution may be completely new attachment technologies (e.g., adhesive flip-chip)

Challenges - Flame Retardants

Elimination of brominated flame retardants is due to concern with dioxin formation upon incineration– Unclear whether this actually occurs– May occur only in older, lower temperature units

Alternatives for thermoplastics exist (including choice of plastic)– Non-organic fillers may affect mechanical properties– Unclear that alternatives are more environmentally benign

Currently no known alternatives for thermosets; may be solved by alternative PWB technologies

EXAMPLE : DESIGN FOR ENVIRONMENT FOR CMP PROCESS

Semiconductor

manufacturer

Equipment supplier

OEM

Regulatory pressure

Resource scarcity

Cost effectiveness

Technological advantage

Process integrity

Specifications

Motivating factors

EXAMPLE

Organization

• Process environmental targets

• Need for treatment equipment

• Treatment System configuration and requirements

Source: Applied Materials

Interface issues

A. Communication Issues1. Results are transferred, not analysis.2. Boundaries of analyses are different for different players4. Interactions between different groups across players (eg: EHS in Manufacturer to Process groups in equipment supplier, Process groups in Manufacturer to EHS groups in supplier, developmental groups in OEM)B. Difference in drivers1. Ideal solution for Semiconductor Manufacturer is different from Equipment Supplier and OEMC. System integration issues1. Influence of environmental solutions on systems is not well understood. Environmental, cost and performance parameters are intertwined.

Economic drivers

Technology

Regulations and incentives

• Point-of-use pollution prevention processes

• Use of novel materials with environmentally benign characteristics

• Reduction of energy use in processes and products

• Product design-for-environment

• Design of products and materials for ease of recyclability

• New metrics for environmental performance

• Regulations on airborne, wastewater and solid discharges

• International standards (e.g., ISO 14000)

• Eco-labeling incentives• Industry agreements

and roadmaps

• Marketing incentives• Total life-cycle cost for

product stewardship• Waste disposal and

abatement cost reduction

• Revenue streams from demanufacturing

• Reduction in liability and risk management cost

CONCEPTUAL

SUCCESSFUL DEPLOYMENT OF ECM PROGRAMS REQUIRE CROSS-CUTTING INNOVATIONS THAT ADDRESS SEVERAL DIMENSIONS

ebmchallenge.ppt3/24/00

The Challenge to Move from “Compliance” to The Challenge to Move from “Compliance” to Benign Products and Benign ProcessesBenign Products and Benign Processes

Life cycle analysis tools in existence provide Life cycle analysis tools in existence provide few alternativesfew alternatives

Original manufacturing lacks in-process Original manufacturing lacks in-process analytical capability that permits early analytical capability that permits early intervention and correctionintervention and correction

Lack of process technology to produce Lack of process technology to produce components with minimal wastecomponents with minimal waste

ebm5steps.ppt3/20/00

Five Steps to Achieve Zero EmissionsFive Steps to Achieve Zero Emissions

Product design wherein all raw materials are Product design wherein all raw materials are used used in the finished productin the finished product Industrial “clusters” that use the waste from Industrial “clusters” that use the waste from oneone facility as the raw material for its facility as the raw material for its productsproducts Higher efficiencies in energy generation and Higher efficiencies in energy generation and

consumptionconsumption Incentives that promote the use and Incentives that promote the use and consumptionconsumption of benign technologies and of benign technologies and productsproducts Change in lifestyle and consumption that are Change in lifestyle and consumption that are lessless wasteful wasteful