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Granted in the Metal Finishing Field Printed copies of patents are furnished by the Patent and Trademark Office for $3.00 each. Address orders to: Commissioner of Patents and Trademarks, Washington, D.C. 20231. PRINTED CIRCUIT BOARD U.S. Patent 6,003,225. Dec. 21, 1999 S. Yoon, assignor to Hughes Electronics Corp., Los Angeles A method for fabrication of alumi- num-backed printed wiring boards with plated holes. POWDER COAnNG GUN U.S. Patent 6,003,779. Dec. 21, 1999 M.A Robidoux, assignor to The Eastwood Co., Malvern, Pa. A method for electrostatic spray- ing of a powder onto a workpiece having a broad surface. CARBON DIOXIDE CLEANING PROCESS U.S. Patent 6,004,400. Dec. 21, 1999 P. W. Bishop and AJ. Harrouer, assignors to Phillips W. Bishop, Chandler, Ariz. A method for cleaning contami- nant particles from a surface of a metal part including preliminar- ily cleaning with an abrasive ma- terial and then cleaning with fro- zen carbon dioxide pellets. SOLVENT CLEANING SYSTEM U.S. Patent 6,044,403. Dec. 21, 1999 D.J. Gray and P.T.E. Gebhard, assignors to Gebhard Gray Associates, Providence, R.I. A closed circuit solvent cleaning method comprising placing an ob- ject to be cleaned in a chamber sealable with respect to the atmo- sphere; applying a negative gauge pressure to the chamber to re- move air and other noncondens- able gases; introducing a solvent to the evacuated chamber; clean- ing the object while maintaining an airless environment within the chamber; recovering the solvent January 2001 from the object and chamber; and processing and cleaning contami- nated solvent within the closed circuit. RECYCLING CLEANING SOLVENT U.S. Patent 6,004,434. Dec. 21, 1999 E. Kiany, assignor to Safety-Kleen Corp., Elgin, Ill. A method comprising cleaning and recycling a mixture of a clean- ing solvent and a treating compo- sition, said cleaning solvent hav- ing been contaminated with impurities through use and com- prising not more than 209(; aro- matic solvents and the remainder aliphatic solvents, and having a flashpoint of 100 to 250°F. CURRENT CONTROL SYSTEM FOR AN ELECTROPLAnNG APPARATUS U.S. Patent 6,004,440. Dec. 21, 1999 K.M. Hanson et al., assignors to Semitool lnc., Kalispell, Mont. A current thief for use in electro- plating a wafer, the current thief comprising a plurality of conduc- tive segments disposed to sub- stantially surround a peripheral region of the wafer; a first plural- ity of resistance devices each as- sociated with a respective one of the plurality of conductive seg- ments; and regulating current through the respective conductive segments during electroplating of the wafer. ELECTROFORMING PROCESS U.S. Patent 6,004,447. Dec. 21, 1999 P. Bischoping et al., assignors to Xerox Corp., Stamford, Conn. An electroform prepared by a pro- cess comprising the steps of elec- troforming a layer of metal on an inner surface of a mandrel having a duct therein, thereby forming an electroform with a hollow inte- rior; and removing the electro- form from the mandrel. DEPOsmON OF CHROMIUM OXIDES U.S. Patent 6,004,448. Dec. 21, 1999 N.M. Martyak, assignor to Atotech USA Inc., N.J. A process for deposition of chro- mium oxides from a trivalent chromium solution containing a complexing agent for a buffer. GALVANIZING EQUIPMENT U.S. Patent 6,004,507. Dec. 21, 1999 J.A Morando, assignor to Alphatech Inc., Grosse Isle, Mich. A material formulation for galva- nizing equipment submerged in molten aluminum and/or zinc melts. COIL COAnNG PROCESS U.S. Patent 6,004,629. Dec. 21, 1999 W.V. Madigan, Bayville, N. Y. A process for coating a continuous moving length of sheet metal com- prising cleaning with a water- based solution to remove surface contaminants that may interfere with the coating adhering to the sheet metal; applying a water- based pretreatment solution to the moving length of sheet metal to promote adhesion of the coating to the surface of the sheet metal; applying an electron-beam-cur- able coating to the moving length of sheet metal; and exposing the moving length of sheet metal to an electron beam to cure the coat- ing. 99

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Page 1: Galvanizing equipment

Granted in theMetal Finishing FieldPrinted copies of patents are furnished by the Patent and Trademark Office for $3.00 each.Address orders to: Commissioner of Patents and Trademarks, Washington, D.C. 20231.

PRINTED CIRCUIT BOARDU.S. Patent 6,003,225. Dec. 21, 1999S. Yoon, assignor to HughesElectronics Corp., Los Angeles

A method for fabrication of alumi­num-backed printed wiringboards with plated holes.

POWDER COAnNG GUNU.S. Patent 6,003,779. Dec. 21, 1999M.A Robidoux, assignor to TheEastwood Co., Malvern, Pa.

A method for electrostatic spray­ing of a powder onto a workpiecehaving a broad surface.

CARBON DIOXIDE CLEANINGPROCESSU.S. Patent 6,004,400. Dec. 21, 1999P.W. Bishop and AJ. Harrouer,assignors to Phillips W. Bishop,Chandler, Ariz.

A method for cleaning contami­nant particles from a surface of ametal part including preliminar­ily cleaning with an abrasive ma­terial and then cleaning with fro­zen carbon dioxide pellets.

SOLVENT CLEANING SYSTEMU.S. Patent 6,044,403. Dec. 21, 1999D.J. Gray and P.T.E. Gebhard,assignors to Gebhard GrayAssociates, Providence, R.I.

A closed circuit solvent cleaningmethod comprising placing an ob­ject to be cleaned in a chambersealable with respect to the atmo­sphere; applying a negative gaugepressure to the chamber to re­move air and other noncondens­able gases; introducing a solventto the evacuated chamber; clean­ing the object while maintainingan airless environment within thechamber; recovering the solvent

January 2001

from the object and chamber; andprocessing and cleaning contami­nated solvent within the closedcircuit.

RECYCLING CLEANING SOLVENTU.S. Patent 6,004,434. Dec. 21, 1999E. Kiany, assignor to Safety-KleenCorp., Elgin, Ill.

A method comprising cleaningand recycling a mixture of a clean­ing solvent and a treating compo­sition, said cleaning solvent hav­ing been contaminated withimpurities through use and com­prising not more than 209(; aro­matic solvents and the remainderaliphatic solvents, and having aflashpoint of 100 to 250°F.

CURRENT CONTROL SYSTEM FORAN ELECTROPLAnNG APPARATUSU.S. Patent 6,004,440. Dec. 21, 1999K.M. Hanson et al., assignors toSemitool lnc., Kalispell, Mont.

A current thief for use in electro­plating a wafer, the current thiefcomprising a plurality of conduc­tive segments disposed to sub­stantially surround a peripheralregion of the wafer; a first plural­ity of resistance devices each as­sociated with a respective one ofthe plurality of conductive seg­ments; and regulating currentthrough the respective conductivesegments during electroplating ofthe wafer.

ELECTROFORMING PROCESSU.S. Patent 6,004,447. Dec. 21, 1999P. Bischoping et al., assignors toXerox Corp., Stamford, Conn.

An electroform prepared by a pro­cess comprising the steps of elec­troforming a layer of metal on an

inner surface of a mandrel havinga duct therein, thereby formingan electroform with a hollow inte­rior; and removing the electro­form from the mandrel.

DEPOsmON OF CHROMIUMOXIDESU.S. Patent 6,004,448. Dec. 21, 1999N.M. Martyak, assignor to AtotechUSA Inc., N.J.

A process for deposition of chro­mium oxides from a trivalentchromium solution containing acomplexing agent for a buffer.

GALVANIZING EQUIPMENTU.S. Patent 6,004,507. Dec. 21, 1999J.A Morando, assignor to AlphatechInc., Grosse Isle, Mich.

A material formulation for galva­nizing equipment submerged inmolten aluminum and/or zincmelts.

COIL COAnNG PROCESSU.S. Patent 6,004,629. Dec. 21, 1999W.V. Madigan, Bayville, N.Y.

A process for coating a continuousmoving length of sheet metal com­prising cleaning with a water­based solution to remove surfacecontaminants that may interferewith the coating adhering to thesheet metal; applying a water­based pretreatment solution tothe moving length of sheet metalto promote adhesion of the coatingto the surface of the sheet metal;applying an electron-beam-cur­able coating to the moving lengthof sheet metal; and exposing themoving length of sheet metal toan electron beam to cure the coat­ing.

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