PRODUCTS

High speed X#ay detection Philips Analytical's new X-ray detector offers a 100-fold increase in recording

speed (compared with traditional detectors) for powder diffractometry, with

no compromise on resolution. The X'Celerator is mounted using Philips'

PreFIX interface allowing easy exchange of optical components without

laborious realignment procedures and maintenance free operation. The

detector is available with several options, including a diffracted beam mono-

chromator, a beta filter and exchangeable Soller slits.

wwwanalytical,philips.com

X'TRA powder diffraction ThermoArrs new X-ray diffraction system, X'TRA, provides high quality

powder diffraction of chemicals, pharmaceuticals, polymers, semiconductors,

thin films, metals and minerals. The vertical O-(~ goniometer, around which

this instrument is built, features removable dual Soller slits and continuous

variable micrometer-controlled slits for adjusting the width of both the

incident and diffracted beams. Analytical algorithms include: peak finding

and profile fitting; data file manipulation; qualitative and quantitative analysis;

percent crystallinity determination; texture and residual stress analysis;

indexing; and least squares unit ceil determination.

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42 ~ Ju ly /August 2OO1

Faster scanning control The Veeco Metrology Group has launched the new NanoScope IV Scanning

Probe Microscopy (SPM) Controller, offering up to ten times faster scanning

with TappingMode+ micro-actuator technology. With over 4000 data points

per scan line, the Nanoscope IV offers excellent visualization and

measurement detail, even when zooming and measuring on large scan

sizes. It also offers more flexibility, cantilever 'Q' control for improved force

regulation and more I/O - including six NDs, access to line syncs, and

oscillator referencing.

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UHV deposition chamber SPECS' new versatile UHV instrument is suitable for thin film deposition and

surface analysis research. The deposition chamber can be equipped with

effusion cells, K-cells, OLED sources and e-beam evaporators. Deposited

layers can be analyzed with techniques such as XPS, LEED, RHEED, Auger,

SIMS or STM.

www.specsusa.com

Sounding out defects Designed specifically with the needs of back-end semiconductor assemblers

in mind, the new SM2000 scanning acoustic microscope from Dage can

detect delaminations, cracks and voids in plastic packages. The SM2000 has

been ergonomically designed and has a PC Windows interface. The

140 x 140 mm inspection area accommodates single or multiple parts, with

a range of transducers including 25, 50 and 100 MHz. Data interpretation is

quick and easy; and for maximum flexibility, the transducers can be changed

without tools in less than two minutes.

www.dage-group.com