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Marc Duranton Koen De Bosschere, Christian Gamrat, Jonas Maebe, Harm Munk, Olivier Zendra High-Performance and Embedded Architecture and Compilation HiPEAC Vision 2017 for Computing in 2025 The HiPEAC project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement number 687698.

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Page 1: HiPEAC Vision 2017 - etp4hpc - HiPEAC_Vision2017-30mn_ETP4HPC... · Cloud / HPC Physical Systems Real-time Embedded Intelligence at the edge: Fog computing Edge computing Stream analytics

Marc Duranton

Koen De Bosschere, Christian Gamrat,

Jonas Maebe, Harm Munk, Olivier Zendra

High-Performance and

Embedded Architecture and

Compilation

HiPEAC Vision

2017for Computing

in 2025

The HiPEAC project has received funding from the European Union’s Horizon 2020

research and innovation programme under grant agreement number 687698.

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The HiPEAC Vision Document is a deliverable of the coordination and support action on High Performance and Embedded Architecture and Compilation that gathers over 450 leading European academic and industrial computing system researchers from nearly 320 institutions in one virtual center of excellence of 1700 researchers.

The HiPEAC Vision

2009 20112008 2013 2015

2

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SELF-SUFFICIENCY IN ICT and HiPEAC Vision 2015

About processor development:“No state-funded or EU-fundedinitiatives exist in Europe, yet. Theopening up of the CPU-market is,however, an opportunity for Europe tojump in, as it clearly shows thatinformation technology is not tightlybound to one computing platformanymore. Open architectures, wherethe code can be reviewed and thedesign audited, may play a major rolein this climate. “

3

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The HiPEAC Vision Document is a deliverable of the coordination and support action on High Performance and Embedded Architecture and Compilation that gathers over 450 leading European academic and industrial computing system researchers from nearly 320 institutions in one virtual center of excellence of 1700 researchers.

The HiPEAC Vision

2009 20112008 2013 2015 2017

January 2017 version is available at:http://hipeac.net/vision

4

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The document

If you only have 5mn…

5

…Read the back page (1 page)

and/or the Executive summary (2 pages)

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The document

If you have 15mn…

6

…Read the Part 1: Recommendations (4 pages)

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The document

If you have more time…

7

…Read the Part 2: Rationale (103 pages)

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Structure HiPEAC Vision 2017

Recommen-

dations

Society

Market Technology

Position of Europe

8

This presentation

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Evolution of society

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ICT-worker shortage in Europe

10

Shortage: 2015: 442 0002020: 913 000

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Market evolution

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22FD

28nm

14nm

10nm

7nm

5nm

Next Gen

FinFET

Non planar / trigate / stacked Nanowires

25nm TBOX

20nm LG ISPD SiCRSD

Si channel

2017

2018

25nm TBOX

20nm LG ISPD SiCRSD

Si channel

12FD

Silicon Quantum bits

FDSOI

Technology evolution

12

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22FD

28nm

14nm

10nm

7nm

5nm

Next Gen

Mechanical switches

Hyb

rid

lo

gic

Steep slope devices

Si Quantum bits

Disruptive scaling

Monolithic 3D for 3D VLSI

FinFET

Alternative to scaling and diversification

25nm TBOX

20nm LG ISPD SiCRSD

Si channel

2017

2018

25nm TBOX

20nm LG ISPD SiCRSD

Si channel

12FD

Silicon Quantum bits

FDSOI

Technology evolution

Non planar / trigate / stacked Nanowires

13

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The cost per transistors is not decreasing anymore

Start of 2 design tracks ?

• High end, high volume -> Latest technology

• Cost effective, mainstream -> Mature technology

14

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Increased Complexity and Cost

The initial product designs will need to

generate high revenues to provide good

buyback from the design and yield ramp-up

costs.

• Barrier for specialization to computing

• Barrier for advanced feature

monolithic dies

Source IBS, Aug. 2014

28nm 20nm 16nm 10nm 7nm 5nm

$38M $67M$132M

$273M

$593M

$1348MIC Design Cost

NRE ++

Wafer Cost

16nm 10nm 7nm 5nm

$9885

$11881

$14707

$19620

IC Design and Yield Ramp-up Costs

28nm 20nm 16nm 10nm 7nm 5nm

$59M $91M$176M

$373M

$876M

$2243M

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Emerging technologies

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Cyber physical entanglement

• The entanglement between the physical and virtual world

• Virtual reality, augmented reality and cyber-physical systems blending together

• Many computers with any shape or size and new interactions with surrounding people

17

“Uncharted 4”

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Human and machine collaborating

• Entering the Centaur1 era

• Intelligent Personal Assistant (Siri, Cortana, Google now, Alexa…)

• Self-Driving car

• BIC (Brain Inspired Computing)

• …Mainly using Deep Learning

techniques for natural signal processing

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1 In Advanced Chess, a "Centaur" is a man/machine team.

Advanced Chess (sometimes called cyborg chess or centaur

chess) was first introduced by grandmaster Garry Kasparov,

with the objective of a human player and a computer chess

program playing as a team against other such pairs.

(from Wikipedia)

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(Narrow) Artificial Intelligence everywhere

• Artificial Intelligence is changing the man-machine interaction – natural interfaces, ”intelligent” behavior

– Voice recognition and synthesis

– Image and situation understanding

– …

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Key elements of Artificial Intelligence

Traditional AI

Analysis of “big data”

ML-based AI:

Deep Learning*

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* Reinforcement Learning, One-shot Learning, etc…

From Greg. S. Corrado, Google brain team co-founder:

– “Traditional AI systems are programmed to be clever

– Modern ML-based AI systems learn to be clever.”

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Example of hardware: Baidu’s Minwa

– For vision using deep learning

– 36 server nodes, each with Intel Xeon E5-2620, FDR Infiniband (56Gb/s) and 4 Nvidia Tesla K40m GPU

– Total of 8.6 TB of fast memory

(Deep) Learning is quite demanding

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Example of hardware: NVIDIA DGX-1

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(Narrow) Artificial Intelligence everywhere

• Artificial Intelligence is changing the man-machine interaction – natural interfaces, ”intelligent” behavior

– Voice recognition and synthesis

– Image and situation understanding

– …

23

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(Narrow) Artificial Intelligence everywhere

• Artificial Intelligence is changing the man-machine interaction – natural interfaces, ”intelligent” behavior

– Voice recognition and synthesis

– Image and situation understanding

– …

• The new systems should make intelligent and trustable decisions

24

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Key ingredients for trustable systems

Mixed-criticality

Security Privacy

Safety

25

Compatibility with

“classical” ICT

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IoT: the Internet of Threats

Today security / privacy issues make the newspaper headlines

Massive adoption of IoT by citizens relies on confidence in terms of security and privacy

26

Europe has little share in this market: Spends 25% of global cybersecurity marketEarns 8.5% of global cybersecurity market

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• Beyond predictability by design – because it is not anymore possible (WCET, simulations of all use cases)

• Capability to build trustable systems from untrusted components

• Mastering trustability for complex distributed systems, composed of black or grey boxes – where transparency is not always possible

Trust is key for critical applications

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New services

Smart sensors

“Dumb” Internet of Things devices

Big Data

Data Analytics / Cognitive

computing

Cloud / HPC

Physical Systems

Real-time

Embedded

Intelligence

at the edge:

Fog computing

Edge computing

Stream analytics

Fast data…

Transforming data into information

as early as possible

Cyber Physical Entanglement

28

Computing Distribution for ”Cognitive” systems

HPC

in the loop

Processing,

Abstracting

Understanding

as early as

possible

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System should be autonomous to make good decisions in all conditions

Embedded intelligence needs local high-end computing

Safety will impose that basic autonomous functionsshould not rely on “always connected” or “always available”

29

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Privacy will impose that some processing should be done locally and not be sent to the cloud.

Example: detecting elderly people falling in their home

Embedded intelligence needs local high-end computing

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Embedded intelligence needs local high-end computing

Dumb sensors Smart sensors: Streaming and distributed data analytics

Bandwidth will require more local processing 31

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"People who are really serious about software should make their own

hardware" Alan Kay

• With doubling hardware performance, the value was in the software

• With stagnating hardware performance, the value is in the co-design of hardware and software

• In the embedded systems market,

almost 90% of the market is on

hardware (from global market insight).

• We need to retain European

capacity to design hardware

PC-era: IntelMobile era: ARM

CPS-era: ?32

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Digital sovereignty of Europe is in danger if the capability to design and produce hardware is lost

TodayYesterday (Today/) Tomorrow

33

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• Computers should not waste energy on tasks that have no added value

• Trade-off energy/precision/response time• Approximate systems because the world is not only 1 and 0• Need new programming concepts for energy efficiency• The myriad of IoT devices will have a large worldwide

energy impact

Power = performance

34

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Customized hardware…… required to increase energy efficiency (e.g. for the inference phase of Deep learning)

Computations (operations and precision) adapted to the use

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Growing complexity of software and hardware Features

•ARM® Dual Cortex™-A15 Microprocessor Subsystem

• Up to 1.5 GHz

• NEON™ SIMD coprocessor and VFPv4

• 2-MiB Unified L2 Cache Memory

• 6 Power Domains

•IVA-HD Hardware Accelerator Subsystem

•ARM Dual Cortex™-M4 Image Processing Unit (IPU)

• Dual-core, 200 MHz per Core

•On-Chip Debug with 14-Pin JTAG and CTools Technologies

•Display Subsystem

• Display Controller with DMA Engine

• Support for 3 LCD Outputs and 1 TV

• 3 Video, 1 GFX, and 1 Write-back Pipeline

• HDMI Encoder: HDMI 1.4a, HDCP 1.4, and

DVI 1.0 Compliant

•Dual-Core PowerVR® SGX544™ 3D GPU

•2D-Graphics Accelerator (BB2D) Subsystem

• Vivante™ GC320 Core

•Imaging Subsystem (ISS), Consisting of Image Signal Processor (ISP) and Still Image Coprocessor (SIMCOP) Block

•Face Detection Interface (FDIF)

•Power-Independent Audio Back-End (ABE) Subsystem

•Level 3 (L3) and Level 4 (L4) Interconnects

•DDR3/DDR3L Memory Interface (EMIF) Module

• Up to 4 GiB of SDRAM per EMIF (2 GiB per Chip Select)

•General-Purpose Memory Controller (GPMC)

•System Direct Memory Access (DMA) Controller

•Five High-Speed Inter-Integrated Circuit (I2C) Ports

•HDQ™/1-Wire® Interface

•5 Configurable UART/IrDA/CIR Modules

•4 Multichannel Serial Peripheral Interfaces (MCSPIs)

•Multichannel Buffered Serial Port (MCBSP)

•Multichannel Pulse Density Modulation (MCPDM)

•Multichannel Audio Serial Port (MCASP)

•6-Path Digital Microphone (DMIC) Module

•MIPI® High-Speed Synchronous Serial Interface (HSI)

•High-Speed (HS) Multiport USB Host Subsystem

•SATA Host Controller and Physical Layer (PHY)

•MMC/SDIO Host Controller

•SuperSpeed (SS) USB OTG Subsystem and USB3 PHY

•Up to 256 General-Purpose I/O (GPIO) Pins

•11 General-Purpose Timers

•2 Watchdog Timers

•32-kHz Synchronized Timer

•Power, Reset, and Clock Management

• Multiple Independent Core Power Domains

• Multiple Independent Core Voltage Domains

• Module-Level Clock Management for Dynamic Reduction of Consumption

• Available TI Clock Tree Tool (CTT) for Interactive Clock Tree Configuration

•Package

• 754 Device Pins

• Ball Grid Array (BGA)

• 0.5-mm Ball PitchFunctional diagram OMAP 5432 Multimedia Device

Processors

DSPs

Graphics accelerators (GPU)

Crypto accelerators

FPGAs

Deep learning accelerators

Quantum accelerators

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There is a need for a holistic approach for systems development

3737

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Interoperability and composability

38

Interoperability and composability solutions are required

Multiple Control Apps

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Cognitive solutions for

computing systems:

• Using AI techniques

for computing

systems

• Similar to Generative

design for mechanical

engineering

Managing complexity

39

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AI for making computing systems: similar to “Generative design” approach

Motorcycle swingarm: the piece that hinges the rear wheel to the bike’s frame

The user only states desired goals and constraints-> The complexity wall might prevent explaining the solution -> Shall we trust “meta-rules”, or the process that is followed to build the AI?

“Autodesk”

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Time to revisit the basic concepts

The US wants to “reboot computing”…

We propose to re-invent computing, typically by challenging basic assumptions... - Interrupts, layered of memory, binary

coding, ...

41

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42

Cyber physical entanglement

Human and machine collaboration

Artificial intelligence

Highlights of HiPEAC vision 2017…

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43

HPC in the loop

Human in the loop

(visualization, interactive

simulations, …)

Artificial intelligence

Highlights of HiPEAC vision 2017…

for High Performance Computers

HPC at the edge Data analytics

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HPC at the edge: supercomputers from previous generations will become embedded systems in the next generations

Watson in 2011…

“In 2011, the supercomputer WATSON was

the size of a bedroom. Today, it's about the

size of three pizza boxes stacked up. It's also

24 times faster and has seen a 2,400 percent

improvement in performance”

"Watson" tomorrow

Note: it is not for the Jeopardy application,

This slide is just to illustrate the title

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Holistic view

Guaranteeing trust

Mastering complexity

Improving performance and energy efficiency

Increasing ICT

workforceReinventingcomputing

Security, safety, privacy

Mastering parallelism and heterogeneity

Beyond predictability

by design

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46

http://hipeac.net/vision

Download thenew HiPEAC Vision at:

Give us your comments at:

[email protected]

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HiPEAC Vision 2017Editorial board: Marc Duranton, Koen De Bosschere,

Christian Gamrat, Jonas Maebe, Harm Munk, Olivier Zendra

47