Infineon’s Radar Technology and Knowles’ Machine Learning ... · About System Plus Google Pixel 4 XL Teardown. Report Ref.: SP20519 ©2020 by System Plus Consulting | SP20519

©2020 by System Plus Consulting | SP20519 Infineon’s Radar Technology and Knowles’ Machine Learning drive Google Pixel 4XL Gesture Recognition | Sample 1Report Ref.: SP20519

22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Infineon’s Radar Technology and Knowles’ Machine Learning drive Google Pixel 4XL Gesture Recognition

Infineon BGT60TR13C AoP and Knowles DSP IA8508 eWLBSP20519 - RF report by Stéphane ELISABETH

Laboratory Analysis by Guillaume CHEVALIERApril 2020 – SAMPLE

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

http://www.systemplus.fr/



Table of ContentsOverview / Introduction 4

o Executive Summaryo Reverse Costing Methodology

Company Profile 8o Alphabet, Infineon, Knowleso 3D Sensing Technologieso Gesture Recognition Technologieso Technology from Infineon’s Portfolioo 60 GHz Radar Technology from Infineono Google Pixel 4 XL Teardown

Market Analysis 27o Pixel 4, a game changer?: Audio AI and Hardware Evolutiono Market forecast: Audio AI and Radar technology

Physical Analysis 32

o Synthesis of the Physical Analysis

o Module Package 35 Package Views: Dimensions, marking, Block Diagram, Integration

Physical Analysis of the DSP Component 38

o DSP Component 39 Package Views: Dimensions, marking

Package Opening: Views

Package Cross-Section : Dimensions, RDLs

Summary of Physical Data

o DSP Component Die 44 Die View & Dimensions Delayering & main Blocs Die Process Die Cross-Section Die Process Characteristic

Physical Analysis of the Radar Sensor 55

o Antenna on Package 56 Package Views: Dimensions, marking Package Overview : Patch Antenna 3D X-Ray deprocessing: Views, Routing, Antenna, Cross-Section

Package Cross-SectionPCB Substrate, Antenna

Summary of Physical Data

o Radar Sensor Die 79 Die View & Dimensions Delayering & main Blocs Die Process Die Cross-Section Die Process Characteristic

Physical Comparison 109 Infineon Technologies: B7HF200 vs. B11HFC Gesture Recognition System: d-ToF vs. Radar

STMicroelectronics VL6180X vs. Infineon BGT60TR13C

Manufacturing Process 114o Synthesis of the main partso DSP, MMIC Die Front-End Process & Fabrication Unito MMIC Process Flowo PCB Substrate and AoP Process & Fabrication Unit

Cost Analysis 136o Synthesis of the cost analysiso Yields Explanation & Hypotheses 139

o DSP Component 141 Die Front-End Cost Die Wafer and Die Cost

DSP Component Packaging and Component Cost

o Radar Sensor 149 Die Front-End Cost Die Wafer and Die Cost Antenna-On-Package Packaging and Component Cost

Cost Comparison 158 Infineon vs. Texas Instruments AoP:

BGT60TR13C vs. AWR1843AoP

Estimated Selling Price 162

Feedbacks 167

Company services 169




Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Cost Comparison

Selling Price Analysis

Feedbacks

Related Reports

About System Plus

Executive Summary

This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of theGoogle Pixel 4XL Gesture Recognition System, including the Knowles IA8508 and the Infineon BGT60TR13C.

• Using a chipset coupling two components from different companies, the smartphone has various HMI features. These include answering phones with a swipe through the air and turning the volume up and down with squeeze and rotation of the hand. Many gestures can be implemented thanks to a 60 GHz radar sensor from Infineon and a Digital Signal Processing (DSP) from Knowles,which have finally made this possible on a smartphone.

• The radar sensor relies on Infineon’s Automotive radar knowledge and latest 0.13 µm SiGe technology development, its B11HFC process. Using AoP technology, the radar features one Tx and three Rx channels directly on top of the Monolithic Microwave Integrated Circuit (MMIC). The radar sensor captures and follows the hand gesture. The DSP, integrated in the System-on-Chip component from Knowles, processes received data are like sound wave signals.

• The report includes a full investigation of the DSP component and the radar sensor. It features a detailed study of the structure of the AoP and of the new implementation of the SiGe BiCMOS technology, including die analysis, process and a PCB cross-section. It contains a complete cost analysis and a selling price estimation of the system. Finally, it features a technical comparison with the previous generation of SiGe transistor, process name B7HFC200, from Infineon and the direct-ToF sensor from STMicroelectronics, model VL6168X and a cost comparison with the AoP system from Texas Instruments, model AWR1843AoP.




Overview / Introduction

Company Profile & Supply Chain o Alphabet, Infineon, Knowleso 3D Sensing & Gesture

Recognition Technologieso Technology from Infineono Google Pixel 4 XL Teardown

Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis

Cost Comparison


Feedbacks

Related Reports

About System Plus

Google Pixel 4 XL Teardown

Google Pixel 4 XL USA Front View©2020 by System Plus Consulting

XX mm

XX mm

XX mm

XX mm XX mm

XX mm

Google Pixel 4 XL USA Front Sensor Hub©2020 by System Plus Consulting





Company Profile & Supply Chain o Alphabet, Infineon, Knowleso 3D Sensing & Gesture

Recognition Technologieso Technology from Infineono Google Pixel 4 XL Teardown

Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis

Cost Comparison


Feedbacks

Related Reports

About System Plus

Google Pixel 4 XL Teardown






Market Analysis

Physical Analysis o Synthesiso DSP Componento Package Views & Dimensionso Package Cross-Sectiono Die Views and dimensionso Die Delayering & Process

o Radar Sensoro Package Views & Dimensionso Package CT Scan deprocessingo Package Cross-Sectiono Die Views and dimensionso Die Delayering & Process

Physical Comparison


Cost Analysis

Cost Comparison


Feedbacks

Related ReportsAbout System Plus

Summary of the Physical Analysis






Market Analysis



Physical Comparison


Cost Analysis

Cost Comparison


Feedbacks


DSP Component – Package View and Dimensions

Package Top View©2020 by System Plus Consulting

XX

mm

XX mm

• Package: eWLB XX-Balls

• Dimensions: XX x XX x XX mm

• Pitch: XX mm

XX mm

• Marking: 8508A49751923B

Package Side View©2020 by System Plus Consulting

Package Bottom View©2020 by System Plus Consulting






Market Analysis



Physical Comparison


Cost Analysis

Cost Comparison


Feedbacks


Radar Sensor – Package View and Dimensions

Package Top View©2020 by System Plus Consulting

XX

mm

XX mm

XX mm

Package Bottom View©2020 by System Plus Consulting

Package Side View©2020 by System Plus Consulting

• Package: AoP XX-Balls

• Dimensions: XX x XX x XX mm

• Pitch: XX mm

• Marking: 13C06






Market Analysis



Physical Comparison


Cost Analysis

Cost Comparison


Feedbacks


Radar Sensor – Package Overview – X-Ray View

Package Overview – X-Ray View©2020 by System Plus Consulting


Package Top & Bottom – Optical View©2020 by System Plus Consulting

XX






Market Analysis



Physical Comparison


Cost Analysis

Cost Comparison


Feedbacks


Radar Sensor – Package Overview – X-Ray Deprocessing – PC Layer #1

Package X-Ray View©2020 by System Plus Consulting

Patch (XX mm²) (XX x XX mm)

XX Ground Plane

XX Ground Plane

Package – X-Ray Edited©2020 by System Plus Consulting


XX

XX

XX

XX

XX

Xx






Market Analysis



Physical Comparison


Cost Analysis

Cost Comparison


Feedbacks


Radar Sensor – Package Cross-Section






Market Analysis



Physical Comparison


Cost Analysis

Cost Comparison


Feedbacks


Radar Sensor – Summary of Physical Data






Market Analysis



Physical Comparison


Cost Analysis

Cost Comparison


Feedbacks


Radar Sensor – MMIC Die Overview

XX Channel XX Channel

VCO

ADC

Buffer

XX






Market Analysis



Physical Comparison


Cost Analysis

Cost Comparison


Feedbacks


Radar Sensor – MMIC Die Overview

Die Overview – Optical View ©2020 by System Plus Consulting

BGT60TR24 – 60 GHz Bloc DiagramInfineon Patent US XX

Die Overview – Optical View ©2020 by System Plus Consulting

From LO Feeding From LO FeedingTo ADC

Transformer & Mixer

RX1 RX2 RX3

IF1 IF2 IF3






Market Analysis



Physical Comparison


Cost Analysis

Cost Comparison


Feedbacks


Radar Sensor – MMIC Die Process – Bipolar Transistor






Market Analysis



Physical Comparison


Cost Analysis

Cost Comparison


Feedbacks


Radar Sensor – MMIC Die Cross-Section – Bipolar Transistor






Market Analysis

Physical Analysis

Physical Comparisono IFX Process: B7HFC200 vs.

B11HFCo D-Tof vs. Radar


Cost Analysis

Cost Comparison


Feedbacks

Related Reports

About System Plus

B7HF200 vs. B11HFC – Cross-Section






Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flowo Synthesiso DSP Die Front-End Process &

Fabrication Unito DSP Component Final Test &

Assemblyo MMIC Process Flowo MMIC Die Front-End Process &

Fabrication Unito Radar Sensor PCB Substrate &

Assembly Process Flowo Radar Sensor Final Test &

Assembly Unit

Cost Analysis

Cost Comparison


Feedbacks


Global Overview






Market Analysis

Physical Analysis

Physical Comparison






Assembly Unit

Cost Analysis

Cost Comparison


Feedbacks


Radar Sensor – MMIC Die Front-End Process Flow (1/11)CMOS RegionBJT Region






Market Analysis

Physical Analysis

Physical Comparison






Assembly Unit

Cost Analysis

Cost Comparison


Feedbacks


Radar Sensor – PCB Substrate Process (1/2)






Market Analysis

Physical Analysis

Physical Comparison


Cost Analysiso Cost Analysis Summaryo Yields Explanation &

Hypotheseso DSP Componento Radar Sensor Component Cost

Cost Comparison


Feedbacks

Related Reports

About System Plus

DSP Component – Front-End Cost






Market Analysis

Physical Analysis

Physical Comparison




Cost Comparison


Feedbacks

Related Reports

About System Plus

Radar Sensor – Wafer & Die Cost






Market Analysis

Physical Analysis

Physical Comparison




Cost Comparison


Feedbacks

Related Reports

About System Plus

Radar Sensor – AoP Packaging Cost per process steps






Market Analysis

Physical Analysis

Physical Comparison




Cost Comparison


Feedbacks

Related Reports

About System Plus

Radar Sensor – Component Cost






Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis

Cost Comparisono IFX BGT60TR13C vs.

TI AWR1843AoP


Feedbacks

Related Reports

About System Plus

Radar Sensor – Infineon vs. Texas Instrument AoP Cost Comparison






Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis

Cost Comparison

Selling Price Analysiso Definition of Priceso Manufacturer Financialso Estimating Selling Price

Feedbacks

Related Reports

About System Plus

Gesture Recognition Chipset






Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis

Cost Comparison


Feedbacks

Related Reports

About System Plus

Related Reports

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

RF PACKAGING• Qualcomm’s First 5G mmWave Chipset: SDX50M and QTM052• Texas Instruments AWR1843AoP 77/79 GHz Radar Chipset• Acconeer A111 60 GHz Pulsed Coherent Radar



https://www.systemplus.fr/reverse-costing-reports/qualcomms-first-5g-mmwave-chipset-sdx50m-and-qtm052/

https://www.systemplus.fr/reverse-costing-reports/texas-instruments-awr1843aop-7779-ghz-radar-chipset/

https://www.systemplus.fr/reverse-costing-reports/acconeer-a111-60-ghz-pulsed-coherent-radar/








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Cost Analysis

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Infineon’s Radar Technology and Knowles’ Machine Learning ... · About System Plus Google Pixel 4 XL Teardown. Report Ref.: SP20519 ©2020 by System Plus Consulting | SP20519