IPC-9850

Surface Mount

Placement Equipment

Characterization

Developed by the SMT Component Placement Equipment Subcommittee(5-41) of the Assembly Equipment Committee (5-40) of IPC

Users of this standard are encouraged to participate in thedevelopment of future revisions.

Contact:

IPC2215 Sanders RoadNorthbrook, Illinois60062-6135Tel 847 509.9700Fax 847 509.9798

ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES ®

September 16, 2002

Table of Contents

1 INTRODUCTION ........................................................ 1

1.1 Scope .................................................................... 1

1.2 Purpose ................................................................. 1

1.3 Background .......................................................... 1

1.3.1 Future Considerations .......................................... 2

1.4 Implementation .................................................... 2

1.4.1 Characterization Limitations ............................... 2

1.4.2 Binding Requirements ......................................... 2

1.4.3 Test Components ................................................. 2

1.4.4 Test Panels ........................................................... 3

1.4.5 Measurement ........................................................ 3

1.5 Forms ................................................................... 4

1.6 Data Methods ....................................................... 4

1.7 Terms and Definitions ......................................... 4

1.8 Units of Measurement ......................................... 5

2 REFERENCED DOCUMENTS ................................. 5

3 PLACEMENT PERFORMANCE METRIC ................ 5

3.1 Machine Performance Form IPC-9850-F1 ......... 5

3.1.1 General Performance ........................................... 5

3.1.2 Performance Validation ........................................ 5

3.2 Characterization Methodology ............................ 6

3.2.1 Background .......................................................... 6

3.3 Machine Performance Parameters ....................... 7

3.3.1 Test Conditions .................................................... 7

3.3.2 Time-Based Parameters ....................................... 7

3.3.3 CMM Measured Parameters ................................ 9

4 ATTRIBUTE DEFECT RATE AND RELIABILITYPERFORMANCE METRIC—FORM IPC-9850-F2 . 12

4.1 Attribute Defect Rate ......................................... 13

4.2 Reliability Parameters ........................................ 14

4.2.1 Mean Placements Between Assists (MPBA) .... 15

4.2.2 Mean Time To Recover from Assists(MTTRa) ............................................................ 15

4.2.3 Mean Placements Between Failures (MPBF) ... 15

4.2.4 Mean Time To Repair Failures (MTTRf) ......... 15

4.2.5 Total Time .......................................................... 15

4.2.6 Non-Scheduled Time ......................................... 15

4.2.7 Operations Time ................................................. 16

4.2.8 Equipment Dependent Uptime .......................... 16

4.2.9 Preventative Maintenance (PM) Time .............. 16

4.2.10 Mispick Rate (in PPM) ..................................... 16

4.3 Reporting Sites ................................................... 17

4.3.1 Number of Machines ......................................... 17

4.3.2 Total Number of Placements ............................. 17

4.3.3 Total Pickup Attempts ....................................... 17

5 MEASUREMENT CAPABILITY VERIFICATION—FORM IPC-9850-F3 ................................................ 17

5.1 Gauge Repeatability and ReproducibilityCapability ........................................................... 17

5.2 Accuracy Capability .......................................... 17

6 TEST VEHICLES .................................................... 19

6.1 Placement Verification Panel Specifications ..... 19

6.2 Placement Verification Panel CarrierSpecifications ..................................................... 20

6.3 Glass Slug Specifications .................................. 20

6.4 Sticky Media Application .................................. 20

6.5 Placement Program ............................................ 26

6.5.1 1608C Component ............................................. 26

6.5.2 SOIC-16 Component ......................................... 26

6.5.3 QFP-100 and BGA-228 Slugs ........................... 26

6.5.4 QFP-208 Slug .................................................... 26

7 FORMS AND DIAGRAMS ...................................... 31

APPENDIX A .............................................................. 35

APPENDIX B .............................................................. 36

APPENDIX C .............................................................. 37

APPENDIX D .............................................................. 39

APPENDIX E .............................................................. 44

APPENDIX F .............................................................. 48

APPENDIX G .............................................................. 49

APPENDIX H .............................................................. 50

APPENDIX I ............................................................... 51

APPENDIX J .............................................................. 52

Figures

Figure 3-1 Performance Parameter Description fora Single Panel .................................................. 8

Figure 3-2 Performance Parameter Description for aFour-Panel Build ............................................... 8

Figure 3-3 Maximum Lead Tip Error Due to PlacementMachine (Combined Xdev, Ydev and θdev .... 11

Figure 5-1 Accuracy Verification Panel ............................ 18

Figure 6-1 Placement Verification Panel .......................... 20

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Figure 6-2 QFP 100 Slug for White Background forLeads on Chrome Background (Negative) ..... 21

Figure 6-3 QFP 100 Slug for Chrome Leads With NoBackground (Positive) .................................... 22

Figure 6-4 QFP 208 Slug for White Background forLeads on Chrome Background (Negative) ..... 23

Figure 6-5 QFP 208 Slug for Chrome Leads With NoBackground (Positive) .................................... 24

Figure 6-6 BGA-228 Slug for White Background forLeads on Chrome Background (Negative) ..... 25

Figure 6-7 BGA-228 Slug with No Background(Positive) ......................................................... 26

Figure 6-8 Component Location Layout for 1608CComponents ................................................... 27

Figure 6-9 Component Location Layout for SOIC 16Components ................................................... 28

Figure 6-10 Component Location Layout for QFP-100and BGA 228 Slug Components .................... 29

Figure 6-11 Component Location Layout for QFP-208Slug Components ........................................... 30

Figure A-1 Cpk Graphic Representation .......................... 35

Figure H-1 Gauge R&R Spreadsheet Example ............... 50

Figure I-1 Placement Verification Panel Carrier ............. 51

Figure J-1 Termination-to-Land Calculation Example ...... 52

Tables

Table 3-1 Cpk for Termination-to-Land Coverag ............... 11

Table 4-1 Component Typesand Quantities for ‘Typical Kit’ .......................... 13

Table 4-2 Calculation Example ......................................... 15

Table 4-3 Terms Definition ................................................ 16

Table 6-1 Tool Kit Materials Listfor Performance Evaluation .............................. 19

Table D-1 Mean and stdev using 2 fiducials ..................... 40

Table D-2 Mean and stdev per method using 4 fiducials .. 40

Table D-3 Mean and stdev vs. number ofmeasured leads ................................................. 42

IPC-9850 July 2002

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Surface Mount Placement Equipment Characterization

1 INTRODUCTION

1.1 Scope This standard establishes the procedures tocharacterize the capability of surface mount assemblyequipment in specification documents, as well as in docu-mentation used to verify a specific machine’s placementcapability conformance to the specification, while main-taining a placement accuracy to placement speed relation-ship.

1.2 Purpose IPC-9850 has been developed to standard-ize the parameters, measurement procedures, and the meth-odologies used for the specification, evaluation, and con-tinuing verification of assembly equipment characterizationparameters. These standardized toolsshall be used todevelop and report the information called out in this stan-dard.

1.3 Background With the proliferation of Surface MountTechnology (SMT), placement equipment users havestruggled with the question of which machine will performbest in a given manufacturing environment. The advantageof the SMT assembly process to rapidly place componentsin precise alignment to the land patterns on the printedwiring board (PWB) was the initial yardstick by whichmachines were selected. Machines that could place compo-nents the quickest and with the least amount of scrap wereconsidered the best.

Initially, the most common evaluation method was place-ment yield. For this evaluation, a machine is made to popu-late a large number of the user product where visible place-ment errors are counted as defects. Machines with the leastdefects and the most robust operation were considered best.The high yield and reliability of modern SMT placementsystems require that very large amounts of data be col-lected to meaningfully assess yield and reliability. Thisstandard provides new tools for gauging the yield and reli-ability of placement equipment yet presents performanceresults in the traditional metrics.

In addition to the high yield and reliability expected ofmodern placement equipment, the SMT assembly processhas become significantly more demanding. Componentshave decreased in size, component terminations aresmaller, and placement locations have moved closertogether. All this while the number of components on thePWB and product volumes have increased significantly.Placement equipment must now place components morerapidly and with extreme precision to be financially viable.This has made requirements on placement machines moredemanding.

Historically, placement equipment vendors have selectedtheir own parameters and methodologies to present thespecification of their machines’ throughput and placementcapabilities. The many representations of this informationhave made the comparison between similar types of place-ment machines very difficult. To obtain comparable data,users have been forced to conduct on-location evaluationsof various machines under the same conditions. This typeof methodology is very time consuming for users and verycapital intensive for suppliers.

This standard simplifies the evaluation process by standard-izing the performance parameters that describe the place-ment machines’ capabilities. It also couples placementthroughput and placement quality so speed and accuracyparameters are dependent on each other. This standard alsospecifies the methodologies by which the capability param-eters are measured. This reduces potential user-vendor fric-tion created when the user believes the equipment is notfunctioning properly. The methodologies specified hereinare consistent and verifiable, thus providing common-ground-methodologies between users and vendors.

These methodologies were achieved by separating machineperformance from the rest of the SMT process variables,which include paste printing, component quality, packagingtype and PWB quality. The speed and quality evaluationmethods of this standard specify that measurements will bemade by placement of standardized components into stickymedia on clear glass panels. Experience shows that surfacemount equipment must perform well on sticky mediabefore it can perform well in production. Furthermore,improved process capability on sticky tape usually trans-lates into enhanced process capability in production.Although this method does not provide information thatcan be utilized to perfectly predict production quality, thismethodology was selected in order to remove as much ofthe variation as possible between facilities, products, pro-cess, and operators.

While the ultimate goal is to evaluate a machine’s capabil-ity to place components in paste on actual PWBs, it is notcurrently possible to make such measurements at therequired precision and speed. It is anticipated that futurein-line inspection systems will improve in their ability tomeasure component location and orientation. In the futureit may become possible to use in-line post-placement (pre-reflow) automatic optical inspection (AOI) systems to mea-sure the placement machine capabilities.

Due to the convergence of high-speed and fine pitchmachines, this standard makes no attempt to separate thetwo types of machines. The user is empowered to decide if

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