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LCD COLOR MONITOR SERVICE MANUALCHASSIS NO. : CL-66MODEL:L1530SSNT (L1530SSNTN.AL**G,AN**EF) L1530SBNT (L1530SBNTN.AL**G,AN**EF)
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COLOR MONITORSERVICE MANUAL
Website:http://biz.LGservice.comE-mail:http://www.LGEservice.com/techsup.html
CAUTIONBEFORE SERVICING THE UNIT, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS NO. : CL-66
MODEL: L1530SSNT (L1530SSNTN.AL**G,AN**EF)L1530SBNT (L1530SBNTN.AL**G,AN**EF)
( ) **Same model for Service
*To apply the Genesis ZAN3SL Chip.
MENU SET/AUTOLightView- +
-2 -
CONTENTS
SPECIFICATIONS ................................................... 2
PRECAUTIONS ....................................................... 3
TIMING CHART ....................................................... 7
DISASSEMBLY .........................................................8
BLOCK DIAGRAM ................................................. 10
DESCRIPTION OF BLOCK DIAGRAM...................11
ADJUSTMENT ...................................................... 13
TROUBLESHOOTING GUIDE .............................. 15
WIRING DIAGRAM ................................................19
EXPLODED VIEW...................................................20
REPLACEMENT PARTS LIST ...............................22
SCHEMATIC DIAGRAM......................................... 24
SPECIFICATIONS
1. LCD CHARACTERISTICSType : TFT Color LCD ModuleSize : 326.5(H) x 253.5(V) x 11.2(D)Pixel Pitch : 0.297mm x 0.297mmColor Depth : 6bits(with FRC)/ 16M colors Active Video Area : 15.0inch Surface Treatment : Anti-Glare, Hard Coating (3H)Backlight Unit : 2CCFLOpraating Mode : Transmissive mode, Normally whiteElectrical Interface : LVDS
2. OPTICAL CHARACTERISTICS2-1. Viewing Angle by Contrast Ratio ≥ 10
Left : 55° min. 65° typ. Right : 55° min. 65° typ. Top : 40° min. 45° typ. Bottom : 50° min. 55° typ.
2-2. Luminance: 200(min.), 250(typ.) (Full white pattern, 0.73V)
2-3. Contrast Ratio : 300(min.), 400(typ.)
3. SIGNAL (Refer to the Timing Chart)3-1. Sync Signal
1) Type : Separate Sync.2) Input Voltage Level : Low=0~0.8V, High=2.1~5.5V3) Sync Polarity : Positive or Negative
3-2. Video Input Signal1) Type : R, G, B Analog2) Voltage Level : 0~0.7 Va) Color 0, 0 : 0 Vp-pb) Color 7, 0 : 0.35 Vp-pc) Color 15, 0 : 0.7 Vp-p
3) Input Impedance : 75 Ω
3-3. Operating FrequencyHorizontal : 30 ~ 63kHzVertical : 56 ~ 75Hz
4. POWER SUPPLY4-1. Power
100-240V~, 50/60Hz 0.6A
4-2. Power Consumption
5. ENVIRONMENT5-1. Operating Temperature : 10°C~35°C (50°F~95°F)5-2. Operating Humidity : 10%~80%5-3. MTBF : 50,000 HRS with 90% Confidence level
Lamp Life : 40,000 Hours (Min.)
6. DIMENSIONS (with TILT/SWIVEL)
Width : 368mm (14.01'')Depth : 355mm (5.97'')Height : 105mm (14.16'')
7. WEIGHT (with TILT/SWIVEL)
Net. Weight : 3.6kg (8.82 lbs)Gross Weight : 5.0kg (12.13 lbs)
MODE
POWER ON (NORMAL)
STAND-BY
SUSPEND
DPM OFF
POWER S/W OFF
H/V SYNC
ON/ON
OFF/ON
ON/OFF
OFF
-
POWER CONSUMPTION
less than 25 W
less than 1 W
less than 1 W
less than 1 W
less than 1 W
LED COLOR
GREEN
AMBER
AMBER
AMBER
OFF
VIDEO
ACTIVE
OFF
OFF
OFF
-
-3 -
WARNING FOR THE SAFETY-RELATED COMPONENT.
• There are some special components used in LCDmonitor that are important for safety. These parts aremarked on the schematic diagram and thereplacement parts list. It is essential that these criticalparts should be replaced with the manufacturer’sspecified parts to prevent electric shock, fire or otherhazard.
• Do not modify original design without obtaining writtenpermission from manufacturer or you will void theoriginal parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULEWITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arrangedin four corners.
• Do not press on the panel, edge of the frame stronglyor electric shock as this will result in damage to thescreen.
• Do not scratch or press on the panel with any sharpobjects, such as pencil or pen as this may result indamage to the panel.
• Protect the module from the ESD as it may damage theelectronic circuit (C-MOS).
• Make certain that treatment person’s body aregrounded through wrist band.
• Do not leave the module in high temperature and inareas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit withinthe module.
• If the surface of panel become dirty, please wipe it offwith a softmaterial. (Cleaning with a dirty or rough clothmay damage the panel.)
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight (CCFL) orinverter circuit, must disconnect the AC adapterbecause high voltage appears at inverter circuit about650Vrms.
• Handle with care wires or connectors of the invertercircuit. If the wires are pressed cause short and mayburn or take fire.
Leakage Current Hot Check Circuit
PRECAUTION
CAUTIONPlease use only a plastic screwdriver to protect yourselffrom shock hazard during service operation.
1.5 Kohm/10W
To Instrument'sexposed METALLIC PARTS
Good Earth Groundsuch as WATER PIPE,CONDUIT etc.
AC Volt-meter
-4 -
SERVICING PRECAUTIONSCAUTION: Before servicing receivers covered by thisservice manual and its supplements and addenda, readand follow the SAFETY PRECAUTIONS on page 3 of thispublication.NOTE: If unforeseen circumstances create conflictbetween the following servicing precautions and any of thesafety precautions on page 3 of this publication, alwaysfollow the safety precautions. Remember: Safety First.
General Servicing Precautions1. Always unplug the receiver AC power cord from the AC
power source before;a. Removing or reinstalling any component, circuit
board module or any other receiver assembly.b. Disconnecting or reconnecting any receiver electrical
plug or other electrical connection.c. Connecting a test substitute in parallel with an
electrolytic capacitor in the receiver.CAUTION: A wrong part substitution or incorrectpolarity installation of electrolytic capacitors mayresult in an explosion hazard.
d. Discharging the picture tube anode.2. Test high voltage only by measuring it with an
appropriate high voltage meter or other voltagemeasuring device (DVM, FETVOM, etc) equipped witha suitable high voltage probe.Do not test high voltage by "drawing an arc".
3. Discharge the picture tube anode only by (a) firstconnecting one end of an insulated clip lead to thedegaussing or kine aquadag grounding system shieldat the point where the picture tube socket ground leadis connected, and then (b) touch the other end of theinsulated clip lead to the picture tube anode button,using an insulating handle to avoid personal contactwith high voltage.
4. Do not spray chemicals on or near this receiver or anyof its assemblies.
5. Unless specified otherwise in this service manual,clean electrical contacts only by applying the followingmixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator;10% (by volume) Acetone and 90% (by volume)isopropyl alcohol (90%-99% strength)CAUTION: This is a flammable mixture.Unless specified otherwise in this service manual,lubrication of contacts in not required.
6. Do not defeat any plug/socket B+ voltage interlockswith which receivers covered by this service manualmight be equipped.
7. Do not apply AC power to this instrument and/or any ofits electrical assemblies unless all solid-state deviceheat sinks are correctly installed.
8. Always connect the test receiver ground lead to thereceiver chassis ground before connecting the testreceiver positive lead.Always remove the test receiver ground lead last.
9. Use with this receiver only the test fixtures specified inthis service manual.CAUTION: Do not connect the test fixture ground strapto any heat sink in this receiver.
Electrostatically Sensitive (ES) DevicesSome semiconductor (solid-state) devices can bedamaged easily by static electricity. Such componentscommonly are called Electrostatically Sensitive (ES)Devices. Examples of typical ES devices are integratedcircuits and some field-effect transistors andsemiconductor "chip" components. The followingtechniques should be used to help reduce the incidence ofcomponent damage caused by static by static electricity.1. Immediately before handling any semiconductor
component or semiconductor-equipped assembly, drainoff any electrostatic charge on your body by touching aknown earth ground. Alternatively, obtain and wear acommercially available discharging wrist strap device,which should be removed to prevent potential shockreasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped withES devices, place the assembly on a conductivesurface such as aluminum foil, to prevent electrostaticcharge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder orunsolder ES devices.
4. Use only an anti-static type solder removal device.Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient todamage ES devices.
5. Do not use freon-propelled chemicals. These cangenerate electrical charges sufficient to damage ESdevices.
6. Do not remove a replacement ES device from itsprotective package until immediately before you areready to install it. (Most replacement ES devices arepackaged with leads electrically shorted together byconductive foam, aluminum foil or comparableconductive material).
7. Immediately before removing the protective materialfrom the leads of a replacement ES device, touch theprotective material to the chassis or circuit assemblyinto which the device will be installed.CAUTION: Be sure no power is applied to the chassisor circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackagedreplacement ES devices. (Otherwise harmless motionsuch as the brushing together of your clothes fabric orthe lifting of your foot from a carpeted floor cangenerate static electricity sufficient to damage an ESdevice.)
-5 -
General Soldering Guidelines1. Use a grounded-tip, low-wattage soldering iron and
appropriate tip size and shape that will maintain tiptemperature within the range or 500。F to 600。F.
2. Use an appropriate gauge of RMA resin-core soldercomposed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.4. Thoroughly clean the surfaces to be soldered. Use a
mall wire-bristle (0.5 inch, or 1.25cm) brush with ametal handle.Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering techniquea. Allow the soldering iron t ip to reach normal
temperature.(500。F to 600。F)
b. Heat the component lead until the solder melts.c. Quickly draw the melted solder with an anti-static,
suction-type solder removal device or with solderbraid.CAUTION: Work quickly to avoid overheating thecircuitboard printed foil.
6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normal
temperature (500。F to 600。F)b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction ofthe component lead and the printed circuit foil, andhold it there only until the solder flows onto andaround both the component lead and the foil.CAUTION: Work quickly to avoid overheating thecircuit board printed foil.
d. Closely inspect the solder area and remove anyexcess or splashed solder with a small wire-bristlebrush.
IC Remove/ReplacementSome chassis circuit boards have slotted holes (oblong)through which the IC leads are inserted and then bent flatagainst the circuit foil. When holes are the slotted type,the following technique should be used to remove andreplace the IC. When working with boards using thefamiliar round hole, use the standard technique asoutlined in paragraphs 5 and 6 above.
Removal1. Desolder and straighten each IC lead in one operation
by gently prying up on the lead with the soldering irontip as the solder melts.
2. Draw away the melted solder with an anti-staticsuction-type solder removal device (or with solderbraid) before removing the IC.
Replacement1. Carefully insert the replacement IC in the circuit board.2. Carefully bend each IC lead against the circuit foil pad
and solder it.3. Clean the soldered areas with a small wire-bristle
brush. (It is not necessary to reapply acrylic coating tothe areas).
"Small-Signal" Discrete TransistorRemoval/Replacement1. Remove the defective transistor by clipping its leads as
close as possible to the component body.2. Bend into a "U" shape the end of each of three leads
remaining on the circuit board.3. Bend into a "U" shape the replacement transistor leads.4. Connect the replacement transistor leads to the
corresponding leads extending from the circuit boardand crimp the "U" with long nose pliers to insure metalto metal contact then solder each connection.
Power Output, Transistor DeviceRemoval/Replacement1. Heat and remove all solder from around the transistor
leads.2. Remove the heat sink mounting screw (if so equipped).3. Carefully remove the transistor from the heat sink of the
circuit board.4. Insert new transistor in the circuit board.5. Solder each transistor lead, and clip off excess lead.6. Replace heat sink.
Diode Removal/Replacement1. Remove defective diode by clipping its leads as close
as possible to diode body.2. Bend the two remaining leads perpendicular y to the
circuit board.3. Observing diode polarity, wrap each lead of the new
diode around the corresponding lead on the circuitboard.
4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solder
joints of the two "original" leads. If they are not shiny,reheat them and if necessary, apply additional solder.
Fuse and Conventional ResistorRemoval/Replacement1. Clip each fuse or resistor lead at top of the circuit board
hollow stake.2. Securely crimp the leads of replacement component
around notch at stake top.3. Solder the connections.
CAUTION: Maintain original spacing between thereplaced component and adjacent components and thecircuit board to prevent excessive componenttemperatures.
-6 -
Circuit Board Foil RepairExcessive heat applied to the copper foil of any printedcircuit board will weaken the adhesive that bonds the foilto the circuit board causing the foil to separate from or"l i f t-off" the board. The following guidelines andprocedures should be followed whenever this condition isencountered.
At IC ConnectionsTo repair a defective copper pattern at IC connections usethe following procedure to install a jumper wire on thecopper pattern side of the circuit board. (Use thistechnique only on IC connections).
1. Carefully remove the damaged copper pattern with asharp knife. (Remove only as much copper asabsolutely necessary).
2. carefully scratch away the solder resist and acryliccoating (if used) from the end of the remaining copperpattern.
3. Bend a small "U" in one end of a small gauge jumperwire and carefully crimp it around the IC pin. Solder theIC connection.
4. Route the jumper wire along the path of the out-awaycopper pattern and let it overlap the previously scrapedend of the good copper pattern. Solder the overlappedarea and clip off any excess jumper wire.
At Other ConnectionsUse the following technique to repair the defective copperpattern at connections other than IC Pins. This techniqueinvolves the installation of a jumper wire on thecomponent side of the circuit board.1. Remove the defective copper pattern with a sharp
knife.Remove at least 1/4 inch of copper, to ensure that ahazardous condition will not exist if the jumper wireopens.
2. Trace along the copper pattern from both sides of thepattern break and locate the nearest component that isdirectly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the leadof the nearest component on one side of the patternbreak to the lead of the nearest component on theother side.Carefully crimp and solder the connections.CAUTION: Be sure the insulated jumper wire isdressed so the it does not touch components or sharpedges.
TIMING CHART
-7 -
VIDEO
SYNC
B
C
E
A
D
DotClock
SyncDuration
( C )
FrontPorch ( D )
1 H(Pixels) + 25.175 31.468 KHz 800 640 16 96 48 640 x 350
V(Lines) - 70.0 Hz 449 350 37 2 60
2 H(Pixels) - 28.322 31.468 KHz 900 720 17 108 55 720 x 400
V(Lines) + 70.0 Hz 449 400 13 2 34 (TEXT)
3 H(Pixels) - 25.175 31.469 KHz 800 640 16 96 48 640 x 480
V(Lines) - 60.0 Hz 525 480 10 2 33
4 H(Pixels) - 30.24 35.00 KHz 864 640 64 64 96 640 x 480
V(Lines) - 66.67 Hz 525 480 3 3 39
5 H(Pixels) - 31.5 37.861 KHz 832 640 24 40 128 640 x 480
V(Lines) - 72.8 Hz 520 480 9 3 28
6 H(Pixels) - 31.5 37.50KHz 840 640 16 64 120 640 x 480
V(Lines) - 75.0 Hz 500 480 1 3 16
7 H(Pixels) + 36.0 35.156 KHz 1024 800 24 72 128 800 x 600
V(Lines) + 56.25 Hz 625 600 1 2 22
8 H(Pixels) + 40.0 37.879 KHz 1056 800 40 128 88 800 x 600
V(Lines) + 60.3 Hz 628 600 1 4 23
9 H(Pixels) + 50.0 48.077 KHz 1040 800 56 120 64 800 x 600
V(Lines) + 72.188 Hz 666 600 37 6 23
10 H(Pixels) + 49.5 46.875 KHz 1056 800 16 80 160 800 x 600
V(Lines) + 75.0 Hz 625 600 1 3 21
11 H(Pixels) - 57.2832 49.725 KHz 1152 832 32 64 224 832 x 624
V(Lines) - 74.55 Hz 667 624 1 3 39 (MAC)
12 H(Pixels) - 65 48.363 KHz 1344 1024 24 136 160 1024 x 768
V(Lines) - 60.0 Hz 806 768 3 6 29
13 H(Pixels) - 75 56.476 KHz 1328 1024 24 136 144 1024 x 768
V(Lines) - 70.0 Hz 806 768 3 6 29
14 H(Pixels) + 78.75 60.023 KHz 1312 1024 16 96 176 1024 x 768
V(Lines) + 75.0 Hz 800 768 1 3 28
MODE H / V Sync Polarity Frequency
TotalPeriod
( E )
VideoActive
Time ( A )
Blanking Time ( B )
Resolution
-8 -
DISASSEMBLY
1. Put a soft cushion on the floor and lay the stand on itsside so that the base is accessible.
4. Cover the panel with your hand so that it is not scratched.Then, pull up the cabinet corner side.
5-1. Disassemble the cabinet.
5-2. Hold the control PCB as shown in the figure and gentlypull it out.
6. Push up the back cover as shown in the figure and pullout the chassis assembly so that the latch is untied.
2. Hold the set while folding the latch and take out the standbase.
3-1. Push the cover upward and remove it.
3-2. Unscrew the four screws.
# 1 # 4
# 2 # 5
# 3 # 6
-9 -
# 7 # 9
# 8
7. Push the shield cap upward and disassemble it. 9. Pull out the link cable while pushing up the main frame.
8. Pull out the cable.
-10 -
BLOCK DIAGRAM
LIP
S
5V
5V
Pow
er +
+
Inve
rter
BR
T-C
TL
INV
-CT
LgmZ
AN
3SL
AD
CS
calin
g
PLL
OS
D
LVD
STr
ansm
itter
Pan
el
MC
UE
EP
RO
M(S
yste
m)
LVD
SA
nalo
g(R
/G/B
)
D-S
ub To K
ey C
ontr
ol
3.3V
VM
OD
3.3
V
1.8
V
Reg
ulat
or
3.3
V
1.8
V
Sw
itch
(Sys
tem
)3.
3V MO
D-O
N
5V
DESCRIPTION OF BLOCK DIAGRAM
-11 -
1. Video Controller Part.This part amplifies the level of video signal for the digital conversion and converts from the analog video signal tothe digital video signal using a pixel clock.The pixel clock for each mode is generated by the PLL.The range of the pixel clock is from 25MHz to 80MHz.This part consists of the Scaler, ADC and TMDS receiver .The Scaler gets the video signal converted analog to digital, interpolates input to 1024 X768 resolution signal andoutputs 8-bit R, G, B signal to transmitter.
2. Power Part.This part consists of the one 5V, one 3.3V, and one 1.8V regulators to convert power which is provided 5V inPower board.3.3V is provided for LCD panel and inverter, 5V is provided for micom.Also, 5V is converted 3.3V and 1.8V by regulator. Converted power is provided for IC in the main board.
3. MICOM Part.This part consists of EEPROM IC which stores control data, Reset IC and the Micom.The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable.The controlled data of each modes is stored in EEPROM.
-12 -
EMICOMPONENTS
LINE100 ~ 240V
INPUT RECTIFIERAND FILTER
ENERGYTRANSFER
OUTPUT RECTIFIERAND FILTER
12V
5V
GND
SIGNALCOLLENT-
ION
PHOTO-COUPLERISOLATION
HVDC 100KHz
PRIMARY SECONDARY
50 ~ 60Hz
PWMCONTROLCIRCUIT
LIPS Board Block Diagram
Operation description_LIPS
1. EMI components.This part contains of EMI components to comply with global marketing EMI standards like FCC,VCCI CISPR, thecircuit included a line-filter, across line capacitor and of course the primary protection fuse.
2. Input rectifier and filter.This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor.
3. Energy Transfer.This part function is for transfer the primary energy to secondary through a power transformer.
4. Output rectifier and filter.This part function is to make a pulse width modulation control and to provide the driver signal to power switch,toadjust the duty cycle during different AC input and output loading condition to achieve the dcoutput stabilized, andalso the over power protection is also monitor by this part.
5. Photo-Coupler isolation.This part function is to feed back the dc output changing status through a photo transistor to primary controller toachieve the stabilized dc output voltage.
6. Signal collection.This part function is to collect the any change from the dc output and feed back to the primary through phototransistor.
-13 -
ADJUSTMENT
Windows EDID V1.0 User Manual
Operating System: MS Windows 98, 2000, XPPort Setup: Windows 98 => Don’t need setup
Windows 2000, XP => Need to Port Setup.This program is available to LCD Monitor only.
1. Port Setupa) Copy “UserPort.sys” file to
“c:\WINNT\system32\drivers” folderb) Run Userport.exe
c) Remove all default numberd) Add 300-3FF
e) Click Start button.f) Click Exit button.
2. EDID Read & Write1) Run WinEDID.exe
2) Edit Week of Manufacture, Year of Manufacture, Serial Numbera) Input User Info Datab) Click “Update” buttonc) Click “ Write” button
-14 -
Figure 1. Cable Connection
SERVICE OSD
1) Turn off the power switch at the front side of the display.
2) Wait for about 5 seconds and press MENU, POWER switch with 1 second interval.
3) The SVC OSD menu contains additional menus that the User OSD menu as described below.
a) Auto Color : W/B balance and Automatically sets the gain and offset value.b) NVRAM INIT : EEPROM initialize.(24C08)c) CLEAR ETI : To initialize using time.d) AGING : Select Aging mode(on/off).e) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually.f) R/G/B-6500K : Allows you to set the R/G/B-6500K value manually.g) R/G/B-Offset : Allows you to set the R/G/B-Offset value manually.(Analog Only) h) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only)i) PANEL : To select applied module.
220
IBMCompatible PC
PARALLEL PORT
Power inlet (required)
Power LED
ST Switch
Power Select Switch(110V/220V)
Con
trol
Lin
e
Not u
sed
RS232
C
PARAL
LEL
V-SY
NC
POW
ER
ST
VGS
MONITOR
E
E
V-Sync On/Off Switch(Switch must be ON.)
F
F
A
A
BB
C
C
15105
5
69
1
1
1
14
13
25
6
5V
5V
5V
4.7K4.7K
4.7K
74LS06
74LS06
OFF ON
OFF
ON
11Video SignalGenerator
-15 -
TROUBLESHOOTING GUIDE
1. NO POWER
CHECK U801.
CHECK U801 PIN 1& U803 PIN
3 VOLTAGE(5V) ?
NO
NO POWER
(POWER INDICATOR OFF)
CHECK POWER BOARD,AND FIND OUT A SHORT
POINT AS OPENING EACH POWER LINE
CHECK J707 VOLTAGE PIN5, PIN6 (5V)?
NO
CHECK 5VR LINE(OPEN CHECK)
CHECK Q803 PIN 3(3.3V) &U803 PIN 4 (1.8V)?
NO
CHECK IIC LINECONNECTION (U501, U502)
CHECK U201 VCC, XTAL, RESET
IS U201 PIN88VOLTAGE REPEATED
AS PULSE SHAPE ?
NO
YES
YES
YES NO PROBLEM
YES
CHECK KEY CONTROL
CONNECTOR ROUTINE
1
1 1
2
1 2
Waveforms
J707-#5, 6 / U801-#1/U803-#3 U201-#88
-16 -
2. NO RASTER (OSD IS NOT DISPLAYED) – LIPS
CHECK MICOM INV ON/OFFPORT. (U501 PIN9)
J707 PIN22.5V?
NO
NO RASTER(OSD IS NOT DISPLAYED)
CHECK LIPSJ707
PIN5, PIN 65V?
NO
1. CONFIRM BRIGHTNESSOSD CONTRL STATE.
2. CHECK MICOM DIM-ADJ PORT(U501 PIN41)
J707 PIN15V?
NO
LIPS
CHECK PULSE AS
CONTACTING SCOPE PROBE TO CAUTION LABEL.
(CONTACT PROBE TO CAUTION LABEL.
CAN YOU SEE PULSE AT YOUR SCOPE?
NO
REPLACE CCFL LAMPIN THE LCD MODULE
YES
YES
YES
YES
1
3 4
J705 Inverter output
3 4
Waveforms
J707-#2 J707-#21 J707-#5, 6 / U801-#1/U803-#3
Inverter Off
Micom Port check
J705 Inverter output
Micom Port check
Inverter On
J705 Inverter output
-17 -
1. CHECK PIN88SOLDERING CONDITION2. CHECK X5013. TROUBLE IN U201
U201 POWER PINS 3.3V?
NOCHECK U803, U801
U201 PIN88
OSCILLATE AS12MHZ?
CHECK CONNECTION LINE
FROM U201 TO U501
TROUBLE IN CABLE OR LCD MODULE
CHECK 5VR LINEU501 PIN85V?
YES
YES
YES
3. NO RASTER (OSD IS NOT DISPLAYED) – gmZAN3SL
NO RASTER(OSD IS NOT DISPLAYED)
U501PIN43 IS 48KHz H-SYNC?PIN44 IS 60Hz V-SYNC?IS PULSE APPEARED
AT SIGNAL PINS?
NO
NO
NO
2
2
6
Waveforms
U201-#88 6 U501-#43, 44
YES
-18 -
CHECK U803, U801U201
POWER PIN99(1.8V)PIN33(3.3V)?
NO
1. CHECK PC2. CHECK SIGNAL CABLE
& D-SUB CONNECTOR LINE
CHECKR,G,B INPUT?
U201 PIN 70,74,77
NO
CHECK H-SYNC LINE(D-SUB→U501 →U201
PIN95)
CHECKH-SYNC INPUT U201 PIN 95?
NO
YES
YES
CHECK V-SYNC LINE
(D-SUB→U501 →U201
PIN96)
CHECKV-SYNC INPUT U201 PIN 96?
NO
YES
NO RASTER(OSD IS DISPLAYED)
4. NO RASTER (OSD IS DISPLAYED) – gmZAN3SL
TROUBLE IN
LCD MODULE
YES
-19 -
WIRING DIAGRAM
MMST9151
Main Board
Power Board
Control Board
Connector Ass’y P/N: 6631T20024C
Connector Ass’y P/N: 6631T11012R
-20 -
EX
PL
OD
ED
VIE
W
010
020
100
090
060
070
030
140
150
120
040
070 11
0
080
130
050
-21 -
EXPLODED VIEW PARTS LIST
010
020
030
040
050
060
070
080
090
100
110
120
130
140
150
3091TKL097V CABINET ASSEMBLY, L1530 BRAND L088 L088 (PC-ABS) Q-CKD-SILVER-USA
3091TKL097K CABINET ASSEMBLY, L1530 BRAND 3090TKL088 "B"-CKD-SILVER-Brazil,Mexico,Panama
3091TKL153C CABINET ASSEMBLY, L1530 BRAND L088 PC+ABS CKD-BLACK-USA
3091TKL097S CABINET ASSEMBLY, L1530S BRAND 3090TKL088 "C"-CKD-BLACK-Panama
6304FLP146B LCD(LIQUID CRYSTAL DISPLAY), LM150X08-A4K8 LG PHILPS TFT COLOR PSWG,LVDS,16MS,SS S D-IC , COST COMPENSATION
or 6304FLP146A LCD(LIQUID CRYSTAL DISPLAY), LM150X08-A4K8 LG PHILPS TFT COLOR PSWG,LVDS,16MS,SS S D-IC
6304FLP113A LCD(LIQUID CRYSTAL DISPLAY), LM150X08-A4K3 LG PHILPS TFT COLOR PSWG,LVDS,16MS,HYNIX/HITACHI
3809TKL067G BACK COVER ASSEMBLY, L1530S L072 (PC-ABS) F-CKD-USA
3809TKL067C BACK COVER ASSEMBLY, L1530 3808TKL072 "A"-CKD-Brazil,Mexico,Panama
3043TKK146B TILT SWIVEL ASSEMBLY, L1530 .. "A"-CKD
3043TKK145K TILT SWIVEL ASSEMBLY, L1530 .. "D"-CKD-SILVER
3043TKK145Q TILT SWIVEL ASSEMBLY, L1530S .. (BK-VER)"G"-CKD-BLACK
4951TKS136J METAL ASSEMBLY, FRAME "A"-CKD
4814TKK263A SHIELD, INVERTER CAP(L1530)
4814TKK263B SHIELD, INVERTER CAP_"A"CKD
6871TPT271X PWB(PCB) ASSEMBLY,POWER, M-CHASSIS 15INCH POWER TOTAL LIEN CHANG C306 68PF 450V
or 6871TPT282E PWB(PCB) ASSEMBLY,POWER, M-CHASSIS 15INCH C306 68PF 450V POWER TOTAL LIEN CHANG PB FREE
or 6871TPT271N PWB(PCB) ASSEMBLY,POWER, M-CHASSIS 15INCH POWER TOTAL LIEN CHANG C306 68PF
3313TL5101E MAIN TOTAL ASSEMBLY, L1530SN GMZAN3SL MX CKD - E BRAND CL-66-LPL
3313TL5127E MAIN TOTAL ASSEMBLY, L1530SN KNPAEFM BRAND CL-66-LPL TN
3313TL5101F MAIN TOTAL ASSEMBLY, L1530SN GMZAN3SL SP CKD - E BRAND CL-66-LPL
6631T11012R CONNECTOR ASSEMBLY, 20P H-H 140MM UL20276 PANEL LINK CABLE LM567D
6871TST541E PWB(PCB) ASSEMBLY,SUB, L1930BM CONTROL TOTAL BRAND MX CKD-LPL
6871TST804E PWB(PCB) ASSEMBLY,SUB, L1730B LGEMX CONTROL TOTAL BRAND LF-LPL TN
6871TST541H PWB(PCB) ASSEMBLY,SUB, L1530SM CONTROL TOTAL BRAND SP CKD-LPL
3550TKK446F COVER, L1530S BACK DOOR_"E"-CKD-SILVER
3550TKK446H COVER, L1530S BACK DOOR (BK) "C"-CKD-BLACK
3550TKK452D COVER, LXX30 STAND REAR COVER_"B"-CKD-SILVER
3550TKK452E COVER, LXX30S STAND REAR COVER (BK) "C"-CKD-BLACK
6850TD9004G CABLE,D-SUB, UL20276-9C(5.8MM) DT 1800MM BLACK(9930) SONY DM
6410TUW008A POWER CORD, LP31+LS13 LONGWELL UL/CSA 1870MM WALL CD/PB FREE BLACK
or 174-206M POWER CORD, SP305 IS14 I-SHENG UL/CSA 1870MM WALL BLACK
DescriptionPart No.Ref. No.
- 22 -
DATE: 2005. 3. 21. *S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
C204 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC205 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC206 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC207 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC208 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC210 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC213 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC214 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC215 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC216 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC217 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC218 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC219 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC220 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC221 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC222 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC223 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC224 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC225 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC226 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC227 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC231 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC232 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC233 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC234 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC503 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC504 0CE106CK610 "10UF SHL,SD 50V 20% BULK FL"C506 0CC030CK01A 3PF 1608 50V 0.25 PF R/TP NPC507 0CC180CK41A 18PF 1608 50V 5% R/TP NP0C508 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC701 0CK105CD56A 1UF 1608 10V 10% R/TP X7RC708 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC709 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC717 0CC101CK41A 100PF 1608 50V 5% R/TP NP0C718 0CC101CK41A 100PF 1608 50V 5% R/TP NP0C720 0CC680CK41A 68PF 1608 50V 5% R/TP NP0C721 0CC680CK41A 68PF 1608 50V 5% R/TP NP0C727 0CK105CD56A 1UF 1608 10V 10% R/TP X7RC732 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC733 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7RC734 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7RC735 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7RC801 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC819 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC820 0CE107EF628 "100UF KMG,RD 16V 20% FM2.5 T"C821 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC829 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(YC831 0CE107EF628 "100UF KMG,RD 16V 20% FM2.5 T"C832 0CE107EF628 "100UF KMG,RD 16V 20% FM2.5 T"C833 0CK105CD56A 1UF 1608 10V 10% R/TP X7RC834 0CC102CK41A 1000PF 1608 50V 5% R/TP NP0
DATE: 2005. 3. 21. *S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
D701 0DSIH00018A "ENKMC2837-T112,LF ISAHAYA R/"D702 0DSIH00018A "ENKMC2837-T112,LF ISAHAYA R/"D706 0DSIH00018A "ENKMC2837-T112,LF ISAHAYA R/"ZD701 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W 5.ZD702 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W 5.ZD703 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W 5.ZD704 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W 5.ZD705 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W 5.ZD711 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W 5.
Q502 0IKE704200H KIA7042AP TO-92 TP 4.2 VOLTU201 0IPRPGN016B "GMZAN3SL-BD-LF GENESIS 128P,"U501 0IZZTSZ535A L1530SN GMZAN3SL MICOM ASSY-LPLU501 0IZZTSZ701A L1530SN ZAN3SL MICOM ASSY P-LPL TNU502 0ISG240860B "M24C08WMN6T(P),LF SGS-THOMSO"U801 0IPMGKE011A KIA78D33F KEC DPAK R/TP 3.3VU803 0IPMGSG019A "LD1117S18TR,LF STM SOT223 R/"
U802 0TFVI80067A SI3865BDV(E3) VISHAY R/TP TSQ503 0TRIH80001A "RT1C3904-T112,LF ISAHAYA R/T"Q504 0TRIH80001A "RT1C3904-T112,LF ISAHAYA R/T"Q505 0TRIH80001A "RT1C3904-T112,LF ISAHAYA R/T"Q703 0TR390609FA KST3906-MTF TP SAMSUNG SOT2Q704 0TR390609FA KST3906-MTF TP SAMSUNG SOT2
R201 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TPR202 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TPR203 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TPR208 0RJ1200D677 120 OHM 1/10 W 5% 1608 R/TPR209 0RJ1200D677 120 OHM 1/10 W 5% 1608 R/TPR210 0RJ1200D677 120 OHM 1/10 W 5% 1608 R/TPR211 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TPR213 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TPR214 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TPR220 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TPR221 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TPR222 0RJ1004D677 1000000 OHM 1/10 W 5% 1608 RR506 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR508 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR514 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR515 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR516 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR518 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR520 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR521 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR522 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR523 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP
REPLACEMENT PARTS LIST
CAUTION: BEFORE REPLACING ANY OF THESE COMPONENTS, READ CAREFULLY THE SAFETY PRECAUTIONS IN THIS MANUAL.
* NOTE : S SAFETY MarkAL ALTERNATIVE PARTS
MAIN BOARDCAPACITORS
ICs
DIODEs
TRANSISTOR
RESISTORs
DATE: 2005. 3. 21. *S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
R534 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TPR535 0RJ3301D677 3.3K OHM 1/10 W 5% 1608 R/TPR537 0RJ3301D677 3.3K OHM 1/10 W 5% 1608 R/TPR541 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TPR542 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TPR543 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR544 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR545 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TPR547 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TPR548 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TPR549 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TPR555 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TPR557 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TPR560 0RJ4702D677 47000 OHM 1/10 W 5% 1608 R/TR561 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR566 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TPR701 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TPR703 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TPR706 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TPR708 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TPR709 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TPR716 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR717 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR721 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TPR722 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TPR723 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TPR724 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TPR726 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TPR727 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TPR728 0RJ1502D677 15K OHM 1/10 W 5% 1608 R/TPR735 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TPR737 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TPR744 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR747 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR749 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TPR770 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TPR771 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TPR775 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TPR779 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TPR780 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TPR781 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TPR782 0RJ0471D677 4.7 OHM 1/10 W 5% 1608 R/TPR803 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TPR811 0RJ2202D677 22K OHM 1/10 W 5% 1608 R/TPR812 0RJ5600D677 560 OHM 1/10 W 5% 1608 R/TPR813 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TPR814 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TPR815 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TPR816 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TPR817 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TPR818 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TPR819 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TPR820 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TPR821 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TPR822 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TPR827 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP
X501 6212AA2004A HC-49U TXC 12.0MHZ +/- 30 PP
SW2 140-058E SKHV10910B LGEC NON 12V 20A
DATE: 2005. 3. 21. *S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION
SW3 140-058E SKHV10910B LGEC NON 12V 20ASW6 140-058E SKHV10910B LGEC NON 12V 20ASW7 140-058E SKHV10910B LGEC NON 12V 20ASW8 140-058E SKHV10910B LGEC NON 12V 20ALED1 0DLLT0340AA LITEON LTL-14CDJNHBP1 BK GREC1 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7RC2 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7RQ1 0TR390409AE FAIRCHILD KST3904(LGEMTF) TPQ2 0TR390409AE FAIRCHILD KST3904(LGEMTF) TPR1 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR2 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR3 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TPR4 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TPR5 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TPR7 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TPR8 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP
- 23 -
OTHERs
CONTROL BOARD
SCHEMATIC DIAGRAM
- 24 -
1. SCALERL1515/L1715Z
AN
3SL
# 1
25
U201-#88
52
- 25 -
2. MICOML1515/L1715M
ICO
M# 2
1.5
K(1
7")
6U
501-#43, 44
6
- 26 -
3. POWERL1515/L1715P
OW
ER
# 3
390390
390390
1
1
1J707-#5,6/U
801-#1/U803-#3
- 27 -
4. CONNECTOR & JACKSL1515/L1715C
ON
NE
CTO
R &
JAC
KS
# 4
15K
1 43
Inverter Off
Inverter On
4J707-#2
3J707-#2
1J707-#5,6/U
801-#1/U803-#3
Micom
Port check
J705 Inverter output
Micom
Port check
J705 Inverter output
Inverter Off
Inverter On
Mar. 2005P/NO : 3828TSL094X Printed in Korea