COLOR MONITORSERVICE MANUAL

Website:http://biz.LGservice.com

CAUTIONBEFORE SERVICING THE UNIT, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS NO. : LM76D

MODEL: L177WSB (L177WSB-*FS.K***AP*)

( ) **Same model for Service

- 2 -

CONTENTS

1. LCD CHARACTERISTICSType : TFT Color LCD ModuleActive Display Area : 17 inch Pixel Pitch : 0.255 (H) x 0.255 (V) Color Depth : 8bits, 16.2M colorsSize : 254.5 (H) x 389.2 (W) x 11.5(D) Electrical Interface : LVDSSurface Treatment : Hard-coating(3H), Anti-GlareOperating Mode : Normally White, Transmissive modeBacklight Unit : 2-CCFL

2. OPTICAL CHARACTERISTICS2-1. Viewing Angle by Contrast Ratio 10

Left : -70° min., -80°(Typ) Right : +70° min., +80°(Typ)Top :+60° min., +75°(Typ) Bottom : -70° min., -85°(Typ)

2-2. Luminance : 175(min), 250(Typ) (Full White pattern, 0.70V) -6500K: 110(min) (Full White pattern, 0.70V) -9300K75%(min)

2-3. Contrast Ratio : 5000:1 (DFC)

3. SIGNAL (Refer to the Timing Chart)3-1. Sync Signal

• Type : Separate Sync, SOG

3-2. Video Input Signal1) Type : R, G, B Analog2) Voltage Level : 0~0.71 Va) Color 0, 0 : 0 Vp-pb) Color 7, 0 : 0.467Vp-pc) Color 15, 0 : 0.714Vp-p

3) Input Impedance : 75

3-3. Operating FrequencyHorizontal : 30 ~ 83kHzVertical : 56 ~ 75Hz

4. Max. ResolutionD-sub Analog : 1440 x 900@75Hz

5. POWER SUPPLY5-1. Power : AC 100~240V, 50/60Hz , 0.8A

5-2. Power Consumption

6. ENVIRONMENT6-1. Operating Temperature : 10°C~35°C (50°F~95°F)

(Ambient)6-2. Relative Humidity : 10%~80% (Non-condensing)6-3. MTBF : 50,000 HRS with 90% Confidence

Lamp Life : 50,000 Hours(Min)

7. DIMENSIONS (with TILT/SWIVEL)

Width : 409.3 mm (16.11'')Depth : 204.0 mm (8.03'')Height : 362.0mm (14.25'')

8. WEIGHT (with TILT/SWIVEL)

Net. Weight : 2.8 kg (6.17 lbs)Gross Weight : 4.0 kg (8.82 lbs)

SPECIFICATIONS

SPECIFICATIONS ................................................... 2PRECAUTIONS ....................................................... 3TIMING CHART ....................................................... 7DISASSEMBLY ........................................................ 8BLOCK DIAGRAM...................................................10

DISCRIPTION OF BLOCK DIAGRAM .................. 11

ADJUSTMENT ...................................................... 13

SERVICE OSD ........................................................14

TROUBLESHOOTING GUIDE .............................. 15

WIRING DIAGRAM ............................................... 21

EXPLODED VIEW...................................................22

REPLACEMENT PARTS LIST ...............................24

SCHEMATIC DIAGRAM......................................... 26

MODE

POWER ON (NORMAL)

STAND-BY

SUSPEND

DPMS OFF

POWER S/W Off

H/V SYNC

ON/ON

OFF/ON

ON/OFF

OFF/OFF

-

POWER CONSUMPTION

less than 1 W

less than 27 W

less than 1 W

less than 1 W

less than 1 W

LED COLOR

BLUE

AMBER

AMBER

AMBER

OFF

VIDEO

ACTIVE

OFF

OFF

OFF

-

- 3 -

PRECAUTION

WARNING FOR THE SAFETY-RELATED COMPONENT.

• There are some special components used in LCDmonitor that are important for safety. These parts aremarked on the schematic diagram and thereplacement parts list. It is essential that these criticalparts should be replaced with the manufacturer’sspecified parts to prevent electric shock, fire or otherhazard.

• Do not modify original design without obtaining writtenpermission from manufacturer or you will void theoriginal parts and labor guarantee.

TAKE CARE DURING HANDLING THE LCD MODULEWITH BACKLIGHT UNIT.

• Must mount the module using mounting holes arrangedin four corners.

• Do not press on the panel, edge of the frame stronglyor electric shock as this will result in damage to thescreen.

• Do not scratch or press on the panel with any sharpobjects, such as pencil or pen as this may result indamage to the panel.

• Protect the module from the ESD as it may damage theelectronic circuit (C-MOS).

• Make certain that treatment person’s body aregrounded through wrist band.

• Do not leave the module in high temperature and inareas of high humidity for a long time.

• The module not be exposed to the direct sunlight.

• Avoid contact with water as it may a short circuit withinthe module.

• If the surface of panel become dirty, please wipe it offwith a softmaterial. (Cleaning with a dirty or rough clothmay damage the panel.)

WARNING

BE CAREFUL ELECTRIC SHOCK !

• If you want to replace with the new backlight (CCFL) orinverter circuit, must disconnect the AC adapterbecause high voltage appears at inverter circuit about650Vrms.

• Handle with care wires or connectors of the invertercircuit. If the wires are pressed cause short and mayburn or take fire.

Leakage Current Hot Check Circuit

CAUTIONPlease use only a plastic screwdriver to protect yourselffrom shock hazard during service operation.

1.5 Kohm/10W

To Instrument’sexposedMETALLIC PARTS

Good Earth Groundsuch as WATER PIPE,CONDUIT etc.

AC Volt-meter

- 4 -

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by thisservice manual and its supplements and addenda, readand follow the SAFETY PRECAUTIONS on page 3 of thispublication.NOTE: If unforeseen circumstances create conflictbetween the following servicing precautions and any of thesafety precautions on page 3 of this publication, alwaysfollow the safety precautions. Remember: Safety First.

General Servicing Precautions1. Always unplug the receiver AC power cord from the AC

power source before;a. Removing or reinstalling any component, circuit

board module or any other receiver assembly.b. Disconnecting or reconnecting any receiver electrical

plug or other electrical connection.c. Connecting a test substitute in parallel with an

electrolytic capacitor in the receiver.CAUTION: A wrong part substitution or incorrectpolarity installation of electrolytic capacitors mayresult in an explosion hazard.

d. Discharging the picture tube anode.2. Test high voltage only by measuring it with an

appropriate high voltage meter or other voltagemeasuring device (DVM, FETVOM, etc) equipped witha suitable high voltage probe.Do not test high voltage by "drawing an arc".

3. Discharge the picture tube anode only by (a) firstconnecting one end of an insulated clip lead to thedegaussing or kine aquadag grounding system shieldat the point where the picture tube socket ground leadis connected, and then (b) touch the other end of theinsulated clip lead to the picture tube anode button,using an insulating handle to avoid personal contactwith high voltage.

4. Do not spray chemicals on or near this receiver or anyof its assemblies.

5. Unless specified otherwise in this service manual,clean electrical contacts only by applying the followingmixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator;10% (by volume) Acetone and 90% (by volume)isopropyl alcohol (90%-99% strength)CAUTION: This is a flammable mixture.Unless specified otherwise in this service manual,lubrication of contacts in not required.

6. Do not defeat any plug/socket B+ voltage interlockswith which receivers covered by this service manualmight be equipped.

7. Do not apply AC power to this instrument and/or any ofits electrical assemblies unless all solid-state deviceheat sinks are correctly installed.

8. Always connect the test receiver ground lead to thereceiver chassis ground before connecting the testreceiver positive lead.Always remove the test receiver ground lead last.

9. Use with this receiver only the test fixtures specified inthis service manual.CAUTION: Do not connect the test fixture ground strapto any heat sink in this receiver.

Electrostatically Sensitive (ES) DevicesSome semiconductor (solid-state) devices can bedamaged easily by static electricity. Such componentscommonly are called Electrostatically Sensitive (ES)Devices. Examples of typical ES devices are integratedcircuits and some field-effect transistors andsemiconductor "chip" components. The followingtechniques should be used to help reduce the incidence ofcomponent damage caused by static by static electricity.1. Immediately before handling any semiconductor

component or semiconductor-equipped assembly, drainoff any electrostatic charge on your body by touching aknown earth ground. Alternatively, obtain and wear acommercially available discharging wrist strap device,which should be removed to prevent potential shockreasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped withES devices, place the assembly on a conductivesurface such as aluminum foil, to prevent electrostaticcharge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder orunsolder ES devices.

4. Use only an anti-static type solder removal device.Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient todamage ES devices.

5. Do not use freon-propelled chemicals. These cangenerate electrical charges sufficient to damage ESdevices.

6. Do not remove a replacement ES device from itsprotective package until immediately before you areready to install it. (Most replacement ES devices arepackaged with leads electrically shorted together byconductive foam, aluminum foil or comparableconductive material).

7. Immediately before removing the protective materialfrom the leads of a replacement ES device, touch theprotective material to the chassis or circuit assemblyinto which the device will be installed.CAUTION: Be sure no power is applied to the chassisor circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackagedreplacement ES devices. (Otherwise harmless motionsuch as the brushing together of your clothes fabric orthe lifting of your foot from a carpeted floor cangenerate static electricity sufficient to damage an ESdevice.)

- 5 -

General Soldering Guidelines1. Use a grounded-tip, low-wattage soldering iron and

appropriate tip size and shape that will maintain tiptemperature within the range or 500 F to 600 F.

2. Use an appropriate gauge of RMA resin-core soldercomposed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.4. Thoroughly clean the surfaces to be soldered. Use a

mall wire-bristle (0.5 inch, or 1.25cm) brush with ametal handle.Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering techniquea. Allow the soldering iron t ip to reach normal

temperature.(500 F to 600 F)

b. Heat the component lead until the solder melts.c. Quickly draw the melted solder with an anti-static,

suction-type solder removal device or with solderbraid.CAUTION: Work quickly to avoid overheating thecircuitboard printed foil.

6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normal

temperature (500 F to 600 F)b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction ofthe component lead and the printed circuit foil, andhold it there only until the solder flows onto andaround both the component lead and the foil.CAUTION: Work quickly to avoid overheating thecircuit board printed foil.

d. Closely inspect the solder area and remove anyexcess or splashed solder with a small wire-bristlebrush.

IC Remove/ReplacementSome chassis circuit boards have slotted holes (oblong)through which the IC leads are inserted and then bent flatagainst the circuit foil. When holes are the slotted type,the following technique should be used to remove andreplace the IC. When working with boards using thefamiliar round hole, use the standard technique asoutlined in paragraphs 5 and 6 above.

Removal1. Desolder and straighten each IC lead in one operation

by gently prying up on the lead with the soldering irontip as the solder melts.

2. Draw away the melted solder with an anti-staticsuction-type solder removal device (or with solderbraid) before removing the IC.

Replacement1. Carefully insert the replacement IC in the circuit board.2. Carefully bend each IC lead against the circuit foil pad

and solder it.3. Clean the soldered areas with a small wire-bristle

brush. (It is not necessary to reapply acrylic coating tothe areas).

"Small-Signal" Discrete TransistorRemoval/Replacement1. Remove the defective transistor by clipping its leads as

close as possible to the component body.2. Bend into a "U" shape the end of each of three leads

remaining on the circuit board.3. Bend into a "U" shape the replacement transistor leads.4. Connect the replacement transistor leads to the

corresponding leads extending from the circuit boardand crimp the "U" with long nose pliers to insure metalto metal contact then solder each connection.

Power Output, Transistor DeviceRemoval/Replacement1. Heat and remove all solder from around the transistor

leads.2. Remove the heat sink mounting screw (if so equipped).3. Carefully remove the transistor from the heat sink of the

circuit board.4. Insert new transistor in the circuit board.5. Solder each transistor lead, and clip off excess lead.6. Replace heat sink.

Diode Removal/Replacement1. Remove defective diode by clipping its leads as close

as possible to diode body.2. Bend the two remaining leads perpendicular y to the

circuit board.3. Observing diode polarity, wrap each lead of the new

diode around the corresponding lead on the circuitboard.

4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solder

joints of the two "original" leads. If they are not shiny,reheat them and if necessary, apply additional solder.

Fuse and Conventional ResistorRemoval/Replacement1. Clip each fuse or resistor lead at top of the circuit board

hollow stake.2. Securely crimp the leads of replacement component

around notch at stake top.3. Solder the connections.

CAUTION: Maintain original spacing between thereplaced component and adjacent components and thecircuit board to prevent excessive componenttemperatures.

- 6 -

Circuit Board Foil RepairExcessive heat applied to the copper foil of any printedcircuit board will weaken the adhesive that bonds the foilto the circuit board causing the foil to separate from or"l i f t-off" the board. The following guidelines andprocedures should be followed whenever this condition isencountered.

At IC ConnectionsTo repair a defective copper pattern at IC connections usethe following procedure to install a jumper wire on thecopper pattern side of the circuit board. (Use thistechnique only on IC connections).

1. Carefully remove the damaged copper pattern with asharp knife. (Remove only as much copper asabsolutely necessary).

2. carefully scratch away the solder resist and acryliccoating (if used) from the end of the remaining copperpattern.

3. Bend a small "U" in one end of a small gauge jumperwire and carefully crimp it around the IC pin. Solder theIC connection.

4. Route the jumper wire along the path of the out-awaycopper pattern and let it overlap the previously scrapedend of the good copper pattern. Solder the overlappedarea and clip off any excess jumper wire.

At Other ConnectionsUse the following technique to repair the defective copperpattern at connections other than IC Pins. This techniqueinvolves the installation of a jumper wire on thecomponent side of the circuit board.1. Remove the defective copper pattern with a sharp

knife.Remove at least 1/4 inch of copper, to ensure that ahazardous condition will not exist if the jumper wireopens.

2. Trace along the copper pattern from both sides of thepattern break and locate the nearest component that isdirectly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the leadof the nearest component on one side of the patternbreak to the lead of the nearest component on theother side.Carefully crimp and solder the connections.CAUTION: Be sure the insulated jumper wire isdressed so the it does not touch components or sharpedges.

- 7 -

TIMING CHART

mode section polarity

DOT

CL OCK

[MHz]

Freque ncy

[kHz] /[Hz]

Total

Period (E)

Display

(A)

Front

Porch

(D)

Syn c

.

(C)

Back

Porch

(B)

Resol -

ution

H(P ixels) + 31.469 800 640 16 96 48 1

V(Lines) - 25.175

70.09 449 350 37 2 60

640 x

350

H(P ixels ) - 31.468 900 720 18 108 54 2

V(Lines) + 28.321

70.08 449 400 12 2 35

720 X

400

H(P ixels ) - 31.469 800 640 16 96 48 3

V(Lines) - 25.175

59.94 525 480 10 2 33

640 x

480

H(P ixels ) - 37.5 840 640 16 64 120 4

V(Lines) - 31.5

75 500 480 1 3 16

640 x

480

H(P ixels ) + 37.879 1056 800 40 128 88 5

V(Lines) + 40.0

60.317 628 600 1 4 23

800 x

600

H(P ixels) + 46.875 1056 800 16 80 160 6

V(Lines) + 49.5

75.0 625 600 1 3 21

800 x

600

H(P ixels) +/- 49.725 1152 832 32 64 224 7

V(Lines) +/- 57.283

74.55 667 624 1 3 39

832 x

624

H(P ixels) - 48.363 1344 1024 24 136 160 8

V(Lines) - 65.0

60.0 806 768 3 6 29

1024 x

768

H(P ixels) - 60.123 1312 1024 16 96 176 9

V(Lines) - 78.75

75.029 800 768 1 3 28

1024 x

768

H(P ixels) +/- 68.681 1456 1152 32 128 144 10

V(Lines) +/- 100.0

75.062 915 870 3 3 39

1152 x

870

H(P ixels) +/- 61.805 1504 1152 18 134 200 11

V(Lines) +/- 92.978

65.96 937 900 2 4 31

1152 x

900

H(P ixels) + 63.981 1688 1280 48 112 248 12

V(Lines) + 108.0

60.02 1066 1024 1 3 38

1280 x

1024

VIDEO

SYNC

AE

D B

C

- 8 -

DISASSEMBLY

1. Put a cushion or soft cloth on a flatsurface.

4. Nip Latch inside, Take off the stand base from stand body.

5. Please pull the stand body lightlyto separate it from the hinge body.

6. Remove the screws.

7. Pull the front cover upward,then separate all the latches.

8. Place the monitor face down,then disassemble back cover.

2. Place the monitor face down onthe cushion or soft cloth.

3. Slide the Cable Deco Cover out from the stand body.

- 9 -

BLOCK DIAGRAM

Reg

ula

tor

Fla

sh R

OM

EEP

RO

M(S

yst

em

)

Cry

stal

V3.

3

V8.

1

V3

5V

inte

rface

SD

ATA

/S

CLK

14

.31

8M

Hz

LIP

S

.3

V3.

3V

3.3

14

40

*9

00

@6

0H

z

V8.

1

5V

12

V

Inve

rter

( 2L

amp

s )

D-Sub

Module KEY

Du

al

In

terf

ace

En

gin

e

Dis

pla

yP

roce

ssin

gEn

gin

e

LV

DS

Pan

el

Inte

rface

OS

DC

lock

Gen

era

tor

MC

U

TS

UM

U5

8C

WH

L

Filter

12

V

An

alo

g(R

/G

/B

)

An

alo

g(V

syn

c/H

syn

c)

LV

DS

- 10 -

BLOCK DIAGRAM-POWER

LA

MP

Hig

h

Lo

w

PO

WE

RIN

VE

RT

ER

Inve

rter

Co

ntr

ol

IC

P-c

h

N-c

h

Inve

rter

Tran

sS

MP

S

Lam

pC

urr

ent

Fee

db

ack

Ove

rVo

ltag

eP

rote

ctio

n

Po

wer

Co

ntr

ol

IC

Fee

db

ack

Lin

e F

ilter

LN

Dri

ve B

lock

12V

13V

5V

Inve

rter

On

/OF

F (

3.3V

)

Dim

min

g (

Lam

p C

urr

ent

Co

ntr

ol)

Au

x

Dri

ve

Sta

rt

Mo

du

le V

cc

Mai

n B

oar

d(S

cale

r &

DC

DC

conv

erte

r)

12V

5V

- 11 -

DESCRIPTION OF BLOCK DIAGRAM

1. Video Controller Part.This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to thedigital video signal using a pixel clock.The pixel clock for each mode is generated by the PLL.The range of the pixel clock is from 25MHz to 136MHz.This part consists of the Scaler, ADC convertor, TMDS receiver and LVDS transmitter.The Scaler gets the video signal converted analog to digital, interpolates input to 1440 X 900 resolution signal andoutputs 8-bit R, G, B signal to transmitter.

2. Power Part.This part consists of the one 3.3V, and one 1.8V regulators to convert power which is provided 5V in Power board.12V is provided for inverter, 5V is provided for LCD panel.Also, 5V is converted 3.3V and 1.8V by regulator. Converted power is provided for IC in the main board.The inverter converts from DC12V to AC 700Vrms and operates back-light lamps of module.

3. MICOM Part.This part is include video controller part. And this part consists of EEPROM IC which stores control data, Reset IC andthe Micom.The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable.The controlled data of each modes is stored in EEPROM.

- 12 -

LIPS Board Block Diagram

EMICOMPONENTS

LINE100 ~ 240V

INPUT RECTIFIERAND FILTER

SWITCHINGTRANSFORMER

OUTPUT RECTIFIERAND FILTER

12V

5V

GND

SIGNALCOLLENT-

IONPHOTO-COUPLER

ISOLATION

PWM CONTROLCIRCUIT

HVDC 100KHz

PRIMARY SECONDARY

50 ~ 60Hz

INVERTER CIRCUIT High Voltage12V

Operation description_LIPS

1. EMI components.This part contains of EMI components to comply with global marketing EMI standards like FCC,VCCI CISPR, thecircuit included a line-filter, across line capacitor and of course the primary protection fuse.

2. Input rectifier and filter.This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor.

3. Energy Transfer.This part function is for transfer the primary energy to secondary through a power transformer.

4. Output rectifier and filter.This part function is to make a pulse width modulation control and to provide the driver signal to power switch, toadjust the duty cycle during different AC input and output loading condition to achieve the dc output stabilized, andalso the over power protection is also monitor by this part.

5. Photo-Coupler isolation.This part function is to feed back the DC output changing status through a photo transistor to primary controller toachieve the stabilized DC output voltage.

6. Signal collection.This part function is to collect the any change from the DC output and feed back to the primary through phototransistor.

- 13 -

ADJUSTMENT

Windows EDID V1.0 User Manual

Operating System: MS Windows 98, 2000, XPPort Setup: Windows 98 => Don’t need setup

Windows 2000, XP => Need to Port Setup.This program is available to LCD Monitor only.

1. Port Setupa) Copy “UserPort.sys” file to

“c:\WINNT\system32\drivers” folderb) Run Userport.exe

c) Remove all default numberd) Add 300-3FF

e) Click Start button.f) Click Exit button.

2. EDID Read & Write1) Run WinEDID.exe

2) Edit Week of Manufacture, Year of Manufacture, Serial Numbera) Input User Info Datab) Click “Update” buttonc) Click “ Write” button

- 14 -

0

BMCompatible PC

PARALLEL POR

Power inlet (required)

Power LED

S Switch

Power Select Switch(110V/220V)

Con

trol L

ine

Not us

edRS2

32C

PARAL

LEL

V-SYN

CPO

WER

ST

VGS

MONITOR

E

E

V-Sync On/O Switch(Switch must be ON )

F

A

A

BB

C

C

156

5VOFF ON

OFF

ON

11Video SignalGenerator

Figure 1. Cable Connection

SERVICE OSD

1) Turn off the power switch at the front side of the display.

2) Wait for about 5 seconds and press MENU, POWER switch with 1 second interval.

3) The SVC OSD menu contains additional menus that the User OSD menu as described below.

a) Auto Color : W/B balance and Automatically sets the gain and offset value.b) NVRAM INIT : EEPROM initialize.(24C08)c) CLEAR ETI : To initialize using time.d) AGING : Select Aging mode(on/off).e) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually.f) R/G/B-6500K : Allows you to set the R/G/B-6500K value manually.g) R/G/B-Offset : Allows you to set the R/G/B-Offset value manually.(Analog Only) h) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only)i) MODULE : To select applied module.

- 15 -

TROUBLESHOOTING GUIDE

1. NO POWER - MAIN

NO POWER(POWER INDICATOR OFF)

NOCHECK POWER BOARD,AND FIND OUT A SHORTPOINT AS OPENING EACH POWER LINE

NO PROBLEM

1

Waveforms

U201-#96

CHECK KEY CONTROLCONNECTOR ROUTINE

CHECK U201

NO

NO

CHECK 3.3V LINE(OPEN CHECK)

CHECK 3.3V LINE

NOCHECK X-TAL

YES

CHECK J703VOLTAGE

PIN5, PIN6 (5V)?

CHECKU601 PIN2 VOLTAGE

(3.3V) ?

IS U201 PIN75 (3.3V) VOLTAGE ?

CHECK U201 PIN 96 PULSE

1

YES

YES

YES

- 16 -

2. NO RASTER (OSD IS NOT DISPLAYED) – LIPS

NO RASTER(OSD IS NOT DISPLAYED)

NO

NO

NO

NO

REPLACE CCFL LAMPIN THE LCD MODULE

CHECK POWER BOARD, AND FIND OUT A SHORT POINT AS OPENING EACH POWER LINE

CHECK MICOM INVON/OFF PORT.

1. CONFIRM BRIGHTNESSOSD CONTRL STATE.

2. CHECK MICOM DIM-ADJ PORT

LIPS

J703PIN5, PIN6

5V?

J703 PIN95V?

J703 PIN105V?

CHECKPULSE AS

CONTACTING SCOPE PROBE TO CAUTION LABEL.

(CONTACT PROBE TO CAUTION LABEL.

CAN YOU SEE PULSE AT YOUR SCOPE?

YES

YES

YES

YES

- 17 -

3. NO RASTER (OSD IS NOT DISPLAYED) – MAIN

NO RASTER(OSD IS NOT DISPLAYED)

NO

NO

NO

TROUBLE IN CABLE OR LCD MODULE

CHECK U601

1. CHECK C509, C510SOLDERING CONDITION

2. CHECK X5013. TROUBLE IN U201

CHECK CONNECTIONLINE FROM D-SUB TOU201

U201PIN96, 97

OSCILLATE AS14.31MHZ?

U201PIN27 IS 48KHz H-SYNC?PIN28 IS 60Hz V-SYNC?IS PULSE APPEARED

AT SIGNAL PINS?AT MODE 12?

1

2

1 2

Waveforms

U201-#96, 97 U201-#27 H-SYNC 2 U201-#28 V-SYNC

YES

YES

YES

U201PIN 16, 75

3.3V?

- 18 -

4. TROUBLE IN DPM - MAIN

TROUBLE IN DPM

NO

NO

TROUBLE IN U201

CHECK PC PC IS NOT GOINGINTO DPM OFF MODE

CHECK H/V SYNC LINE

CHECKR730, R731

CHECKU201 PIN 27,28SYNC PULSE ?

3

3

Waveforms

R442 H-Sync 3 R443 V-Sync

YES

YES

- 19 -

5. POWER - LIPS

NO POWER(POWER INDICATOR OFF)

NO

NO

Troub e n Fuse (F101)

CHECK 5V, 12V L ne

Check BD101

NO Troub e n D201, D202

Troub e n IC101

YES

CHECKFuse F101 OK?

CHECKC101 Voltage

(AC110V->160Vdc(AC220V->304Vdc

Check IC101PIN5 Voltage

Check D201, D202Voltage

YES

YES

YES

NO

- 20 -

6. Raster - LIPS

NO Raster(Lamp Off)

NO Check Scaler Output(Main Board)

CHECK T301

NO

NO

Check Q301, Q302

Check the waveform of U301Pin1, 15

Check the waveform of U301Pin2, 3

NO

If waveform is no problem

Check D304Or Trouble in U301

YES

CHECKP201 Pin9

3.3V?

Check IC301 Pin25V?

Check U301 Pin6 VSEN,Less than 3V

Check U301 Pin12 SSTCMT,Less than 1V

Check U301Drain waveform

YES

YES

YES

NO

- 21 -

WIRING DIAGRAM

11P

6P

4P

30P

6631900030F

6631T20023J

EAD37413101

6631V12031H

300

310

900

910

920

930

200

400

410

430

420

510

520

500

EXPLODED VIEW

- 22 -

EXPLODED VIEW PARTS LIST

- 23 -

DescriptionPart No.Ref. No.

300

430 MDQ39702401 Frame,PRESS SPTE 0.3t L177WSB. SUS L177WSB Lamp Wire Shield(Metal) Set

EBR38509601 Upper SMT PCB,CONTROL S.T - L177WS

EBR39262801 PCB Assembly,MAIN T.T S chassis L177WSB BFS

EAY38422101 Power Supply Assembly,FREE L177WS LCD Lianchang

Cabinet Assembly,L177WSB . 17" Cabinet Assy black NT local

500

510

520

900

910

920

ACQ33707104 Cover Assembly,L177WS/WSB LM57B 19" Cover, Hinge Assy, Normal Stand, L177W ND Local

MCK38601901 Cover,MOLD ABS L1954 ABS L1954 COVER, STAND BODY

MCK38602601 Cover,MOLD ABS L1954 ABS L1954, COVER CABLE

930 AAN33777301 Base Assembly,ASSY L177W - L177W Stand base Assy_black

ABJ34560301

LCD,Module-TFT,LM171WX3-TLA1 WXGA 17.1INCH 1280X720 250CD COLOR 60% 16/10 800:1 LPL 17"W response time :8ms,P4,Color Depth:16.7M. Viewing Angle:160/160 LG PHILIPS LCD EAJ38936201

LCD,Module-TFT,HSD170MGW1-B00 WXGA 17.0INCH 1440X900 250CD COLOR 63% 16/10 600:1 Hannstar 17"W ZBD, 2CCFL(Edge type),16.2M, Viewing Angle 80/80/80/80. Non-Glare. HANNSTAR DISPLAY CORPORATION EAJ39167201

LCD,Module-TFT,HSD170MGW1- B00 WXGA 17.0INCH 1440X900 250CD COLOR 63% 16/10 600:1 Hannstar 17"W Non-ZBD, 2CCFL(Edge type),16.2M, Viewing Angle 80/80/80/80, Non-Glare HANNSTAR DISPLAY CORPORATION EAJ39167202

LCD,Module-TFT,HSD170MGW1-B01 WXGA 17.0INCH 1440X900 250CD COLOR 63% 16/10 600:1 Hannstar 17"W, ZBD, 2CCFL(Edge type),16 2M, Viewing Angle 80/80/80/80. Non-Glare. Source/Gate IC : Novatek. HANNSTAR DISPLAY CORPORATION EAJ39167203

LCD,Module-TFT,HSD170MGW1- B01 WXGA 17.0 NCH 1440X900 250CD COLOR 63% 16/10 600:1 Hannstar 17"W Non-ZBD, 2CCFL(Edge type),16.2M, Viewing Angle 80/80/80/80. Non-Glare.Source/Gate IC : Novatek HANNSTAR DISPLAY CORPORATION EAJ39167204

200

310

Lens,MOLD PMMA SAMSUNG TECHWIN LENS Lx72 / Lx7w lens , power LED Knob Double injection Power LED for L1972, Lxx7W

MFB38581401

Lens,MOLD PMMA SAMSUNG TECHWIN LENS Lx72 / Lx7w lens ,power LED Knob Double injection Power LED for L1972, Lxx7W-"01" for CKDMFB38581403

410 Frame Assembly,L177WSB . 17" L177WSB REAR FRAME ASSY LPL-HSD ADV33844405

420Bracket,PRESS SBHG 0.6T BRACKET L177WSB - SBHG L177WSB Metal Bracket HSD MAZ40651001

Bracket,PRESS SBHG 0.6 BRACKET L177W - SBHG L177W Metal Bracket MAZ39062501

400 Cover Assembly,Rear,L177WSB . 17" Back cover Assy Black NT local ACQ34560801

REPLACEMENT PARTS LIST

DATE:2007.07.20

LOC NO. PART NO. DESCRIPTION/SPECIFICATION LOC NO. PART NO. DESCRIPTION/SPECIFICATON

C502 0CK473CK56A “Capacitor,Ceramic,Chip,C1608X7R1H473KT 47nF”C503 0CK473CK56A “Capacitor,Ceramic,Chip,C1608X7R1H473KT 47nF”C504 0CK473CK56A “Capacitor,Ceramic,Chip,C1608X7R1H473KT 47nF”C505 0CK473CK56A “Capacitor,Ceramic,Chip,C1608X7R1H473KT 47nF”C506 0CC102CK41A “Capacitor,Ceramic,Chip,C1608C0G1H102JT 1nF”C507 0CK473CK56A “Capacitor,Ceramic,Chip,C1608X7R1H473KT 47nF”C508 0CK473CK56A “Capacitor,Ceramic,Chip,C1608X7R1H473KT 47nF”C509 0CC220CK41A “Capacitor,Ceramic,Chip,C1608C0G1H220JT 22pF”C510 0CC220CK41A “Capacitor,Ceramic,Chip,C1608C0G1H220JT 22pF”C511 0CK104CK56A “Capacitor,Ceramic,Chip,0603B104K500CT 100nF”C512 0CE106CF638 “Capacitor,AL,Radial,SHL5.0TP16VB10M 10uF”C513 0CK104CK56A “Capacitor,Ceramic,Chip,0603B104K500CT 100nF”C514 0CK104CK56A “Capacitor,Ceramic,Chip,0603B104K500CT 100nF”C515 0CK104CK56A “Capacitor,Ceramic,Chip,0603B104K500CT 100nF”C516 0CK104CK56A “Capacitor,Ceramic,Chip,0603B104K500CT 100nF”C517 0CK104CK56A “Capacitor,Ceramic,Chip,0603B104K500CT 100nF”C518 0CK104CK56A “Capacitor,Ceramic,Chip,0603B104K500CT 100nF”C519 0CK104CK56A “Capacitor,Ceramic,Chip,0603B104K500CT 100nF”C520 0CK104CK56A “Capacitor,Ceramic,Chip,0603B104K500CT 100nF”C521 0CK104CK56A “Capacitor,Ceramic,Chip,0603B104K500CT 100nF”C522 0CK104CK56A “Capacitor,Ceramic,Chip,0603B104K500CT 100nF”C523 0CK104CK56A “Capacitor,Ceramic,Chip,0603B104K500CT 100nF”C524 0CK104CK56A “Capacitor,Ceramic,Chip,0603B104K500CT 100nF”C525 0CK104CK56A “Capacitor,Ceramic,Chip,0603B104K500CT 100nF”C526 0CK104CK56A “Capacitor,Ceramic,Chip,0603B104K500CT 100nF”C527 0CK104CK56A “Capacitor,Ceramic,Chip,0603B104K500CT 100nF”C601 0CE107EF610 “Capacitor,AL,Radial,KMG16VB100M 100uF 20”C602 0CK103CK51A “Capacitor,Ceramic,Chip,0603B103K500CT 10nF”C603 0CK475CC94A “Capacitor,Ceramic,Chip,C1608Y5V0J475ZT 4.7u”C604 0CE107EF610 “Capacitor,AL,Radial,KMG16VB100M 100uF 20”C605 0CE477EF638 “Capacitor,AL,Radial,KMG5.0TP16VB470M 470”C702 0CK103CK51A “Capacitor,Ceramic,Chip,0603B103K500CT 10nF”C703 0CK103CK51A “Capacitor,Ceramic,Chip,0603B103K500CT 10nF”C704 0CK104CK56A “Capacitor,Ceramic,Chip,0603B104K500CT 100nF”C705 0CK105CD56A “Capacitor,Ceramic,Chip,C1608X7R1A105KT 1uF”C706 0CC101CK41A “Capacitor,Ceramic,Chip,C1608C0G1H101JT 100p”C720 0CC680CK41A “Capacitor,Ceramic,Chip,C1608C0G1H680JT 68pF”C721 0CC680CK41A “Capacitor,Ceramic,Chip,C1608C0G1H680JT 68pF”C722 0CC680CK41A “Capacitor,Ceramic,Chip,C1608C0G1H680JT 68pF”C723 0CC680CK41A “Capacitor,Ceramic,Chip,C1608C0G1H680JT 68pF”

D711 0DSIH00018A “Diode,Switching,ENKMC2837 T112 1.2V”D712 0DSIH00018A “Diode,Switching,ENKMC2837 T112 1.2V”D713 0DSIH00018A “Diode,Switching,ENKMC2837 T112 1.2V”ZD1 0DZ560009GB “Diode,Zener,BZT52C5V6S (F) 5.6V”ZD2 0DZ560009GB “Diode,Zener,BZT52C5V6S (F) 5.6V”ZD3 0DZ560009GB “Diode,Zener,BZT52C5V6S (F) 5.6V”ZD4 0DZ560009GB “Diode,Zener,BZT52C5V6S (F) 5.6V”ZD5 0DZ560009GB “Diode,Zener,BZT52C5V6S (F) 5.6V”ZD6 0DZ560009GB “Diode,Zener,BZT52C5V6S (F) 5.6V”ZD7 0DZ560009GB “Diode,Zener,BZT52C5V6S (F) 5.6V”ZD705 0DZ560009GB “Diode,Zener,BZT52C5V6S (F) 5.6V”ZD706 0DZ560009GB “Diode,Zener,BZT52C5V6S (F) 5.6V”ZD707 0DZ560009GB “Diode,Zener,BZT52C5V6S (F) 5.6V”ZD709 0DZ560009GB “Diode,Zener,BZT52C5V6S (F) 5.6V”ZD710 0DZ560009GB “Diode,Zener,BZT52C5V6S (F) 5.6V”ZD8 0DZ560009GB “Diode,Zener,BZT52C5V6S (F) 5.6V”

U201 EAN39545901 “IC,Protocol Controller,TSUMU58BWHL LF 0.3T”U502 EAN37157001 “IC,Serial Flash Memory,W25X20VSNIG 2MBIT 25”U503 0IMMR00203A “IC,EEPROM,FM24C08 8KBIT 1KX8BI”U601 0IPMGA0010A “IC,LDO Voltage Regulator,AZ1117H 3.3 4.75TO10”U602 0IPMG00049A “IC,LDO Voltage Regulator,AZ1117H ”

Q501 0TRKE80046A “TR,Bipolar,2N3904S NPN 6V 60V 4”Q601 0TRKE80046A “TR,Bipolar,2N3904S NPN 6V 60V 4”Q602 0TR127309AA “TR,Bipolar,KTA1273 PNP 5V 30V”Q701 0TR390609DC “TR,Bipolar,2N3906S RTK PNP 5V”Q702 0TR390609DC “TR,Bipolar,2N3906S RTK PNP 5V”

R1 0RJ7501D677 “Resistor,Chip,MCR03EZPJ752 7.5KOHM”R2 0RJ7501D677 “Resistor,Chip,MCR03EZPJ752 7.5KOHM”R3 0RJ1201D677 “Resistor,Chip,MCR03EZPJ122 1.2KOHM”R4 0RJ1801D677 “Resistor,Chip,MCR03EZPJ182 1.8KOHM”R5 0RJ1201D677 “Resistor,Chip,MCR03EZPJ122 1.2KOHM”R501 0RJ0562D677 “Resistor,Chip,MCR03EZPJ560 56OHM 5”R502 0RJ0562D677 “Resistor,Chip,MCR03EZPJ560 56OHM 5”R503 0RJ0562D677 “Resistor,Chip,MCR03EZPJ560 56OHM 5”R504 0RJ0562D677 “Resistor,Chip,MCR03EZPJ560 56OHM 5”R505 0RJ1001D677 “Resistor,Chip,MCR03EZPJ102 1KOHM 5”R506 0RJ0562D677 “Resistor,Chip,MCR03EZPJ560 56OHM 5”R507 0RJ0562D677 “Resistor,Chip,MCR03EZPJ560 56OHM 5”R508 0RJ1002D677 “Resistor,Chip,MCR03EZPJ103 10KOHM”R509 0RJ3900D677 “Resistor,Chip,MCR03EZPJ391 390OHM”R510 0RJ4700D677 “Resistor,Chip,MCR03EZPJ471 470OHM”R511 0RJ2002D677 “Resistor,Chip,MCR03EZPJ203. 20KOHM”R512 0RJ1002D677 “Resistor,Chip,MCR03EZPJ103 10KOHM”R513 0RJ1002D677 “Resistor,Chip,MCR03EZPJ103 10KOHM”R514 0RJ1002D677 “Resistor,Chip,MCR03EZPJ103 10KOHM”R515 0RJ1002D677 “Resistor,Chip,MCR03EZPJ103 10KOHM”R516 0RJ4701D677 “Resistor,Chip,MCR03EZPJ472 4.7KOHM”R517 0RJ4701D677 “Resistor,Chip,MCR03EZPJ472 4.7KOHM”R518 0RJ1000D677 “Resistor,Chip,MCR03EZPJ101 100OHM”R519 0RJ4701D677 “Resistor,Chip,MCR03EZPJ472 4.7KOHM”R520 0RJ0332D677 “Resistor,Chip,MCR03EZPJ330 33OHM 5”R521 0RJ0332D677 “Resistor,Chip,MCR03EZPJ330 33OHM 5”R522 0RJ4701D677 “Resistor,Chip,MCR03EZPJ472 4.7KOHM”R524 0RJ0000D677 “Resistor,Chip,MCR03EZPJ000 0OHM 5%”R525 0RJ0000D677 “Resistor,Chip,MCR03EZPJ000 0OHM 5%”R6 0RJ1801D677 “Resistor,Chip,MCR03EZPJ182 1.8KOHM”R601 0RJ2001D677 “Resistor,Chip,MCR03EZPJ202 2KOHM 5”R602 0RJ3900D677 “Resistor,Chip,MCR03EZPJ391 390OHM”R603 0RJ3900D677 “Resistor,Chip,MCR03EZPJ391 390OHM”R604 0RJ1002D677 “Resistor,Chip,MCR03EZPJ103 10KOHM”R605 0RX0681K668 “Resistor,Metal Oxide Film,RSD02F36R80J ”R606 0RJ0000D677 “Resistor,Chip,MCR03EZPJ000 0OHM 5%”R607 0RH1002D622 “Resistor,Chip,MCR10EZHJ103 10KOHM”R608 0RJ1002D677 “Resistor,Chip,MCR03EZPJ103 10KOHM”R701 0RJ0000D677 “Resistor,Chip,MCR03EZPJ000 0OHM 5%”R702 0RJ4701D677 “Resistor,Chip,MCR03EZPJ472 4.7KOHM”R703 0RJ4701D677 “Resistor,Chip,MCR03EZPJ472 4.7KOHM”R704 0RJ1200D677 “Resistor,Chip,MCR03EZPJ121 120OHM”R705 0RJ1200D677 “Resistor,Chip,MCR03EZPJ121 120OHM”R706 0RJ1000D677 “Resistor,Chip,MCR03EZPJ101 100OHM”R707 0RJ1000D677 “Resistor,Chip,MCR03EZPJ101 100OHM”R708 0RJ1000D677 “Resistor,Chip,MCR03EZPJ101 100OHM”R709 0RJ2001D677 “Resistor,Chip,MCR03EZPJ202 2KOHM 5”R710 0RJ4701D677 “Resistor,Chip,MCR03EZPJ472 4.7KOHM”R711 0RJ4701D677 “Resistor,Chip,MCR03EZPJ472 4.7KOHM”R726 0RJ4701D677 “Resistor,Chip,MCR03EZPJ472 4.7KOHM”R727 0RJ4701D677 “Resistor,Chip,MCR03EZPJ472 4.7KOHM”R728 0RJ0332D677 “Resistor,Chip,MCR03EZPJ330 33OHM 5”R729 0RJ0000D677 “Resistor,Chip,MCR03EZPJ000 0OHM 5%”R730 0RJ0682D677 “Resistor,Chip,MCR03EZPJ680 68OHM 5”R731 0RJ0682D677 “Resistor,Chip,MCR03EZPJ680 68OHM 5”R732 0RJ0332D677 “Resistor,Chip,MCR03EZPJ330 33OHM 5”R733 0RJ0752D677 “Resistor,Chip,MCR03EZPJ750 75OHM 5”R734 0RJ0752D677 “Resistor,Chip,MCR03EZPJ750 75OHM 5”

- 24 -

CAPACITORs

DIODEs

ICs

TRANSISTORs

RESISTORs

LOC NO. PART NO. DESCRIPTION/SPECIFICATON LOC NO. PART NO. DESCRIPTION/SPECIFICATON

R736 0RJ0752D677 “Resistor,Chip,MCR03EZPJ750 75OHM 5”

J1 6602T12005E “Connector,Wafer,12505WR 06A00 6P 1.2”J2 6602T12005C “Connector,Wafer,12505WR 04A00 4P 1.2”J404 6630V90220E “Connector,Wafer,TJC2004 6A 6P 2.0MM”J701 6630G100316 “Connector,DSUB,DZ11AA1 HVG PF D SUB”J703 6630V90220K “Connector,Wafer,TJC2004 11A 11P 2.0M”J707 EAG37060101 “Connector,FFC/FPC/PIC,10031HR 30 30P 1.00M”P2 6602T12004C “Connector,Wafer,12505WS 04A00 4P 1.2”

SW1 6600R00004C “Switch,Tact,JTP1127WEM 1C1P 15VD”SW2 6600R00004C “Switch,Tact,JTP1127WEM 1C1P 15VD”SW3 6600R00004C “Switch,Tact,JTP1127WEM 1C1P 15VD”SW4 6600R00004C “Switch,Tact,JTP1127WEM 1C1P 15VD”SW5 6600R00004C “Switch,Tact,JTP1127WEM 1C1P 15VD”SW6 6600R00004C “Switch,Tact,JTP1127WEM 1C1P 15VD”

D1 0DLGP0128AA “LED,Chip,GPTD1210YBC BLUE/YEL”X501 6212AA2001G “Crystal,HLX U F 14.31818M 18”

- 25 -

CONNECTORs

SWITCHs

OTHERs

- 26 -

SCHEMATIC DIAGRAM

1. SCALER

- 27 -

2. POWER & WAFER

- 28 -

3. INVERTER

- 29 -

4. POWER

JULY. 2007P/NO : MFL30290846 Printed in China