Mobile Phone LG C1100 Service Manual

Serv

ice M

an

ual

Mo

del : C

1100

Service ManualC1100

P/N : MMBD0034301 Date : June, 2004 / Issue 1.0

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1. INTRODUCTION ................................ 21.1 Purpose ............................................... 21.2 Regulatory Information ........................ 21.3 Abbreviations ....................................... 4

2. PERFORMANCE ................................. 62.1 H/W Features ...................................... 62.2 Technical Specification ........................ 7

3. TECHNICAL BRIEF ......................... 113.1 Transceiver ....................................... 113.2 Power Amplifier Module .................... 163.3 13MHz Clock ..................................... 173.4 Power Supplies for RF Circuits ......... 173.5 Digital Main Processor ...................... 183.6 Analog Main & Power Management

Processor ........................................... 233.7 Memory ............................................. 333.8 Display and Interface ......................... 343.9 Keypad Switches and Scanning......... 353.10 Microphone........................................ 363.11 Main Receiver .................................. 373.12 Headset Jack Interface ..................... 383.13 Speaker & MIDI IC ........................... 393.14 Key Back-light Illumination ............... 403.15 LCD Back-light Illumination .............. 413.16 MOTOR ............................................ 42

4. TROUBLE SHOOTING ................... 434.1 RX Trouble ........................................ 434.2 TX Trouble ......................................... 514.3 Power On Trouble ............................. 594.4 Charging Trouble ............................... 614.5 LCD Trouble. ..................................... 634.6 Receiver Trouble ............................... 654.7 Speaker Trouble ................................ 674.8 Mic Trouble ........................................ 694.9 Vibrator Trouble ................................. 714.10 Key Backlight LED Trouble .............. 734.11 Folder on/off Trouble ........................ 744.12 SIM Detect Trouble .......................... 764.13 Earphone Trouble ............................. 774.14 Indicator LED Trouble ...................... 804.15 RTC Trouble ..................................... 81

5. DISASSEMBLY INSTRUCTION ... 825.1 Disassembly ...................................... 82

6. DOWNLOAD AND CALIBRATION ............................. 906.1 Download .......................................... 906.2 Calibration ......................................... 97

7. BLOCK DIAGRAM ......................... 100

8. CIRCUIT DIAGRAM ....................... 101

9. PCB LAYOUT ..................................... 9511.1 TOP ................................................. 9511.2 BOTTOM ......................................... 96

10. ENGINEERING MODE ................ 10710.1 BB Test .......................................... 10710.2 RF Test .......................................... 10810.3 MF Mode ....................................... 10810.4 Trace optiont ................................. 11010.5 Call timer ....................................... 11010.6 Fact. Reset .................................... 11010.7 S/W version ................................... 110

11. STAND ALONE TEST.................. 11111.1 Introduction .................................... 11111.2 Setting Method .............................. 11111.3 HW Test : Software for Standalone

Test Setup ..................................... 112

12. AUTO CALIBRATION .................. 11412.1 Overview ....................................... 11412.2 Requirements ................................ 11412.3 Equipment Setup............................ 11412.4 AGC ............................................... 11612.5 APC ............................................... 11612.6 ADC ............................................... 11612.7 Setting ........................................... 11612.8 How to do calibration ..................... 116

13. EXPLODED VIEW &REPLACEMENT PART LIST ............................................................. 117

13.1 Exploded View ............................... 11713.2 Replacement Parts ........................ 11913.3 Accessory ...................................... 126

Table Of Contents

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1. INTRODUCTION

1.1 PurposeThis manual provides the information necessary to repair, calibration, description and downloadthe features of this model.

1.2 Regulatory Information

A. SecurityToll fraud, the unauthorized use of telecommunications system by an unauthorized part (forexample, persons other than your company’s employees, agents, subcontractors, or personworking on your company’s behalf) can result in substantial additional charges for yourtelecommunications services. System users are responsible for the security of own system.There are may be risks of toll fraud associated with your telecommunications system. Systemusers are responsible for programming and configuring the equipment to prevent unauthorizeduse. The manufacturer does not warrant that this product is immune from the above case but willprevent unauthorized use of common-carrier telecommunication service of facilities accessedthrough or connected to it.

The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of HarmIf a telephone company determines that the equipment provided to customer is faulty andpossibly causing harm or interruption in service to the telephone network, it should disconnecttelephone service until repair can be done. A telephone company may temporarily disconnectservice as long as repair is not done.

C. Changes in ServiceA local telephone company may make changes in its communications facilities or procedure. Ifthese changes could reasonably be expected to affect the use of the this phone or compatibilitywith the network, the telephone company is required to give advanced written notice to the user,allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance LimitationsMaintenance limitations on this model must be performed only by the manufacturer or itsauthorized agent. The user may not make any changes and/or repairs expect as specificallynoted in this manual. Therefore, note that unauthorized alternations or repair may affect theregulatory status of the system and may void any remaining warranty.

E. Notice of Radiated EmissionsThis model complies with rules regarding radiation and radio frequency emission as defined bylocal regulatory agencies. In accordance with these agencies, you may be required to provideinformation such as the following to the end user.

1. INTRODUCTION

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F. PicturesThe pictures in this manual are for illustrative purposes only; your actual hardware may lookslightly different.

G. Interference and AttenuationPhone may interfere with sensitive laboratory equipment, medical equipment, etc. Interferencefrom unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTIONBoards, which contain Electrostatic Sensitive Device (ESD), are indicated by thesign. Following information is ESD handling:

Service personnel should ground themselves by using a wrist strap when exchange systemboards.

When repairs are made to a system board, they should spread the floor with anti-static matwhich is also grounded.

Use a suitable, grounded soldering iron.

Keep sensitive parts in these protective packages until these are used.

When returning system boards or parts like EEPROM to the factory, use the protective

package as described.

1. INTRODUCTION

1. INTRODUCTION

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1.3 AbbreviationsFor the purposes of this manual, following abbreviations apply:

APC Automatic Power Control

BB Baseband

BER Bit Error Rate

CC-CV Constant Current – Constant Voltage

DAC Digital to Analog Converter

DCS Digital Communication System

dBm dB relative to 1 milli watt

DSP Digital Signal Processing

EEPROM Electrical Erasable Programmable Read-Only Memory

ESD Electrostatic Discharge

FPCB Flexible Printed Circuit Board

GMSK Gaussian Minimum Shift Keying

GPIB General Purpose Interface Bus

GSM Global System for Mobile Communications

IPUI International Portable User Identity

IF Intermediate Frequency

LCD Liquid Crystal Display

LDO Low Drop Output

LED Light Emitting Diode

OPLL Offset Phase Locked Loop

PAM Power Amplifier Module

PCB Printed Circuit Board

PGA Programmable Gain Amplifier

PLL Phase Locked Loop

PSTN Public Switched Telephone Network

RF Radio Frequency

RLR Receiving Loudness Rating

RMS Root Mean Square

RTC Real Time Clock

1. INTRODUCTION

- 5 -

SAW Surface Acoustic Wave

SIM Subscriber Identity Module

SLR Sending Loudness Rating

SRAM Static Random Access Memory

PSRAM Pseudo SRAM

STMR Side Tone Masking Rating

TA Travel Adapter

TDD Time Division Duplex

TDMA Time Division Multiple Access

UART Universal Asynchronous Receiver/Transmitter

VCO Voltage Controlled Oscillator

VCTCXO Voltage Control Temperature Compensated Crystal Oscillator

WAP Wireless Application Protocol

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2. PERFORMANCE

2.1 H/W Features

Item Feature Comment

Li-ion, 760 mAh

Standard Battery Cell Size: 33.8(W) x 49.7(H) x 4.6(T) [mm]

Weight: 30.00g

Under the minimum current consumption environment Stand by Current (such as paging period 9), the level of standby current

is below 4mA.

Talk time Up to 3 hours (GSM TX Level 7)

Stand by time Up to 200 hours (Paging Period: 9, RSSI: -85 dBm)

Charging time Approx. Under 3 hours

RX Sensitivity GSM, EGSM: –105dBm, DCS: –105dBm

TX output powerGSM, EGSM: 33dBm (Level 5), DCS: 30dBm (Level 0)

GPRS compatibility Class 10

SIM card type 3V only

Display Main LCD: 128 x 128 pixel 65K Color STN

Hard icons. Key Pad;

Status Indicator0 ~ 9, #, *, Up/Down/Left/Right Navigation Key, Menu Key, Clear Key, Send Key, END/PWR KeySoft Key (Left/Right)

ANT External

EAR Phone Jack Yes

PC Synchronization Yes

Speech coding EFR/FR/HR

Data and Fax Yes

Vibrator Yes

Loud Speaker Yes

Voice Recording No

C-Mike Yes

Receiver Yes

Travel Adapter Yes

MIDI 16 Poly

Options Hands-free kit, CLA, Data Kit

2. PERFORMANCE

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2. PERFORMANCE

2.2 Technical Specification

Item Description Specification

GSM

TX: 890 + n x 0.2 MHzRX: 935 + n x 0.2 MHz (n=1~124)

EGSM1 Frequency Band TX: 890 + (n-1024) x 0.2 MHz

RX: 935 + (n-1024) x 0.2 MHz (n=975~1024)

DCSTX: 1710 + (n-512) x 0.2 MHzRX: 1805 + (n-512) x 0.2 MHz (n=512~885)

2 Phase ErrorRMS < 5 degreesPeak < 20 degrees

3 Frequency Error < 0.1 ppm

GSM, EGSM

Level Power Toler. Level Power Toler.

5 33 dBm 2dB 13 17 dBm 3dB

6 31 dBm 3dB 14 15 dBm 3dB

7 29 dBm 3dB 15 13 dBm 3dB

8 27 dBm 3dB 16 11 dBm 5dB

9 25 dBm 3dB 17 9 dBm 5dB

10 23 dBm 3dB 18 7 dBm 5dB

11 21 dBm 3dB 19 5 dBm 5dB

12 19 dBm 3dB

4 Power Level DCS

Level Power Toler. Level Power Toler.



2 26 dBm 3dB 10 10 dBm 4dB






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GSM, EGSM

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 –30

250 –33

400 –60

600~ <1,200 –60

1,200~ <1,800 –60

1,800~ <3,000 –63

3,000~ <6,000 –65

5 Output RF Spectrum 6,000 –71

(due to modulation)DCS

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 –30

250 –33

400 –60

600~ <1,200 –60

1,200~ <1,800 –60

1,800~ <3,000 –65

3,000~ <6,000 –65

6,000 –73

GSM, EGSM

Offset from Carrier (kHz). Max. dBm

400 –19

600 –21

1,200 –21

6 Output RF Spectrum 1,800 –24(due to switching

DCStransient)

Offset from Carrier (kHz). Max. dBm

400 –22

600 –24

1,200 –24

1,800 –27

7 Spurious Emissions Conduction,Emission Status

2. PERFORMANCE

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2. PERFORMANCE


GSM, EGSM

8 Bit Error RateBER (Class II) < 2.439% @–102 dBm

DCS

BER (Class II) < 2.439% @–100 dBm

9 RX Level Report Accuracy 3 dB

10 SLR 8 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 –12 –

200 0 –

300 0 –12

11 Sending Response 1,000 0 –6

2,000 4 –6

3,000 4 –6

3,400 4 –9

4,000 0 –

12 RLR 2 3 dB

Frequency (Hz) Max. (dB) Min. (dB)

100 –12 –

200 0 –

300 2 –7

500 –5

13 Receiving Response 1,000 0 –5

3,000 2 –5

3,400 2 –10

4,000 2

* Mean that Adopt a straight line in between 300 Hzand 1,000 Hz to be Max. level in the range.

14 STMR 13 5 dB

15 Stability Margin > 6 dB

dB to ARL (dB) Level Ratio (dB)

–35 17.5

–30 22.5

16 Distortion–20 30.7

–10 33.3

0 33.7

7 31.7

10 25.5

17 Side tone Distortion Three stage distortion < 10%

18System frequency

≤ 2.5 ppm(13 MHz) tolerance

19 32.768KHz tolerance ≤ 30 ppm

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At least 80 dB under below conditions:20 Ringer Volume 1. Ringer set as ringer.

2. Test distance set as 50 cm.

21 Charge CurrentCC Charge : < 500 mATrickle Charge : < 60 mA

Antenna Bar Number Power

5 –85 dBm ~

4 –90 dBm ~ –86 dBm

22 Antenna Display 3 –95 dBm ~ –91 dBm

2 –100 dBm ~ –96 dBm

1 –105 dBm ~ –101 dBm

0 ~ –105 dBm

Battery Bar Number Voltage

0 ~ 3.62V

23 Battery Indicator 1 3.62 ~ 3.73V

2 3.73 ~ 3.82V

3 3.82V ~

24 Low Voltage Warning3.5 0.03V (Standby)

3.62 0.03V (Call)

25 Forced shut down 3.35 0.03VVoltage

1 Li-ion Battery

26 Battery TypeStandard Voltage = 3.7VBattery full charge voltage = 4.2VCapacity : 950mAh

Switching-mode charger27 Travel Charger Input : 100 ~ 240V, 50/60 Hz

Output : 5.2V, 600 mA

2. PERFORMANCE

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3. TECHNICAL BRIEF

3.1 Transceiver (SI4205-BM, U301)The RF parts consist of a transmitter part, a receiver part, a frequency synthesizer part, a voltage supply part, and a VCTCXO part.

The Aero I transceiver is the integrated RF front end for multi-band GSM/GPRS digital cellularhandsets and wireless data modems. The integrated solution eliminates the IF SAW filter,external low noise amplifier (LNAs) for three bands, transmit and RF voltage controlled oscillator(VCO modules, and other discrete components found in conventional designs.

Figure 3-1. RECEIVER FUNCTIONAL BLOCK DIAGRAM

AN

TE

NN

A S

WIT

SH

TCXO

3. TECHNICAL BRIEF

(1) Receiver PartThe Aero I transceiver uses a low-IF receiver architecture which allows for the on chipintegration of the channel selection filters, eliminating the external RF image reject filters and theIF SAW filter required in conventional superheterodyne architectures.

A. RF front endRF front end consists of Antenna Switch(FL400), two SAW Filters(FL401, FL402) and dualband LNAs integrated in transceiver (U401).

The Received RF signals(GSM 925MHz ~ 960MHz, DCS 1805MHz ~ 1880MHz) are fed intothe antenna or Mobile switch.

The Antenna Switch(FL400) is used to control the Rx and Tx paths. And, the input signalsVC1 and VC2 of a FL400 are directly connected to baseband controller to switch either Tx orRx path on.

The logic and current is given below Table 3-1.

Table 3-1. The Logic and current

Three differential-input LNAs are integrated in SI4205. The GSM input supports the GSM 850(869-849 MHz) or E-GSM 900 (925-960MHz) bands. The DCS input supports the DCS 1800(1805-1880 MHz) band. The PCS input supports the PCS 1900 (1930-1990 MHz) band.

The LNA inputs are matched to the 150Ω balanced output SAW filters through external LCmatching networks. The LNA gain is controlled with the LNAG[1:0] and LNAC[1:0] bits inregister 05h (Figure 3-2).

VC1 VC2 Current

DCS TX 0V 2.5 ~ 3.0V 10.0 mA max

GSM TX 2.5 ~ 3.0V 0V 10.0 mA max

GSM/DCS RX 0V 0V < 0.1 mA

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3. TECHNICAL BRIEF

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3. TECHNICAL BRIEF

Figure 3-2. SI4205 RECEIVER PART

B. Intermediate frequency (IF) and DemodulationA quadrature image-reject mixer downconverts the RF signal to a 100KHz intermediatefrequency (IF) with the RFLO from the frequency synthesizer. The RFLO frequency isbetween 1737.8 to 1989.9 MHz, and is internally divided by 2 for GSM 850 and E-GSM 900modes. The mixer output is amplified with an analog programmable gain amplifier (PGA),which is controlled with the AGAIN[2:0] bits in register 05h (Figure3-2). The quadrature IFsignal is digitized with high resolution A/D converters (ADCs).

The ADC output is downconverted to baseband with a digital 100KHz quadrature LO signal.Digital decimation and IIR filters perform channel selection to remove blocking and referenceinterference signals. The selectivity setting (CSEL=0) or a low selectivity setting (CSEL=1).The low selectivity filter has a flatter group channelization filter is in the baseband chip. Afterchannel selection, the digital output is scaled with a digital PGA, which is controlled with theDGAIN [5:0] bits in register 05h.

The amplified digital output signal go through with DACs that drive a differential analog signalonto the RXIP,RXIN,RXQP and RXQN pins to interface to standard analog ADC inputbaseband ICs. No special processing is required in the baseband for offset compensation orextended dynamic range.

Compared to a direct-conversion architecture, the low-IF architecture has a much greaterdegree of immunity to dc offsets that can arise from RF local oscillator(RFLO) self-mixing,2nd order distortion of blockers, and device 1/f noise.

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(2) Transmitter PartThe transmit (Tx) section consists of an I/Q baseband upconverter, and offset phase-lockedloop (OPLL) and two output buffers that can drive external power amplifiers (PA), one for theGSM 850 (824-849 MHz) and E-GSM 900 (880-915 MHz) bands and one for the DCS 1800(1710-1785 MHz) and PCS 1900 (1850-1910MHz) bands.

Figure 3-3. SI4205 TRANSMITTER PART

A. IF ModulatorThe baseband converter(BBC) within the GSM chipset generates I and Q baseband signalsfor the Transmit vector modulator. The modulator provides more than 40dBc of carrier andunwanted sideband rejection and produces a GMSK modulated signal. The basebandsoftware is able to cancel out differential DC offsets in the I/Q baseband signals caused byimperfections in the D/A converters.

The Tx-Modulator implements a quadrature modulator. A quadrature mixer upconverts thedifferential in-phase (TXIP, TXIN) and quadrature (TXQP, TXQN) signals with the IFLO togenerate a SSB IF signal that is filtered and used as the reference input to the OPLL.

The IFLO frequency is generated between 766 and 896 MHz and internally divided by 2 togenerate the quadrature LO signals for the quadrature modulator, resulting in an IF between383 and 448 MHz. For the E-GSM 900 band, two different IFLO frequencies are required forspur management. Therefore, the IF PLL must be programmed per channel in the E-GSM900 band.

B. OPLLThe OPLL consists of a feedback mixer, a phase detector, a loop filter, and a fully integratedTXVCO. The TXVCO is centered between the DCS 1800 and PCS 1900 bands, and itsoutput is divided by 2 for the GSM 850 and E-GSM 900 bands. The RFLO frequency isgenerated between 1272 and 1483 MHz. To allow a single VCO to be used for the RFLO,high-side injection is used for the GSM 850 and E-GSM 900 bands, and low-side injection isused for the DCS 1800 and PCS 1900 bands. The I and Q signals are automatically swappedwhen switching bands. Additionally, the SWAP bit in register 03h can be used to manuallyexchange the I and Q signals. Low-pass filters before the OPLL phase detector reduce theharmonic content of the quadrature modulator and feedback mixer outputs. The cutofffrequency of the filters is programmable with the FIF[3:0] bits in register 04h (Figure 3-3), andshould be set to the recommended settings detailed in the register description.

3. TECHNICAL BRIEF

÷ 2 BBG[1:0]

FIF[3:0]

TXBAND[1:0]

PDIBPDRB

SWAPTXIP

TXIN

I

Q

TXQP

TXQN

÷ 1,2

REG

RFOG

RFOD

REG

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3. TECHNICAL BRIEF

(3) Frequency Synthesizer

Figure 3-4. SI4205 FREQUENCY SYNTHESIZER PART

The Aero I transceiver integrates two complete PLLs including VCOs, varactors, resonators,loop filters, reference and VCO dividers, and phase detectors. The RF PLL uses twomultiplexed VCOs. The RF1 VCO is used for receive mode, and the RF2 VCO is used fortransmit mode. The IF PLL is used only during transmit mode. All VCO tuning inductors arealso integrated. The IF and RF output frequencies are set by programming the N-Dividerregisters, N RF1, N RF2 and NIF. Programming the N-Divider register for either RF1 or RF2automatically selects the proper VCO. The output frequency of each PLL is as follows:

The DIV2 bit in register 31h controls a programmable divider at the XIN pin to allow either a13 or 26 MHz reference frequency. For receive mode, the RF1 PLL phase detector updaterate ( ) should be programmed = 100 kHz for DCS 1800 or PCS 1900 bands, and = 200kHz for GSM 850 and E-GSM 900 bands. For transmit mode, the RF2 and IF PLL phasedetector update rates are always =200 kHz.

3.2 Power Amplifier Module (RF3133, U302)The RF3133 is a high-power, high-efficiency power amplifier module with integrated powercontrol. The device is self-contained with 50Ω input and output terminals. The power controlfunction is also incorporated, eliminating the need for directional couplers, detector diodes,power control ASICs and other power control circuitry; this allows the module to be drivendirectly from the DAC output.

The device is designed for use as the final RF amplifier in GSM 850, E-GSM 900, DCS and PCShandheld digital cellular equipment and other applications in the 824-849 MHz, 880-915 MHz,1710-1785 MHz, and 1850-1910 MHz bands.

On-board power control provides over 37 dB of control range with an analog voltage input(TX_RAMP); and, power down with a logic “low” for standby operation (TX_ENABLE).

External control (BAND_SELECT) is used to select the GSM or DCS band with a logic high orlow. A logic low enables the GSM band whereas a logic high enables the DCS band.

Figure 3-5. FUNCTIONAL BLOCK DIAGRAM OF RF3133

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1DSC/PCS IN

2

3

4

5

6

7

BAND SELECT

TX ENABLE

VBATT

VREG

VRAMP

GSM IN

DSC/PCS OUT

VC

C2

VC

C2

VCC OUT

GSM OUT

11

8

12

10

9

3. TECHNICAL BRIEF

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3. TECHNICAL BRIEF

3.3 13MHz Clock (VCTCXO, X301)The 13 MHz clock(X301) consists of a TCXO(Temperature Compensated Crystal Oscillator)which oscillates at a frequency of 13 MHz. It is used within the Si4205, analog base bandchipset (U102, AD6537B), digital base band chipset (U101, AD6525), and MIDI (U401) chipset.

Figure 3-6. VCTCXO CIRCUIT DIAGRAM

3.4 Power Supplies for RF Circuits (RF LDO, U303)Two regulators are used for RF circuits. One is MIC5255 (U303), and the other is one port ofAD6537B (U102).

MIC5255 (U303) supplies power to transceiver (SI4205, U301).

One port of AD6537B supplies power to VCTCXO (X301).

Main power (VBAT) from battery is used for PAM (RF3133, U302) because PAM requires highpower.

Table 3-2. RF POWER SUPPLIERS

Figure 3-7. RF LDO CIRCUIT DIAGRAM

AD6535_AFCDAC

1608

VVCXO

2.2uC371

4VCC

15K

R317X301

13MHz

GND2

OUT3

C3721000p

AFC

Supplier Voltage Powers Enabled signal

U303 (VRF) 2.85V U301, U302 CLKON

U102 (VVCX0) 2.75V X301

Battery (VBAT) 3.4~4.2V U302,U303

10uC361

VRF

10u

C362

0.01u

C3633

GND21

IN5

OUT

U303MIC5255-2.85BM5

4BYP EN

R317 0

VBAT

CLKON

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3.5 Digital Main Processor (AD6525, U101)

3. TECHNICAL BRIEF

AD6525 GSM-PROCESSOR

KEYPADCOL[4:0]KEYPADROW[4:0]

KEYPADMatrix JTAG

UniversalSystem

Connector(USC)

PowerSub-system

32kHz

AD6537B

DRV-OUT AGC

13MHz

VCO

Synthesizer

LAN-IN

RADIO(AD6523/AD6524)

ControlSerialPort

RX/TXI/Q

SerialPort

VOICEDATASerialPort

BacklightService light

FLASH16 bit

SRAM8 or 16 bit(optional)

AccessoryDevices

e.g.BATTERY

SIM

PA SupplyEnable

VDDIOVDDCORE

GNDIOGNDCORE

ASDOASFSASDI

VSDOVSDIVSFS

BSDOBSOFS

BSDIBSIFS

CLKOUT_GATECLKOUT

VBCRESETGeneric Serial Port E

OSCIN

OSCOUT

JTAGENTCK, TMSTDI, TDO

PWRONVDDRTC

RESET

JTAGE, HSL, GPIOUSCTX/RX/CLK

Generic Serial port AGeneric Serial port BGeneric Serial port D

BACKLIGHT0BACKLIGHT1

ROMCSADD[23:0]DATA[15:0]

RDWRHWR/UBSLWR/LBS

ASDIASDFSASDO

VSDIVSDOVSFS

MCLK oeMCLKRESET

RAMPRF TimingI/Q InterinceVOICE 1/F &Buzzer

AFC

MODE

JTAG

BSDIBSIFSBSDOBSOFS

DISPLAYCSLCDCTL

ROMCS

Generic Serial Port C

GPCS0GPCS1Generic Serial Port D-AGeneric Serial Port D-B

CLKINCLKON

Micro SM™RF Interface

SIM Serial Interface

GPIO[ ] / IR Q

DISPLAY(parallel or

serial)

USC

Figure 3-8. SYSTEM INTERCONECTION OF AD6525 EXTERNAL INTERFACE

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3. TECHNICAL BRIEF

• AD6525 is an ADI designed processor.

• AD6525 consists of

1. BUS arbitration Subsystem• EBUS, RBUS, PBUS, SBUS, DMABUS, IOBUS

2. DSP Subsystem• ADI DSP, Viterbi coprocessor, Ciphering unit, Cache memory/controller system

3. MCU Subsystem• ARM7TDMI, boot ROM, Clock generation and access control module

4. Peripheral Subsystem• MMI group Keyboard, Display, Backlight, RTC, GPIO interface

• House Keeping group Watchdog Timer, Interrupt controller, General Timer

• GSM system group

• Direct Memory Access group Between PBUS,RBUS, and EBUS

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3. TECHNICAL BRIEF

3.5.1 Interconnection with external devices

A. RTC Block InterfaceCountered by external X-TAL

The X-TAL oscillates 32.768KHz

B. LCD module interfaceThe LCD module is controlled by DBB chipset, AD6525.

When LCD operate, the AD6525 controls the LCD module through LCD_CS, LCD_RESET,ADD01, WR, DATA[00-15]. LCD_ID, LCD_RESET

Table 3-3. LCD module interface

C. RF InterfaceThe AD6525 control RF parts through PA_BAND, ANT_SW1, ANT_SW2, CLKON , PA_EN,S_EN, S_DATA, S_CLK, RF_PWR_DWN

Table 3-4. RF CONTROL SIGNALS DISCRIPTION

Signals Description

LCD_CS MAIN LCD driver chip enable. MAIN LCD driver IC has own CS pin

LCD_RESET This pin resets LCD module.

This pin determines whether the data to LCD module are display dataADD1(RS) or control data. ADD1 can select 16 bit parallel bus. ADD1 is also

used to address flash memory.

WR Write control. The phone do not read data from LCD chip.

DATAParallel data lines. Color LCD driver chip uses the 16-bit datainterface.

2V8_VMEM 3V voltage is supplied to white colored LED driver for backlighting.

LCD_BACKLIGHT Control signal of white LED driver IC.

DATA[00-15] Parallel data lines, Sub LCD driver chip uses the 8-bit data in reface.

GPO Signal Name Description

17 PA_BAND PAM Band Select

9 ANT_SW1 Antenna Switch Band Select

11 ANT_SW2 Antenna Switch Band Select

- CLKON RF LDO Enable/Disable

16 PA_EN PAM Enable/Disable

19 S_EN PLL Enable/Disable

20 S_DATA Serial Data to PLL

21 S_CLK Clock to PLL

4 RF_PWER_DWN Powerdown Input

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3. TECHNICAL BRIEF

D. SIM InterfaceThe AD6525 check status periodically in call mode if SIM card is inserted or not, but theAD6525 don't check in deep sleep mode.

Interface by SIM_DATA, SIMCLK, SIM_RST(GPIO_23)

Table 3-5. SIM CONTROL SIGNALS DISCRIPTION

Figure 3-9. SIM CIRCUIT

E. Key InterfaceInclude 5 column and 5 row. The AD6525 detect key press by interrupt.

F. ADP3537B InterruptThere are two interrupts, EOC and CHRDET

EOC: End of Charge. AD6525 makes charging operation stop when high signal is inputted.

CHRDET: This pin is activated when the charger is inserted.

Description

SIM_DATAThis pin receives and sends data to SIM card. This model supportonly 3.0 volt interface SIM card.

SIMCLK Clock 3.25MHz frequency.

SIM_RST(GPIO_23) Reset SIM block

C116

1000p

VSIM

C1170.1u

220n

C115

CLK3

4GND1

GND278

GND39

GND4GND5

106

IORST

2VCC

15

VPP

J101

GCA261-6S

VA165

AV

L14

K02

200

VSIM

SIM_DATA

AD6525

- 22 -

3.5.2 AD6525 Architecture

Figure 3-10. AD6525 INTERNAL ARCHITECTURE

The internal architecture of AD6525 is shown in Figure 3-10. AD6525 regroups three mainsubsystems connected together through a dynamic and flexible communication bys network.It also includes onboard system RAM (SRAM) and interfaces with external Flash Memory,Baseband converter functions, and terminal functions like MMI, SIM and Universal SystemConnector (USC).

The Digital Signal Processing (DSP) subsystem primarily hosts all the speech processing,channel equalization and channel codec functions. The code used to implement suchfunctions can be stored in external Flash Memory and dynamically downloaded on demandinto the DSP’s program RAM and Instruction Cache.

The microcontroller subsystem supports all the GSM terminal software, including the layer 1,2 and 3 of the GSM protocol stack, the MMI, and applications software such as dataservices, test and maintenance. It is tightly associated with on-chip system SRAM and alsoincludes boot ROM memory with a small dedicated routine to facilitate the initialization of theexternal Flash Memory via code download using the on-chip serial interface to the externalFlash Memory interface.

The peripheral subsystem is composed of system peripherals such as interrupt controller,real time clock, watch dog timer, power management and a timing and control module. Italso includes peripheral interfaces to the terminal functions: keyboard, battery supervision,radio and display. Both the DSP and the MCU can access the peripheral subsystem via theperipheral bus (PBUS).

For program and data storage, both the MCU subsystem and the DSP subsystem canaccess the on chip system SRAM and external memory such Flash Memory. The access tothe SRAM module is made through the RAM Bus (RBUS) under the control of the busarbitration logic. Similarly, access to the Flash Memory is through the parallel External Bus(EBUS).

3. TECHNICAL BRIEF

AD6525

AD6537BDSP

SRAM FLASH

MMIUSC

MUCPeripheral

RF-Control

Subsystem

SubsystemSubsystem(ARM7TDMI®)

DMA and BUSARBITRARION

Serial Link

DSP BUS

RBUS

EBUSPBUS

SBUS

- 23 -

3. TECHNICAL BRIEF

3.6 Analog Main & Power Management Processor (AD6537B, U102)

Figure 3-11. AD6537B FUNCTIONAL BLOCK DIAGRAM

AD6525orAD6526

- 24 -

• AD6537B is an ADI designed processor.

• AD6537B consists of

1. BB Transmit section• This section generates in-phase and quadrature BB modulated GMSK signals.

• Digital GMSK modulator, 10-bit DACs, Reconstruction Filter

2. BB Receive section• 2 identical ADC channels that process BB in-phase and quadrature input signals.

3. Auxiliary section• 2 auxiliary DASs •AFC DAC, IDAC, AUX ADC

• AUX ADC : 6 channels 10 bitsAFC DAC : 13 bitsIDAC : 10 bits

4. Voiceband section• Receive audio signal from MIC.

Send audio signal to Speaker

• It interconnect with external device like main microphone, main receiver, ear-microphone and Hands-free kit.

5. Power Management section• 8 LDOs Block in the AD6537B. VCORE, VMEM, VEXT, VSIM, VRTC, VABB, VMIC,

VVCXO

• Battery Charging Block

3. TECHNICAL BRIEF

- 25 -

3. TECHNICAL BRIEF

3.6.1 Baseband transmit section 1. The AD6537B Baseband Transmit Section is designed to support GMSK for both single-

slot and multi-slot application.

2. The transmit channel consists of a digital GMSK modulator, a matched pair of 10-bitDACs and a matched pair of reconstruction filter

Figure 3-12. AD6537B BASEBAND TRANSMIT SECTION

3.6.2 Baseband receive section 1. This section consists of two identical ADC channels that process baseband in-phase(I)

and quadrature(Q) input signals.

2. Each channel consists of a coarse switched capacitor Anti-Alias filter, followed by a low-pass digital filter

Figure 3-13. AD6537B BASEBAND RECEIVE SECTION

3. TECHNICAL BRIEF

- 26 -

3.6.3 Auxiliary Section1. This section includes an Automatic Frequency Control (AFC) DAC, voltage reference

buffers, an Auxiliary ADC, and light controllers.

2. This section also contains AUX ADC and Voltage Reference

• AFC DAC: 13 bits

• IDAC: 10 bits

• The Auxiliary ADC provides :

Two differential inputs for temperature sensing.

- A differential input for the battery charger current sensor

- A single-ended input for battery voltage measurement

- A single-ended input for battery type identification

- Two single-ended inputs for microphone and hookswitch detection, one for each of twoanalog

Audio input channels

- Two general purpose external inputs

- REF, REFOUT, REFCHG

- REFADC and REFADC/2, and AGND1 inputs for offset and gain measurement

Figure 3-14. AD6537B AUXILIARY SECTION

CSFS

CSDI

CSDO

AD6537B

ControlSerialPort

AFCDAC

VoltageReference

REFTXCM

AuxADC

AFCDAC

REFBB

REFOUT

REF

REFCHG

TEMP1

TEMP2

AUXADC1

AUXADC2

AIN1P

AIN2P

BATTYPE

ISENSE

VBATSENSE

LIGHT1

LIGHT2

LIGHT3

LightControllers

3. TECHNICAL BRIEF

- 27 -

3.6.4 Audio Section1. Receive audio signal from microphone. C1100 use differential configuration.

2. Send audio signal to speaker. C1100 use differential configuration.

3. This section provides an audio codec with a digital-to-analog converter and an analog-to-digital converter, a ring tone volume controller, a microphone interface, and multipleanalog input and output channels.

4. It interconnect with external device like main microphone, main receiver, and headset jackthrough the AIN1N, AIN1P, AIN2N, AIN2P, AIN3N, AIN3P, AOUT1P, AOUT1N, AOUT2P,AOUT2N, AOUT3P, and AOUT3N port.

• AIN1P, AIN1N : Main microphone positive/negative terminal

• AOUT2P, AOUT2N : Main Speaker positive/negative terminal

• AIN2P, AIN2N : Ear-Mic microphone positive/negative terminal

• AOUT1P, AOUT1N : Ear-Mic speaker positive/negative terminal

Figure 3-15. AD6537B AUDIO SECTION

GPI

CSFS

CSDI

CSDO

ASFS

ASDI

ASDO

AD6537B

ControlSerialPort

Ring ToneVolume Controller

AudioSerialPort

Filter/SRC

Filter/SRC

DAC

ADC

PGA

PGA

PGA

AIN3P

AIN3N

8Ω

32Ω

32Ω

SPWR

AOUT2P

AOUT2N

AOUT1N

AOUT3N

AOUT3P

AOUT1P

SGND

AIN1P

AIN1N

AIN2P

AIN2N

AnalogSwitch

AnalogSwitch

Analog Adder

Microphone Interface

Gain Pre-Amp

3. TECHNICAL BRIEF

- 28 -

3.6.5 Power Management

Figure 3-16. AD6537B POWER MANAGEMENT SECTION

1. Power up sequence logic1. The AD6537B controls power on sequence

2. Power on sequencez

- If a battery is inserted, the battery powers the 8 LDOs.

- Then if PWRONKEY is detected, the LDOs output turn on.

- REFOUT is also enabled

- Reset is generated and send to the AD6525

3. TECHNICAL BRIEF

- 29 -

Figure 3-17. AD6537B POWER MODE LOGIC

2. LDO Block1. There are 8LDOs in the AD6537B.

- VCORE : supplies Digital Baseband Processor core and AD6537 digital core(1.8V, 80mA)

- VMEM : supplies external memory and the interface to the external memory onthe digital baseband processor (1.8V or 2.8V, 150mA)

- VEXT : supplies Radio digital interface and high voltage interface (2.8V,170mA)

- VSIM : supplies the SIM interface circuitry on the digital processor and SIMcard (1.8V or 2.85V, 20mA)

- VRTC : supplies the Real-Time Clock module (1.8 V, 200 µA)

- VABB : supplies the analog portions of the AD6537

- VMIC : supplies the microphone interface circuitry (2.5 V, 1 mA)

- VVCXO : supplies the voltage controlled crystal oscillator ( 2.75 V, 10 mA)

AD6537B

THERMThermalShutdown

DDLO

UVLO

CHGDET

VBAT

KEYON

DBBON

VRTC

VEXT

VCXDEN

POWERMODE

Enable

Mode

Enable

Mode

Enable

Mode

Enable

Mode

Enable

Digital coreLDO Regulator

Memory InterfaceLDO Regulator

External InterfaceLDO Regulator

SIM InterfaceLDO Regulator

VCXOLDO Regulator

VCORE Comparator

VMEM Comparator

VEXT Comparator

VCORE

VMEM

VEXT

VCORECP

VMEMCP

VEXTCP

low: VCORE < 1.5Vhigh: VCORE > 1.5V

high: VMEM > 2.5V or 1.5Vlow: VMEM < 2.5V or 1.5V

high: VEXT > 2.5V low: VEXT < 2.5V

VCORE

VMEM

VEXT

VSM

VVCXO

VSMEnControl Bit

3. TECHNICAL BRIEF

- 30 -

Table 3-6. AD6537B LDO DESCRIPTION

3. Battery Charging Block1. It can be used to charge Lithium Ion and/or Nickel Metal Hydride batteries.

Charger initialization, trickle charging, and Li-Ion charging control are implemented inhardware.

2. Charging Process

- Check charger is inserted or not

- If AD6537B detects that Charger is inserted, the CC-CV charging starts.

- Exception: When battery voltage is lower than 3.2V, the precharge(low current chargemode) starts firstly.

- And the battery voltage reach to 3.2V the CC-CV charging starts.

3. Pins used for charging

- CHG_DET: Interrupt to AD6525 when charger is plugged.

- CHG_EN: Control signal from AD6525 to charge Li+ battery

- EOC: Interrupt to AD6525 when battery is fully charged

- GATEIN: Control signal from AD6525 to charge NiMH battery. But, not used.

- MVBAT: Battery voltage divider. Divide ratio is 1:2.3 and it is sensed in AD6521AUX_ADC

4. TA (Travel Adaptor)

- Input voltage: AC 85V ~ 260V, 50~60Hz

- Output voltage: DC 5.2V ( ±0.2 V )

- Output current: Max 850mA ( ±50mA )

5. Battery

- Li-polymer & Li-ion battery (Max 4.2V, Nom 4.0V)

- Standard battery: Capacity - 770mAh, Advanced Li-ion

Description

VSIM 2.85V(is provided to SIM card)

VCORE 1.8V(is provided to the AD6525 & AD6537B’s digital core)

VRTC 1.8V(is provided to the RTC and Backup Battery)

VMIC 2.55V(is provided to the AD6525 I/O and used as microphone bias)

VTCXO 2.75V(is provided to VCTCXO)

VMEM 2.8V(is provided to Flash)

VEXT 2.8V(is provided to LCD)

3. TECHNICAL BRIEF

- 31 -

Figure 3-18. AD6537B BATTERY CHARGING BLOCK

Figure 3-19. C1100 AUDIO CIRCUIT

AD6537B

ControlSerialPort

CSFS

CSDI

CSDO

ChargeTimer

TroubleCharge

Chg.DAC

VCHG

GATEDRIVE

ISENSE

VBATSENSE

VBATx

BATTYPE

REFOHGRTRIF

RSENSE

AGND1

VCHARGER

RGATE

3-TerminalBattery Pack

RTEMP

thermistorINT InterruptLogic

AuxADC

CLOSE TO EARJACK

CLOSE TO MIC

CLOSE TO

HEADSET JACK

AD6537

0R124

2.2KR134

TC153

10u

R128

100C163

39p

1KR126

C179

39p

OB4-15L42-C33L

MIC101

12

C12339p

39p

C196

R156 100K

SP115

VEXT

R150

100

39p

C1651MR144

100pC171

1u

C157

C178

39p

C177

39p

100R148

100

R132

0.1uC124

C152

39p

VA153

AV

L5M

02-2

00

VEXT

R158 NA

VMEM

VA151

AV

L5M

02-2

00

C168

18p

39K

R153

C139 4.7u

SG

ND

1T

8

SG

ND

2R

8

SPWR1R10

SPWR2T10

NC_R12R12

N15

LG

ND

LIGHT1L16M15

LIGHT2LIGHT3

M16

B10AUXADC1AUXADC2

A9

DG

ND

M2

AIN1NR16

AIN1PP16R15

AIN2N

P15AIN2P

R13AIN3LAIN3R

R14

K15AOUT1NAOUT1P

J15

T9AOUT2N1

R9AOUT2N2

R11AOUT2P1

T11AOUT2P2AOUT3N

K16J16

AOUT3P

AG

ND

1

C193

VMEM

46N

O

2VCC

39p

U105

MAX4599EXT-T5C

OM

GND3

1IN

NC

VA152

AV

L5M

02-2

00

U104

MAX9075EXK-T

2GND

1OUT

VCC

5

3 VIN+

VIN-4

R159

1K

AV

L5M

02-2

00

VA154

C154

39p

4.7

R141

C188

0.1u

1MR145

VBAT

C155

39p39p

C153

39p

C161

10u

TC151

NA

R154R137 1K

4.7K

R130

R149

NA

2.2KR127

VMIC

VMEM

39p

C156

C160

0.1u

330KR147

R138

2.2K

C167

39p

J102

1

2

34

5

C170100p

C151 0.1u

C162

39p

R181 4.7

SP114

VMIC

HOOK_DET

VMIC_ON

JACK_DET

HOOK_DET

RLEDGLED

RECP

SPKN

SPKP

RECN

3. TECHNICAL BRIEF

- 32 -

Figure 3-20. MAIN RECEIVER CIRCUIT

Figure 3-21. CHARGING CIRCUIT

In order to reduce time for trickle charging, additional circuit (Pre-charge circuit) was included.This circuit has supplied a 50mA current into the battery additionally.

So call it, it reduce trickle charging time

Closed to Analog SW

47p

C412C411

47p

R407

0

0

R409

4.7

R414

100KR415

C40747p

39pC409

NA

VMEM

R405

R406

NA

47pC410

1V+

COM13

COM29

GND6

4IN1

8IN2

NC15

7NC2

2NO1

10NO2

MAX4684EUBU402

4.7

R416

47pC406

SPK_REC_N

SPK_REC_P

SPKN

SPKP

RECP

RECN

SPK_RCV_SEL

1%

Current Sense

CLOSE TO BATTERY PACK

D6

G4 5S

TPCF8102

D11D22D33 D4 6

D5 7

8

Q103

VCHARGE VBAT

0.1u

C14049.9R162

0

R163

100KR1651.5K

R157

1KR164

NAR155

6

3

1

4

Q104

UMX1NTN

2 5

VBAT

330R108

D101

CUS02

0.2R107

VCHARGE

10u

C187

RED_LEDPRE_CHARGE

3. TECHNICAL BRIEF

- 33 -

3.7 Memory (TH50VPF5783AASB, U201)

Block Diagram

Figure 3-22. MEMORY BLOCK DIAGRAM

• 128Mbit flash memory + 32Mbit PSRAM

• 16 bit parallel data bus

• ADD01 ~ ADD22.

• 2 Chip enables for Flash memory select.

• RF Calibration data, Audio parameters and battery calibration data etc are stored in Flashmemory area.

Vccf Vss

DQ0~DQ15(DQ0~DQ7)

Vccps

A0~A20

A-1 A0~A21

A-1 A0~A21

WP/ACC

RY/BYf

BYTE

WEOE

CE1ps

CE2psUBLB

RESETCEf1CEf2

Vss

128 MbitsFLASH Memory

328 MbitsPSEUDO SRAM

DQ0~DQ15

DQ0~DQ15

- 34 -

3.8 Display and InterfaceTable 3-7. LCD module discription

C1100 Main LCD supports one 65,536 color LCD module.

There are the control signals : LCD_CS (This acts as the chip select enable for the LCD Driver),WR, ADD01(RS) and LCD_RESET. DATA[00:15] pins to send data for displaying graphical textonto the LCD.

Figure 3-23. LCD INTERFACE CIRCUIT

3. TECHNICAL BRIEF

Main LCD Display Format 128 X RGB X 128 dots

Main LCD Backlight White LED Backlight

LCD BACKLIGHT LED

C255

22p

C219

22p

39pC262

C242

22p22p

C276

820R204

456789

20212223242526272829

3

30313233341

1011121314151617 18

19

2

CN201

EN_SET9

11GND

10IN

2OUT

U203

AAT3123ITP-20-T1

4C1+

C1-3

C2+1

12C2-D1

8

D27

D36

D45

22p

C225C215

22p 22p

C224C221

22p

R210 820

22p

C240

22p

C227

C258

1uF

VBAT

C220

VRTC

22p 22p

C243C212

22p

C223

22p

C244

22p

C233

22p

VA207

AV

L14

K02

200

C214

22p 22p

C222C216

22p

R213 820

C237

22p

C274

22p

C247

22p22p

C235

22p

C239 C248

22p

C257

22p

R214 820

C2601uF

820

R212

R202

820

22p

C241

22p

C246

C261

VEXT

1uF

22p

C238

820R205

820R209820R211

C278

22p

330R219

820R203

C271

18p

C217

VBAT

22p

FB1

22p

C213

22p

1uF

C254

C259

22p

C231

22p

C245

C272

18p

C275

22p 22p

C256

R218 330

C236

22p22p

C218

820R201

22p

C211 C234

22p

R206 820R207 820

820R216

C226

22p

820R208

C232

22p22p

C277

R215 820

SPK_REC_NSPK_REC_P

LCD_RESET

LCD_CSMOTOR

DATA05

DATA07DATA06

DATA04DATA03DATA02DATA01DATA00

ADD01

LCD_DIM

DATA10DATA09DATA08

DATA11DATA12

DATA15

DATA13DATA14

WR

LCD_ID

- 35 -

3. TECHNICAL BRIEF

3.9 Keypad Switches and ScanningThe key switches are metal domes, which make contact between two concentric pads on thekeypad layer of the PCB when pressed. There are 24 switches (SW1-SW2,KB2~KB22),connected in a matrix of 5 rows by 5 columns, as shown in Figure, except for the power switch(KB101), which is connected independently. Functions, the row and column lines of the keypadare connected to ports of AD6525. The columns are outputs, while the rows are inputs and havepull-up resistors built in.

When a key is pressed, the corresponding row and column are connected together, causing therow input to go low and generate an interrupt. The columns/rows are then scanned by AD6525to identify the pressed key.

Figure 3-24. C1100 KEYPAD CIRCUIT

6

3MENU

RIGHT

2

0

SELECT

*

98

UP

LEFT

CONFIRMDOWN

SEND7

CLR

1

4

#

DOWN

5UP

SP205

SP235

KB19SP230

SP234

123

45

SW1

KB10

KB2SP209

KB16

SP201

KB17

VA201

AV

L5M

02-2

00

SP228KB15

KB5

KB11

KB12

680

R243

SP211

SP207

KB8

KB14

SP206

KB20

SP208

SP227 SP226KB3KB7

SP231

SW2

123

45

KB18

AV

L5M

02-2

00

SP233

VA202

SP229

KB6

KB9

680

R242

KB21

SP212 SP210

SP232

SP213

SP204

KB22

KB4

KB13

KEY_ROW0

KEY_COL2

KEY_ROW1

KEY_COL0

KEY_ROW4

KEY_COL1

KEY_COL3KEY_COL4

KEY_ROW2

KEY_ROW3

PWR KEY

0.01u

C144

KEYON (AD6537B)R161

1K KB101

3.10 MicrophoneThe microphone is placed to the front cover and contacted to main PCB. The audio signal ispassed to AIN1P and AIN1N pins of AD6537B. The voltage supply VMIC is output fromAD6537B, and is a bias voltage for the AIN1P. The AIN1P and AIN1N signals are then A/Dconverted by the Voiceband ADC part of AD6537B. The digitized speech is then passed to theDSP section of AD6525 for processing (coding, interleaving etc.).

Figure 3-25. MICROPHONE

- 36 -

3. TECHNICAL BRIEF

AIN1P

AIN1N

1k

2.2k39p

10u

100

39p

100 0.1u39p

39p 39p

2.2k39p 39p

Main Mic

AD6537B

VMIC

- 37 -

3. TECHNICAL BRIEF

3.11 Main ReceiverThe Receiver is driven directly from AD6537B AOUT1P and AOUT1N pins and the gain iscontrolled by the PGA in an AD6537B.

The Receiver is placed in the folder cover and contacted to LCD MODULE

Figure 3-26. MAIN RECEIVER

- 38 -

3.12 Headset Jack InterfaceThis phone chooses a 3-pole type ear-mic jack which has three electrodes such as Receiver+, Mic+, and GND. This type usually supports only single-ended configuration in the audiopath. But most of phones use the common interface.

Figure 3-27. HANDS-FREE & HEADSET JACK INTERFACE

3. TECHNICAL BRIEF

AIN2NAIN2P

AIN3LAIN3R

AD6537B

CLOSE TO EARJACK

HEADSET JACKTC153

10u

C179

39p

C12339p

39p

C196

R156 100K

SP115

VEXT

R150

100

39p

C1651MR144

100pC171

C178

39p

C177

39p

100R148

0.1uC124

C152

39p

VA153

AV

L5M

02-2

00

VEXT

R158 NA

VMEM

C168

18p

39K

R153

VMEM

46N

O

2VCC

U105

MAX4599EXT-T5C

OM

GND3

1IN

NC

U104

MAX9075EXK-T

2GND

1OUT

VCC

5

3 VIN+

VIN-4

R159

1K

AV

L5M

02-2

00

VA1544.7

R1411MR145

39p

C153

NA

R154R137 1K

4.7K

R130

VMIC

VMEM

330KR147

R138

2.2K

C167

39p

J102

1

2

34

5

C170100p

C151 0.1u

R181 4.7

SP114

HOOK_DET

VMIC_ON

JACK_DET

- 39 -

3. TECHNICAL BRIEF

3.13 Speaker & MIDI ICC1100 don’t use buzzer. but uses the loud speaker and Melody IC which makes the robustjoyful melody sounds.

• Melody IC control2GPIO are assigned to control melody IC. Melody data is transferred to melody IC.

Figure 3-28. SPEAKER & MIDI IC

This phone have a melody IC of Yamaha, YMU759B is a synthesis LSI for portabletelephone that is capable of playing high quality music by utilizing FM synthesizer andADPCM decoder. This chipset is equipped with Yamaha's original FM synthesizer, withwhich the device is capable of simultaneously generating up to 16 voices with differenttones, that is 16 polys. YMU759B includes a speaker amplifier low ripple whose maximumoutput is 550mW at SPVDD = 3.6V.

Closed to Analog SW

(16 Poly MIDI)

C403 0.1u

47p

VMEM

R403

10K

C412C411

47p

C404

R407

0.01u

0

0

R409

28_WR

4.7

R414

HPOUT_L10

HPOUT_R11

5IFSEL

6 PLLC

32 SDOUT

SPOUT117

SPOUT218

SPVDD 15

16SPVSS

VDD7

VREF9

8 VSS

_CS29

_IRQ3

31_RD

4_RST

30A0

1CLK1

D027

D126

D225

D324

D42322

D521

D620

D7

12EQ1

EQ2 13

14EQ3

EXT1 219EXT2

YMU759B U4010R401

100p

C405

0

R404

R408 3.3K

100KR415

10K

R412

C40747p

39K

R402

VBAT

39pC409

NA

VMEM

R405

R406

NA

47pC410

1V+

150KR417

COM13

COM29

GND6

4IN1

8IN2

NC15

7NC2

2NO1

10NO2

MAX4684EUBU402

4.7

R416

R410 047pC406

1000p

R413

0

C402 0.1u

C401

0.1u

SPK_REC_N

SPK_REC_PC408

13MHZ_MIDIMIDI_RESET

ADD00RD

MIDI_CS

WRMIDI_INT

DATA08DATA09DATA10DATA11DATA12DATA13DATA14DATA15

SPKN

SPKP

RECP

RECN

SPK_RCV_SEL

- 40 -

3.14 Key Back-light IlluminationIn key back-light illumination, there are 10 blue LEDs on main PCB keypad side , which aredriven by LIGHT3 line from AD6537B.

Figure 3-29. KEY BACK-LIGHT ILLUMINTION

3. TECHNICAL BRIEF

LD118LD111

SP109 SP110

LD115

47R116

LD119

R11347

LD116

SP108

R1174747

R11247

R118 R11947

SP102

LD114LD113

SP105SP104

LD117

SP106

47R115

LD112

47R114

LD120

SP107

R11147 47

R120

SP103 SP111

VBAT

AD6537B

LIGHT1

LIGHT2

LIGHT3

RLED

GLED

RED LED

GREEN LED

NAR264

5

6

3

1

4

Q201

UMX1NTN

2

10K

R225

0R263

R262

0

0

R261

R226 47K

R229 47K47K

R227

RLED

GLED

RED_LEDIND_LEDG

- 41 -

3. TECHNICAL BRIEF

3.15 LCD Back-light IlluminationIn LCD Back-light illumination, there is an charge pump driver in main PCB, which is controlledby LCD_DIM line from AD6525.

Figure 3-30. MAIN LCD BACKLIGHT ILLUMINATION

LCD BACKLIGHT LED

39pC262

EN_SET9

11GND

10IN

2OUT

U203

AAT3123ITP-20-T1

4C1+

C1-3

C2+1

12C2-D1

8

D27

D36

D45

C258

1uF

VA207

AV

L14

K02

200

C2601uF

C2611uF

C271

18p

VBAT

FB1

1uFC259

C272

18p

LCD_DIM IND_LEDG

LCD MODULE

3.16 MOTORThe Vibrator is placed in the folder cover and contacted to LCD MODULE. The vibrator isdriven from VIBRATOR (GPIO_0) of AD6525.

Figure 3-31. MOTOR

- 42 -

3. TECHNICAL BRIEF

20R223

1SS352D201

47KR224

VBAT

R230 220

R234100K

VBAT

VA204

AV

L14

K02

200

23

64

1

5

Q202

EMZ2 C2734.7u

1.5KR233

MOTOR

VIBRATOR

- 43 -

4. TROUBLE SHOOTING

4.1 RX Trouble

RX Check Area

HP8922 : Test mode62 CH, 7 level setting (TCH)

62 CH, -60dBm setting (BCCH)Spectrum analyzer settingOscilloscope setting

START

1.CheckRegulator Circuit

2.CheckVCTCXO Circuit

3.CheckControl Signal

4.CheckAnt SW &Mobile SW

5. CheckSaw Filter

Circuit

6. CheckRX IQ

Redownload SW, CAL

4. Trouble Shooting

1

2

6

5

3

4Test Point

Checking FlowFigure 4-1.

4. Trouble Shooting

- 44 -

(1) Checking Regulator Circuit

Test Points

Circuit Diagram

Checking Flow

Figure 4-2.

U303. 3

U303. 5

Pin 3. High ?

Yes

Changing the BoardRF 2.85V O.K?

Yes

No

Replace U303Regulator Circuit is OKSee next Page to checkVCTCXO

NoCheck Pin 5.

10uC361

VRF

10u

C362

0.01u

C3633

GND21

IN5

OUT

U303MIC5255-2.85BM5

4BYP EN

R317 0

VBAT

CLKON

4. Trouble Shooting

- 45 -

(2) Checking VCTCXO Circuit

Test Points Checking Flow

Waveform

Circuit Diagram

Figure 4-3.

No

Yes

No

Yes

Check Pin 3.Refer to Graph 2-1

Check Pin 4.Refer to Graph 2-2

13 MHzO.K?

2.75V OK?

Check U101, PMIC

VCTCXO Circuit is OKSee next Page to checkANT SW & Mobile SW

Changing X301

(1608)

AD6535_AFCDAC

C373100p

1000pC372

R314

C3712.2u

100

X301

2GND

3OUT

VCC4

13MHz

VVCXO

R315

15KAFC

X301. 4 X301. 3

4. Trouble Shooting

- 46 -

(3) Checking PLL Control Signal

Test Points

Waveform

Checking Flow

Figure 4-4.

S_DATA

S_CLK

S_EN

RF_PWR_DWN

Check RF_PWR_DWN. Level is High?

Yes

Control Signal is OKSee next Page to checkANT SW & Mobile SW

No

Check TP Check if there isAny Major DifferenceRefer to Graph 3-13-2

Similar?

Yes

No

Download the SW

Download the SW

4. Trouble Shooting

- 47 -

(4) Checking Ant SW & Mobile SW

Test Points

Circuit Diagram Waveform

Figure 4-5.

GPO_9

GPO_11

22pC321

C383 27p

0.5pC322

C385 10p

10pC382

C325NA

33nH

L305

C384 3.3p

KMS-507 SW301AN

TG

1

G2

RF

14GND7

VC

1

11

VC

2

2SHS-C090DR

FL3018ANT

1DCS_RX

DCS_TX3

EGSM_RX10

EGSM_TX5

GND14

GND26

GND37

GND49

GND512

GND613

33nH

L306

27p

C387

ANT_SW1

ANT_SW2

SW301. RF

FL301. 1

FL301. 10

L306 (VC1)

L305 (VC2)

SW301. ANT

4. Trouble Shooting

- 48 -

Checking Flow

Check L305, L306Check whether Ant SWSet as RX modeRefer to Table 4-1

Check SW301 Pin ANT,RFwith RF Cable connected. Open

Yes

Yes

Yes

Yes

Changing SW301

Check SW301 Pin ANT,RFwith No RF Cable Connected

For these 2 test case,No Call connection is needed

No

Changing SW301No

Changing the Board.No

Changing FL301NoCheck RF Level of

FL301.2 (for GSM) &FL301.11(for DCS)

Ant SW & Mobile SW is OKSee next Page to checkRx IQ Signal

For this RF Level test case,RX Stand alone Mode is neededrefer to chapter 11

Short

VC1 : LowVC2 : Low

Pin10 : ~ -62dBmPin 1 : ~ -63dBm

Table 4-1.

ANT SW VC1 VC2

DCS TX 0 1

EGSM TX 1 0

EGSM,DCS RX 0 0

4. Trouble Shooting

- 49 -

(5) Checking SAW Filter Circuit

Test Points

Checking Flow

Circuit Diagram

Figure 4-6.

FL302

B7820

G1

2

G2

5

IN1 O1

3

O2

4

C353

1p

C352

1p

7.5nHL304

27nHL303

C354

1p

1p

C351

G1

2

G2

5

IN1

3O1

O2

4

FL303

B7821

27p

C387

Check RF Level ofSaw Filter InputFor GSM : FL302.1

Check RF Level ofSaw Filter OutputFor GSM : FL302.3For DCS : FL303.3

FL303.1 : ~ -61dBm

FL302.3 : ~ -64dBmFL303.3 : ~ -65dBm

Saw Filter is OKSee next Page to checkRx IQ Signal

Yes

Yes Yes

No

Check the parts arewell SolderedFor GSM : C387

No No

Check the parts are well SolderedFor GSM : L303,C351For DCS : L304, C353

ChangingC387for GSM

ChangingC387for GSM

For the test,RX Stand alone Mode isneeded. Refer to chapter 11

ChangingL303, C351 for GSML304, C353 for DCS

ChangingFL302 for GSMFL303 for DCS

FL303FL302

- 50 -

4. Trouble Shooting

(6) Checking RX IQ

Test Points

Waveform

Checking Flow

Circuit Diagram

Yes

NoCheck C342, C343.Check if there isAny Major Difference• Refer to Graph 4-4

Similar? Replace U301

Redownload the SoftwareAnd calibrate

39p

39p

C343

C342

QP

QN

IP

IN

Figure 4-7.

Graph 4-4.

C342C343

- 51 -

4.2 TX Trouble

4. Trouble Shooting

START

1. CheckRegulator Circuit

2. CheckVCTCXO Circuit

3. CheckControl Signal

HP8922 : Test mode 62 CH, 7 level setting (TCH) 62 CH, -60dBm setting (BCCH)

Spectrum analyzer settingOscilloscope setting

4. CheckTX IQ

5. CheckPAM Control Signal

6. Check Ant SW &Mobile SW

Redownload SW, CAL

Test Points

Checking Flow

Figure 4-8.

6

1

2

3

5

4

- 52 -

(1) Checking Regulator Circuit

Figure 4-9.

4. Trouble Shooting

10uC361

VRF

10u

C362

0.01u

C3633

GND21

IN5

OUT

U303MIC5255-2.85BM5

4BYP EN

R317 0

VBAT

CLKON

No No

Yes Yes

RF 2.85VO.K? Pin 3. High ? Changing the Board

Regulator Circuit is OK.See next Page to checkVCTCXO

Replace U303

Check Pin 5 .

Test Points

Circuit Diagram

Checking Flow

U303. 3

U303. 5

- 53 -

4. Trouble Shooting

(2) Checking VCTCXO Circuit

Yes

Yes

Check Pin 3.• Refer to Graph 2-11

13 MHzO.K?

2.75V OK?

Check U101,PMIC

No

No

Changing X301

VCTCXO Circuit is OKSee next Page to checkANT SW & Mobile SW

(1608)

AD6535_AFCDAC

C373100p

1000pC372

R314

C3712.2u

100

X301

2GND

3OUT

VCC4

13MHz

VVCXO

R315

15KAFC

Figure 4-10.

Test Points Checking Flow

Waveform

Circuit Diagram

X301. 4 X301. 3

(3) Checking PLL Control Signal

- 54 -

4. Trouble Shooting

No

No

Yes

Yes

Check RF_PWR_DWN.

Similar?

Control Signal is OK.See next Page to checkANT SW & Mobile SW

Level is High? Download the SW

Download the SW

Figure 4-11.

Test Points

Checking Flow

Waveform

S_DATA

S_CLK

S_EN

RF_PWR_DWN

- 55 -

4. Trouble Shooting


Graph 4-7.(a) Graph 4-7.(b)

Figure 4-12.

GPO_9

GPO_11

22pC321

C383 27p

0.5pC322

C385 10p

10pC382

C325NA

33nH

L305

C384 3.3p

KMS-507 SW301AN

TG

1

G2

RF

14GND7

VC

1

11

VC

2

2SHS-C090DR

FL3018ANT

1DCS_RX

DCS_TX3

EGSM_RX10

EGSM_TX5

GND14

GND26

GND37

GND49

GND512

GND613

33nH

L306

27p

C387

ANT_SW1

ANT_SW2

Test Points

Waveform

Circuit Diagram

SW301. RF

FL301. 1L306 (VC1)

L305 (VC2)

SW301. ANT

FL301. 10

- 56 -


4. Trouble Shooting

Yes

Yes

Yes

Yes

For the test,TX Stand alone Mode is needed. Refer tochapter 11 (PL=7 for GSM, PL=2 for DCS)

Check L305, L306Check whether Ant SWSet as TX mode• Refer to Graph 4-7(a),4-7(b)• Refer to Table 4-2

Check RF Level ofFL301 Pin 5 (for GSM) & Pin 3(for DCS)

Check SW301.ANT, RF withRF Cable connected.

Check SW301.ANT,RFwith RF Cable disconnected

Check VC1, VC2 Changing board

Go to 4.3.5 Checking PAMcontrol signal

Changing SW301

Changing SW301

Pin5 : ~29.5dBmPin 3 : ~26.5dBm

Open

Short

END

No

No

No

No

Checking Flow

Table 4-2.

ANT SW VC1 VC2

DCS TX 0 1

EGSM TX 1 0

EGSM,DCS RX 0 0

- 57 -

4. Trouble Shooting

(6) Checking PAM Control Signal

Go to Next Step

Similar?

Yes

NoDownload S/W

Graph 4-8.

Figure 4-13.

Test Points

Waveform

Checking Flow

TX_RAMP (R301)

PA_EN (R302)

Check TX_RAMP and PA_ENCheck if there is Any Major Difference or not Refer to Graph 5-11

- 58 -

(7) Checking TX IQ

Figure 4-14.

Graph 4-9.

C399

22n 22p

C386

39p

39p

C343

C342

TXIN5

TXIP4

TXQN7

TXQP6

32V

DD

2

RXIN32

RXIP

1RXQN

GN

D4

31

QP

QN

IP

IN

4. Trouble Shooting

Test Points

Waveform

Circuit Diagram

C342C343

4. Trouble Shooting

- 59 -

4.3 Power On Trouble

Figure 4-15. AD6537B POWER MANAGEMENT SECTION

For AD6535 & 6537B

VBAT

VSIM

C133

10u

VMIC

C147

22p

VBAT

VCORE VMEM

VBAT

VEXT

10u

C146

A4

VE

XT

1B

4V

EX

T2

T3

VM

EM

1V

ME

M2

T2

VM

ICN

16

T7VRTC

VS

IMT

6D

16V

VC

XO

H16

VA

BB

VB

AT

1N

2

C15

VB

AT

1-1

P2

VB

AT

2

VB

AT

2-1

G15

VB

AT

2-2

H15

R2

VB

AT

3

VB

AT

3-1

A3

VB

AT

3-2

B3

R5

VB

AT

4V

BA

T5

R4

B8VBATSENSE

VBAT_NETT4

P1

VC

OR

E1

N1

VC

OR

E2

R6

NC

_R6

C149

39p

VVCXO

R101NA

C148

47n

47n

C132

10u

C13510u

C131

C137C136

10u10u

VRTC

R104

NA

C195

0.1u

0

R103

10u

C134

AD6537B

Circuit Diagram Test Points&

4. Trouble Shooting

- 60 -

No

No

No

No

NoNo

Yes

Yes

Yes

Yes

Yes

START

Check Battery Voltage> 3.35V ?

Push power-on key and check the level change of

U102 KEYON

Check the voltage ofthe following port at U102

VOORE=1.8V ?VMEM = 1.8 or 2.8V ?

VEXT=2.8V ? VRTC=1.8V ?VSIM=2.85V ? VMIC=2.5V ?VVCXO=2.75V ?

Logic level at KEYON of U102= HIGH?

Does it work properly?

THE PHONE WILLPOWER ON.

Charge or Change Battery and try again.

Check the contact of power-key or dome switch.

Replace U102

Redownload software & try again.

Yes

Yes


The power-on procedure is completed.The problem may be elsewhere.

Replace the main board.

Checking Flow

- 61 -

4. Trouble Shooting

4.4 Charging Trouble

Figure 4-16.

1%

Current Sense


D6

G4 5S

TPCF8102

D11D22D33 D4 6

D5 7

8

Q103

VBAT

330R108

D101

CUS02

VCHGISENSE

GATEDRIVE

0.2R107

VCHARGE

10u

C187

Test Points

Circuit Diagram

D101 Q103

R107

- 62 -

4. Trouble Shooting

Voltage at VCHG of U102 = 5.2V?

R107, Q103, D101 well-soldered?

Voltage across D101 = ~0.3V

Voltage acrossR107 is ~100mV.

~0.7< Voltage(Q103) < ~1.3V

Is the battery charged ?

The charging adaptor(TA) is out of order.Change the charging adaptor.

Resolder R102, U102, D101.

Replace D101.

Replace R107.

Replace Q103.

The battery may have the problem.Change the battery and try again.

CHARGING WILLOPERATE PROPERLY.

Yes

Yes

Yes

Yes

Yes

Yes

No

No

No

No

No

No

START

SETTING : Connect the battery and the charging adaptor(TA) to the phone

Checking Flow

- 63 -

4. Trouble Shooting

4.5 LCD Trouble.

Figure 4-17.(a) Figure 4-17.(b)

Figure 4-17.(c)

Checking Flow

Connection Check

CN201

If the FPCB has aproblem,the control signals forLCD cannot betransmitted properly.

- 64 -

4. Trouble Shooting

START

Is the connection of LCDmodule with LCD connector on

PCB OK?

Check the soldering of CN201

Check the soldering ofConnector at LCD module.

Check the soldering of CRC filter

Does LCD work properly?

LCD WILL WORKPROPERLY.

The FPCB which connects the mainboard and LCD module

has a problem. Replace the FPCB.

Change the FPCB and try again.

At LCD module

FPCB Check

Reassemble LCD module with LCD connector.

Resolder CN201.

Resolder connector.

Resolder CRC filter.

Replace LCD module.

No

No

No

No

No

Yes

Yes

Yes

Yes

Yes

Yes

Checking Flow

- 65 -

4. Trouble Shooting

4.6 Receiver Trouble

AD6537B

AOUT1P

AOUT1N

MIDI

Closed to Analog SW

47p

C412C411

47p

R407

0

0

R409

4.7

R414

100KR415

C40747p

39pC409

NA

VMEM

R405

R406

NA

47pC410

1V+

COM13

COM29

GND6

4IN1

8IN2

NC15

7NC2

2NO1

10NO2

MAX4684EUBU402

4.7

R416

47pC406

SPK_REC_N

SPK_REC_P

SPKN

SPKP

RECP

RECN

SPK_RCV_SEL

Receiver path

SPK path

Figure 4-18.

Test Points

Circuit Diagram

U401

vibratorSpeaker

Receiver

U402

R414C411

C412R416

Solderingcheck

4. Trouble Shooting

- 66 -

Checking Flow

Waveform

SETTING : After initialize Agilent 8960, Test EGSM, DCS mode

START

Check the signal level of RCVP & RCVN at R414, R416. Are

these voltage is about 1.2V?

Check the signal level at R415. Is it almost 0?

Check the soldering R414 & R416

Re-soldering R414, R416

Check the soldering of U402

Replace the Main board. ABB is out of order.

Re-soldering U402

Replace the dual mode speakerCheck the contact state of dual mode speaker.

The dual mode speaker will work properly.

Replace U402

No

No

No

No

No

Yes

Yes

Yes

Yes

Graph 4-10.

4. Trouble Shooting

- 67 -

4.7 Speaker Trouble

Test Points

Circuit Diagram

Figure 4-19.

Closed to Analog SW

(16 Poly MIDI)

C403 0.1u

47p

VMEM

R403

10K

C412C411

47p

C404

R407

0.01u

0

0

R409

28_WR

4.7

R414

HPOUT_L10

HPOUT_R11

5IFSEL

6 PLLC

32 SDOUT

SPOUT117

SPOUT218

SPVDD 15

16SPVSS

VDD7

VREF9

8 VSS

_CS29

_IRQ3

31_RD

4_RST

30A0

1CLK1

D027

D126

D225

D324

D42322

D521

D620

D7

12EQ1

EQ2 13

14EQ3

EXT1 219EXT2

YMU759B U4010R401

100p

C405

0

R404

R408 3.3K

100KR415

10K

R412

C40747p

39K

R402

VBAT

39pC409

NA

VMEM

R405

R406

NA

47pC410

1V+

150KR417

COM13

COM29

GND6

4IN1

8IN2

NC15

7NC2

2NO1

10NO2

MAX4684EUBU402

4.7

R416

R410 047pC406

1000p

R413

0

C402 0.1u

C401

0.1u

SPK_REC_N

SPK_REC_PC408


ADD00RD

MIDI_CS

WRMIDI_INT


SPKN

SPKP

RECP

RECN

SPK_RCV_SEL

CN201U401

vibratorSpeaker

Solderingcheck

C410C404

R420

R404

C405

Speaker path

receiver path

These five componentsmake up the amplifier andthe filter stage of melody.

[C404 R402 C405 R404 R417]

Analog switch for select audiopath or midi path.

To the speaker at LCDmodule via CN201.

C417

4. Trouble Shooting

- 68 -

Checking Flow

SETTING : Connect PIF to the phone, and Power on. Enter the engineering mode, and set"Melody on" at Buzzer of BB test menu.

START

Voltage across C408= 3.3 V?

Check the soldering of R410

Check the soldering of U402

Check the signal level of R407, R409

The voltage of R415 is ~2.8V

Speaker Working!!

Re-soldering R410

Replace U102( ABB LDO)

Replace U401

Replace U402

Replace speaker

Re-soldering U402

Check the state of contact of dual mode speaker

Yes

Yes

Yes

Yes

Yes

Yes

No

No

No

No

No

No

4. Trouble Shooting

- 69 -

4.8 Mic Trouble

Test Points

Circuit Diagram

CLOSE TO MIC

2.2KR134

R128

100C163

39p

1KR126

OB4-15L42-C33L

MIC101

12

100

R132

VA151

AV

L5M

02-2

00

C19339p

VA152

AV

L5M

02-2

00

39p

C161

10u

TC1512.2KR127

C160

0.1u

C162

39p

VMIC

Figure 4-20.

Solderingcheck

MIC101

R127 R126

C193

R128

R132C160

The signal flow of themicrophone to ABB

- 70 -

4. Trouble Shooting

SETTING : After initialize Agilent 8960, Test EGSM, DCS mode

Figure 4-20.

Checking Flow

START

Voltage across C193= 2.5VDC?

Voltage VMIC of U102 = 2.5VDC?

Resolder R126 & R127.

Replace U102.

Replace the microphone, MIC101.

Resolder C160, R128, R132.

Replace Main board.

MIC Bias Voltage

MIC WILL WORK.

Check the soldering of R110,C160,

R128, R132.

Check the signal levelat each side of MIC101. Is it a

few tens mVAC?

Yes

Yes

Yes

No

No

No

No

- 71 -

4. Trouble Shooting

4.9 Vibrator Trouble

20R223

1SS352D201

47KR224

VBAT

R230 220

R234100K

VBAT

VA204

AV

L14

K02

200

23

64

1

5

Q202

EMZ2 C2734.7u

1.5KR233

MOTOR

VIBRATOR


Test Points

Circuit Diagram

Vibratorblock Soldering Check

in LCD Module

VibratorQ202

L

H

When the vibrator works, thesignal at this point goes H

When the vibrator works, thecurrent flow in this direction.

Current path

From the vibrator at LCDmodule via CN201.

- 72 -

4. Trouble Shooting

START

Is the voltage at pin6 of Q202

near VBAT?

Check the soldering of R223.

Replace Q202.

Resolder R223.

Resolder CN201.

Resolder vibrator.

Check the soldering of R223

Check the soldering of CN301

Check the soldering of vibrator at

LCD module

Replace Vibrator.

VIBRATOR WILLWORK PROPERLY.

Yes

Yes

Yes

Yes

Yes

No

No

No

No

NoResolder R223.

Checking Flow

SETTING : After Initialize Agilent 8960, Test in EGSM, Connect PIF to the phone, and Poweron. Enter The engineering mode, and set ’Vibrator on’ at Vibration of BB testmenu.

- 73 -

4. Trouble Shooting

4.10 Key Backlight LED Trouble

LD118LD111

SP109 SP110

LD115

47R116

LD119

R11347

LD116

SP108

R1174747

R11247

R118 R11947

SP102

LD114LD113

SP105SP104

LD117

SP106

47R115

LD112

47R114

LD120

SP107

R11147 47

R120

SP103 SP111

VBAT

START

Check the U102.

Check the soldering of each R or replace LEDs not working.

BACKLIGHT WILLWORK PROPERLY.

Is the voltage level VBAT3.6-4.2V?

Are all LEDs LD111~LD120t

working?

No

No

Yes

Yes

Test Points

Checking Flow

Circuit Diagram

Figure 4-22.

ToLIGHT3port ofABB

Light3

- 74 -

4.11 Folder on/off Trouble

FOLDER SWITCH

C11110p

R142 51K

VEXT

C112

0.1u GND13

4GND2

NC12

NC25

OUTPUT1

PGND7

6VDD

A3212EEH U103

4. Trouble Shooting

Figure 4-23.

Test Points

Circuit Diagram

U103

C111 R142 C112

The voltage at this pointgoes from 2.8V to 0 V

when the folder is closed.

This component operatewhen a magnet get closehere.

AD6525

- 75 -

4. Trouble Shooting

START

Check the magnet in the folder side.

Place the magnet properly.

Resolder U103.

Resolder R142 & U103.

Replace U103.

Replace U102.

Voltage at Pin 6 of U103 = 2.8V ?

Open Folder.Voltage at Pin 1 of U103

= 2.8V ?


FOLDER WILL WORKPROPERLY.

Close Folder orget close any magnet to U103.

Voltage at Pin 1 of U103= 0V ?

Voltage VEXT1 of U102= 2.8V?

No

No

No

No

No

No

Yes

Yes

Yes

Yes

Yes

Redownload software or change the main board.

Checking Flow

- 76 -

4.12 SIM Detect Trouble

C116

1000p

VSIM

C1170.1u

220n

C115

CLK3

4GND1

GND278

GND39

GND4GND5

106

IORST

2VCC

15

VPP

J101

GCA261-6S

VA165

AV

L14

K02

200

VSIM

SIM_DATA

START

Resolder J101. Replace J101.

Does the SIM supports 3V?

Change the SIM. Our Phone supports 3V SIM only.

Voltage at Pin 1 of J101 = 2.85V?

Check the soldering condition

of J101.

Voltage VSIM of U102.= 2.85V?

Check the contact betweenJ101 and SIM

card.

Change theSIM and try again.


Resolder J101.

Replace J101.

SIM will be DETECTED.

The SIM is malfunctioned. Change the SIM.

Change the main board.

Does it work properly after redownloading SW?

Yes

Yes

Yes

Yes

Yes

No

No

No

No No

No No

4. Trouble Shooting

Test Points

Checking Flow

Circuit Diagram

Figure 4-24.

PIN1

DBB

SETTING : Insert SIM into J101, connect PIF to the Phone, and Power on.

- 77 -

4. Trouble Shooting

4.13 Earphone Trouble

CLOSE TO EARJACK

HEADSET JACKTC153

10u

C179

39p

C12339p

R156 100K

SP11539p

C165

100R148

0.1uC124

VA153

AV

L5M

02-2

00

R158 NA

VMEM

C168

18p

39K

R153

VMEM

46N

O

2VCC

U105

MAX4599EXT-T5C

OM

GND3

1IN

NC

R159

1K

AV

L5M

02-2

00

VA1544.7

R141

NA

R154R137 1K

VMIC

VMEM

R138

2.2K

C167

39p

J102

1

2

34

5

R181 4.7

SP114

HOOK_DET

VMIC_ON

Test Points

Circuit Diagram

J102

R181 C167 R154 R159R153R156

R158C123

AIN2P

AIN2N

AOUT3P

JACK_DET(DBB)

The direction of the audiosignal from the ear-mic

The direction of the audiosignal to the ear-receiver

VMEM VMIC SWITCHINGWhen Jack is activated


- 78 -

START

Insert the earphone to the phone.

Set the audio part of the testequipment to echo mode.

Does the audioprofile of the phone change to

the earphone mode?

Can you hear your vioce fromthe earphone?

EARPHONE WILLWORK PROPERLY.

Change Earphone.

Can you hear your voice fromthe earphone?

Can you hear the sound from

voltage at C139=~1.2V

Check soldering C139,R141,J102

Replace main board

Re-solder C139,R141,J102

Download S/W

Earphone receiving pathproblem

Earphone sending pathproblem

Change the earphone and try again.

Set the audio part of the testequipment to PRBS or continuous wave mode.

Earphone detect problem

Audio path problem

4 3

3

2

1

Yes

Yes

Yes

Yes

Yes

No

No

No

No

No

4. Trouble Shooting

Checking Flow

Earphone receiving path problem

- 79 -

4. Trouble Shooting

4

3

Yes

Yes

Yes

Yes

Yes

No

No

No

No

Earphone sending path problem

Voltage at A point= 1.5~1.9 VDC ?

Is the signal level across C166&7a few tens

or hundreds VAC ?

Does it work well? Redownload software.

Does it work well? Change the main board.

Resolder C166&7.

Resolder R181.

ResolderR153, R159.

Voltage at R150= 2.8V ?

Voltage at Pin1 of U104 = 2.8V ?

Resolder R150.

Resolder R145, R147, R144


Voltage at Pin 3 of U104> Voltage at Pin 4

of U104?

Resolder or replace U104.

5

5

1

4

Yes

Yes

Yes

No

No No


Earphone sending path problem

4.14 Indicator LED Trouble

- 80 -

4. Trouble Shooting

Test Points

Circuit Diagram

Checking Flow

CN201

21 22

RLED

GR225

10KR223 17K

UMX1NTN

4

5

6 12

3

0

0

R261

GREEN LED

R263

RED LED

GLED

RED_LED

Q201R264 NA

R262

0

R226 47K

R22747K

VBAT of U102 is 3.6~4.2V?

Are both LEDs notworking?


Replace Q201, and try again.

Check the VBAT of U102.

Check the soldering or replace LEDs not working.

No

No

Yes

Yes

START

Figure 4-26.

R226 R227 R264 R262

Q201

R225 R229

- 81 -

5. DISASSEMBLY INSTRUCTION

4.15 RTC Trouble

Test Points

Circuit Diagram

Checking Flow

START

Is the voltage level at R123about 1.8V?

Replace X101 and try again.

Check the soldering of R123.


Yes

Yes

No

X101

R123

3

2

X1U1

4

132.768KHz

MC_146

R12310M

DBB

OSCOUT

OSCIN

Figure 4-27.

- 82 -


5.1 Disassembly1. Remove the Battery and Screws as shown below.

Figure 5-1.

Figure 5-2.


- 83 -


Figure 5-3.

- 84 -

Figure 5-4.


- 85 -


Figure 5-5.

Figure 5-6.

- 86 -


Figure 5-7.

Figure 5-8.

3

1

12

- 87 -

Figure 5-9.



- 88 -

Figure 5-10.

Figure 5-11.


- 89 -

Figure 5-12.

32

1

- 90 -

6. DOWNLOAD AND CALIBRATION

6.1 Download

A. Download SetupFigure 6-1 describes Download setup.

Figure 6-1. Download Setup


UART

- 91 -

B. Download Procedure1. Access Flash loader program in PC and select Erase. (Don’t check OWCD)

2. Press Start and Wait until Erase is completed.


1. Select Erase

2. Check

3. Don’t CheckOWCD

1. PressStart and

Wait

- 92 -

3. Change Address and Size(Address : 18000000, Size : 0x800000), and Press Start and Waituntil Erase is completed again.

4. Press Write to start Download and press Key to choose software (AlchemyData.mot)

1. Change Addressand Size

3. Press Start andWait

2. Don’t CheckOWCD

1. Press

2. Press


- 93 -

5. Choose software

6. Wait until converting from MOT to BIF is completed (Don’t check OWCD)

1. Select File

2. Press Open

2. Wait until completion 1. Don’t Check OWCD


- 94 -

7. Press Start and Power on the phone using JIG remote Power on (Switch 1)

8. Wait until Sending Block is completed


- 95 -

9. Press Write to start Download and press Key to choose software (CodeData.mot)

10. Choose software


- 96 -

11. Wait until Sending Block is completed

1. Wait UntilSending Blockis completed


- 97 -

6.2 Calibration

A. Equipment List

Table 6-1. Calibration Equipment List

B. Equipment Setup

Figure 6-2.


Equipment for Calibration Type/Model Brand

Wireless Communication Test Set HP-8960 Agilent

RS-232 Cable and Test JIG LG

RF Cable LG

Power Supply HP-66311B Agilent

GPIB interface card HP-GPIB Agilent

Calibration & Final test software LG

Test SIM Card

PC (for Software Installation) Pentium II class above 300MHz

- 98 -

Figure 6-3. The top view of Test JIG

C. Test Jig Operation

Table 6-2. Jig Power

Table 6-3. Jig DIP Switch

Table 6-4. LED Description


LED Number Name Description

LED 1 Power Power is provided for Test Jig.

LED 2 TA Indicate charging state of the phone battery

LED 3 UART Indicate data transfer state through the UART port

LED 4 MON Indicate data transfer state through the MON port

Power Source Description

Power Supply usually 4.0V

Travel Adaptor Use TA, name is TA-20G (24pin)

Switch Number Name Description

Switch 1 ADI-REMOTE In ON state, phone is awaked. It is used ADI chipset.

Switch 2 TI-REMOTE In ON state, phone is awaked. It is used TI chipset.

Switch 3 VBAT Power is provided for phone from battery

Switch 4 PS Power is provided for phone from Power supply

- 99 -

1. Connect as Fig 6-2 (RS232 serial cable is connected between COM port of PC and MONport of TEST JIG, in general)

2. Set the Power Supply 4.0V

3. Set the 3 rd , 4 th of DIP SW ON state always

4. Press the Phone power key, if the Remote ON is used, 1 st ON state

D. Procedure1. Connect as Fig 6-2 (RS232 serial cable is connected between COM port of PC and MON

port of TEST JIG, in general)

2. Power ON PC then enter into Windows 98 (Remark : Windows 2000 system could befeasible)

3. Run AUTOCAL.exe, the AUTOCAL application window will be appeared.


- 100 -

7. BLOCK DIAGRAM

7. BLOCK DIAGRAM

Speaker &Receiver Motor

LCD Panel128X128

Indicate LED(2 Color)

Connector RTCBackupBattery

Board to BoardConnector

Ear JackLCDConnectorRF

ABB

(AD6537B)

Charging

SIMConnector Flash

Memory

DBB

(AD6525)

YNU763MIDI

Battery IO Connector

- 101 -

8. CIRCUIT DIAGRAM

Sign & Name

1

02/25

CLOSE TO EARJACK

A

Approved

3

JTAG PORT

DRAWING

D

1 2

CHO B.K.

PWR KEY

LG Electronics Inc.

CLOSE TO MIC

7

KIM S. K.

Designer

TP

6

Iss.

C

54

CLOSE TO

Sheet/Sheets

KIM Y. T.

NO.

5

2

1%

D

LGIC(42)-A-5505-10:01

B

C

B

Name

B

Current Sense

NAME2400

Notice No.

10

Data Set Ready

02/25

HEADSET JACK

2004E

8

MODEL

3

GUIDE HOLE

A

AD6537


02/252004

Athena, Typhoon, Audio

REV. 1.0

1/4C1100 (GB-1E)

DRAWING

Section

A

Date

Date

9

For AD6535 & 6537B

PARK S.J.

4

LG Electronics Inc.

FOLDER SWITCH

Checked

0R124

LD118

R105 NA

C111

VBAT

10p

TDI

TDO_0

TDO_1

TMS

VBAT

_F_WE

2.2KR134

JTAG1

GND

JTAGEN

RPWON

TCK

LD111

R142 51K

TC153

10u

VCORE

R128

100

200KR122

C163

D6

G4 5S

39p

TPCF8102

D11D22D33 D4 6

D5 7

8

C116

Q103

1KR126

1000p

C179

39p

OB4-15L42-C33L

MIC101

12

SP109

1u

C181

SP110

VCHARGE VBAT

0.1u

C14049.9R162

0

R163

100KR1651.5K

R157

1KR164

NAR155

VSIM

TP110TP112

LD115

47R116

6

3

1

4

VSIM

Q104

UMX1NTN

2 5

100p

C191

C133

C12339p

10u

0.01u

C199

C144

C182

NA

0.1u

22p

C106

39p

C196

VMIC

R156 100K

39p

C186

C147

22p

SP115

LD119

C183 22p

VBAT

R11347

LD116

SP108

VBAT

VEXT

R150

100

39p

C165

VCORE

VREF

1MR144

100pC171

1u

C157

C178

39p

VS

SR

TC

D3

P14WE

VSIM

R102 100K

VC

C3

K14

C8

VC

C4

A2

VD

DR

TC

VE

XT

1B

14

VE

XT

2B

10C

6V

EX

T3

VE

XT

4D

5

L2

VM

EM

1N

5V

ME

M2

N9

VM

EM

3V

ME

M4

N13

E3

VP

EG

1

VSDIG3H3

VSDOH2

VSFS

VS

IML

9

PWRONB2

RAMCSM14

M11RD

N14RESET

M13ROMCS

SIMCLKK12J13

SIMDATAOP

C14USC0USC1

D12

USC2A14A13

USC3USC4

E11C12

USC5USC6

B13

H1

VC

C1

VC

C2

P7

GPO_9H11

N12HWR

JTAGENK11

KEYPADCOL0C4E4

KEYPADCOL1KEYPADCOL2

B4A4

KEYPADCOL3KEYPADCOL4

C3

KEYPADROW0A6F4

KEYPADROW1KEYPADROW2

D4B5

KEYPADROW3KEYPADROW4

A5

LWRP13

OSCINA3B3

OSCOUT

GPO_16E13G11

GPO_17GPO_18

E12

GPO_19D14

G13GPO_2

D13GPO_20GPO_21

F11

GPO_22A7C5

GPO_23

E1GPO_24

GPO_3G12H12

GPO_4

GPO_5A1C1

GPO_6

GPO_7F14F13

GPO_8

GPIO_21J11

J14GPIO_22GPIO_23

L10K13

GPIO_24

GPIO_3C11

GPIO_32L14

GPIO_4D9

B11GPIO_5

A11GPIO_6

C10GPIO_7

D8GPIO_8GPIO_9

A10

GPO_0B1C2

GPO_1

F12GPO_10GPO_11

E14

GPCS0M12L13

GPCS1

GPIO_0D11D10

GPIO_1

GPIO_10C9C7

GPIO_11B9

GPIO_12GPIO_13

A9B8

GPIO_14GPIO_15

A8

GPIO_16D6B7

GPIO_17

GPIO_18H14H13

GPIO_19

GPIO_2B12

J12GPIO_20

DATA6P8N8

DATA7DATA8

M8P9

DATA9

M5DISPLAYCS

J1G

ND

1

D7

GN

D10

GN

D11

B6

GN

D2

K1

P3

GN

D3

GN

D4

L6

GN

D5

L8

GN

D6

P12

GN

D7

L11

C13

GN

D8

A12

GN

D9

CLKINL12

G14CLKON

CLKOUTD1D2

CLKOUT_GATE

N6DATA0DATA1

P6

M9DATA10DATA11

P10N10

DATA12DATA13

M10

DATA14P11

DATA15N11

DATA2M6N7

DATA3DATA4

M7L7

DATA5

ADD21M4P5

ADD22

J4ADD3ADD4

K3K2

ADD5ADD6

K4

ADD7L4L1

ADD8ADD9

L3

ASDIE2

ASDOF1

ASFSF2

BSDIG2

F3BSDO

G1BSIFS

BSOFSG4

ADD0H4J3

ADD1

L5ADD10

M1ADD11ADD12

M2N1

ADD13ADD14

P1N2

ADD15ADD16

P2

ADD17N3M3

ADD18ADD19

P4

ADD2J2

N4ADD20

TP118

AD6525ACA-REEL

U101

C177

39p

VMEM

330R108

100R148

100

R132

0.1uC124

VBAT

R11747

R146

VEXT

20K

C152

39p

VA153

AV

L5M

02-2

00

47R112

VEXT

47R118

100KR151

R158 NA

VMEM

C1170.1u

VA151

AV

L5M

02-2

00

D101

CUS02

C168

18p

VEXT

TP106

R11947

SP102

39K

R153

10u

C146

A2VCXOEN

A4

VE

XT

1B

4V

EX

T2

T3

VM

EM

1V

ME

M2

T2

R3VMEMSEL

VM

ICN

16

T7VRTC

VS

IMT

6D

16V

VC

XO

C139 4.7u

H16

VA

BB

VB

AT

1N

2

C15

VB

AT

1-1

P2

VB

AT

2

VB

AT

2-1

G15

VB

AT

2-2

H15

R2

VB

AT

3

VB

AT

3-1

A3

VB

AT

3-2

B3

R5

VB

AT

4V

BA

T5

R4

B8VBATSENSE

VBAT_NETT4

VCHGA5

P1

VC

OR

E1

N1

VC

OR

E2

A10REFBB

REFCHGD15

REFOUTB11

T1RESET

RXONK1

SG

ND

1T

8

SG

ND

2R

8

SPWR1R10

SPWR2T10

B2TCK

TDIA1

TDOC1

TEMP1B9A8

TEMP2

TMSB1

K2TXON

B5NC_B5

B7NC_B7

NC_C16C16

NC_E15E15E16

NC_E16

F16NC_F16

G16NC_G16

NC_R1R1

NC_R12R12

R6

NC

_R6

T12NC_T12

NC_T15T15

B12PA

QNA14A15

QP

B15REF

T5GND_NET1

GND_NET2F15

C2GPI

A13IN

INTD1

A12IP

ISENSEA7

KEYONT14T13

KEYOUT

N15

LG

ND

LIGHT1L16M15

LIGHT2LIGHT3

M16

L1MCLK

J2MCLKEN

A16NC_A16

D2ASDO

F2ASFS

ASMJ1 B10

AUXADC1AUXADC2

A9

B6BATTYPE

G2BSDI

E2BSDOBSIFS

F1

BSOFSG1

H2CSDICSDO

H1

CSFSL2

R7DBBON

DG

ND

M2

A6GATEDRIVE

AG

ND

4T

16

AIN1NR16

AIN1PP16R15

AIN2N

P15AIN2P

R13AIN3LAIN3R

R14

K15AOUT1NAOUT1P

J15

T9AOUT2N1

R9AOUT2N2

R11AOUT2P1

T11AOUT2P2AOUT3N

K16J16

AOUT3P

ASDIE1

AG

ND

031

L12 M

5A

GN

D03

2A

GN

D03

3M

6M

7A

GN

D03

4A

GN

D03

5M

10M

11A

GN

D03

6A

GN

D03

7M

12

AGND04E7

E10AGND05AGND06

E11E12

AGND07AGND08

F5F6

AGND09

AG

ND

1B

16A

GN

D2

A11

L15

AG

ND

3

G10

AG

ND

017

AG

ND

018

G11

G12

AG

ND

019

AGND02E5

AG

ND

020

K5

K6

AG

ND

021

K7

AG

ND

022

AG

ND

023

K10

K11

AG

ND

024

AG

ND

025

K12 L5

AG

ND

026

AG

ND

027

L6

L7

AG

ND

028

AG

ND

029

L10

E6AGND03

L11

AG

ND

030

M1ABBRESET

AFCDACB14

B13AGND01

AGND010F7

F10AGND011AGND012

F11F12

AGND013AGND014

G5G6

AGND015AGND016

G7

C193

VMEM

U102

AD6537B

46N

O

2VCC

39p

U105

MAX4599EXT-T5C

OM

GND3

1IN

NC

VA152

AV

L5M

02-2

00

U104

MAX9075EXK-T

2GND

1OUT

VCC

5

3 VIN+

VIN-4

VEXT

C112

VEXT

0.1u

VBAT

R159

1K

C149

39p

R12110K

AV

L5M

02-2

00

VVCXO

VA154

R109NA

C105

22pR101

NA

C154

39p

R161

1K

4.7

R141

C104

0.1u

C188

0.1u

C101

1uF

C102

0.1u

1MR145

0.2R107

C107

0.1u

VBAT

VSIM

LD114

C148

C155

39p

47n

39p

C153

47n

220n

C115

C132

39p

VCHARGE

C161

10u

TC151

NA

R154R137 1K

10u

C135

1uF

LD113

C103

SP105

4.7K

R130

CLK3

4GND1

GND278

GND39

GND4GND5

106

IORST

2VCC

15

VPP

J101

GCA261-6S

C143

1uF

R149

NA

NAC138

R106NA

10u

C131

2.2KR127

NAR152

VCOREVMEM

SP104

VMIC

VMEM

39p

C156

C160

0.1u

330KR147

VRTC

C185

0.068u

LD117

C137

SP106

C136

10u10u

R138

2.2K

TP104

VRTC

GND13

4GND2

NC12

NC25

OUTPUT1

PGND7

6VDD

A3212EEH U103

VA165

AV

L14

K02

200

1

2

KB101

D104 KDS121E

3

C167

39p

TP108

47R115

R104

NA

1uC184

TP114TP115

J102

1

2

34

5

LD112

47R114

C192

100p

LD120

C195

SP107

0.1u

10MR123

0

R103

47n

C108

10u

C187

X101

MC-146

32.768KHz12

3 4

TP105

R11147

C170100p

10u

C134

VSIM

C151

TP101

0.1u

C162

39p

100R125

47R120

SP103

R181 4.7

SP114

VMIC

SP111

VBAT

TP116TP117

HOOK_DET

RED_LEDPRE_CHARGE

SIM_DATA

VMIC_ON

JACK_DET

MIDI_SEL

MIDI_SEL

HOOK_DET

RLEDGLED

WR

ROM_CS2

MIDI_INT

SPK_RCV_SEL

MIDI_RESET

MIDI_CS

ADD00

RECP

SPKN

SPKP

JACK_DET

CLKON

VBACKUP_SEL

TDO_0

TMS TX_RAMP

LCD_ID

VIBRATOR

TCK

TDI

TDO_0

TDO_1TMS

VBAT

LCD_DIM

ABB_INT

CLKON

TDO_1

VBACKUP_SEL

BAT_TEMP

PWR_ONPWR_HOLD

JTAGEN

PWR_ON

AFC

IND_LEDG

QPQN

INIP

RDUBSLBS

ROM_CS1

JTAGEN

VMIC_ON

RECN

KEY_ROW0

PWR_ON

RAM_CSRD

S_CLKS_DATA

PWR_HOLD

S_EN

ANT_SW2

TDI

LCD_CS

PRE_CHARGE

PA_BANDPA_EN

DSR

RF_TEMP

TCK

RESET

ADD21

ADD02

RESET

KEY_ROW4KEY_ROW3KEY_ROW2KEY_ROW1KEY_ROW0

KEY_COL4KEY_COL3KEY_COL2KEY_COL1KEY_COL0

SIM_DATA

ANT_SW1

RF_PWR_DWN

ADD04ADD05ADD06ADD07ADD08ADD09ADD10ADD11ADD12ADD13ADD14ADD15ADD16ADD17ADD18ADD19ADD20

DATA14

DATA03DATA04DATA05DATA06DATA07DATA08DATA09

DATA00

DATA15

DATA01DATA02

13MHZ

RAM_CS

WR

ADD01

ADD22

ADD03

MON_RX

MON_TX

USC0USC1USC2USC3USC4USC5USC6

LCD_RESET

ABB_INT

DATA10DATA11DATA12DATA13

8. CIRCUIT DIAGRAM

- 102 -

NA

6

Type

1

R256

2

3

TX

MENU

5

KIM S. K.

RIGHT

2

CTS

0

RTS

SELECT

4

*

0

Date

C

9

USC2D

NA

NA

-

NAME

DRAWING

10

8

MODEL

UP

LEFT

(128M / 32M)

UART

3

CONFIRM

Date

D

R258 B

4 9

47

0

UART

I/O CONNECTOR

A

USC5

47

R249

DOWN

Name

LG Electronics Inc.

Data Set Ready

-

CHO B.K.

RI(Ring Indicator)

Type

RX

SEND

47

JIG_PWR_ON

1

CLOCK

DAI

RXDUSC1

NA

LG Electronics Inc.

02/25

Iss.

47

NA

R257

USC0

RED LED

TXD

A

6

C

R244

LGIC(42)-A-5505-10:01

USC6

PARK S. J.

Section

R250

DAI

-

7

GREEN LED

R248

Sheet/Sheets

8

Sign & Name

02/25

2

64/32

Checked

RESET

CLR

1

0

Terminal Ground

R246

NO.

KIM Y. T.

USC4

DRAWING

47

NA

B

NA

200402/25 C1100 (GB-1E)

2/4

REV. 1.0

Memory, Key, I/O, LCD Interface

B

2004

NA

128/32

2004

Notice No.

-4

#

DOWN

Designer

5

R253

5

PIN

NA

Approved

A

7

E

UP

LCD BACKLIGHT LED

3

NA

C255

22p

SP205

R265

1K

C219

22p

NAR264

39pC262

C242

22p

SP235

22p

C276

820R204

456789

20212223242526272829

3

30313233341

1011121314151617 18

19

2

NAR248

CN201

EN_SET9

11GND

10IN

2OUT

U203

AAT3123ITP-20-T1

4C1+

C1-3

C2+1

12C2-D1

8

D27

D36

D45

22p

C225C215

22p 22p

KB19

C224

SP230

SP234

R235

123

45

100KSW1

47R249

R245 47

VMEM

VBAT

KB10

C221

22p

R210 820

10K

R221

20R223

KB2

R237100K

R251 47

22p

C240

22p

C227

3456789

SP209

1516171819

2

2021222324

25

26 2728

29CN202

1

1011121314

C258

KB16

1uF

VBAT

C220

VRTC

SP201

22p

R240100K

5

6

3

1

4

NAR257

Q201

UMX1NTN

2

22p

1SS352

C243

D201

47R255

3p

C251

C212

22p

KB17

VA201

AV

L5M

02-2

00

SP228

C223

22p

C244

22p

C233

KB15

22p

VA207

AV

L14

K02

200

C214

22p 22p

C222

47R250

SP224

C216

22p

R213 820

C237

22p

C274

22p

C247

22p

KB5

22p

KB11

C235

22p

C239

KB12

C252

39p

C248

22p

CN2031

680

R243

SP211

C257

SP207

22p

10K

R225

100KR239

100KR236

KB8

47R254

R214

KB14

820

C260

SP206

1uF

820

R212

R202

820

KB20

22p

47R246

C241

47K

22p

C246

R224

0R263

R262

0

VBAT

0

R261

C261

VEXT

1uF

SP208

SP227

22p

C238

SP226

820R205

R226 47K

KB3KB7

820

VMEM

R209

0R258

R230 220

820

VSS1G3

_BYTEH9

J2_CE1PS

_CEF1H2F5

_CEF2

_LBC4

H3_OE

D5_RESET

_UBD4

_WEC6

C5_WP_ACC

R211

NC13L10

NC14M1

NC15M10

NC2B1

NC3B10

NC4C1

NC5F1F6

NC6F9

NC7F10

NC8G1

NC9

RY_BYE5

VCCF1J5G5

VCCF2VCCPS

J6

VSS0J9

DQ15H8

DQ2K4H5

DQ3H6

DQ4K7

DQ5G7

DQ6J8

DQ7K3

DQ8DQ9

H4

K6DU1DU2

G8

NC0A1

NC1A10

NC10G6

G10NC11

L1NC12

A21E9

D2A3

F3A4

E3A5A6

D3

A7C3

A8C7

A9E7

D6CE2PS

DQ0J3

DQ1G4

DQ10J4

DQ11K5J7

DQ12H7

DQ13DQ14

K8

G2A0

F2A1

A10F7

A11C8D8

A12A13

E8

A14F8D9

A15G9

A16F4

A17E4

A18D7

A19

A2E2

E6A20

SP231

TH50VPF5783AASB

U201

C278

39pC267

22p

SW2

123

45

R234

KB18

100K

330

VBAT

AV

L5M

02-2

00R219

SP233

VA202

0R256

820R203

C271

18p

VA203

AVL14K02200

C217

10p

C269

VBAT

22p

VCHARGE

10K

R232

FB1

22p

C213

22p

SP229

1uF

C254

C259

47R247

KB6

VMEM

KB9

680

R242

AVL14K02200

VA206

VA204

AV

L14

K02

200

22p

C231

NAR253

23

64

1

5

Q202

EMZ2

22p

C245

20p

C268

KB21

VA205

AV

L5M

02-2

00

C272

18p

C275

47

22p

1uF

R238

C299

C290

1uF

C298

1uF

22p

C256

R218 330

C236

22p22p

C218

820

SP203

R201

22p

C211 C234

SP212

22p

SP210

R244 NA

0.1u

C203

R241 47

22p

C201

R206 820

1uF

C202

R207 820

820R216

SP232

C226

22p

C2734.7u

820R208

47R252

1.5KR233

C232

22p

SP213

SP204

KB22

R229 47K

KB4

22p

C277

47KR227

KB13

R215 820

KEY_ROW0

KEY_COL2

KEY_ROW1

BAT_TEMP

ROM_CS2ROM_CS1

SPK_REC_NSPK_REC_P

PWR_ON

RLED

GLED

MOTOR

LCD_RESET

LCD_CSMOTOR

ADD06ADD05ADD04

ADD22ADD21

ADD03

ADD20ADD19ADD18ADD17ADD16ADD15ADD14ADD13ADD12ADD11

ADD02ADD01

USC1

USC3

VIBRATOR

WRRD

ADD10ADD09ADD08ADD07

DATA05

DATA07DATA06

DATA04DATA03DATA02DATA01DATA00

ADD01

LBS

RAM_CS

RESET

UBS

KEY_COL0

DSR

USC0

LCD_DIM

KEY_ROW4

DATA00DATA01DATA02DATA03DATA04DATA05DATA06DATA07DATA08DATA09DATA10DATA11DATA12DATA13DATA14DATA15

USC6

MON_TX

RED_LED

KEY_COL1

KEY_COL3KEY_COL4

KEY_ROW2

KEY_ROW3

DATA10DATA09DATA08

DATA11DATA12

DATA15

DATA13DATA14

WR

IND_LEDG

MON_RXUSC2

USC5

USC4

LCD_ID

8. CIRCUIT DIAGRAM

- 103 -

Date

A

B

(1608)

5

Checked

6

Iss. Name

2004

3

GPO_9

NAME

RX

B

D

CHO B.K.

C

E2004

L

GPO_11

DCS_TX

9

C

GPO_19

02/25

GPO_20

4

LG Electronics Inc.4

A

Approved

ANT_SW1

2

02/25RF BOARD TEMPERATURE

DRAWING

LG Electronics Inc.

1

DRAWING

B

Section

L

GPO_17

GPO_16

LGIC(42)-A-5505-10:01

Sign & Name

KIM S. C.

32 5

200402/25 C1100 (GB-1E)

3/4

REV. 1.0

RF(AERO1)

8

GPO_4

1

SEO D. H.

10

GSM_TX

NO.

H

L

GPO_21

7

D

MODEL

AD6535_PA

H

ANT_SW2

Date

L

A

Sheet/Sheets

Designer

AD6535_AFCDAC

Notice No.

33u

RF_PWR_DWN

C301

L3024.7nH

1.2nHL308

R310 0

10uC361

0.5p

C331

FL302

B7820

G1

2

G2

5

IN1 O1

3

O2

4

VRF

150R311

C312

10p

C373100p

6p

C345

C399

22n

22p

VRF

C316

C321

C353

27p

1p

1000pC372

S_CLK

10u

C362

C383

S_EN

27p

0.022uC341

C326

R304

2p

100

0.5pC322

0.01u

C363

22p

C386

C352

1p

C385 10p

L301

8.2nH

10pC382

R306130

R314

C3712.2u

100

21

7GSM_IN

GSM_OUT9

TX_ENABLE 3

VBATT 4

8VCC1

VCC212

10VCC_OUT

6VRAMP

5VREG

BAND_SELECT

DCS_IN 1

11DCS_OUT

GN

D1

13

22G

ND

10

GN

D11

2324G

ND

1225

GN

D13

GN

D14

26

GN

D2

1415G

ND

3

GN

D4

16G

ND

51718

GN

D6

GN

D7

19

GN

D8

20

GN

D9

U302RF3133

2

7.5nHL304

33p

ANT1

C311

130R307

R312150

0.5p

C323

R301 15K

C35622p

VRF

3GND

21

IN5

OUT10KR316

U303MIC5255-2.85BM5

4BYP EN

27nHL303

R319

S_DATA

39p

39p

C343

C389

C342

47p

36

R309

C354

X301

2GND

3OUT

VCC4

1p

C317

27p

13MHz

C325NA

1000pC355

22nH

L307

C350

39p

33nH

L305

R305

47

C344

C384 3.3p

C375

VREF

10p

100p

R317 0

KMS-507 SW301AN

TG

1

G2

RF

1p

VVCXO

C351

14GND7

VC

1

11

VC

2

2

R315

15K

SHS-C090DR

FL3018ANT

1DCS_RX

DCS_TX3

EGSM_RX10

EGSM_TX5

GND14

GND26

GND37

GND49

GND512

GND613

G1

2

G2

5

IN1

3O1

O2

4

VRF

FL303

B7821

33nH

L306

27p

C387

VBAT

R302 100

SC

LK

13S

DI

14

SD

O11

TXIN5

TXIP4

TXQN7

TXQP6

9V

DD

1

32V

DD

2

XE

N26

XIN

8

XO

UT

2710

_PD

N

12_S

EN

33GND5GND6

3435

GND7GND8

36

RFIDN19

RFIDP18

RFIGN21

RFIGP20

RFIPN17

RFIPP16

22R

FO

D23

RF

OG

RXIN32

RXIP

1RXQN

28R

XQ

P

SI4205

U301

DIA

G1

24 25D

IAG

2

GND115

GN

D2

29 30G

ND

3G

ND

431

22p

VRF

VBAT

C302

QP

13MHZ

PA_EN

QN

S_EN

S_CLK

RF_PWR_DWN

CLKON

PA_BAND

13MHZ_MIDI

ANT_SW1

ANT_SW2

IP

IN

TX_RAMP

AFC

S_DATA

RF_TEMP

8. CIRCUIT DIAGRAM

- 104 -

8. CIRCUIT DIAGRAM

0

Type

Date

1

KIM S.K.

DRAWING

16Poly

YMU759B YMU762

7

B

C

2 3

D

E

8

2004 DRAWING

MODEL

9

KIM Y. T.02/25

102

02/25

53 4 6

PARK S.J.

A A

CHO B.K.

Iss.

2004

Closed to Analog SW

Notice No.

Sheet/Sheets

5

B

1

NAME

C

NO.

A

U401

R403 NA

R412 10K

02/252004

MIDI

REV. 1.0

4/4C1100 (GB-1E)

Part

D

Designer

(16 Poly MIDI)

B

4

10K

40Ploy

Sign & Name

Date Name

Section

LG Electronics Inc.

LGIC(42)-A-5505-10:01 LG Electronics Inc.

Checked

Approved

C403 0.1u

47p

VMEM

R403

10K

C412C411

47p

C404

R407

0.01u

0

0

R409

28_WR

4.7

R414

HPOUT_L10

HPOUT_R11

5IFSEL

6 PLLC

32 SDOUT

SPOUT117

SPOUT218

SPVDD 15

16SPVSS

VDD7

VREF9

8 VSS

_CS29

_IRQ3

31_RD

4_RST

30A0

1CLK1

D027

D126

D225

D324

D42322

D521

D620

D7

12EQ1

EQ2 13

14EQ3

EXT1 219EXT2

YMU759B U4010R401

100p

C405

0

R404

R408 3.3K

100KR415

10K

R412

C40747p

39K

R402

VBAT

39pC409

NA

VMEM

R405

R406

NA

47pC410

1V+

150KR417

COM13

COM29

GND6

4IN1

8IN2

NC15

7NC2

2NO1

10NO2

MAX4684EUBU402

4.7

R416

R410 047pC406

1000p

R413

0

C402 0.1u

C401

0.1u

SPK_REC_N

SPK_REC_PC408


ADD00RD

MIDI_CS

WRMIDI_INT


SPKN

SPKP

RECP

RECN

SPK_RCV_SEL

- 105 -

9. PCB LAYOUT

9. PCB LAYOUT

- 106 -

9. PCB LAYOUT

- 107 -

10. ENGINEERING MODE

A. About Engineering ModeEngineering mode is designed to allow a service man/engineer to view and test the basicfunctions provided by a handset.

B. Access CodesThe key sequence for switching the engineering mode on is 2945#*#. Pressing END willswitch back to non-engineering mode operation.

C. Key OperationUse Up and Down key to select a menu and press ‘select’ key to progress the test. Pressing‘back’ key will switch back to the original test menu.

D. Engineering Mode Menu Tree


Engineering

Mode

BB Test RF Test MF ModeTrace

option Call Timer Fact. Reset

S/W

Version

LED

LCD

Backlight

Buzzer

Vibrator

ADC

Battery

Audio

¡ DAI

SAR TestAll Auto Test

Backlight

Buzzer

VibratorLCD

Key padMicSpkTest

All Calls

Reset

UART On

UART OffLED

- 108 -

10.1 BB Test [MENU 1]Baseband Test

10.1.1 LCD• Contrast value : This menu is to test Main LCD contrast.

- Contrast Value [10-50] : Change this value by up and down key.

• Sub LCD Contrast : This menu is to test Sub LCD contrast.

- Contrast Value [0-50] : Change this value by up and down key.

10.1.2 Backlight [1-2]This menu is to test the LCD Backlight and Keypad Backlight.

• Backlight On : LCD Backlight and Keypad Backlight light on at the same time.

• Backlight Off : LCD Backlight and Keypad Backlight light off at the same time.

• Backlight value : This controls brightness of Backlight. When entering into the menu,the present backlight-value in the phone is displayed. Use Left / Rightkey to adjust the level of brightness. The value of the brightness set atlast will be saved in the NVRAM.

10.1.3 Buzzer This menu is to test the melody sound.

• Melody on : Melody sound is played through the speaker.

• Melody off : Melody sound is off.

10.1.4 VibratorThis menu is to test the vibration mode.

• Vibrator On : Vibration mode is on.

• Vibrator Off : Vibration mode is off.

10.1.5 ADC (Analog to Digital Converter)This displays the value of each ADC.

• MVBAT ADC (Main Voltage Battery ADC)

• AUX ADC (Auxiliary ADC)

• TEMPER ADC (Temperature ADC)

10.1.6 BATTERY• Bat Cal :

This displays the value of Battery Calibration. The following menus are displayed in order; BAT_LEV_4V, BAT_LEV_3_LIMIT,BAT_LEV_2_LIMIT, BAT_LEV_1_LIMIT, BAT_IDLE_LI MIT, BAT_INCALL_LIMIT,SHUT_DOWN_VOLTAGE, BAT_RECHARGE_LMT

• TEMP Cal :

This displays the value of Temperature Calibration.The following menus are displayed in order; TEMP_HIGH_LIMIT,TEMP_HIGH_RECHARGE_LMT, TEMP_LOW_RECHARGE_LMT, TEMP_LOW_LIMIT


- 109 -

10.1.7 AudioThis is a menu for setting the control register of Voiceband Baseband Codec chip. Although the actual value can be written over, it returns to default value after switching off andon the phone.

• VbControl1 : VbControl1 bit Register Value Setting






10.1.8 DAI (Digital Audio Interface)This menu is to set the Digital Audio Interface Mode for Speech Transcoder and Acoustictesting.

• DAI AUDIO : DAI audio mode

• DAI UPLINK : Speech encoder test

• DAI DOWNLINK : Speech decoder test

• DAI OFF : DAI mode off

10.2 RF Test [MENU 2]Radio Frequency Test

10.2.1 SAR testThis menu is to test the Specific Absorption Rate.

• SAR Test On : Phone continuously process TX only. Call-setup equipment is notrequired.

• SAR Test Off : TX process off

10.3 MF Mode [MENU 3]This manufacturing mode is designed to do the baseband test automatically. Selecting this menuwill process the test automatically, and phone displays the previous menu after completing thetest.

10.3.1 All auto testLCD, Backlight, Vibrator, Buzzer, Key Pad, Mic&Speaker,

10.3.2 LEDLCD Backlight and LED Backlight are on for about 1.5 seconds at the same time, then off.

10.3.3 BacklightThis menu is to test the volume of Melody. It rings in the following sequence. Volume 1,Volume 2, Volume 3, Volume 0 (mute), Volume 4, Volume 5.

10.3.4 BuzzerVibrator is on for about 1.5 seconds.


- 110 -

10.3.5 VibratorMain LCD screen resolution tests horizontally and vertically one by one and fills the screen.

10.3.6 LCDWhen a pop-up message shows ‘Press Any Key’, you may press any keys including sidekeys, but not [Soft2 Key]. If the key is working properly, name of the key is displayed on thescreen. Test will be completed in 15 seconds automatically.

10.3.7 Key padSub LCD screen resolution tests horizontally one by one and fills the screen.

10.3.8 MicSpkTestThe sound from MIC is recorded for about 3 seconds, then it is replayed on the speakerautomatically

10.4 Trace option [MENU 4]This is NOT a necessary menu to be used by neither engineers nor users.

10.5 Call timer [MENU 5]This menu is to set the Digital Audio Interface Mode for Speech Transcoder and Acoustic testing.

• All calls : This displays total conversation time. User cannot reset this value.

• Reset settings : This resets total conversation time to this, [00:00:00].

• DAI DOWNLINK : Speech decoder test

• DAI OFF : DAI mode off

10.6 Fact. Reset [MENU 6]This Factory Reset menu is to format data block in the flash memory and this procedure set upthe default value in data block.

Attention

- Fact. Reset (i.e. Factory Reset) should be only used during the Manufacturing process.

- Servicemen should NOT progress this menu, otherwise some of valuable data such as Settingvalue, RF Calibration data, etc. cannot be restored again.

10.7 S/W versionThis displays software version stored in the phone.


- 111 -

11. STAND ALONE TEST

11.1 IntroductionThis manual explains how to examine the status of RX and TX of the model.

A. Tx Test

TX test - this is to see if the transmitter of the phones is activating normally.

B. Rx Test

RX test - this is to see if the receiver of the phones is activating normally.

11.2 Setting Method

A. COM port

a. Move your mouse on the “Connect” button, then click the right button of the mouse andselect “Com setting”.

b. In the “Dialog Menu”, select the values as explained below.

- Port : select a correct COM port

- Baudrate : 38400

- Leave the rest as default values

B. Tx

1. Selecting Channel

- Select one of GSM or DCS Band and input appropriate channel.

2. Selecting APC

a. Select either Power level or Scaling Factor.

b. Power level

- Input appropriate value GSM (between 5~19) or DCS (between 0~15)

c. Scaling Factor

- A ‘Ramp Factor’ appears on the screen.

- You may adjust the shape of the Ramp or directly input the values.

C. Rx

1. Selecting Channel

- Select one of GSM or DCS Band and input appropriate channel.

2. Gain Control Index (0~ 26) and RSSI level

- See if the value of RSSI is close to -16dBm when setting the value between 0 ~ 26 inGain Control Index.

- Normal phone should indicate the value of RSSI close to -16dBm.


- 112 -

11.3 HW Test : Software for Standalone Test Setupa. Select a COM port

b. Set the values in Tx or Rx

c. Select band and channel

d. After setting them all above, press connect button.

e. Press the start button

Figure 11-1. HW test program


- 113 -




- 114 -

12. AUTO CALIBRATION

12.1 OverviewAutocal (Auto Calibration) is the PC side Calibration tool that perform Tx ,Rx and BatteryCalibration with Agilent 8960(GSM call setting instrument) and TektronixPS2521G(Programmable power supply).Autocal generate calibration data by communicating with phone and measuring equipmentthen write it into calibration data block of flash memory in GSM phone.

12.2. Requirements- PC or Notebook installed with Microsoft Windows 98/ME/2000/XP

- Auto Calibration program(Autocal.exe)

- GSM Phone

- LGE PIF JIG, Serial Cable, Data Cable

- Agilent 8960(Call Setting Instrument)

- Tektronix PS2521G(Programmable Power Supply)

12.3 Equipment Setup- File(F) Clear View : Clear Calibration Status window texts

- File(F) Save View : Save Calibration Status window texts

- File(F) Save Setting : Save Current Calibration settings to setting file(*.cal)

- File(F) Load Setting : Load saved Calibration setting

- File(F) Make BIN ALL : Make binary file after calibration finished

- File(F) Make BIN BAT.Cal only : Make binary file of battery cal data only after calibrationfinished

- File(F) Make & Write BIN : Make binary file after calibration finished then download itto the Flash Memory

- View(V) Tools : Enable or disable Tool bar

- View(V) Status : Enable or disable status bar

- Connection(C) Connect : Connect the phone with PC. This procedure checkswhether the PC is connected “ag8960 ” or not. After that itperforms sync. procedure with phone. If the sync.procedure is successful state column on status barchanged to SETUP, else you should disconnect phone andtry again from the beginning and also check the wholeconnection. All measurement is performed at state SETUP.

- Connection(C) Port Setting : Show COM port setting dialog and Baudrate you canchange,etc.

- GPIB(G) Connect : Connect the Ag8960 GPIB card with PC.


- 115 -

Figure 12-1. Equipment Setup

Screen Cable loss : Enter the RF cable loss GSM and DCS

Screen GPIB(Primary address) : Enter the SS(Ag8960) and PS(Tektronix PS2521G) GPIBaddress

Screen ADC Channel : Default ADC Calibration Channel

Screen Auto Calibration Item : Default Calibration Settings about Tx, Rx, ADC and writeBIN file


- 116 -

12.4 AGCThis procedure is for Rx calibration.In this procedure, We can get RSSI correction value. Set band EGSM and press Start buttonthe result window will show correction values per every power level and gain code and thesame measure is performed per every frequency.

12.5 APCThis procedure is for Tx calibration.In this procedure you can get proper scale factor value and measured power level.

12.6 ADCThis procedure is for battery calibration.You can get main Battery Config Table and temperature Config Table

12.7 SettingCheck com port and cable loss. Select automatic calibration item. If you uncheck one itemcalibration will stop from the unchecked item. This is useful when you want to process only oneitem.

12.8 How to do calibrationA. Connect cable between phone and serial port of PC.

B. Connect Ag8960 equipment and Power Supply and phone.

C. Set correct port and baud rate.

D. Press Start button. AutoCal process all calibration procedure

i. AGC EGSM

ii. AGC DCS

iii. APC EGSM

iv. APC DCS

v. ADC

E. After finished all measurement. The state is return to SETUP.

F. The Cal file will be generated and then the calibration data will be written into phone andthen will be reset.


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13. EXPLODED VIEW & REPLACEMENT PART LIST


13.1 EXPLODED VIEW

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Note.


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Level Location No. Description Part Number Specification Color Remark1 GSM(FOLDER) TGFF0033001 Silver2 APEY00 PHONE APEY0131001 C1100 ORUSV Silver3 ACGG00 COVER ASSY,FOLDER ACGG0037701 C1100 ORUSV Silver4 ACGH00 COVER ASSY, FOLDER(LOWER) ACGH0020701 C1100 ORUSV Main Window Tape 0.1t Dark Gray5 MCJH00 COVER,FOLDER(LOWER) MCJH0016501 C1300 CGRSV Dark Gray 75 MFBC00 FILTER,SPEAKER MFBC0008101 C1300 CGRSV ELLIPSE 0.1t Black 65 MMAA00 MAGNET,SWITCH MMAA0000601 LG-G510,511,512 common use, DIA : 3.0mm+1.5t Silver 105 MPBF00 PAD,FLEXIBLE PCB MPBF0005601 C1300 CGRSV 26 X 5 X 3.5 t Black 95 MPBG00 PAD,LCD MPBG0021101 C1300 CGRSV 35.6 X 39.3 X 0.7 t Black 85 MTAD00 TAPE,WINDOW MTAD0022201 C1300 CGRSV 0.1 t 54 ACGJ00 COVER ASSY, FOLDER(UPPER) ACGJ0029801 C1100 ORUSV Silver5 MCJJ00 COVER,FOLDER(UPPER) MCJJ0022501 C1100 ORUSV Silver 205 MDAM00 DECO,WINDOW(SUB) MDAM0005001 C1100 ORUSV 0.2t Silver 245 MGAD00 GASKET,SHIELD FORM MGAD0049601 C1300 CGRSV 4 x 8 x 1.5 t Gold 175 MGAD01 GASKET,SHIELD FORM MGAD0049901 C1300 CGRSV 5.2 X 5.2 X 1.8 t Gold 185 MICA00 INSERT,FRONT MICA0001201 LG-G510,511,512 common use, DIA = 1.7mm+2.3t5 MPBZ00 PAD MPBZ0042501 C1300 CGRSV 1.0 t Black 195 MSAZ00 SHEET MSAZ0013401 C1200 TMDBD, Dx=11.3, Dy=7.3, t<0.2mm White 215 MTAA00 TAPE,DECO MTAA0047201 C1100 ORUSV 0.2t 235 MTAB00 TAPE,PROTECTION MTAB0042401 C1300 CGRSV Upper Protection 38 X 68 X 0.07t 265 MTAE00 TAPE,WINDOW(SUB) MTAE0014901 C1100 ORUSV 0.16t 224 ACGK00 COVER ASSY,FRONT ACGK0032501 C1100 ORUSV Silver5 MBHY00 BUMPER MBHY0008401 C1300 CGRSV 4.4 X 1.9 Silver 485 MBHY01 BUMPER MBHY0008501 C1300 CGRSV 4.4 X 1.9, 5.2 PI for MIKE Silver 475 MBJL00 BUTTON,SIDE MBJL0011601 C1300 CGRSV Chrome Plating Silver 445 MCJK00 COVER,FRONT MCJK0023101 C1100 ORUSV Silver 465 MICA00 INSERT,FRONT MICA0006001 G7030,M1.4 x L2.5, Outside Diameter 2.0 Yellow5 MPBZ00 PAD MPBZ0050701 C1300 CGRSV 2.0 X 2.0 X 0.5t Black5 MSGY00 STOPPER MSGY0004901 C1300 CGRSV 8.9 X 2.6 Silver 495 MTAZ00 TAPE MTAZ0036001 C1300 CGRSV 20 X 4 X 0.05t Blue4 AWAB00 WINDOW ASSY,LCD AWAB0009701 C1100 ONLY LG LOGO Silver 45 BFAA00 FILM,INMOLD BFAA0015901 C1100 EUASV Main Window Inmold Film Silver5 MWAC00 WINDOW,LCD MWAC0036601 C1100 ORUSV 1.0t Silver4 GMZZ00 SCREW MACHINE GMZZ0009402 C1300 CGRSV 1.4 mm, 3.0 mm, Head DIA 2.7, 1.2t, STAR Silver4 MCCH00 CAP,SCREW MCCH0021501 C1300 CGRSV 3.1PI Dark Gray 24 MHFD00 HINGE,FOLDER MHFD0005901 Pi5.8, 5Kgf, CAN Type, Prexco(Head R1.0), Click Hinge Deep Silver 414 MIDZ00 INSULATOR MIDZ0041401 C1300 CGRSV 9 X 5.5 X 0.05t Blue 154 MLAC00 LABEL,BARCODE MLAC0003401 EZ LOOKS(user for mechanical)4 MTAB00 TAPE,PROTECTION MTAB0042601 C1300 CGRSV Main Window Protection 41 X 65 X 0.15t 14 MWAD00 WINDOW,LED MWAD0003501 C1100 ORUSV 0.8t Cyber Mirror 253 ACGM00 COVER ASSY,REAR ACGM0029801 C1100 ORUSV Silver4 MCCC00 CAP,EARPHONE JACK MCCC0013501 C1300 CGRSV 6.2PI Silver 324 MCIA00 CONTACT,ANTENNA MCIA0010901 C1300 CGRSV 4.75pi X 3.85h Gold 314 MCJN00 COVER,REAR MCJN0019801 C1100 ORUSV CE0700 carved Silver 334 MGAD00 GASKET,SHIELD FORM MGAD0045801 C1300 CGRSV 11 X 2.8 X 0.4t Gold 354 MGAD01 GASKET,SHIELD FORM MGAD0049001 C1300 CGRSV 6.5 X 2.8 X 0.35t Gold 364 MGAD02 GASKET,SHIELD FORM MGAD0049301 C1100 ORUSV 9 X 2.5 X 0.45t Gold 374 MLEA00 LOCKER,BATTERY MLEA0015201 C1300 CGRSV Silver 304 MPBH00 PAD,MIKE MPBH0007501 C1300 CGRSV 3.2 PI 1.0t Black 344 MSDC00 SPRING,LOCKER MSDC0001901 diameter 5X1.6 294 SNGF00 ANTENNA,GSM,FIXED SNGF0003701 3.0 ,-2 dBd,SILVER ,GSM+DCN,C1100+C1200 283 ADCA00 DOME ASSY,METAL ADCA0017101 C1300 CGRSV D-Dimple 4.9 or 5.0 PI White 403 AKAZ00 KEYPAD ASSY AKAZ0004502 C1100 ORUSV menu EMI Applied Silver 423 GMZZ00 SCREW MACHINE GMZZ0009402 C1300 CGRSV 1.4 mm, 3.0 mm, Head DIA 2.7, 1.2t, STAR Silver 33 MCCF00 CAP,MOBILE SWITCH MCCF0013401 C1300 CGRSV 3 PI, 5.2 PI Silver 273 MLAK00 LABEL,MODEL MLAK0006901

13.2 Replacement Parts<Mechanic component>

Note: This Chapter is used for reference, Part order isordered by SBOM standard on GCSC


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Level Location No. Description Part Number Specification Color Remark4 SACY00 PCB ASSY,FLEXIBLE SACY0017002 145 SACA00 PCB ASSY, FLEXIBLE,AUTO SACA00008016 C1 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP6 C2 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP6 CN1 CONNECTOR,BOARD TO BOARD ENBY0013401 34 PIN,0.4 mm,STRAIGHT ,Au ,B to B G54006 CN2 CONNECTOR,BOARD TO BOARD ENBY0018701 41 PIN,0.3 mm,ETC ,AU ,6 LD1 DIODE,LED,CHIP EDLH0003401 RED, GREEN ,ETC ,R/TP ,SIZE 1315 , GSM DUAL LED6 R1 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP6 R2 RES,CHIP ERHY0000172 68 ohm,1/16W ,F ,1005 ,R/TP6 R3 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP6 R4 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP6 SPCY00 PCB,FLEXIBLE SPCY0032001 POLYI ,45 mm,DOUBLE ,4 SBCL00 BATTERY,CELL,LITHIUM SBCL0001303 2 V,1 mAh,COIN ,SOLDER TYPE BACKUP BATTERY 134 SJMY00 VIBRATOR,MOTOR SJMY0002802 3 V,0.08 A,12*15 ,G5300 VIBRATOR (0.5t PAD) 124 SUSY00 SPEAKER SUSY0006207 ASSY ,8 ohm,92 dB,17 mm,5T 114 SVLY00 LCD SVLY0018801 163 SAFY00 PCB ASSY,MAIN SAFY0097701 C1100 EUASV 384 MLAB LABEL,A/S MLAB0000601 HUMIDITY STICKER4 MLAC00 LABEL,BARCODE MLAC0003301 EZ LOOKS(use for PCB ASSY MAIN(hardware))4 SAFA00 PCB ASSY,MAIN,AUTO SAFA0034201 C1100 ORUSV5 C101 CAP,CERAMIC,CHIP ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP5 C102 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP5 C103 CAP,CERAMIC,CHIP ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP5 C104 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP5 C105 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C106 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C107 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP5 C108 CAP,CERAMIC,CHIP ECCH0000163 47 nF,10V,K,X5R,HD,1005,R/TP5 C111 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP5 C112 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP5 C115 CAP,CERAMIC,CHIP ECCH0001811 220000 pF,10V ,Z ,Y5V ,HD ,1005 ,R/TP5 C116 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP5 C117 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP5 C123 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C124 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP5 C131 CAP,TANTAL,CHIP ECTH0001901 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP5 C132 CAP,CERAMIC,CHIP ECCH0000163 47 nF,10V,K,X5R,HD,1005,R/TP5 C133 CAP,TANTAL,CHIP ECTH0001901 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP5 C134 CAP,TANTAL,CHIP ECTH0001901 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP5 C135 CAP,TANTAL,CHIP ECTH0001901 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP5 C136 CAP,TANTAL,CHIP ECTH0001901 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP5 C137 CAP,TANTAL,CHIP ECTH0001901 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP5 C139 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP5 C140 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP5 C143 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP5 C144 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP5 C146 CAP,TANTAL,CHIP,MAKER ECTZ0002601 10 uF,10V ,M ,STD ,2125 ,R/TP5 C147 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C148 CAP,CERAMIC,CHIP ECCH0000163 47 nF,10V,K,X5R,HD,1005,R/TP5 C149 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C151 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP5 C152 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C153 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C154 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C155 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C156 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C157 CAP,CERAMIC,CHIP ECCH0000276 1 uF,10V,Z,Y5V,HD,1608,R/TP5 C160 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP5 C161 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C162 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C163 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C165 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C167 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C168 CAP,CERAMIC,CHIP ECCH0000113 18 pF,50V,J,NP0,TC,1005,R/TP5 C170 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP5 C171 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP5 C177 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C178 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP

<Main component>


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Level Location No. Description Part Number Specification Color Remark5 C179 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C181 CAP,CERAMIC,CHIP ECCH0000276 1 uF,10V,Z,Y5V,HD,1608,R/TP5 C182 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP5 C183 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C184 CAP,CERAMIC,CHIP ECCH0000276 1 uF,10V,Z,Y5V,HD,1608,R/TP5 C185 CAP,CERAMIC,CHIP ECCH0000165 68 nF,6.3V,K,X5R,HD,1005,R/TP5 C186 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C187 CAP,CERAMIC,CHIP ECCH0003401 10 uF,6.3V ,Z ,Y5V ,HD ,2012 ,R/TP5 C188 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP5 C191 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP5 C192 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP5 C193 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C195 CAP,CERAMIC,CHIP ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP5 C196 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C201 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C202 CAP,CERAMIC,CHIP ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP5 C203 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP5 C211 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C212 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C213 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C214 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C215 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C216 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C217 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C218 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C219 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C220 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C221 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C222 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C223 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C224 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C225 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C226 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C227 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C231 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C232 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C233 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C234 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C235 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C236 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C237 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C238 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C239 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C240 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C241 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C242 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C243 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C244 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C245 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C246 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C247 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C248 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C251 CAP,CERAMIC,CHIP ECCH0000104 3 pF,50V,C,NP0,TC,1005,R/TP5 C252 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C254 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C255 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C256 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C257 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C258 CAP,CERAMIC,CHIP ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP5 C259 CAP,CERAMIC,CHIP ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP5 C260 CAP,CERAMIC,CHIP ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP5 C261 CAP,CERAMIC,CHIP ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP5 C262 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C267 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C268 CAP,CERAMIC,CHIP ECCH0000114 20 pF,50V,J,NP0,TC,1005,R/TP5 C269 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP5 C271 CAP,CERAMIC,CHIP ECCH0000113 18 pF,50V,J,NP0,TC,1005,R/TP5 C272 CAP,CERAMIC,CHIP ECCH0000113 18 pF,50V,J,NP0,TC,1005,R/TP


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Level Location No. Description Part Number Specification Color Remark5 C273 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP5 C274 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C275 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C276 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C277 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C278 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C290 CAP,CERAMIC,CHIP ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP5 C298 CAP,CERAMIC,CHIP ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP5 C299 CAP,CERAMIC,CHIP ECCH0004903 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP5 C301 CAP,TANTAL,CHIP,MAKER ECTZ0000318 33 uF,10V ,M ,L_ESR ,ETC ,R/TP5 C302 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C311 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP5 C312 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP5 C316 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP5 C317 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP5 C321 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C322 CAP,CERAMIC,CHIP ECCH0000101 0.5 pF,50V,C,NP0,TC,1005,R/TP5 C323 CAP,CERAMIC,CHIP ECCH0000101 0.5 pF,50V,C,NP0,TC,1005,R/TP5 C326 CAP,CERAMIC,CHIP ECCH0000176 2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP5 C331 CAP,CERAMIC,CHIP ECCH0000101 0.5 pF,50V,C,NP0,TC,1005,R/TP5 C341 CAP,CERAMIC,CHIP ECCH0000159 22 nF,16V,K,X7R,HD,1005,R/TP5 C342 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C343 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C344 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP5 C345 CAP,CERAMIC,CHIP ECCH0000107 6 pF,50V,D,NP0,TC,1005,R/TP5 C350 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C351 CAP,CERAMIC,CHIP ECCH0000102 1 pF,50V,C,NP0,TC,1005,R/TP5 C352 CAP,CERAMIC,CHIP ECCH0000102 1 pF,50V,C,NP0,TC,1005,R/TP5 C353 CAP,CERAMIC,CHIP ECCH0000102 1 pF,50V,C,NP0,TC,1005,R/TP5 C354 CAP,CERAMIC,CHIP ECCH0000102 1 pF,50V,C,NP0,TC,1005,R/TP5 C355 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP5 C356 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C361 CAP,CERAMIC,CHIP ECCH0003401 10 uF,6.3V ,Z ,Y5V ,HD ,2012 ,R/TP5 C362 CAP,CERAMIC,CHIP ECCH0003401 10 uF,6.3V ,Z ,Y5V ,HD ,2012 ,R/TP5 C363 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP5 C371 CAP,CERAMIC,CHIP ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP5 C372 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP5 C373 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP5 C375 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP5 C382 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP5 C383 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP5 C384 CAP,CERAMIC,CHIP ECCH0000171 3.3 pF,16V ,J ,NP0 ,TC ,1005 ,R/TP5 C385 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP5 C386 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP5 C387 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP5 C389 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP5 C399 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP5 C401 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP5 C402 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP5 C403 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP5 C404 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP5 C405 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP5 C406 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP5 C407 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP5 C408 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP5 C409 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP5 C410 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP5 C411 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP5 C412 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP5 CN201 CONNECTOR,BOARD TO BOARD ENBY0013402 34 PIN,0.4 mm,STRAIGHT ,Au ,B to B G54005 CN202 CONNECTOR,I/O ENRY0002202 24 PIN,0.5 mm,ETC ,AU ,OFFSET TYPE5 D101 DIODE,SWITCHING EDSY0012101 US-FLAT ,30 V,1 A,R/TP ,2.5*1.25*0.6(t)5 D104 DIODE,SWITCHING EDSY0005701 EMT3 ,80 V,4 A,R/TP ,5 D201 DIODE,SWITCHING EDSY0012301 1-1E1A ,85 V,1 A,R/TP ,P=200mW, IFM=200mA5 FB1 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead5 FL301 FILTER,SEPERATOR SFAY0003702 900 ,1800 ,1.3 dB,1.5 dB,30 dB,25 dB,4532 ,Antenna switch5 FL302 FILTER,SAW SFSY0021301 942.5 MHz,2.0*1.4*0.68 ,SMD ,5 FL303 FILTER,SAW SFSY0021302 1842.5 MHz,2.0*1.4*0.68 ,SMD ,


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Level Location No. Description Part Number Specification Color Remark5 J101 CONN,SOCKET ENSY0007607 6 PIN,ETC ,BRIDGE NON PROTECTOR TYPE ,2.54 mm,3.0T5 J102 CONN,JACK/PLUG, EARPHONE ENJE0002301 3,5 PIN,G7000 EAR JACK 3 pole, 5 pin KSD5 L301 INDUCTOR,CHIP ELCH0001004 8.2 nH,J,1005,R/TP5 L302 INDUCTOR,CHIP ELCH0005013 4.7 nH,S ,1005 ,R/TP ,5 L303 INDUCTOR,CHIP ELCH0002715 27 nH,G ,1608 ,R/TP ,coil inductor5 L304 INDUCTOR,CHIP ELCH0002714 7.5 nH,G ,1608 ,R/TP ,coil inductor5 L305 INDUCTOR,CHIP ELCH0005006 33 nH,J ,1005 ,R/TP ,5 L306 INDUCTOR,CHIP ELCH0005006 33 nH,J ,1005 ,R/TP ,5 L307 INDUCTOR,CHIP ELCH0001413 22 nH,J ,1005 ,R/TP ,CDMA5 L308 INDUCTOR,CHIP ELCH0001009 1.2 nH,S ,1005 ,R/TP ,5 LD111 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T5 LD112 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T5 LD113 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T5 LD114 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T5 LD115 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T5 LD116 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T5 LD117 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T5 LD118 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T5 LD119 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T5 LD120 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T5 MTCA00 TERMINAL,GROUND MTCA0001501 C1300 CGRSV 4.7 X 1.8 X 1.3 (0.3t) Sn Plating Silver5 Q103 TR,FET,P-CHANNEL EQFP0004201 2.9*1.9*0.8(t) ,0.7 W,20 V,-6.0 A,R/TP ,NDC652P upgrade(substitution) item5 Q104 TR,BJT,ARRAY EQBA0000406 SC-70 ,0.2 W,R/TP ,CDMA,Common use5 Q201 TR,BJT,ARRAY EQBA0000406 SC-70 ,0.2 W,R/TP ,CDMA,Common use5 Q202 TR,BJT,ARRAY EQBA0002701 EMT6 ,150 mW,R/TP ,NPN, PNP, 150 mA5 R102 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP5 R103 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP5 R107 RES,CHIP ERHY0001102 0.2 ohm,1/4W ,F ,2012 ,R/TP5 R108 RES,CHIP ERHY0000230 330 ohm,1/16W,J,1005,R/TP5 R111 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R112 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R113 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R114 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R115 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R116 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R117 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R118 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R119 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R120 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R121 RES,CHIP ERHY0000125 10K ohm,1/16W,F,1005,R/TP5 R122 RES,CHIP ERHY0000286 200K ohm,1/16W,J,1005,R/TP5 R123 RES,CHIP ERHY0000512 10M ohm,1/16W,J,1608,R/TP5 R124 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP5 R125 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP5 R126 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP5 R127 RES,CHIP ERHY0000247 2.2K ohm,1/16W,J,1005,R/TP5 R128 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP5 R130 RES,CHIP ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP5 R132 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP5 R134 RES,CHIP ERHY0000247 2.2K ohm,1/16W,J,1005,R/TP5 R137 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP5 R138 RES,CHIP ERHY0000247 2.2K ohm,1/16W,J,1005,R/TP5 R141 RES,CHIP ERHY0000202 4.7 ohm,1/16W,J,1005,R/TP5 R142 RES,CHIP ERHY0000274 51K ohm,1/16W,J,1005,R/TP5 R144 RES,CHIP ERHY0000296 1M ohm,1/16W,J,1005,R/TP5 R145 RES,CHIP ERHY0000296 1M ohm,1/16W,J,1005,R/TP5 R146 RES,CHIP ERHY0000265 20K ohm,1/16W,J,1005,R/TP5 R147 RES,CHIP ERHY0000291 330K ohm,1/16W,J,1005,R/TP5 R148 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP5 R150 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP5 R151 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP5 R153 RES,CHIP ERHY0000271 39K ohm,1/16W,J,1005,R/TP5 R156 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP5 R157 RES,CHIP ERHY0000116 1.5K ohm,1/16W,F,1005,R/TP5 R159 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP5 R161 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP5 R162 RES,CHIP ERHY0004101 49.9 ohm,1/10W ,F ,1608 ,R/TP5 R163 RES,CHIP ERHY0000401 0 ohm,1/16W,J,1608,R/TP


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Level Location No. Description Part Number Specification Color Remark5 R164 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP5 R165 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP5 R181 RES,CHIP ERHY0000202 4.7 ohm,1/16W,J,1005,R/TP5 R201 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R202 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R203 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R204 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R205 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R206 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R207 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R208 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R209 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R210 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R211 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R212 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R213 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R214 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R215 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R216 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP5 R218 RES,CHIP ERHY0000230 330 ohm,1/16W,J,1005,R/TP5 R219 RES,CHIP ERHY0000230 330 ohm,1/16W,J,1005,R/TP5 R221 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP5 R223 RES,CHIP ERHY0000207 20 ohm,1/16W,J,1005,R/TP5 R224 RES,CHIP ERHY0000273 47K ohm,1/16W,J,1005,R/TP5 R225 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP5 R226 RES,CHIP ERHY0000273 47K ohm,1/16W,J,1005,R/TP5 R227 RES,CHIP ERHY0000273 47K ohm,1/16W,J,1005,R/TP5 R229 RES,CHIP ERHY0000273 47K ohm,1/16W,J,1005,R/TP5 R230 RES,CHIP ERHY0000226 220 ohm,1/16W,J,1005,R/TP5 R232 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP5 R233 RES,CHIP ERHY0000244 1.5K ohm,1/16W,J,1005,R/TP5 R234 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP5 R235 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP5 R236 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP5 R237 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP5 R238 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R239 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP5 R240 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP5 R241 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R242 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP5 R243 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP5 R245 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R246 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R247 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R249 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R250 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R251 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R252 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R254 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R255 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R256 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP5 R258 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP5 R261 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP5 R262 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP5 R263 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP5 R265 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP5 R301 RES,CHIP ERHY0000263 15K ohm,1/16W,J,1005,R/TP5 R302 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP5 R304 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP5 R305 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP5 R306 RES,CHIP ERHY0004301 130 ohm,1/16W ,J ,1005 ,R/TP5 R307 RES,CHIP ERHY0004301 130 ohm,1/16W ,J ,1005 ,R/TP5 R309 RES,CHIP ERHY0006603 36 ohm,1/16W ,J ,1005 ,R/TP5 R310 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP5 R311 RES,CHIP ERHY0000223 150 ohm,1/16W,J,1005,R/TP5 R312 RES,CHIP ERHY0000223 150 ohm,1/16W,J,1005,R/TP5 R314 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP5 R315 RES,CHIP ERHY0000263 15K ohm,1/16W,J,1005,R/TP


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Level Location No. Description Part Number Specification Color Remark5 R316 RES,CHIP ERHY0000125 10K ohm,1/16W,F,1005,R/TP5 R317 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP5 R319 THERMISTOR SETY0001201 NTC ,22 Kohm,SMD ,1.0*0.5 / NSM4 SERIES5 R401 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP5 R402 RES,CHIP ERHY0000271 39K ohm,1/16W,J,1005,R/TP5 R403 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP5 R404 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP5 R407 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP5 R408 RES,CHIP ERHY0000250 3.3K ohm,1/16W,J,1005,R/TP5 R409 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP5 R410 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP5 R412 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP5 R413 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP5 R414 RES,CHIP ERHY0000202 4.7 ohm,1/16W,J,1005,R/TP5 R415 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP5 R416 RES,CHIP ERHY0000202 4.7 ohm,1/16W,J,1005,R/TP5 R417 RES,CHIP ERHY0000284 150K ohm,1/16W,J,1005,R/TP5 SPFY00 PCB,MAIN SPFY0072101 FR-4 ,1.00 mm,BUILD-UP 8 ,5 SW1 SWITCH,TACT ESCY0002501 12 V,0.05 A,HORIZONTAL ,220 G,G5200 TACK S/W5 SW2 SWITCH,TACT ESCY0002501 12 V,0.05 A,HORIZONTAL ,220 G,G5200 TACK S/W5 SW301 CONN,RF SWITCH ENWY0003001 STRAIGHT ,SMD ,0.6 dB,3.8X3.0X3.6T5 TC151 CAP,TANTAL,CHIP,MAKER ECTZ0005201 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP5 TC153 CAP,TANTAL,CHIP,MAKER ECTZ0005201 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP5 U101 IC EUSY0157001 LFBGA ,160 PIN,R/TP ,DIGITAL BASEBAND PROCESSOR5 U102 IC EUSY0169301 148-TERMINAL BGA ,148 PIN,R/TP ,GSM ANALOG BASEBAND / TYPHOON B5 U103 IC EUSY0129502 LEADLESS CHIP ,6 PIN,R/TP ,HALL-EFFECT SWITCH IC / 2.0*3.0*0.85 U104 IC EUSY0077701 SC70-5 ,5 PIN,R/TP ,5 U105 IC EUSY0077301 SC70-6/SOT23-6 ,6 PIN,R/TP ,5 U201 IC EUSY0145401 P-FBGA73 ,73 PIN,R/TP ,128M FLASH 32M PSRAM / BOTTOM BOOT / CE 2 PCS5 U203 IC EUSY0178201 TSOPJW-12 ,12 PIN,R/TP ,CHARGE PUMP FOR WHITE LED / MAX - 6 LEDS5 U301 IC EUSY0161301 8x8 LGA ,28 PIN,R/TP ,5 U302 PAM SMPY0004001 35 dBm,55 %,2 A,-50 dBc,25 dB,10.0 * 7.0 * 1.4 ,SMD ,5 U303 IC EUSY0118602 SOT-23-5 ,5 PIN,R/TP ,150mA LOW NOISE uCAP CMOS LDO5 U401 IC EUSY0098501 32-PIN QFN ,32 PIN,R/TP ,MA-2 / UP TO 16 VOICES / FM SYNTHESIZER5 U402 IC EUSY0119001 10 uMAX ,10 PIN,R/TP ,DUAL SPDT ANALOG SWITCHES5 VA151 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR5 VA152 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR5 VA153 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR5 VA154 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR5 VA165 VARISTOR SEVY0000702 14 V,10% ,SMD ,5 VA201 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR5 VA202 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR5 VA203 VARISTOR SEVY0000702 14 V,10% ,SMD ,5 VA204 VARISTOR SEVY0000702 14 V,10% ,SMD ,5 VA205 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR5 VA206 VARISTOR SEVY0000702 14 V,10% ,SMD ,5 VA207 VARISTOR SEVY0000702 14 V,10% ,SMD ,5 X101 X-TAL EXXY0015601 .032768 MHz,20 PPM,7 pF,65000 ohm,SMD ,6.9*1.4*1.3 ,5 X301 VCTCXO EXSK0000801 13.0 MHz, PPM,10 pF,SMD ,5.0*3.2*1.5 ,3 SUMY00 MICROPHONE SUMY0003803 PIN ,42 dB,4*1.5 ,FPCB 392 MHBY00 HANDSTRAP MHBY0001101 Neck Strap 380mm Gray


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13.3 Accessory

Level Location No. Description Part Number Specification Color Remark2 SBPL00 BATTERY PACK,LI-ION SBPL0072128 3.7 V,760 mAh,1 CELL,PRISMATIC ,C1100 BATTERY(SV) Silver2 SGEY00 EAR PHONE/EAR MIKE SET SGEY0003203 G4050 G4010 For USA ,3 POLE Design change2 SSAD00 ADAPTOR,AC-DC SSAD0007835 FREE ,50 Hz,5.2 V,800 mA,CE,CB ,UK(IO.24P)

Note: This Chapter is used for reference, Part order isordered by SBOM standard on GCSC

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