Moldflow at PDS

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Moldflow at PDS

CONFIDENTIAL

What is Moldflow?

Moldflow is a simulation software used to determine the

design of a plastic injected part, optimize mold design and

layout, and validate process used for injection molding

Moldflow products help identify areas that are difficult to fill,

where visual defects may occur, and excessive warp in parts.

Moldflow at PDS

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4 Step Process1. Prototype - Fill/Pack/Warp

• Prepare supplied prototype data for Moldflow analysis

• Determine fill points for both sequential and open fill patterns

• Validate part dimensions based on ISO thermal analysis

2. Production Fill Points Establish Gating - Fill/Pack/ISO Warp

• Determine fill points for both hard and soft shot

• Optimize process and/or Implement part changes to improve warp

• Use preliminary manifold to validate sequential filling pattern

• Evaluate part dimensions based on ISO thermal warp (hard shot only)

3. Final Gating & Manifold Validation - Fill/Pack/ISO Warp

• Incorporate final tool design including Manifold, approved gate locations and cold runner

(soft and hard shot)

• Use previously optimized process

• Optimize manifold bores using supplier standards or guide lines if needed

• Optimize process and evaluate part dimensions based on an ISO thermal analysis (hard

shot only)

4. Final Gating Manifold & Cooling Design Validation - Cooling/Fill/Pack/Warp

• Prepare final tooling data for Moldflow analysis

• Incorporate supplied cooling lines (hard shot only)

• Use final optimized process, manifold cold runners and gate locations

• Running additional Iterations to achieve acceptable molding conditions

• Evaluate part dimensions (hard shot only)

Moldflow at PDS

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Moldflow Results

Important Results

Flow:

• Fill Time

• Pressure at V/P Switchover

• Temperature at flow front

• Pressure at Injection Location: XY Plot

• Volumetric shrinkage at ejection

• Time to reach ejection temperature

• Frozen layer fraction

• Air traps

• Clamp force: XY Plot

• Pressure

• Sink marks estimate

• Weld lines

• Cavity Weight

Cool:

• Circuit coolant temperature

• Circuit flow rate

• Circuit Reynolds Number

• Circuit Metal Temperature

• Average temperature, part

• Circuit pressure

• Circuit heat removal efficiency

• Temperature, part

Warp:

• Deflection: All effects

• Deflection: X Component

• Deflection: Y Component

• Deflection: Z Component

Moldflow Simulation

Windage

PDS Moldflow CONFIDENTIAL

Windage Case Study

Windage

• Windage is the process of utilizing the Warp

characteristics from Moldflow to apply reverse

warp to the molded part

• The in mold warp result is corrected for tolerance

considerations

• Areas with high tolerance and excessive warp

can be corrected with this method

Using the Process:

• Windage is applied after all other design

considerations are utilized to reduce warp

• This process is employed in the validation phase if

warp can not be reduced through better gating

• Many large, thin parts require windage to hold

tolerance

Excessive Warp

Moldflow Simulation

Windage

PDS Moldflow CONFIDENTIAL

Windage Case Study

Windage

• Excessive warp was found to be 7.11mm

• Reverse warp is applied to the part design

• The part is rerun in Moldflow with the Windage applied

Moldflow Simulation

Windage

PDS Moldflow CONFIDENTIAL

Windage Case Study

Windage

• The data is reverse engineered to counter act the warp

• Multiple iterations are usually attempted to achieve the best results

• Characteristics change with each situation

Moldflow Simulation

Windage

PDS Moldflow CONFIDENTIAL

Windage Case Study

Windage

• The data is then sent to Moldflow to be verified

• The data can be overlaid with the nominal to ensure part conformity

Moldflow Simulation

Windage

PDS Moldflow CONFIDENTIAL

Windage Case Study

Windage

• Side-by-side comparison of windage result to nominal result show drastic improvement

• The Windage solid brought the maximum deviation down over 6mm, cutting over 85% of calculated warp

Moldflow Simulation

Windage

PDS Moldflow CONFIDENTIAL

Windage Case Study

Windage

Excessive Warp Reverse Engineering

Moldflow Verification New Tool Data

“Reverse Engineering services provide an effective solution to warp reduction. When coupled with Moldflow

Simulation the windage process saves time and money on warp prone parts.”

-Marino Colarossi , President

FEA at PDS

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FEA at PDS

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Displacement Studies

• Force Load application

• Enforced displacement

• Linear and non-linear

analysis

FEA at PDS

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Stress - Strain

&

Material Validation

• Material stress and

ultimate strength

• Plastic Strain and areas

of deformation

• Validation through

situational force

application

• Trial of multiple

materials for each

application

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Motion Solve StudiesFEA at PDS

• Kinematic motion solve

• Assembly design and

mechanical motion

studies

• Clearance and operation

of moving parts

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Loading and UnloadingFEA at PDS

• Loading force studies

• Removal Force studies

• Contact surface and

frictional forces

• Direct and angled

removal/insertion loads

• Multiple component

assembly

• Clip holding forces

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OptimizationFEA at PDS

• Rib design optimization

• Material reduction

• Structural optimization

for specific load cases

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3D Printing at PDS

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3D Printing at PDS Rapid Prototypes

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3D Printing at PDS Material Options

ABS PLA SOFT

• Strong Durable plastic

• Used for functional/

end use printed parts

• Various finishing

techniques

• High Tolerance prints

• Affordable low cost

prints

• Post processing for

visual appeal

• Flexible and durable

• Varying hardness

levels

• Wearables and

functional items