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External Use
TM
Next Generation Kinetis K Series
– K2, and L Series MCUs
APF-IND-T0472
J U N E . 2 0 1 4
Huang David | Kinetis Product Marketing Manager
Lin Ming | Kinetis Product Marketing Manager
Xiong Neo | Kinetis Field Application Engineer
TM
External Use 1
Agenda
• Kinetis Microcontroller Solutions Introduction
• General Purpose Kinetis K Product Lines
− Kinetis K-Series
− Kinetis K2
• General Purpose Kinetis L Product Lines
• Additional Resources − Enablement
− Kinetis Minis support (CSP)
TM
External Use 2
K2 the Next Generation of
Kinetis K Solutions
Leadership in Cortex-M
World’s Broadest, Most Scalable Portfolio…
…with Best-in-Class Tools and Software support!
TM
External Use 3
Kinetis Microcontroller Solutions Introduction
TM
External Use 4
ARM SOC Portfolio’s
1st to
Market with
Cortex M4
1st to
Market with
Cortex M0+
TM
External Use 5
Unbound Scalability from lowest-power to higher performances
Higher Performances up to 180MHz
with FPU – 50% faster than previous
generation with double of RAM memory
Product breadth ARM® Cortex®-M0+ to
M4 with 900+ code compatible product
offerings, 60+ pin for pin compatible
devices that span multiple families
Lowest power to highest
functionality Energy efficient battery
powered products to analog intensive
sensing products.
900+ Products
600 products (M4)
200 products (M0+)
TM
External Use 6
Leadership in Cortex M World’s Broadest, Most Scalable Portfolio
1st to market Cortex-M4
1st to market Cortex-M0+
Cortex M Vendor
900 Freescale - Kinetis
650 ST Micro
250 NXP
250 SiLabs / Energy Micro
280 Atmel
50 Texas Instruments
None Renesas
None Microchip
TM
External Use 7
Kinetis Microcontrollers (Now & in the Future…) World’s Broadest ARM Cortex-M Portfolio
Pe
rfo
rma
nc
e
Integration
Kinetis X Series High-performance ARM
Cortex-M MCU families with
advanced memory and feature
integration for robust,
networked industrial and
consumer systems.
Kinetis L Series Ultra-low power/cost ARM
Cortex-M0+ MCU families
from 48MHz / 8KB with mixed-
signal, connectivity & HMI
features in low pin-count
packages.
Kinetis E Series Robust, 5V ARM Cortex-M0+
& ARM Cortex-M4 MCU
families for use in high
electrical noise environments.
Safety features for high-
reliability applications
Freescale Bundled IDE, RTOS & Middleware - Rapid prototyping Platform - Broad ARM Ecosystem Support
Leading Performance - Low Power - Scalability - Industrial-grade reliability & temp
Kinetis K Series Industry-first ARM Cortex-M4
MCU families from 50MHz /
32KB with low power,
FlexMemory, mixed-signal and
broad connectivity, HMI &
security features.
General Purpose
Segment Focused Kinetis V Series High efficiency, high speed
peripherals ARM Cortex-M0+
& Cortex-M4 MCU families for
use in motor control & power
conversion.
Kinetis W Series Integrated wireless
connectivity ARM Cortex-M4
and M0+ MCU families with
class-leading sub-1 GHz and
2.4 GHz RF transceivers
Kinetis M Series High accuracy metrology ARM
Cortex-M0+ MCU families for
single chip smart meter
implementations.
Availability
NOW!
Availability
NOW!
Availability
NOW!
Availability
NOW!
Sample
NOW!
Sample
NOW!
TM
External Use 8
Kinetis Key Pillars by Family
L E K X W M V
Low Power 5V
Robustness
High
Performance &
Rich
Integration or
Streamline
Integration
Extreme
performance &
integration
Integrated RF
Connectivity
Integrated
metrology
engine
Motor and
Power
Conversion
48MHz Cortex
M0+
Up to 48MHz
Cortex M0+
Up to 180MHz
Cortex M4
Up to 400MHz
Cortex M-next
Up to 50MHz
Cortex M4,
Cortex M0+
Up to 48MHz
Cortex M0+
Up to 200MHz,
Cortex M4,
Cortex M0+
8KB to 512kB
Flash
8KB to 128kB
Flash
32KB to 2MB
Flash
0KB to 16MB
Flash
32KB to
512kB Flash
32KB to
128kB Flash
16KB to 2MB
Flash
Up to 128KB
RAM
Up to 16KB
RAM
Up to 256KB
RAM
Up to 512KB
RAM
Up to 64KB
RAM
Up to 32KB
RAM
Up to 256KB
RAM
Now! Now! Now! TBD Now Now Now
Leading Performance – Low Power – Scalability – Industrial Grade reliability & temp
Freescale Bundled IDE, RTOS & Middleware – Rapid Prototyping Platform – Broad ARM Ecosystem Support
TM
External Use 9
General Purpose Kinetis K Product Lines
TM
External Use 10
Kinetis K Series Kinetis L Series
ARM® Cortex™-M0+ ARM® Cortex™-M4
( with optional SPFPU ) Processor
Typical ~50uA/MHz
( VLPR Mode )
Typical ~130uA/MHz
( VLPR Mode ) Ultra Low Power
8kB – 256kB Flash
1kB – 32kB SRAM
32kB – 2MB Flash
8kB – 256kB SRAM Memory
16 – 121 Pin 32 – 256 Pin Pin-Count
Baseline / Mixed-Signal
and optional
Segment LCD,
USB
Baseline / Mixed-Signal
and optional
FlexMemory, USB,
Segment LCD, CAN,
Ethernet, Graphic LCD,
DRAM-CTRL, NAND-Flash-
CTRL, Crypto, Anti-Tamper
Features
From $0.49
( MKL02x, 8KB, 16QFN )
From $0.79
( MK02, 64KB, 32QFN ) Price
Up to
48MHz
Up to
50 / 72 / 100 / 120 / 150 /
180MHz Performance
www.freescale.com/FREEDOM
www.freescale.com/TOWER Demo Board
www.freescale.com/KINETIS Note: Availability
device dependent
Freescale free
RTOS called MQX www.freescale.com/MQX
including USB /
Ethernet / MS File
System /
Peripherals Driver
MQX-Lite
+USB and Peripherals
Drivers (also within Processor
Expert – Code Generator)
Kinetis E Series
ARM® Cortex™-M0+
Up to
48MHz
8kB – 128kB Flash
1kB – 16kB SRAM
16 – 80 Pin
5V / EMC / Safety (CRC)
Control (Flextimer)
and optional
Segment LCD,
CAN
na
From $0.78
( MKE02x, 16KB, 32LQFP )
Kinetis General Purpose Product Lines
TM
External Use 11
Kinetis K 1st Generation
Key Pillars: • Ultra-Scalable hardware and software compatible ARM Cortex-M4 MCUs
• Exceptional Mixed Signal integration
• Innovative Flex Memory offers EEPROM capability with unprecedented programming speed, low-power and endurance
• Comprehensive Enablement – Freescale MQX RTOS and Eclipse-based CodeWarrior IDE, as well as IAR, KEIL and other ARM ecosystem providers
Key Application Examples: • Applications requiring:
− Rich Mixed-Signal integration
− Broad offer of FlexMemory (EEPROM)
− Rich HMIs (SLCD, GLCD, Touch Sensing)
1st Generation K-Series Families
K10 – Baseline
K30 – SLCD
K40 – SLCD + USB
K60/K61 – Ethernet (optional Tamper)
K70 – Graphics
K20 – USB
K5x – Measurement ( Medical )
• Building Control: Rich HMI Security &
access control
• Factory Automation
• Medical: Heart rate monitors, Blood glucose
monitors
• Metering: Flow meters, SLCD meters
• HMI Rich Point of Sale
• Portable Instrumentation
Kinetis K Series
TM
External Use 12
Kinetis K Series MCU Portfolio
Feature Rich MCUs
Analog Mixed Signal - Up to 4x 16-bit ADCs
-16-bit ADCs w/ PGAs
- AmpOp
-TriAmp
FlexMemory - EEPROM
- Read-While-Write
HMI: -Touch Sensing
- Segment LCD
- Graphic LCD
Next Generation Key Differentiators
Power / Processing Efficiency - Excel in Power Efficiency
- Cortex-M4 w/ FPU >100MHz from
64KB to 2MB of Flash
- Power conscious peripherals
Streamline Feature Set - Smart Integration: right features at
the right price.
- Save BOM cost with Crystal-less
USB device functionality
Introduction of New Tools - Kinetis Software Development
Library (SDK)
-Kinetis Development Studio
- Embed support
- expansion of low-cost Freescale
Freedom development platform
K10 Family
Mixed-Signal
K20 Family
USB
K30 Family
Segment LCD
K40 Family
Segment LCD + USB
K5x Family (Measurement)
Analog, USB, SLCD,
Ethernet, Encryption
K60/K61 Family
Ethernet, USB
K70 Family
+ Graphics LCD
K02 Family
L-Series Bridge
K11/12 Family
Baseline w/ opt. Tamper
K21/K22 Family
USB w/ opt. Tamper
K24F Family
USB + High RAM
K64F Family
Ethernet + USB + High RAM
First Generation Key Differentiators
Ethernet
Graphic Controller
Measurement
Segment LCD
USB
Baseline
Comprehensive Enablement - Hardware and Software Scalability
TM
External Use 13
TM
External Use 14
K2 – The Next Generation of Kinetis Solutions
• Speed application development with a comprehensive set of
new tools built upon the already strong Kinetis Enablement
• A New standard of Cortex M3/M4 power efficiency with an
unbeatable low dynamic power consumption from 100 to
180MHz while delivering 7x lower static power compared
with the closest competitor
• New Lower price points with better enablement,
power/performance efficiency and smart integration. Kinetis K2
starting at $0.79 (10ku RSL) with Cortex-M4, 100MHz, FPU and
64KB of Flash Memory
The next generation of Kinetis solutions builds
on its strong history of scalability and innovation
paired with an even more expansive set of
enablement solutions
TM
External Use 15
K2 - A New High of Cortex M3/M4 power efficiency
with New Lows in Prices
• Second Generation of Kinetis K devices
− A New standard of Cortex M3/M4 power efficiency
• 125uA/MHz in VLPR mode (4MHz)
• 160uA/MHz in Run Compute (100MHz)
• 170uA/MHz in Run
• 2.6uA low power mode with full state retention, wake-up time of 6uS
• 150nA in the Lowest mode
− Full Series of Cost-Effective Devices
− Total of 65 Part Number already in production, 21 more to be launch further in
2014
TM
External Use 16
K2 – Break thought investment in Software Development
• A comprehensive set of new tools built upon the already strong
Kinetis Enablement
− Kinetis Software Development Kit (SDK)
− Kinetis Design Studio (KDS)
− Kinetis Bootloader
− Addition of mbed support to the Kinetis K-Series
− Expansion of ultra-low-cost Freedom Boards for K-Series
• New tools being launched with K2, initially based on the second
generation of K-Series devices as a starting point. Will cover the full
Kinetis Series with updated releases
TM
External Use 17
K2 – The Next Generation of Kinetis Solutions
Key Pillars: • Market’s Most Comprehensive Software Development
• New Heights in Scalability with New Lows in Price
• The Pinnacle in Performance and Power Efficiency
Key Application Examples:
2nd Generation Kinetis K Families
K12 – Baseline MCUs
K64, K66 – Ethernet MCUs
K24 – USBs MCU w/ extended RAM
K63, K65 – Ethernet. w/ Tamper MCUs
K22 – USB MCUs
K21 – USB w/ Tamper MCUs
K11 – Baseline w/Tamper MCUs
Building/Home Control
Security & access control
Factory Automation
Metering
Smart metering
Grid Concentrators
Consumer
Gaming systems / Wearables
Printers / Portable media players
Point of Sale
Remote Sensing
Wireless Nodes
Audio & Video Controllers
K02 – L-Series Bridge Cortex-M4 MCUs
Kinetis K Series
TM
External Use 18
• Next-generation Kinetis K series devices leverage Freescale’s
proven Kinetis L series MCU low-power technology and set a new
height of performance and power efficiency for ARM® Cortex® -
M3/M4-based MCUs, while adding enhanced power-conscious
peripherals.
Leading Performance / Power Efficiency
Highest Performance Efficiency - Half the dynamic power consumption than STM32F103/F105 and STM32F3 - 15% lower dynamic power consumption than STM32F401 and Atmel SAMG
Best-in-Class State for Memory Retention Low Power Modes - From 5 to 50x lower currents than STM32F devices - 3x lower than Atmel SAM5G
10x lower Shelf Mode than STM32F - K2 Deepest low-power mode down to 150nA
TM
External Use 19
• Next-generation Kinetis K series devices add to the existing large
Kinetis MCU portfolio, adding new combinations of memory sizes,
packaging and integration, allowing customers and even broader
selection of products at even lower price points.
Broad Scalability at New Price Points
Lowest-priced ARM® Cortex ®-M4-based device – Next-generation devices start at 100 MHz with floating point unit, 64 KB
Flash at just $.79 (USD)
Streamlined Feature Set – Optimized on-chip integration with BOM-saving features such as
crystal-less USB device functionality
Preserve engineering investment – Broad and fast-growing portfolio of more than 900 Kinetis MCU solutions with
software and hardware compatibility
TM
External Use 20
K Series Roadmap
TM
External Use 21 (1) All excepted 50MHz versions (2) Only 120 or 150MHz versions (3) USB HS on 120 or 150MHz versions
K70
Family
K6x
Family
K5x
Family
K40
Family
K30
Family
K2x
Family
K1x
Family
K10
K11
K12
K20
K21
K22
K24
K30
K40
K50
K51
K52
K53
K60
K61
K63
K64
K65
K66
K70
K0x
Family K02
120-150MHz 1MB
Flash 128KB
RAM
256
Pins FPU
CAN
drive
r
Ethernet
IEEE 1588
USB
FS
w PHY
USB HS
w PHY
Encrypt.
Tamper TFT
driver
SVGA
180MHz 1.25-
2MB
Flash
256KB
RAM
144
Pins FPU
CAN
drive
r
Ethernet
IEEE 1588
USB
FS
w PHY
USB HS
w PHY Encrypt.
LP
UART/TP
M
180MHz 1.25-
2MB
Flash
256KB
RAM
169
Pin
s
FPU CAN
drive
r
Ethernet
IEEE 1588
USB
FS
w PHY
USB HS
w PHY
Encrypt.
Tamper LP
UART/TP
M
120MHz 640KB-
1MB
Flash
192-256KB
RAM
100-144
Pins FPU
CAN
drive
r
Ethernet
IEEE 1588
USB FS
crystal-less Tampe
r
120MHz 1MB
Flash 256KB
RAM
144
Pins FPU
CAN
drive
r
Ethernet
IEEE 1588
120-150MHz 1MB
Flash 128KB
RAM
143-
256
Pins
FPU CAN
drive
r
Ethernet
IEEE 1588
USB
FS
w PHY
USB HS
w PHY
Encryp
t
Tampe
r 100-150MHz
256KB-1MB
Flash 64-128KB
RAM
100-
144
Pins
FPU(2) CAN
drive
r
Ethernet
IEEE 1588
USB
FS
w PHY
USB HS(3)
w PHY Tampe
r
USB FS
crystal-
less
Encrypt.
Tamper
100MHz
512KB
Flash 64-128KB
RAM
144
Pins Analog USB FS
w PHY
Ethernet
driver
LCD driver
320 Segm Tamper
512KB
Flash 128KB
RAM
144
Pins Analog USB FS
w PHY
Ethernet
driver Tamper 100MHz
160-512KB
Flash 32-128KB
RAM
64-
144
Pins
Analog USB FS
w PHY
LCD driver
320 Segm
160-512KB
Flash 32-128KB
RAM
64-
144
Pins
Analog USB FS
w PHY
72-100MHz
72-100MHz
72-100MHz 96-512KB
Flash 32-128KB
RAM 64-144
Pins
LCD driver
320 Segm
USB FS
w PHY
72-100MHz 96-512KB
Flash 32-128KB
RAM
64-144
Pins LCD driver
320 Segm
CAN
driver
120MHz 1MB
Flash 256KB
RAM
100-144
Pins FPU CAN
50-120MHz 192KB-1MB
Flash 32-128KB
RAM
48-
144
Pins
FPU(2) CAN(1) USB FS
w PHY
50-120MHz 192KB-1MB
Flash 32-128KB
RAM
80-144
Pins FPU(2) CAN(1) USB FS
w PHY
50-120MHz 32KB-1MB
Flash 8-128KB
RAM
32-
144
Pins
FPU(2) CAN(1) USB FS
w PHY
USB FS
crystal less Encrypt.
Encrypt.
Tamper
USB HS(3)
w PHY
50MHz 192-512KB
Flash
32-64KB
RAM
48-
121
Pins
50MHz 192-512KB
Flash 32-64KB
RAM
80-
121
Pins
Encrypt.
Tamper
50-120MHz 32KB-1MB
Flash
8-128KB
RAM
32-
144
Pins
FPU(2) CAN(1)
100MHz 64-128KB
Flash
16KB
RAM
32-64
Pins FPU
ARM Cortex-M4 core w DSP features
Multi LP Modes and Peripherals
Low Power Boot, Clock Gating
Direct Memory Access (DMA) Controller
PMC (internal regulator, POR and LVD)
1.71-3.6V, 5V tolerance (1), -40 to 105°C
System
Common Features
90nm TFS Flash
SRAM
Internal Memory Security/Protection
Flash Writte 1.71V
Memory
Up to 4x 16-bit ADC w PGA (1,15µs) (1)
Analog Comparators
Analog Peripherals
UART / SPI / I2C
I2S
Serial Interfaces
Flextimers (GP, PWM, Quad decoder)
Low-Power Timer
Periodic Interrupt Timer (PIT)
Programmable Delay Block (PDB)
Hardware and Software Watchdog
Timers
Main Osc. 32-40KHz / 3-32MHz
RTC (32KHz Osc, Vbat)
MCG (FLL and PLL)
Oscillators
Cyclic Redundancy Check (CRC) module
Security
JTAC, cJTAG, SWD Debug
TPIU, FPB, DWT, ITM Trace
Serial Programming Interface
Program and Test
Kinetis K Series MCU Product Family Features
Kinetis K Series
TM
External Use 22
Pe
rfo
rman
ce
Memory Density 32KB 64KB 128KB 256KB 512KB
50 MHz
72 MHz
100 MHz
120 MHz
150 MHz
Kinetis K Series
Kinetis K Series Portfolio ARM Cortex-M4 solutions for a wide range of embedded applications
180 MHz
Production
Execution
K11D / K21D
K12D / K22D
K11D / K21D
K12D / K22D
K11D / K21D
K12D / K22D
K02F K02F
K22F
K22F
K21F /
K22F
K21F /
K22F
K24F
K64F K63F / K64F
K24F
K65F /
K66F
K65F /
K66F
K12 – Baseline MCUs
K64, K66 – Ethernet MCUs
K24 – USBs MCU w/ extended RAM
K63, K65 – Ethernet. w/ Tamper MCUs
K22 – USB MCUs
K21 – USB w/ Tamper MCUs
K11 – Baseline w/Tamper MCUs
K02 – L-Series Bridge Cortex-M4
2nd Gen Kinetis K-Series Families
K10D / K20D K10D / K20D K10D / K20D
K30D / K40D K30D / K40D K30D / K40D
K10D / K20D K10D / K20D K10D / K20D
K30D / K40D K30D / K40D K30D / K40D
K5xD K5xD
K60D K60D
K10F / K20F K10F / K20F
K60F / K61F K60F / K61F
K70F K70F
K60F / K61F K60F / K61F
K70F K70F
K1x – Baseline
K30 – SLCD
K40 – SLCD + USB
K60/K61–Ethernet w/optional Tamper
K70 – Graphics
K2x – USB
K5x – Measurement ( Medical )
1st Gen Kinetis K-Series Families
TM
External Use 23
K22F Family Extension
• Cost-Effective USB Kinetis Microcontrollers now starting at 64K
Flash up to 512KB with minimum of 100MHz Cortex-M4 and FPU.
Unique Cost Effective MCUs that do not sacrifice performance 100MHz Cortex-M4 MCUs with Floating Point Unit starting at $0.79 @10k/u RSL
Best-In-Class Power Consumption Leverages L-Series Ultra-Low-Power Technology in Kinetis K-Series devices
Smart Integration Reduce BOM & System Cost: USB Crystal-less, Precision Votage Reference, USB Voltage Regulator Low Power Peripherals: LPUART, Asynchronous DMA, LPTimer.
TM
External Use 24
New K22F – 512K/256K Flash – 120MHz - FPU
Debug
Interfaces DSP
Interrupt
Controller
Arm Cortex-M4
120MHz with HS RUN
Internal and
External
Watchdogs
16ch-
ADMA
Low-Leakage
Wake-Up Unit
Program Flash
Up to 512K
SRAM
up to128KB
Serial
Programming
Interface
(EzPort)
Phase-Locked
Loop
Frequency-
Locked Loop
Low/High
Frequency
Oscillators
Internal
Reference
Clocks
Cyclic
Redundancy
Check (CRC)
2 x16-bit
ADC
2 x ACMP
Up to 2 x
12-bit
DAC
FlexTimer
Programmable
Delay Block
Periodic
Interrupt
Timers
Low-Power
Timer
Independent
Real-Time
Clock (RTC)
2xI2C 1xI2S
2xSPI
4xUARTs
GPIO
Core System Memories Clocks
Security
and Integrity
Analog Timers Communication Interfaces HMI
USB OTG
(LS/FS)+
PHY
USB
Voltage
Regulator
FlexBus
External
Bus
Interface
FPU
Standard Feature Optional Feature
Kinetis K Series
32-byte
Register File
Vref
New
Crystal-less
USB device
capability
Key Features: • Core/System
− Cortex-M4 @ 120MHz / FPU • Memory
− up to 512KB Flash, − up to 128KB SRAM − FlexBus (External Bus Interface)
• Communications − USB OTG FS/LS (Crystal-less
Device Operation) − USB Vreg. − Multiple serial ports
• Analog − 2 x16-bit ADC − Up to 2 x12-bit DAC − 2 x ACMP − Voltage Reference
• Timers − up to 2x8ch FTM (PWM) − 2x2ch FTM (PWM/Quad Dec.) − Low Power Timer − RTC with independent Vbat.
supply • Others
− 6 high-drive I/Os (20mA) – SPI/I2C
− 1.71V-3.6V; -40 to 105oC • Packages
64LQFP, 64BGA, 100LQFP, 121BGA
TM
External Use 25
New K22F – 128K Flash – 100MHz - FPU
Debug
Interfaces DSP
Interrupt
Controller
Arm Cortex-M4
100MHz with HS RUN
Internal and
External
Watchdogs
4ch-ADMA
Low-Leakage
Wake-Up Unit
Program Flash
128KB
SRAM
24KB
Serial
Programming
Interface
(EzPort)
Frequency-
Locked Loop
Low/High
Frequency
Oscillators
Internal
Reference
Clocks
Cyclic
Redundancy
Check (CRC)
2 x16-bit
ADC
2 x ACMP
1 x12-bit
DAC
FlexTimer
Programmable
Delay Block
Periodic
Interrupt
Timers
Low-Power
Timer
Independent
Real-Time
Clock (RTC)
2xI2C 1xI2S
2xSPI
4xUARTs
GPIO
Core System Memories Clocks
Security
and Integrity
Analog Timers Communication Interfaces HMI
USB HOST
(LS/FS)+
PHY
FPU
Standard Feature Optional Feature
Kinetis K Series
Vref
New
Crystal-less
USB device
capability
Key Features: • Core/System
− Cortex-M4 @ 100MHz / FPU • Memory
− 128KB Flash, − 24KB SRAM
• Communications − USB OTG FS/LS (Crystal-less
Device Operation) − Multiple serial ports
• Analog − 2 x16-bit ADC − 1 x12-bit DAC − 2 x ACMP − Voltage Reference
• Timers − 1x8ch FTM (PWM) − 2x2ch FTM (PWM/Quad Dec.) − Low Power Timer − RTC with independent Vbat.
supply • Others
− 6 high-drive I/Os (20mA) – SPI/I2C
− 1.71V-3.6V; -40 to 105oC • Packages 64LQFP, 64BGA, 100LQFP,
121BGA
TM
External Use 26
New K02F – 128K/64K Flash – 100MHz - FPU
Debug
Interfaces DSP
Interrupt
Controller
Arm Cortex-M4
100MHz with HS RUN
Internal and
External
Watchdogs
4ch-ADMA
Low-Leakage
Wake-Up Unit
Program Flash
Up to128KB
SRAM
16KB
Serial
Programming
Interface
(EzPort)
Frequency-
Locked Loop
Low/High
Frequency
Oscillators
Internal
Reference
Clocks
Cyclic
Redundancy
Check (CRC)
1 x16-bit
ADC
2 x ACMP
1 x12-bit
DAC
FlexTimer
Programmable
Delay Block
Periodic
Interrupt
Timers
Low-Power
Timer
1xI2C 1xSPI
2xUARTs
GPIO
Core System Memories Clocks
Security
and Integrity
Analog Timers Communication Interfaces HMI
FPU
Standard Feature Optional Feature
Kinetis K Series
Vref
Key Features: • Core/System
− Cortex-M4 @ 100MHz / FPU • Memory
− up to 128KB Flash, − 16KB SRAM
• Communications − Multiple serial ports
• Analog − 16-bit ADC − 12-bit DAC − 2 x ACMP − Voltage Reference
• Timers − 1x6ch FTM (PWM) − 2x2ch FTM (PWM/Quad Dec.) − Low Power Timer − RTC with independent Vbat.
Supply • Others
− 6 high-drive I/Os (20mA) – SPI/I2C
− 1.71V-3.6V; -40 to 105oC • Packages 32QFN, 48LQFP, 64LQFP
TM
External Use 27
More Memory. More Possibilities.
• The Kinetis K portfolio is expanding to include 3 new families: K24,
K63, and K64 with high memory densities, low power, and
optimized integration.
Devices with up to 256KB SRAM and 1MB of Flash
Best in Class for Low Power Applications
‒ Lowest Power Mode Down to 340nA
‒ Full retention low power mode down to 6uA with wake up in 5uS
‒ Run current Down to 250uA/MHz executing from Flash
Cost Optimized with New USB Crystal-less capability!
TM
External Use 28
K24F – K64F – K63F - Market Trends and Applications
• Market Trends Smarter Consumer and Industrial Devices with:
− Increased functionality − Highly connected − More advanced HMIs (for
things like smart thermostats)
− Small form factor
• Applications Consumer Gaming systems Wearables Smart Phone / Tablets
Accessories Metering Connected Meters Smart-Grid Concentrators
Building &Home Automation Connected Security & access
control Smart Thermostats
Point of Sale &Secure Applications Factory Automation Portable Instrumentation
TM
External Use 29
K24F Block Diagram
Debug
Interfaces DSP
Interrupt
Controller Floating Point
Unit (sFPU)
Arm Cortex-M4
Up to 120 MHz
Internal and
External
Watchdogs
Memory
Protection Unit
(MPU)
16-ch DMA
Low-Leakage
Wake-Up Unit
Program Flash
(1MB)
SRAM
(256KB)
External Bus
Interface
(FlexBus)
Serial
Programming
Interface
(EzPort)
Phase-Locked
Loop
Frequency-
Locked Loop
Low/High
Frequency
Oscillators
Internal
Reference
Clocks
Cyclic
Redundancy
Check (CRC)
Up to 2 x16-
bit ADC
3 x ACMP
Up to 2 x
12-bit
DAC
FlexTimer
Programmable
Delay Block
Periodic
Interrupt
Timers
Low-Power
Timer
Independent
Real-Time
Clock (RTC)
3xI2C 1xI2S
3xSPI
1 x USB OTG
(LS/FS) +
PHY
6xUARTs
Secure
Digital Host
Controller
(SDHC)
GPIO
Core System Memories Clocks
Security
and Integrity
Analog Timers Communication Interfaces HMI
USB
Voltage
Regulator Cryptographic
Acceleration
Unit (CAU)
Random
Number
Generator
CAN
Vref
New
Crystal-less
USB device
capability
Key Features: • Core/System
− Cortex-M4 up to 120MHz with FPU • Memory
− 1MB Flash, − 256KB SRAM
• Communications − USB OTG 2.0 FS/LS w/ PHY − USB Vreg up to 120mA − Crystal-less USB device capability − CAN − Multiple serial ports
• Analog − 2x 16-bit ADC − 2 x12-bit DAC − 3 x ACMP
• Timers − 2x8ch FTM (PWM) − 2x2ch FTM (PWM/Quad Dec.) − Low Power Timer − RTC with independent Vbat supply
• Others − 1.71V-3.6V; -40 to 105oC − Up TBD to x I/Os (5V tolerant) − Crypto acceleration
• Orderable Part Number − MK24FN1M0VLL12 - 100LQFP − MK24FN1M0VDC12 - 121XFBGA − MK24FN1M0VLQ12 - 144LQFP
TM
External Use 30
K63F / K64F Block Diagram
Debug
Interfaces DSP
Interrupt
Controller Floating Point
Unit (sFPU)
Arm Cortex-M4
Up to 120 MHz
Internal and
External
Watchdogs
Memory
Protection Unit
(MPU)
16-ch DMA
Low-Leakage
Wake-Up Unit
Program Flash
(Up to 1MB)
SRAM
(256KB)
External Bus
Interface
(FlexBus)
Serial
Programming
Interface
(EzPort)
Phase-Locked
Loop
Frequency-
Locked Loop
Low/High
Frequency
Oscillators
Internal
Reference
Clocks
Cyclic
Redundancy
Check (CRC)
Up to 2 x16-
bit ADC
3 x ACMP
Up to 2 x
12-bit
DAC
FlexTimer
Programmable
Delay Block
Periodic
Interrupt
Timers
Low-Power
Timer
Independent
Real-Time
Clock (RTC)
3xI2C 1xI2S
3xSPI
1 x USB OTG
(LS/FS) +
PHY
6xUARTs
Secure
Digital Host
Controller
(SDHC)
GPIO
Core System Memories Clocks
Security
and Integrity
Analog Timers Communication Interfaces HMI
USB
Voltage
Regulator
Standard Feature Optional Feature
IEEE 1588
Ethernet
MAC DRY ICE
Cryptographic
Acceleration
Unit (CAU)
Random
Number
Generator
Up to 4KB
EEPROM
(Flexmemory)
CAN
Vref
New
Crystal-less
USB device
capability
Key Features: • Core/System
− Cortex-M4 up to 120MHz with FPU • Memory
− up to 1MB Flash, − up to 256KB SRAM − up to 4KB EEPROM (FlexMemory)
• Communications − USB OTG FS/LS w/ PHY and USB
Vreg − Crystal-less USB device
capability − Ethernet w/ IEEE1588 − CAN − Multiple serial ports
• Analog − 2x 16-bit ADC − 2 x 12-bit DAC; 3 x ACMP
• Timers − 2x8ch FTM (PWM) − 2x2ch FTM (PWM/Quad Dec.) − Low Power Timer − RTC with independent Vbat supply
• Others − 1.71V-3.6V; -40 to 105oC − Up TBD to x I/Os (5V tolerant) − Tamper and Crypto acceleration
• Packages: 100 LQFP, 121 MAPBGA, 144LQFP, 144BGA
TM
External Use 31
Outstanding Power Consumption
Run current down to 250uA/MHz in VLPR Mode (CPU @ 4MHz - Running from Flash)
Run current down to 260uA/MHz in Run Mode (CPU @ 120MHz – Running from Flash)
Lowest Power Mode with State Retention: 6uA (LLS Mode)
20x better then STM32F427!!!
Lower Power Mode: 340nA (VLLS0)
6x better then STM32F427!!!
RTC power consumption of only 810nA
TM
External Use 32
K66F / K65F Family
• Expanding Memory Integration up to 2MB of Flash, 256KB of RAM
and boosting up maximum frequency to 180MHz Cortex-M4 with
FPU
More Memory and Performance 2M Flash, 256KB RAM,180MHz with 8KB of CPU cache.
Higher Integration Dual USB with HS embedded PHY, Ethernet, Dual CAN, SDHC, TSI and SDRAM controller
Complete Set of Security Features Cryptography Accelerator, True Random Number Generator, Active and passive Tamper pins and Voltage, Temperature and Frequency Tamper detect
TM
External Use 33
K66/K65 180MHz Devices (2MB Flash, 256KB SRAM)
Debug
Interfaces DSP
Interrupt
Controller Floating Point
Unit (sFPU)
Arm Cortex-M4
Up to 180 MHz with HSRUN
Internal and
External
Watchdogs
Memory
Protection Unit
(MPU)
32ch
ADMA
Wake-Up
Unit (More)
Program Flash
(Up to 2MB)
SRAM
(256KB)
External Bus
Interface
(FlexBus)
Serial
Programming
Interface
(EzPort)
Phase-Locked
Loop
Frequency-
Locked Loop
Low/High
Frequency
Oscillators
Internal
Reference
Clocks
Cyclic
Redundancy
Check (CRC)
Random
Number
Generator
Cryptographic
Acceleration
Unit (CAU)
Up to 2 x16-
bit ADC
4 x ACMP
Up to 2 x
12-bit
DAC
FlexTimer
LPTPM
Programmable
Delay Block
Periodic
Interrupt
Timers
Low-Power
Timer
Independent
Real-Time
Clock (RTC)
IEEE 1588
Timer
4xI2C 1xI2S
3xSPI
1 x USB OTG
(LS/FS) +
PHY
5xUARTs
LPUART
Secure
Digital Host
Controller
(SDHC)
GPIO
Core System Memories Clocks
Security
and Integrity
Analog Timers Communication Interfaces HMI
2xCAN
USB
Voltage
Regulator
USB Device
Charger
Detect
IEEE 1588
Ethernet
MAC
1 x USB OTG
(LS/FS/HS) w
PHY
TSI
DRY ICE
Kinetis K Series
Carrier
Modulator
Transmitter
SDRAM
Controller 8KB I/D Cache
New
Crystal-less
USB device
capability
Key Features: • Core/System
− Cortex-M4 @ 180 MHz with 8KB I-Cache and FPU
• Memory − up to 2MB Flash, − up to 256KB SRAM
• Communications − USB OTG FS/LS w/ PHY and USB
Vreg. − USB OTG LS/FS/HS w/PHY − Crystal-less USB device
capability − Ethernet − Multiple serial ports including dual
CAN • Analog
− 4 x ACMP, − 2x 16-bit ADC, Up to 2 x 12-bit
DAC − Analog Vref
• Others − 1.71V-3.6V; -40 to 105oC − up to 105 x I/Os (3V) − Tamper and Crypto acceleration − 144LQFP, 144BGA, 169MBGA
169WCSP • Availability
− Samples: 1Q2014 − Qual/Production: early 3Q2014
TM
External Use 34
‘K2’ Products Availability
K66/K65 – 2MB,1.25MB - 180MHz: Sampling
K64/K63 – 1MB, 640KB – 120MHz: Production Ramp-up
K24 – 1MB – 120MHz: Production Ramp-up
K22/K21 – 1MB, 640KB – 120MHz: Full Production
K11/K12/K21/K22 – 192KB to 512KB – 50MHz: Full Production
New K22F/K02F – 64KB to 512KB -100/120MHz: Sampling
New K22F/K02F – 64KB to 512KB -100/120MHz
MC Partnumber 10k RSL Max. Freq.
Pin Count Package Flash SRAM RTC ADC DMA
USB Vreg PLL Flex.Bus FTMs DAC
MK22FN512VDC12 $3.85 120MHz 121 XFBGA 512K 128KB Yes 2x16-bit 16-ch Yes Yes Yes 2x8ch; 2x2ch 2
MK22FN512VLL12 $3.79 120MHz 100 LQFP 512K 128KB Yes 2x16-bit 16-ch Yes Yes Yes 2x8ch; 2x2ch 2
MK22FN512VLH12 $3.63 120MHz 64 LQFP 512K 128KB Yes 2x16-bit 16-ch Yes Yes Yes 2x8ch; 2x2ch 2
MK22FN256VDC12 $3.08 120MHz 121 XFBGA 256K 48KB Yes 2x16-bit 16-ch Yes Yes No 1x8ch; 2x2ch 1
MK22FN256VLL12 $3.02 120MHz 100 LQFP 256K 48KB Yes 2x16-bit 16-ch Yes Yes No 1x8ch; 2x2ch 1
MK22FN256VMP12 $3.08 120MHz 64 BGA 256K 48KB Yes 2x16-bit 16-ch Yes Yes No 1x8ch; 2x2ch 1
MK22FN256VLH12 $2.86 120MHz 64 LQFP 256K 48KB Yes 2x16-bit 16-ch Yes Yes No 1x8ch; 2x2ch 1
MK22FN128VDC10 $2.63 100MHz 121 XFBGA 128K 24KB Yes 2x16-bit 4-ch No No No 1x8ch; 2x2ch 1
MK22FN128VLL10 $2.57 100MHz 100 LQFP 128K 24KB Yes 2x16-bit 4-ch No No No 1x8ch; 2x2ch 1
MK22FN128VMP10 $2.63 100MHz 64 BGA 128K 24KB Yes 2x16-bit 4-ch No No No 1x8ch; 2x2ch 1
MK22FN128VLH10 $2.41 100MHz 64 LQFP 128K 24KB Yes 2x16-bit 4-ch No No No 1x8ch; 2x2ch 1
MK02FN128VLH10 $1.68 100MHz 64 LQFP 128K 16KB No 1x16-bit 4-ch No No No 1x6ch; 2x2ch 1
MK02FN128VLF10 $1.55 100MHz 48 LQFP 128K 16KB No 1x16-bit 4-ch No No No 1x6ch; 2x2ch 1
MK02FN128VFM10 $1.49 100MHz 32 QFN 128K 16KB No 1x16-bit 4-ch No No No 1x6ch; 2x2ch 1
MK02FN64VLH10 $1.47 100MHz 64 LQFP 64K 16KB No 1x16-bit 4-ch No No No 1x6ch; 2x2ch 1
MK02FN64VLF10 $1.35 100MHz 48 LQFP 64K 16KB No 1x16-bit 4-ch No No No 1x6ch; 2x2ch 1
MK02FN64VFM10 $0.79 100MHz 32 QFN 64K 16KB No 1x16-bit 4-ch No No No 1x6ch; 2x2ch 1
TM
External Use 35
New K22F/K02F – 64KB to 512KB -100/120MHz:
What is Available Now?!
MCU samples in inventory:
Samples Partnumber
Max. Freq.
Pin Count Package Flash SRAM
PK22FN512VDC12 120MHz 121 XFBGA 512K 128KB
PK22FN512VLL12 120MHz 100 LQFP 512K 128KB
PK22FN512VLH12 120MHz 64 LQFP 512K 128KB
PK22FN256VDC12 120MHz 121 XFBGA 256K 48KB
PK22FN256VMP12 120MHz 64 BGA 256K 48KB
Tower Boards: X-TWR-K22F120M
with User Manual
Design files (schematic, BOM,…)
IDE Support:
IAR 7.10.1
Keil
Sample Code
With Quick Start Guide
MQX support - release 4.1
NDA Documentation
Customer Presentation
Product Brief
Preliminary Datasheet’s
Preliminary Reference Manual
Preliminary Errata
http://compass.freescale.net/go/K22F_Alpha
MCU offer update in the KPUR
including 10ku/y pricing
volume quotes contact Tactical Marketing
or Business Development Team.
Questions: [email protected]
TM
External Use 36
Kinetis New K22F/K02 Microcontrollers Availability
Schedule
K22FN512Vxx12 K22FN256Vxx12 K22FN128Vxx10 K02FN128Vxx10
K02FN64Vxx10
Development
Samples *1
121 XFBGA- Now
100LQFP - Now
64LQFP - Now
121 XFBGA- Now NA NA
Final Mask PK
Units *1
121XFBGA – April
64LQFP – May 100LQFP – TBD *3
121XFBGA – May
64LQFP – June 100LQFP – TBD *3
121XFBGA – April
100LQFP – May
64LQFP – May
64LQFP - Jun
48LQFP - TBD*3
32QFN – Jul
Production MK
Units *1 *2
121XFBGA - June
64LQFP – July 100LQFP – TBD *3
121XFBGA - July
64LQFP – Aug 100LQFP – TBD *3
121XFBGA – July
100LQFP – July
64LQFP – Aug
64LQFP – Aug
48LQFP - TBD*3
32QFN – Sep
*1: Limited quantity availability
*2: >100 unit orders require 12-14 weeks lead-time. After a quarter expected lead-times of 6-8weeks.
*3: 100LQFP: Availability dependent on demand. Please contact Product Marketing.
Part Number Package Decoder:
xx = DC: 121XFBGA: 8x8mm; 0.5mm height
xx = LL: 100LQFP
xx = LH: 64LQFP
xx = LF: 48LQFP
TM
External Use 37
Conclusion
K2 – The Next Generation of Kinetis Solutions - Extend Kinetis Enablement with further easy-of-use
- Introduce next level of performance, feature, and cost-effective K-Series devices
Kinetis K2 becomes the new Low-Power Reference for ARM
Cortex-M3/4 “beyond 100DMIPS with FPU” for both dynamic
and static modes
‘K2’ priced aggressively for Market Share gain having a 10-20%
discount over K-Series 1st generation
Samples and TWR boards available now, announcement at FTF
and production ramp-up through summer of 2014.
TM
External Use 38
General Purpose Kinetis L Product Lines
TM
External Use 39
Kinetis L Series
• Ultra Low Power, Ultra Small Scale, Super Easy to Use, Leading Scalability and
Integration as an ideal solution for Internet of Things edge nodes
World’s Most Energy Efficient ARM based Microcontroller Architected for power efficiency, the Kinetis L series takes advantage of ARM’s ultra low power Cortex-M0+ processor and features peripherals that help you optimize power consumption. Kinetis L series provide ultra low dynamic consumption, ultra low static consumption, rich low power modes and innovative low power peripherals.
World’s Smallest ARM based Microcontroller Built on Freescale leading technology, Kinetis L series provide rich package options from 8x8mm2 121XFBGA, 10x10mm2 100LQFP all the way down to world’s smallest KL03 20WLCSP with 1.6x2mm2 ultra small scale device.
World’s Leading Scalability and Integration with Super Ease of Use Built on the ARM Cortex-M0+ core, the Kinetis L series simplifies development with an upward migration path to Kinetis K and X series. With a comprehensive enablement bundle including low cost Tower System and Freedom Tools, Kinetis Design Studio IDE, Kinetis Software Development Kit, MQX RTOS and the ARM support ecosystem, development is super simple. Expanding on well-known features of the Kinetis platform with leading scalability, best-in-class integration with rich analog features and low-power connectivity, the Kinetis L series redefines entry-level.
TM
External Use 40
Implications for Entry-Level MCUs
+ -
× ÷
sin log n √ ∫
x
n
Scalable, reusable platforms with
modern software techniques/$
Unique platforms,
MCU dependent/$$$
Broad MCU portfolios,
multi-source
Limited choice,
single source
32-bit MCUs 8/16-bit MCUs
Maximum
Energy efficiency
(CoreMark®/mW)
Ultra-low sleep/
power-down
currents
Connectivity
User Interface
Power
Consumption
Computation
Software/Cost
of Ownership
Scalability
Kinetis L Series
TM
External Use 41
Kinetis L Series MCUs: Enabling Differentiation in Entry-
Level Products
Energy efficiency Class-leading
CoreMark/mW
Scalability and
integration Kinetis L to K Series
MCUs (ARM Cortex-M0+
to Coretex-M4)
Enablement Freescale bundle +
ARM ecosystem
Ultra-low static <1uA
Low cost From <$0.50
Ease of use Freedom Platform,
Processor Expert and
MCU Solution Advisor Kinetis L Series MCUs The evolution of the entry-level MCU
32-bit 8-bit
TM
External Use 42
Kinetis L Series MCUs: Target Applications
Banking Building Control Instrumentation
& Medical
Mass Market Mass Market
Aero Model Joy Sticks
OTP
Shaver
Remote Controller ETC
Electronic Label
GPS Watch
Mouse
Fiber Module
RFID
Smoke Detector Thermostat
Cash Registers
Scale
Energy Efficiency
Kinetis L Series
TM
External Use 43
Benefits of Moving from 8/16-bit Architecture to a 32-bit Architecture Built on the ARM Cortex- M0+ Processor
8/16-bit 32-bit ARM Cortex-M0+
Performance
• Older, slower architectures and technology
• Increased code size/complexity when performing complex
math operations
Performance
• 2x to 40x more than 8/16-bit, 9% more than Cortex-M0
• Fast 32-bit math processing
• Fast single-cycle access to I/O
Energy efficiency
• Low energy efficiency
Energy efficiency
• >2x CoreMark/mA than closest 8/16-bit MCU, +30%/ CM0
Low cost
• 6-35 kgates
• Variable code density
Low cost
• 12-35 kgates
• Excellent code density
Ease of development
• Limited addressable memory
• Simplistic interrupt controllers
• Limited scalability (MHz, flash, features)
• Limited ecosystem support
Ease of development
• Linear 4 GB address space—no need for paging
• Full-featured interrupt controller—simpler s/w architecture
• Huge scalability—h/w and s/w reuse across end products
• Huge ARM ecosystem—off-the-shelf
software/tools/training
• Micro Trace Buffer—lightweight, non-intrusive trace
Freescale and ARM collaborated to develop a revolutionary processor that extends battery life by
improving energy efficiency, enables advanced peripherals and software by increasing processing
performance and reduces system cost by improving code density.
Freescale’s MCU experts helped define key ‘8-bit-like’ processor features including ease of use.
TM
External Use 44
The ARM Cortex-M0+ Processor: No compromise in performance
Shorten run time in low-power applications.
• More than 2x CoreMark/mA performance than
the closest 8/16-bit competitor
• 2-stage pipeline—reduced number of cycles per
instruction (CPI) enables faster branch instruction
and ISR entry, reduced power consumption and
increased performance
• Fast I/O port—single-cycle access to I/O
(2x faster than normal I/O)
– Improves reaction time to external events,
allowing bit-banding and software protocol
emulation
– Implemented as FGPIO on Kinetis L series MCUs
Official data: www.coremark.org
1.77
0.11 0.04
0.93
0.74 0.67
0.54
0.00
0.20
0.40
0.60
0.80
1.00
1.20
1.40
1.60
1.80
2.00
CoreMark/MHz
Kinetis L Series
TM
External Use 45
4,896
6,446
10,206 10,066
5,418
0
2,000
4,000
6,000
8,000
10,000
12,000
Corex-M0+ A (16-bit) B (16-bit) C (8-bit) D (8/16-bit)
CoreMark Code in kB
CoreMark code compiled optimized for
size. Same MCUs as for CoreMark/mA
benchmark.
48cycles*, 48Byte Code Size
8cycles,
8Byte Code Size
1 cycle
2 Byte Code Size
*8051 needs at
least 1cycle per
instruction byte
fetch as they only
have an 8-bit
interface
16-bit Multiplication Example
Kinetis L Series ARM® Cortex™-M0+ : What’s the “+” stand for?
TM
External Use 46
2014 Kinetis L Series Product Roadmap The Best Energy Efficiency, Scalable, Mixed-Signal 32-bit MCUs, Based on ARM®
Cortex-M0+™ with best-in-class Enablement
Kinetis L Series
Memory Density 32KB 64KB 128KB 256KB 512KB 8KB 16KB
Inte
gra
tio
n &
Pe
rfo
rma
nce
KL02
KL17 – w/ 16bit ADC with Vref, Boot ROM, Flex IO, optional I2S, DAC, CRC KL16 – w/ 16bit ADC, DAC, TSI, I2S KL15 – w/ 16bit ADC, DAC, TSI KL14 – General Purpose
KL05 – w/ RTC, DMA, DAC, TSI KL04 – w/ RTC, DMA KL03 – w/ RTC, Vref, Boot ROM KL02 – Entry Level
KL27 – w/ 16bit ADC with Vref, Boot ROM, FlexIO, Crystal-less USB Slave, optional I2S, DAC, CRC KL26 – w/ 16bit ADC, DAC, TSI, I2S KL25 – w/ 16bit ADC, DAC, TSI KL24 – USB
KL36 – w/ 16bit ADC, DAC, TSI, I2S KL34 – SLCD KL33 – w/ 16bit ADC, DAC, I2S, Vref, Boot ROM, FlexIO
KL46 – SLCD + USB w/ 16bit ADC, DAC, TSI, I2S KL43 – w/ 16bit ADC, DAC, I2S, Vref, Boot ROM, FlexIO, Crystal-less USB slave
KL80 – w/ QSPI, 72MHz core KL81 – w/ QSPI, enhanced Security
KL02 KL02
KL03 KL03 KL03
KL04 KL04 KL04
KL05 KL05 KL05
KL17 KL17 KL17 KL17
KL14 KL14
KL15 KL15 KL15
KL16 KL16 KL16 KL16
KL27 KL27 KL27
KL24 KL24
KL25 KL25 KL25
KL26 KL26 KL26 KL26
KL33 KL33 KL33 KL33
KL34
KL36 KL36 KL36
KL43 KL43
KL46 KL46
KL28 KL28
KL28S KL28S
KL28S – USB w/ BlackBox for Connectivity Software Package, Security
KL80
KL81
48 MHz
72 MHz
KL28
KL28 – Crystal-less USB OTG, higher RAM to flash ratio (1:2 or 4), low power UART/SPI/I2C, Security
KL27
Production
Concept
Planning
Execution
TM
External Use 47
2014 Kinetis L Series Availability Roadmap
Market Launch
Kinetis L Series
2014 Q2 Q3 Q4 Q1 Q2 & beyond Q1
KL02
8-32K Flash
KL03
8-32K Flash
KL04
8-32K Flash
KL05
8-32K Flash
KL17
32-64K Flash
KL17
128-256K Flash
KL14
32-64K Flash
KL15
32-128K Flash
KL16
32-256K Flash
KL27
32-64K Flash
KL27
128-256K Flash
KL24
32-64K Flash
KL25
32-128K Flash
KL26
32-256K Flash
KL33
32-64K Flash
KL33
128-256K Flash
KL34
64K Flash
KL36
64-256K Flash
KL43
128-256K Flash
KL46
128-256K Flash
KL28
256-512K Flash
KL28S
256-512K Flash
Production
Concept
Planning
Execution
2015 2012/2013
KL80
128K Flash/QSPI
KL81
128K Flash/QSPI
Inte
gra
tio
n &
Pe
rfo
rma
nce
KL13
32-64K Flash
KL28
128K Flash
TM
External Use 48
Kinetis L Series MCUs Feature Overview
Common Features
System
Cortex-M0+ Core, 48/72 MHz
Multi-Low-Power Modes and
Peripherals, Low-Power Boot,
Clock Gating
1.71-3.6 V, –40 °C to 105 °C [1]
Memory
90 nm TFS Flash, SRAM
Internal Memory
Security/Protection
Analog Peripherals
12/16-bit ADC, 12-bit DAC
High-Speed Comparator
Serial Interfaces
UART (Including 1 LPUART)
SPI, I2C
Timers
Real-Time Clock [2]
16-bit Low-Power TPMs (GP
Timer/PWM)
Low-Power Timers
32-bit Periodic Interrupt Timer
[1] Feature not available on CSP packages
[2] For KL02, use software to support
Optional Features
Family Flash SRAM Pin
Count
Key Features
USB SLCD DMA RTC ADC DAC I2S TSI ROM Vref Security
KL46 128-256 KB 16-32 KB 64-121 OTG Y Y Y 16-bit 12-bit Y Y
KL43 128-256 KB 16-32 KB 48-64 Slave Y Y Y 16-bit 12-bit Y Y Y
KL36 64-256 KB 8-32 KB 64-121 Y Y Y 16-bit 12-bit Y Y
KL34 64 KB 8 KB 64-100 Y Y Y 12-bit
KL33 32-256 KB 4-32 KB 64 Y Y Y 16-bit 12-bit Y Y Y
KL28 256-512 KB 128 KB 64-121 OTG Y Y 16-bit 12-bit Y Y Y Y Y
KL27 32-256 KB 8-32 KB 32-64 Slave Y Y 16-bit 12-bit Y Y Y
KL26 32-256 KB 4-32 KB 32-121 OTG Y Y 16-bit 12-bit Y Y
KL25 32-128 KB 4-16 KB 32-80 OTG Y Y 16-bit 12-bit Y
KL24 32-64 KB 4-8 KB 32-80 OTG Y Y 16-bit 12-bit
KL17 32-256 KB 8-32 KB 32-64 Y Y 16-bit 12-bit Y Y Y
KL16 32-256 KB 4-32 KB 32-64 Y Y 16-bit 12-bit Y Y
KL15 32-128 KB 4-16 KB 32-80 Y Y 16-bit 12-bit Y
KL14 32-64KB 4-8 KB 32-80 Y Y 16-bit 12-bit
KL05 8-32 KB 1-4 KB 24-48 Y Y 12-bit 12-bit Y
KL04 8-32 KB 1-4 KB 24-48 Y Y 12-bit
KL03 8-32 KB 2 KB 16-24 Y 12-bit Y Y
KL02 8-32 KB 1-4 KB 16-32 12-bit
TM
External Use 49
Product Family Flash
Memory
10K #
Suggested
Resale Price
General Market
Availability
Volume
Production
KL46/36/34 64-256 KB $1.71 - $2.73 Now Now
KL43/33 64-256KB $1.77 - $2.69 Q3 ’14 Q3’14
KL28 256-512KB $2.85 - $3.47 Q2’15 Q2’15
KL27/17 128-256KB $0.96 - $2.27 Q3 ’14 Q3’14
KL26/16 32-256 KB $0.96 - $2.29 Now Now
KL25/24 32-128 KB $1.30 - $2.01 Now Now
KL15/14 32-128 KB $0.97 - $1.79 Now Now
KL05/04 8-32 KB $0.62 - $1.03 Now Now
KL03 8-32KB $0.49 - $0.93 Q2’14 Q2’14
KL02 8-32 KB $0.49 - $0.86 Now Now
MK L 46 Z 256 V LL 4 Qualification status
Kinetis
Family
/Sub-Family Cortex-M0+ Flash Size Temp L Series
Package
Speed
Kinetis L Series MCUs Availability Pricing from <$.49 SRP @ 10,000 units
TM
External Use 50
Kinetis KL03
Packages
• 24QFN 4x4x0.65/0.5mm
• 16QFN 3x3x0.65/0.5mm
• 20WLCSP 1.6x2.0x0.56/0.4mm
Features Highlight
• ROM boot loader for easy flash upgrade
• High Speed I2C up to 1Mbps
• Embedded 1.2V voltage reference for ADC
• 35uA/MHz VLPR and 1uA sleep
• (50uA/MHz, 2uA)
Availability
• Sample: Mar’14
• Production: Jul’14
SWD
Interface MTB
Interrupt
Controller
ARM Cortex-M0+
48MHz
BME Program Flash
8-32KB
SRAM
2KB
Low
Frequency
Oscillators
High
Accuracy
Internal
Reference
Clocks
48M/8MHz
Unique ID 7ch 12-bit
SAR ADC
High Speed
Analog
Comparator
Low Power
Timer
RTC
Low Power
UART x1
Core System Memories Clocks
Security
and Integrity
Analog Timers Communication Interfaces HMI
SPI x1
2ch
Timer/PWM
ROM
8KB
Internal
Watchdog 16-Byte
Register File
1KHz LPO
I2C x1 Internal
Voltage
Reference
Wake up
pins only
LLWU
Up to 22
GPIO
with 12
Interrupt
/3 high drive
TM
External Use 51
KL03 New Family Summary
• Packages
− 24QFN, 16QFN, 20WLCSP
• New Features
− ROM with Boot Loader
− 1.2V Internal Voltage Reference
− High Speed I2C
• Availability
− PK samples of all packages available NOW!
− X-FRDM-KL03Z available NOW!
− Market launch and production (24QFN) on 25-July!
TM
External Use 52
Kinetis KL43/33
Packages
• 64LQFP 10x10x1/0.5mm
• 64MAPBGA 5x5x1/0.5mm
Features Highlight
• ROM boot loader for easy flash upgrade
• Crystal-less USB Slave
• High Speed IIC up to 1Mbps
• Embedded 1.2V voltage reference for ADC
• FlexIO module
• 60uA/MHz VLPR and 1.5uA sleep
Availability
• Sample: NOW
• Production: July’14
SWD
Interface MTB
Interrupt
Controller
ARM Cortex-M0+
48MHz
DMA
BME
Low-
Leakage
Wakeup
Program Flash
128-256KB
SRAM
16-32KB
Low & High
Frequency
Oscillators
High
Accuracy
Internal
Reference
Clocks
48M/8MHz
Unique ID 16ch 16-bit
SAR ADC
High Speed
Analog
Comparator
6ch
Timer/PWM
Low Power
Timer
Periodic
Interrupt
Timers
RTC
Low Power
UART x2
UART x1
Core System Memories Clocks
Security
and Integrity
Analog Timers Communication Interfaces HMI
SPI x2
2ch
Timer/PWM
USB FS
Slave
USB Voltage
Regulator
ROM
16KB
Internal
Watchdog
I2S x1
32-Byte
Register File
1KHz LPO
FlexIO I2C x2
12-bit DAC
Internal
Voltage
Reference
KL43 only
Up to 54
GPIOs
with 35
Interrupts
Segment
LCD
8x28/4x32
TM
External Use 53
KL43/33 New Family Summary
• Packages
− 64LQFP, 64MAPBGA
• New Features
− ROM with Boot Loader
− 1.2V Internal Voltage Reference
− High Speed I2C
− Crystal-less USB
− FlexIO
• Availability
− PK samples (64LQFP) available NOW!
− X-FRDM-KL43Z and X-TWR-KL43Z48M available on 25-May!
− Market launch and production (64LQFP) on 1-July!
TM
External Use 54
Kinetis KL27/17
Packages
• 64LQFP 10x10x1/0.5mm
• 64MAPBGA 5x5x1/0.5mm
• 48QFN 7x7x0.65/0.5mm
• 32QFN 5x5x0.65/0.5mm
Features Highlight
• ROM boot loader for easy flash upgrade
• Crystal-less USB Slave
• High Speed IIC up to 1Mbps
• Embedded 1.2V voltage reference for ADC
• FlexIO module
• 60uA/MHz VLPR and 1.5uA sleep
Availability
• Sample: NOW
• Production: July’14
SWD
Interface MTB
Interrupt
Controller
ARM Cortex-M0+
48MHz
DMA
BME
Low-
Leakage
Wakeup
Program Flash
128-256KB
SRAM
32KB
Low & High
Frequency
Oscillators
High
Accuracy
Internal
Reference
Clocks
48M/8MHz
Unique ID 16ch 16-bit
SAR ADC
High Speed
Analog
Comparator
6ch
Timer/PWM
Low Power
Timer
Periodic
Interrupt
Timers
RTC
Low Power
UART x2
UART x1
Core System Memories Clocks
Security
and Integrity
Analog Timers Communication Interfaces HMI
SPI x2
2ch
Timer/PWM
USB FS
Slave
USB Voltage
Regulator
ROM
16KB
Internal
Watchdog
I2S x1
32-Byte
Register File
1KHz LPO
FlexIO I2C x2
12-bit DAC
Internal
Voltage
Reference
KL27 only
Up to 54
GPIOs
with 35
Interrupts
TM
External Use 55
KL27/17 New Family Summary
• Packages
− 64LQFP, 64MAPBGA, 48QFN, 32QFN
• New Features
− ROM with Boot Loader
− 1.2V Internal Voltage Reference
− High Speed I2C
− Crystal-less USB
− FlexIO
• Availability
− PK samples (64LQFP) available NOW!
− X-FRDM-KL43Z and X-TWR-KL43Z48M available on 25-May!
− Market launch and production (64LQFP) on 1-July!
TM
External Use 56
Kinetis KL27/17
Packages
• 64LQFP 10x10x1/0.5mm
• 36XFBGA 3.5x3.5x0.5/0.5mm
• 64MAPBGA 5x5x0.5/0.5mm
• 36WLCSP 2.3x2.3x0.5/0.35mm
• 48QFN 7x7x0.65/0.5mm
• 32QFN 5x5x0.65/0.5mm
Features Highlight
• ROM boot loader for easy flash upgrade
• Crystal-less USB Slave
• High-speed I2C up to 1Mbps
• FlexIO module
• CRC for data correction
• 40uA/MHz in VLPR and 1uA in sleep (with RTC and RAM retention)
• USB connection keep alive in sleep mode
Availability
• Sample: 30-Aug’14 (64LQFP), 18-Sept’14 (36XFBGA)
• Production: 31-Oct’14 (64LQFP), 30-Dec’14 (36XFBGA)
SWD
Interface MTB
Interrupt
Controller
ARM Cortex-M0+
48MHz
DMA
BME
Low-
Leakage
Wakeup
Program Flash
32-64KB
SRAM
8-16KB
Low & High
Frequency
Oscillators
High
Accuracy
Internal
Reference
Clocks
48M/8MHz
Unique ID 16-bit SAR
ADC
High Speed
Analog
Comparator
6ch
Timer/PWM
Low Power
Timer
Periodic
Interrupt
Timers
RTC
Low Power
UART x2
UART x1
Core System Memories Clocks
Security
and Integrity
Analog Timers Communication Interfaces HMI
SPI x2
2ch
Timer/PWM
USB FS
Slave
ROM
16KB
Internal
Watchdog
32-Byte
Register File
1KHz LPO
FlexIO CRC
I2C x2
Internal
Voltage
Reference
KL27 only
Up to 54
GPIOs
all with
Interrupts
TM
External Use 57
Kinetis KL28/28S
Packages
• 121XFBGA 8x8x1/0.65mm
• 100LQFP 14x14x1/0.5mm
• 64MAPBGA 5x5x0.65/0.5mm
• 64LQFP 10x10x1/0.5mm
• WLCSP - TBD
Features Highlight
• 72MHz core speed with large memory size
• ROM boot loader for easy flash upgrade
• Black Box
• Crystal-less USB Slave
• High-speed I2C up to 1Mbps
• Embedded 1.2V voltage reference for ADC
• FlexIO module
• 75uA/MHz run and 4uA sleep
Availability
• Sample: Q4’14
• Production: Q2’15
SWD
Interface MTB
Interrupt
Controller
ARM Cortex-M0+
72MHz
DMA
BME
Low-
Leakage
Wakeup
Program Flash
256-512KB
SRAM
128KB
Low & High
Frequency
Oscillators
High
Accuracy
48M/8MHz
IRC
Unique ID 20ch 16-bit
SAR ADC
High Speed
Analog
Comparator
x2
6ch
Timer/PWM
Low Power
Timer x2
Periodic
Interrupt
Timers
RTC
Low Power
UART x3
Low Power
SPI x3
Core System Memories Clocks
Security
and Integrity
Analog Timers Communication Interfaces HMI
2ch
Timer/PWM
x2
USB FS
OTG
USB Voltage
Regulator
ROM
32KB
Internal
Watchdog
I2S x1
32-Byte
Register File
1KHz LPO
Flash
Access
Controller
CFM/PLL
FlexIO
CRC Low Power
I2C x3
12-bit DAC MMCAU
MPU
TRNG
Black Box
Internal
Voltage
Reference
Up to 98
GPIOs
with
Interrupts
Touch
Sensor
Interface
ISO7816-
EVMSIM
TM
External Use 58
L Series Technical Differentiators
TM
External Use 59
TM
Kinetis L Series MCUs: Low-Power Pillars
Ultra-efficient ARM Cortex-M0+ processor Most energy-efficient 32-bit processor on the market with industry
leading throughput/mA
Ultra-low-power modes Several flexible power modes fit for different application use cases
designed to maximize battery life
Energy-saving architecture Optimized for low power with 90 nm TFS technology, clock and
power gating techniques and a highly efficient platform, featuring a
low-power boot option, bit manipulation engine, peripheral bridge
crossbar and zero wait state flash memory controller
Energy-saving peripherals Smart peripherals with functionality in deep sleep modes can make
intelligent decisions and process data without waking up the core
TM
External Use 60
Kinetis L Series MCUs: Energy Efficiency
• Cortex-M0+ processor
• 90 nm low-power flash technology
• Bit manipulation engine
• <40 uA/MHz, 4.8 CM/mW
• Peripheral bridge crossbar
• Zero wait state Flash memory controller
Ultra-efficient processing
• 90nm low-leakage flash technology
• Multiple run, wait and stop modes
• 4 us wake-up from deep sleep modes
• Clock & power gating, low-power boot options
• 2 uA deep sleep Idd with register retention, LVD active and 4.3 us wake-up
Ultra-low-power modes
• Smart peripherals function in deep sleep modes and can make intelligent decisions and process data without waking up the core—ADMA, UART, timers, ADC, segment LCD, touch sensing...
Energy-saving peripherals
Most Innovative
Process
Technology
Kinetis ARM
Cortex-M4 MCUs
TM
External Use 61
Kinetis L Series MCUs: World’s Most Energy-Efficient MCUs
• Ultra-efficient ARM Cortex-M0+ core
− Very low power run at 40 uA/MHz
• Flexible ultra-low-power modes
− Deep sleep down to 150 nA
• Energy-saving architecture
− DMA, UART, ADC, Timers plus other peripherals functional in deep sleep
15.92
8.84 8.0
2.1 1.9 0
2
4
6
8
10
12
14
16
18 MCU CoreMark/mA
x1.
8
Microchip
PIC24
TI
MSP430 Renesas
RL78 Freescale
KL02
ST Micro
STM8
TM
External Use 62
Ultra-Low-Power Modes
Mode Definition
Run MCU can be run at full speed. Supports Compute Operation clocking option where bus and system clock are disabled for
lowest power core processing and energy-saving peripherals with an alternate asynchronous clock source are operational.
VLP Run (VLPR)
MCU maximum frequency is restricted to 4 MHz core/platform and 1 MHz bus/flash clock. Supports Compute Operation
clocking option. LVD protection is off and flash programming is disallowed.
Wait Allows all peripherals to function, while CPU goes to sleep reducing power consumption. No Compute Operation clocking
option.
VLP Wait (VLPW)
Similar to VLP Run, with CPU in sleep to further reduce power. No Compute Operation clocking option.
Stop
MCU is in static state with LVD protection on. Energy-saving peripherals are operational with Asynchronous DMA (ADMA)
feature that can wake-up DMA to perform transfer and return to current mode when complete. AWIC detects wake-up
source for CPU. Lowest power mode with option to keep PLL active. Partial stop clocking options for more peripheral
functionality available.
VLP Stop (VLPS)
MCU is in static state with LVD protection off. Energy-saving peripherals are operational with ADMA feature. AWIC detects
wake-up source for CPU.
LL Stop (LLS)
MCU is in low leakage state retention power mode. LLWU detects wake-up source for CPU including LPTMR, RTC, TSI,
CMP and select pin interrupts. Fast <4.3 us wake-up.
VLL Stop 3 (VLLS3)
MCU is placed in a low leakage mode powering down most internal logic. All system RAM contents are retained and I/O
states held. LLWU controls wake-up source for CPU similar to LLS mode.
VLL Stop 1 (VLLS1)
Similar to VLLS3 with no RAM or register file retention.
VLL Stop 0
(VLLS0)
Pin wakeup supported. LPTMR, RTC, TSI and CMP wake-up supported with external clock. No RAM or register file
retention. Optional POR brown-out detection circuitry.
Expands beyond typical run, sleep and deep sleep modes with power options
designed to maximize battery life in varying applications
RU
N
SL
EE
P
DE
EP
SL
EE
P
TM
External Use 63
Kinetis Power
Modes
Recovery
Time
KL26 Measured Idd
@ 3 V and 25 C
Leading Dynamic Power - 79 uA/MHz*
Innovative low-power process technology (C90TFS) - 39 uA/MHz**
Low-power-focused platform design 1.6 us 2.7 mA @ 48 MHz
Next-generation Cortex-M0+ core 1.6 us 110 uA @ 4 MHz
Asynchronous DMA Wake-Up (ADMA) 1.3 us 301 uA
Energy-saving peripherals are operational with ADMA
feature that can wake-up DMA to perform transfer and return
to current mode when complete 4.2 us 2.3 uA
Low-Leakage Wake-Up Unit 4.3 us 1.7 uA
Enables complete shut-down of core logic, including AWIC,
further reducing leakage currents in all low power modes 39 us 1.3 uA
Supports 8 external input pins and 8 internal modules as
wakeup sources, extends the low power wake-up capability
of some internal peripherals to all power modes 91 us 700 nA
Wake-up inputs are activated in LLS or VLLS modes. 91 us 139 nA /310 nA
Breakthrough Power Efficiency
RUN
VLPR
WAIT
VLPW
STOP
VLPS
LLS
VLLS3
VLLS1
VLLS0
* Compute Operation enabled: 4.0mA @ 48MHz core / 24MHz bus)
** Compute Operation enabled: 156uA @ 4MHz core / 1MHz bus)
TM
External Use 64
Energy-Saving Peripherals (1)
Peripheral Low-Power Functionality
DMA Allows energy-saving peripherals (e.g., ADC, UART and Timer/PWM) to trigger asynchronous DMA request in
STOP/VLPS modes to perform DMA transfer and return to current power mode with no CPU intervention
UART
Supports asynchronous transmit and receive operations to the bus clock supporting communication down to
STOP/VLPS modes. Configurable receiver baud rate oversampling ratio from 4x to 32x allowing higher baud rates
with lower clock sources.
SPI Supports slave mode address match wake-up function and first message capture down to STOP/VLPS modes
I2C Supports multiple address match wake-up function down to STOP/VLPS modes
USB Supports asynchronous wakeup on resume signaling down to STOP/VLPS
LPTPM
(Timer/PWM) Supports 16-bit timer input capture, output compare and PWM functions down to STOP/VLPS modes
LPTMR
(Timer/Pulse
Counter)
Supports 16-bit timer and pulse counter functions in all power modes
RTC Supports 32-bit seconds counter with seconds interrupt and programmable alarm in all power modes with include
temperature and voltage compensation
Intelligent peripherals increasing time in deep sleep modes with no CPU
intervention for increased battery life
TM
External Use 65
Energy-Saving Peripherals (2)
Peripheral Low-Power Functionality
ADC Supports single conversions in multiple result registers down to STOP/VLPS modes with hardware averaging and
automatic compare modes
CMP (Analog
Comparator)
Supports threshold crossing detection in all power modes along with a triggered compare mode for lower
average power compares
DAC Supports static reference in all power modes
Segment LCD Supports alternate displays and blink capability in all power modes
TSI (Capacitive
Touch Sense
Interface) Supports wake-on capacitive touch on single channel in all power modes
LLWU (Low-
Leakage Wake-
up Unit)
Supports 8 wake-up pins, RESET and NMI wakeup pins, and some energy-saving peripherals in LLS and
VLLSx modes
Intelligent peripherals increasing time in deep sleep modes with no CPU
intervention for increased battery life
TM
External Use 66 Note: Availability device dependent
• Kinetis L-Series devices support DMA operation in low power modes
• Stop modes can be entered with the System Clock enabled
• Allows peripherals with STOP mode functionality to trigger asynchronous DMA request
• The MCU will wake from STOP mode to WAIT, process the DMA request and then re-enter the STOP mode with no CPU intervention
• The MCU can be placed in a Compute mode with peripherals configured for STOP. In this mode, the CPU can continue to process data at very low dynamic power Peripherals with STOP mode functionality can continue to operate and trigger DMA transfers
Inter-module-connection with aDMA
Peripheral Wakeup source
Touch Sense
Interface
End of scan
Scan out of range
CMP Compare detected
I2S Receive data ready
Transmit data needed
LPUART Receive data ready
Transmit data needed
LPTPM Compare/capture detected
Counter overflow
Port Control
and Interrupts External edge detected
ADC Conversion complete
Use Case: ADC performing conversions, DMA transferring
conversion results into RAM buffer and CPU processing/filtering
the data all done with minimal power ~ 300uA at 4MHz Core speed
Kinetis L Series Peripherals : Asynchronous DMA (ADMA)
TM
External Use 67
Power Consumed in a “Typical” Application Use Case Wolverine Whitepaper
“Given that ultra-low-power devices spend 99.9
percent of the time in standby mode, leakage
current has become a key factor in determining
power efficiency in smaller process geometries.”
0
50
100
150
200
250
300
16 MHz 8 MHz 4 MHz
uA
Run Frequency
Average Current Consumption(lower is better)
MKL25Z128VLK4
MSP430FR59xx
Use Case Details: • 99.9% of time in standby with RTC active
‒ Kinetis L—VLLS1+RTC
‒ Wolverine—LPM3 + RTC
Conclusions: • Running at same frequency, Kinetis L
consumes 15–20% less average current.
• However, Kinetis L delivers nearly 2x the
work or can do the same work at roughly
half the frequency.
• In this case, Kinetis delivers on the
“typical use case” at nearly 40% less
average current.
TM
External Use 68
Kinetis L Series MCUs: Entry-Level Enablement
Freescale Freedom
Development Platform FRDM-KL02Z
FRDM-KL05Z
FRDM-KL25Z
FRDM-KL26Z
FRDM-KL46Z • Low-cost/power platform for entry-level
developers ($12.95/€10 SRP)
• Integrates a fully featured debugger
that works with all featured tool chains
Freescale Tower System TWR-KL46Z48M
TWR-KL25Z48M • Modular, open source development
platform with reusable peripheral
modules offering connectivity, analog,
graphics LCD and motor control
functionality
Hardware IDE & Code Generation Run-Time Software &
Product Selector
Freescale MQX Lite RTOS www.freescale.com/mqx
• Free, lightweight MQX kernel customised for
small resource MCUs
• Packaged as a Processor Expert component
• Upwards compatible with MQX RTOS
Solution Advisor www.freescale.com/sa
• Web-based interactive MCU selector
• Filters for operating characteristics,
packaging, memory configuration and
peripherals. Verifies muxing compatibility.
• Save, download and print summary reports
and pin muxing configurations.
Freescale & Third-Party IDEs • Freescale CodeWarrior v10.3: free 64KB
• Keil MDK: free 32 KB
• IAR EWARM: free 32 KB
• Atollic TrueStudio: free 8 KB
• GCC ARM Embedded via Launchpad.net
• Additional tool support from Code Red
and others in Q412
Freescale Processor Expert
Code Generator • Free software generation tool for device
drivers/start-up code
• Seven steps from project creation to debug –
dramatically reduces development time
• Available within CodeWarrior or as a
standalone plug-in for IAR/Keil/GNU IDEs
GNU
TM
External Use 69
Additional Resources / Information
TM
External Use 70
Development
Tools
Visual and automated
framework to accelerate
development time, deliver
software components
Kinetis Design Studio
Processor Expert
Scale new heights with Kinetis next
generation ease-of-use software
development
TM
External Use 71
Kinetis Solution Overview
Freescale Bundle
Hardware Freedom board,
Tower Platform
Software CodeWarrior, Processor
Expert, Driver Suite,
eGUI, PEG, FreeMASTER
RTOS MQX,
MQX Lite
Kinetis MCU
ARM Cortex-M0+ Core 48MHz, 1.77 CoreMark/MHz,
2-Stage Pipeline, 1-Cycle GPIO,
Micro Trace Buffer
ARM Cortex-M4 Core 50-150MHz, 3.40 CoreMark/MHz,
HW-divide, MAC, DSP-
commands, FPU option
Differentiators Low-power, Performance, Flex-
Memory, Mixed-Signal,
Security, HMI Features
Special Functions Analog Pre-Processing, 24b-
Sigma Delta ADC, sub -1GHz &
2.4 GHz Transceiver
ARM Eco System
Enablement
TM
External Use 72
The Growing Importance of Software
Average MCU Flash
size grew x8 in the
last decade
57% of projects
are late,
primarily due
to software*
+
Firmware is our customers’
BIGGEST pain point
+
Software now
accounts for
60+% of embedded
project costs*
Libraries (DSP, Math, Encryption)
So
ftw
are
an
d H
ard
ware
Evalu
ati
on
& D
ev T
oo
ls
Sta
cks
(T
CP
/IP
, U
SB
)
Mid
dle
ware
RTOS
Bootloader
Ap
plica
tio
n
Sp
ecif
ic
HAL & Drivers
MCU Hardware
Customer Application
60% SW
cost
57% late
*2013 Embedded Market Study, UBM Tech
TM
External Use 73
Freescale’s Microcontroller Enablement Bundle
Cloud enablement through
freely available online
design tools, communities,
part selectors
Online
Enablement Development
Tools
Visual and automated
framework to accelerate
development time, deliver
software components
Partner Ecosystem &
Kinetis Design Studio
Processor Expert
Find best-fit processors
and tools with web-based
interactive product selector
Solution Advisor
Part Selector
Development
Platforms
Low cost hardware
platforms for prototyping
application development
Tower System
Freedom Development
Platform
Development
Software
Comprehensive solution
for embedded control
and connectivity
MQX Core
PSP & BSP
Complimentary MQX
RTOS
MQX/MQX-Lite
Software Stacks and Libraries
PEG GUI Solutions
Application Notes
Kinetis SDK
TM
External Use 74
Robust Software & Development Ecosystem
>800 Embedded
Software
Engineers
Architectures
Proprietary ColdFire
Tools, OS, Middleware
FreeMASTER
BeeKit
CodeWarrior
SynkroRF
MQX
Applications
VortiQa
Key Software Acquisitions & Investments
1999: Metrowerks 2009: MQX Runtime Platform
2002: AMC, Lineo 2010: Processor Expert, Chipwerks, Swell
2008: Intoto
TM
External Use 75
Kinetis Software Development Kit (SDK)
Product Features
• Open source Hardware Abstraction Layer (HAL) provides APIs for all Kinetis hardware resources
• BSD-licensed set of peripheral drivers with easy-to-use C-language APIs
• Comprehensive HAL and driver usage examples and sample applications for RTOS and bare-metal.
• CMSIS-CORE compatible startup and drivers plus CMSIS-DSP library and examples
• RTOS Abstraction Layer (OSA) with support for Freescale MQX, FreeRTOS, Micrium uC/OS, bare-metal and more
• Integrates USB and TCP/IP stacks, touch sensing software, encryption and math/DSP libraries, and more
• Support for multiple toolchains including GNU GCC, IAR, Keil, and Kinetis Design Studio
HAL, peripheral drivers, libraries, middleware, utilities, and usage examples.
The OSI logo trademark is the trademark of Open Source Initiative.
A complete software framework for developing applications across all Kinetis MCUs
So
ftw
are
an
d H
ard
wa
re
Eva
lua
tio
n &
De
v T
oo
ls
Sta
cks
(TC
P/IP
, U
SB
)
Mid
dle
wa
re
Operating
System
Bootlo
ader
Ap
pli
ca
tio
n
Sp
ec
ific
BSP,
Drivers &
HAL
Libraries (DSP, Math,
Encryption)
MCU Hardware
Customer
Application
Learn more at: www.freescale.com/KSDK (coming April 2014)
TM
External Use 76
Kinetis Design Studio S
oft
ware
an
d H
ard
ware
Eva
lua
tio
n &
De
v T
oo
ls
Sta
cks
(TC
P/IP
, U
SB
)
Mid
dle
wa
re
Operating
System
Bootlo
ader
Ap
pli
ca
tio
n
Sp
ec
ific
BSP,
Drivers &
HAL
Libraries (DSP, Math,
Encryption)
MCU Hardware
Customer
Application
Learn more at: www.freescale.com/KDS
(coming April 2014)
No-cost integrated development environment (IDE) for Kinetis MCUs
$
Eclipse and GCC-based IDE for C/C++ editing, compiling and debugging
Product Features
• A free of charge and unlimited IDE for Kinetis MCUs
• A basic IDE that offers robust editing, compiling and debugging
• Based on Eclipse, GCC, GDB and other open-source technologies
• Includes Processor Expert with Kinetis Platform SDK integration
• Host operating systems:
− Windows 7/8
− Linux (Ubuntu, Redhat, Centos)
− Mac OS X
• Support for SEGGER, P&E and Open SDA/CMSIS-DAP debugger targets
• Support for Eclipse plug-ins including RTOS-awareness (i.e. MQX, FreeRTOS)
• CodeWarrior project importer
TM
External Use 77
Kinetis Bootloader
Product Features
• A common bootloader for all Kinetis MCUs
• Source code provided under a permissive BSD open source license
• ROM based on select Kinetis devices
• Pre-programmed into flash (on devices without a dedicated ROM) for built-in factory programming capabilities
• Fully customizable for use in customer applications providing reliable field updates
• Serial communications with a host via UART, SPI, I2C, USB HID, or CAN − Active peripheral detection
− Common command protocol for all peripherals.
• Command-line and GUI tools provided for Windows, Linux and Mac hosts
ROM or flash based bootloader with open-source software and host-side programming utilities.
In-system flash programming over a serial connection: erase, program, verify
Learn more at: www.freescale.com
(coming April 2014)
The OSI logo trademark is the trademark of Open Source Initiative.
TM
External Use 78
Kinetis K2 Tools Solutions (Addition to existing Kinetis Enablement )
mbed Support – Expanding to Kinetis K-Series
Families
Expand Offer of K-Series Freedom Boards
Ultra low-cost/low-power development platform
Enables quick application prototyping and demonstration of Kinetis MCU families
Rapid and easy Kinetis prototyping and development through the global mbed Developer Community providing free software libraries
mbed servers
CMSIS-CORE
Low Level
Driver Libraries
mbed SDK Runtime, Memory Model, Peripheral APIs,
STDIO, RTOS, Networking, Platform features
mbed Components Database Accelerometer, GPS, 802.15.4/6LoWPAN,
Cellular, Compass, ...
Toolchain
C library
C/C++ Programs
RTOS
Software
TM
External Use 79
Freescale Kinetis Minis
TM
External Use 80
• 1.6 mm x 2.0 mm x 0.56 mm
• Advanced wafer-level chip scale package
for the ultimate in PCB area reduction
• 35% less PCB area, yet delivers 60% more
GPIO than the next competing solution
• 32-bit ARM® Cortex™-M0+ core with high
density feature integration: 32 KB flash,
precision analog, ultra low power and more
• Start developing with the Kinetis L series
Freescale Freedom development platform
• Sampling in April 2014!
For more information, visit
freescale.com/Kinetis/KL03CSP
Freescale Kinetis L combined with WLCSP
packing brings the next World’s Smallest ARM®
Powered MCU
Microscopic Package. Massive Potential.
TM
External Use 81
Freescale CSP Packaging Overview for 32-bit Kinetis
MCUs
• What is Wafer Level CSP?
− Wafer Level Chip Scale Package refers to the technology of packaging an
integrated circuit at the wafer level, instead of the traditional process of
assembling individual units in packages after dicing them from a wafer.
• What will it mean for me as a customer buying and mounting CSP package
into my system
− The cost will be higher. Handling is more complex and thus cost of both handling
and soldering process more expensive
− More information on Freescale recommended handling is available in an
Application Note see AN3846
• CSPs are not targeted at low volume customers. For 2014, only High Touch
accounts backed by Business Development Marketing will be supported.
TM
External Use 82
Alternative to CSPs
• With the higher cost of CSP and difficult handling, customers should consider some alternative options before selecting a CSP.
• If the customer requirement is only for a very thin package, and area is not a major concern, customers should consider the new 121 pin Ultra Fine BGA packages being supported on new products.
− The use of the ultra fine BGA will lead to a lower cost PCB than that which utilizes a CSP.
• Other alternatives to CSP:
− 24, 32 or 48 QFN
− 64, 121 & 144MAPBGA
TM
External Use 83
Perf
orm
an
ce / I
nte
gra
tio
n
32KB 64KB 128KB 256KB 512KB 1MB 2MB
Flash
Kinetis WLCSP Portfolio The World’s Smallest ARM Powered MCUs – From ultra low power to high performance
Kinetis K
Kinetis L
KL02
1.9 x 2.0mm
20CSP
Samples NOW KL15
3.0 x 2.5mm
35CSP
KL16 / 26
2.5 x 2.4 mm
36CSP
K22F
3.4 x 3.2mm
64CSP
K60
6.4 x 5.6mm
143CSP
K10/20/60
5.3 x 5.3mm
120CSP
K61
6.4 x 5.6mm
143CSP
K24 / K64
4.8 x 5.6mm
143CSP
K65
5.6 x 5.5mm
169CSP
Production NOW
New, April
New
K22F
3.4 x 3.2mm
64CSP
New
Future
K22F
4.1 x 3.6mm
80CSP
New New K22F
4.1 x 3.6mm
80CSP
K22F
3.4 x 3.2mm
49CSP
New
K02F
? x ?mm
?CSP
New K02F
? x ?mm
?CSP
New
KL03
2.0 x 1.6mm
20CSP
KL17/27
? x ?mm
36CSP
New
TM
External Use 84
CSP options on Kinetis – Qualified
Device Part # Flash Speed
Grade
Temp
range Package
Dimensions
(mm) Comment
KL02 MKL02Z32CAF4R
KKL02Z32CAF4R 32KB 48MHz
Max
Ambient = -
40 to 85oC
20WLCSP 1.994 x 1.94 x
0.563*
KL15 MKL15Z128CAD4R
KKL15Z128CAD4R 128kB 48MHz 35WLCSP 2.37 x 2.46*
18wk lead-time
for Production
KL16 MKL16Z128CAL4
KKL16Z128CAL4 128kB 48MHz 36WLCSP
2.5 x3 x
0.528**
0.35mm ball
pitch
KL26 MKL26Z128CAL4
KKL26Z128CAL4 128kB 48MHz 36WLCSP
2.5 x3 x
0.528**
0.35mm ball
pitch
K60
K20
MK60DN512ZCAB10R
KK60DN512ZCAB10R
MK20DN512ZCAB10R
KK20DN512ZCAB10R
512KB 100MHz 120WLCSP 5.29 x 5.28 x
0.563*
K60 SCK60FN1MGCAA12R 1MB 120MHz 143WLCSP 6.44 x 5.55x
0.563*
K61
MK61FN1M0CAA12R
KK61FN1M0CAA12R
1MB 120MHz 143WLCSP 6.44 x 5.55x
0.563*
K10 MK10DN512ZAB10R 512KB 100MHz
Max
Ambient =
0 to 70oC
120WLCSP 5.29 x 5.28 x
0.563*
* +/- 0.035mm
** +/- 0.03mm
TM
External Use 85
CSP options on Kinetis – Pipeline
Device Part # Flash RAM Speed
Number of
balls
(pitch)
Temp
range Size (mm)
PK
Samples
*
Qual * Production
*
K24 /
K64
MK24FN1M0CAJ12R
MK64FN1M0CAJ12R 1MB 256Kb 120MHz
142
(0.4mm)
Max
Ambient
= -40 to
85oC
4.8 x 5.6 x
0.563* Now
TBD by
Customer
demand
18wk lead-
time
K65 MK65FN2M0CAC18R
MK65FX1M0CAC18R 2MB 256Kb 180MHz
169
(0.4mm)
5.6 x 5.5 x
0.563* Now May’14 July ‘14
KL03 MKL03Z32xxx4 32kB 4Kb 48MHz 20
(0.4mm)
2.0 x 1.6 x
0.563* April ’14 June’14 July’14
K22F MK22FN256CAH12
MK22FN128CAH12
256kb or
128kB 48Kb 120MHz
64
(0.4mm)
3.4 x 3.2 x
0.563* Now
TBD by
Customer
demand
18wk lead-
time
K22F MK22FN512CAP12
MK22FN256CAP12
512kb or
256kB 128Kb 120MHz
80
(0.4mm)
4.12 x 3.56 x
0.563* TBD TBD TBD
K22F K22FN128CAK10 128kB 24Kb 100MHz 49
(0.4mm)
TBD x
0.563* TBD TBD TBD
K02 K02FN128Cxx10
K02FN64Cxx10
12kB or
64kB 16Kb 100MHz TBD TBD TBD TBD TBD
* Dates subject to change
TM
External Use 86
Typical WLCSP Milestones - TBC
• Mechanical samples: 4 - 6 weeks after silicon validation (confidence)
− Mechanical Samples – WLCSP samples are not tested. Part configurations and IP trims not programmed. Parts can be used to validate the RDL (re-distribution layer) and the case outline.
• Pre-bump probe only, limited test samples: + 6 weeks after CSP mask design
• Ball map must be agreed by customer and RDL feasibility is complete
− Probe-only (Limited Test) Samples – WLCSP sample are tested with appropriate part configurations, IP trims, and NVM initialized. However, parts are not tested or validated after bump processing. These can be shipped to customers for development purposes, but there is risk without validating the functionality of the parts after bump processing prior to shipment.
• Full test samples (@room temp): + 5 weeks (Post Bump)
− Room-Temp Samples – WLCSP sample are tested with appropriate part configurations, IP trims, and NVM initialized. Parts are 100% tested after bump processing. These can be shipped to customers for development purposes, with low risk of failure for yield issues.
• Qualification: + 6 weeks
− Qualification – generally, die itself is already qualified in standard package, additional testing and stressing to confirm WLCSP package qualification.
• Production ramp: + 12 weeks after official design WIN (+6 weeks after qual)
− Production ramp – high volume customer orders can be filled (pending appropriate lead times). Range in schedule dependent on production hardware availability or creation.
TM
External Use 87
Wafer Level Chip Scale Packaging
• Packaging of microcontroller assembled at the wafer level
• The package is of the same size as the die
• Interconnections from the die to the PCB are accomplished by solder balls
• No bond wires or interposer connections are required
Key Advantages:
• It allows the miniaturization of embedded applications
• The die to PCB inductance is minimized
• Enhanced thermal conduction characteristics
PCB Layout Application Note: AN3846, Wafer Level Chip Scale Package
TM
External Use 88
Kinetis Chip Scale Package Portfolio The World’s Smallest ARM Powered MCUs – From ultra low power to high performance
• World’s smallest ARM powered MCU (1.9x2.0mm2)
− Kinetis L-series, KL02 20pin CSP
25% less area, 60% more GPIO than next nearest competitor
Ultra low power Cortex-M0+
• World’s smallest 128KB Flash MCU (2.4x2.5mm2)
− Kinetis L-series, KL16 36pin CSP
− Ultra low power Cortex-M0+
• 512KB Flash, 128KB RAM, USB, ENET (5.3x5.3mm2)
− Kinetis K-series, K60 120pin CSP
− High performance Cortex-M4
• 1MB Flash, 128KB RAM, USB, ENET (6.5x5.6mm2)
− Kinetis K-series, K61 143pin CSP
− High performance Cortex-M4
TM
External Use 89
Freescale Product Longevity Program
• The embedded market needs long-term product support
• Freescale has a longstanding track record of providing long-term production support for our products
• Freescale is pleased to introduce a formal product longevity program for the market segments we serve
− For the automotive and medical segments, Freescale will make a
broad range of program devices available for a minimum of 15
years
− For all other market segments in which Freescale participates,
Freescale will make a broad range of
devices available for a minimum of 10 years
− Life cycles begin at the time of launch
• For terms and conditions and to see a list of participating Freescale products available under this program: www.freescale.com/productlongevity
TM
External Use 90
Kinetis K Series Only Kinetis L Series Only
Kinetis K/L Series MCU Packages Common Packages
32 QFN
5 x 5 mm
0.5 mm pitch
(K10/20)
(KL0)
64 MAPBGA
5 x 5 mm
0.5 mm pitch
(KL2/3/4)
Kinetis K Series MCU Package
Kinetis L Series MCU Package
48 LQFP
7 x 7 mm
0.55 mm pitch
(KL0)
64LQFP
10 x 10 mm
0.5 mm pitch
(K10/20/30/40/50)
(KL1/2/3/4)
80 LQFP
12 x 12 mm
0.5 mm pitch
(KL1/2)
100 LQFP
14 x 14 mm
0.5 mm pitch
(KL2/3/4)
144 LQFP
20 x 20 mm
0.5 mm pitch
(K10/20/30/40/
50/60)
48 QFN
7 x 7 mm
0.5 mm pitch
(KL1/2)
144 MAPBGA
13 x 13 mm
1.0 mm pitch
(K10/20/30/40/
50/60)
169 MAPBGA
9 mm x 9 mm
Pitch 0.65 mm
(K65)
121 MAPBGA
8 x 8 mm
0.65 mm pitch
(K10/20/30/
40/50/60)
(KL2/3/4)
32 LQFP
7 x 7 mm
0.8 mm pitch
(KL0)
35 WLCSP
2.55 x 3 x 0.56 mm
0.4 mm pitch
(KL1/2)
20 WLCSP
1.9 x 2 x 0.56 mm
0.4 mm pitch
(KL0)
90 WLCSP
3.9 x 4.4 x 0.56 mm
0.4 mm pitch
(K10/20)
110 WLCSP
3.9 x 4.4 x 0.56 mm
0.4 mm pitch
(K10/20)
120 WLCSP
5.3 x 5.3 x 0.56 mm
0.4 mm pitch
(K10/20/60)
143 WLCSP
6.5 x 5.6 x 0.56 mm
0.4 mm pitch
(K61)
24 QFN
4 x 4 x 1 mm
0.5 mm pitch
(KL0x)
16 QFN
3 x 3 x 1 mm
0.5 mm pitch
(KL02)
Freescale Diamond ‘13 Products
256 MAPBGA
17 x 17 mm
1.0 mm pitch
(K60/70)
TM
External Use 91
Designing with Freescale
Tailored live, hands-on
training in a city near you
2014 seminar topics include
• QorIQ product family update
• Kinetis K, L, E, V series MCU product training
freescale.com/DwF
TM
© 2014 Freescale Semiconductor, Inc. | External Use
www.Freescale.com
