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Hitachi 2016 Think Outside the Lab Hitachi High Technologies America, Inc. Orthogonal 3D Analysis FIB-SEM and Its Latest Applications

NX9000 Orthogonal FIB-SEM - Microscopy Society of · PDF fileHitachi 2016 Think Outside the Lab Abstract/Overview • The Hitachi NX9000 orthogonal FIB-SEM system is advancing the

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Text of NX9000 Orthogonal FIB-SEM - Microscopy Society of · PDF fileHitachi 2016 Think Outside the...

  • Hitachi 2016 Think Outside the Lab Hitachi High Technologies America, Inc.

    Orthogonal 3D Analysis FIB-SEM

    and Its Latest Applications

  • Hitachi 2016

    Think Outside the Lab

    Abstract/Overview

    The Hitachi NX9000 orthogonal FIB-SEM system is advancing the field of material processing by lifting

    the constraints often encountered by V-shaped FIB-SEM instruments.

    An ever increasing need for three-dimensional signal capture and reconstruction often demand a large

    amount of time for post processing.

    FIB-SEM Design

    Design layout

    EM/IM technologies

    A walkthrough example is presented illustrating how and why an orthogonal FIB-SEM system

    provides a level of precise and accurate measurement and material preparation with a high degree

    of accuracy.

    Orthogonal FIB-SEM

  • Hitachi 2016

    Think Outside the Lab

    Matrix

    FIB-SEM Applications

    Lamella preparation

    STEM imaging

    Serial section SEM imaging

    3D reconstruction (Cut & See) Serial section EDS mapping

    3D composition analysis

    CC SiSi TiTi FeFeCC SiSi TiTi FeFe

    Serial section EBSD mapping

    3D crystal orientation analysis

    Multiple information (Structure/Composition/Crystal

    orientation) can be collected from serial FIB cross sections

    under optimal SEM condition.

  • Hitachi 2016

    Think Outside the Lab

    Overview

    14nm FinFET device

    ~20% performance improvement from 20nm process

    ~35% more energy efficient from previous generation

    Smaller scale devices require improved stability and image

    resolution

    The workflow process for atom probe preparation is

    performed with back side ion milling

    Sample: FinFET

  • Hitachi 2016

    Think Outside the Lab

    Design Layout

    NX9000

    FIB and SEM are arranged orthogonally designed with an optimized coincidence point to obtain the

    best SEM imaging condition at normal incidence in real time. No Y shift during segmentation.

  • Hitachi 2016

    Think Outside the Lab

    In-column

    SED

    In-column

    BSED

    Retractable

    BSED

    STEM detector

    Improved performance at low accelerating voltage

    Cold Field Emission Gun for better electron

    brightness (lower energy spread)

    Short wavelength for improved resolution

    For a diverse range of samples and applications

    Automated Flash-less Technology

  • Hitachi 2016

    Think Outside the Lab

    Multiple Signal Acquisition

    Li Ion Battery by NX9000

    In-column BSED

    LiCoO

    active material

    Conduction aid (carbon black),

    binder, etc.

    Chamber SED In-column SED

    Vacc. : 1kV

    FOV size : 5um Dwell time : 50us

  • Hitachi 2016

    Think Outside the Lab

    3D Reconstruction by Cut&See

    Image Pro Premier

    3D Software used for

    reconstruction of

    FinFET structure

    2nm slice pitch

    Sample: FinFET

    200nm

    Fin MG

    Fin MG

    STI

    XY

    section

    SEM condition FIB condition

    Vacc. 2kV Vacc. 30kV Current 200pA Current 45pA Detector BSD(Vf:0V) Cutting interval 2nm Imaging time 20s/image Number of cut 450 Total time 3hrs

    XY

    section

    3D Volume

  • Hitachi 2016

    Think Outside the Lab

    L-Shape

    SEM

    FIB

    SEM

    Sample

    FIB

    SEM SEM

    SEM Image

    SEM Image

    Conventional vs. L-Shape

    V-Shape

    [FOV Shift]

    L-Shape

    [No FOV Shift]

  • Hitachi 2016

    Think Outside the Lab

    Foreshortening/Aspect Ratio Comparison

    Electron Imaging

    synaptic vesicle synaptic cleft

    mitochondrion

    BSE Image Vacc:1.5kV

    Sample courtesy: Yoshiyuki Kubota, Ph.D.

    National Institute for Physiological Sciences(NIPS)

  • Hitachi 2016

    Think Outside the Lab

    3D Reconstruction by Cut&See

    Image Pro Premier

    3D Software used for

    reconstruction of

    FinFET structure

    2nm slice pitch

    Sample: FinFET

    SEM condition FIB condition

    Vacc. 2kV Vacc. 30kV Current 200pA Current 45pA Detector BSD(Vf:0V) Cutting interval 2nm Imaging time 20s/image Number of cut 450 Total time 3hrs

    3D Volume

    MG

    Fin

  • Hitachi 2016

    Think Outside the Lab

    Atom Probe Preparation Workflow

    Sample: FinFet

    Lg direction Wg direction

    Fin Fin

    Wg direction Lg direction

    Wg

    direction Lg direction

    Fin

    (1)Lg section of extracted

    micro-sample was

    observed.

    (2~5) Micro-sample was

    rotated 45deg and then

    milled in WG direction to

    localize Fin.

    (6~7) Pillar was prepared

    in LG direction to leave

    single row of Fins.

    (8) Target Fin was

    determined for Lg section.

    Sample was fixed with e-beam W deposition between the bottom of sample and the grid.

  • Hitachi 2016

    Think Outside the Lab

    In-column

    SED

    In-column

    BSED

    Retractable

    BSED

    STEM detector

    Chamber SED BSED

    DF-STEM SED (in-column)

    Multiple Signal Acquisition

    Transmission Electron Imaging

    Vacc: 25kV

    E-beam: 270pA

    Ga milling at 5kV

    I-beam: 40pA

  • Hitachi 2016

    Think Outside the Lab

    Atom Probe Preparation Workflow Ar Ion Milling (final)

    Sample: FinFet

    ArB: 1kV, (20nA)

    SEM/STEM: 25kV (270pA)

  • Hitachi 2016

    Think Outside the Lab

    Workflow

    Enhancing Reproducibility

    Throughput Software + Hardware

    Productivity, throughput and repeatability are

    comprised of synergy between:

    User

    Application

    Hardware*

    Ref: http://en.wikipedia.org/wiki/File:Operating_system_placement.svg

    http://en.wikipedia.org/wiki/File:Operating_system_placement.svghttp://en.wikipedia.org/wiki/File:Operating_system_placement.svghttp://en.wikipedia.org/wiki/File:Operating_system_placement.svg

  • Hitachi 2016

    Think Outside the Lab

    Traditional FIB-SEM Configuration

    FIB-SEM Design

    EBSD

    Sample

    (180 deg Rotation &15 deg tilt)

    EBSD

    FIB Milling Position EBSD Position

    Sample

    (55 deg. Pre-tilt)

    FIB FIB

    SEM SEM

  • Hitachi 2016

    Think Outside the Lab

    L-Shape versus V-Shape Configuration

    FIB-SEM Design

    EBSD

    Sample

    (180 deg Rotation &15 deg tilt)

    L-Shape FIB-SEM Layout Traditional FIB-SEM Layout

    FIB

    FIB

    SEM SEM

    FIB FIB Sample

    Examples

  • Hitachi 2016

    Think Outside the Lab

    Sample Preparation

    Atom Probe: Steel

    STEM

    Sample

    FIB

    SEM 1.5m

    Pillar 400nm

    Pillar

    200nm

    Needle 50nm

    Needle

    SEM VACC: 2kV for Observation

    SEM VACC: 15kV for EBSD

    FIB VACC: 30kV

  • Hitachi 2016

    Think Outside the Lab

    Low kV Ar Ion Gun

    Atom Probe: Si

    100nm 100nm

    5nm 5nm

    100nm

    5nm

    Ga-FIB 30kV

    Damage Layer 25nm

    Ga-FIB 5kV

    Damage Layer 15nm

    Ar-B 1kV

    Damage Layer 5nm

    TEM Images

    ACC: 200kV

    Damage layer can be removed evenly

    by Ar ion beam with pillar stub mount

    and rotation.

  • Hitachi 2016

    Think Outside the Lab

    Low kv Ar Ion Gun

    Atom Probe: Indium-Tin Oxide (ITO/GaN)

    Final Milling:

    [email protected]

    Condition

    Sample Temp.: 20K

    Laser Power: 0.01nJ

    All Material Ga

    Sample

    FIB

    SEM

    Finale Milling:

    [email protected]

  • Hitachi 2016

    Think Outside the Lab

    Summary

    An orthogonal FIB-SEM platform delivers:

    Optimized coincident point for best SEM imaging

    Geometry of sample and detectors eliminate limitations found in V-shaped FIB-SEM systems

    Orthogonal column arrangement yields high precision segmentation imaging and analytical 3D

    applications.

    Normal incident SEM imaging eliminates aspect deformation and foreshortening

    Software + Hardware synergy through advanced automation and application specific development

    of modifiable Apps are possible for atom probe preparation techniques and several other

    applications.

    Orthogonal FIB-SEM

  • Jamil J. Clarke [email protected]

    End

    mailto:[email protected]:[email protected]:[email protected]

  • Hitachi 2016

    Think Outside the Lab NX9000 FIB-SEM System