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GOEPEL electronic GmbH Goeschwitzer Str. 58/60 OptiCon 3D-AOI The 3D series of OptiCon AOI systems

OptiCon 3D-AOI - GÖPEL electronicOptiCon 3D-AOI Conventional 3D-AOI-systems True 3D measurements x/y/z-values according to real topography Limited, dependent on PCB topography Independence

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Page 1: OptiCon 3D-AOI - GÖPEL electronicOptiCon 3D-AOI Conventional 3D-AOI-systems True 3D measurements x/y/z-values according to real topography Limited, dependent on PCB topography Independence

ISO 9001 certified

Authorised Distributor:

[email protected] [email protected] [email protected] [email protected] [email protected]

GOEPEL electronic GmbH

Goeschwitzer Str. 58 /60

07745 Jena /Germany

Phone: +49 (0) - 3641 -6896 -0

Fax: +49 (0) - 3641 -6896 -944

Email: [email protected]

Web: www.goepel.com

OptiCon 3D-AOI The 3D series of OptiCon AOI systems

Page 2: OptiCon 3D-AOI - GÖPEL electronicOptiCon 3D-AOI Conventional 3D-AOI-systems True 3D measurements x/y/z-values according to real topography Limited, dependent on PCB topography Independence

Assembled PCB

Telecentric Multi Spot Array (TMSA)

Scanning movement

OptiCon 3D-AOI Technology and key benefits

Requirements on powerful 3D-AOI-systems

OptiCon 3D-AOI Conventional 3D-AOI-systems

True 3D measurements x/y/z-values according to real topography

Limited, dependent on PCB topography

Independence of component and solder joint surface

Yes, because of TMSA-technology Limited, dependent on surface texture

Reliable results on every PCB position Yes, because of TMSA-technology Not guaranteed because of shadowing effects

Retrofit / option for standard AOI-systems Yes No

Combination with standard AOI technologies (orthogonal and angled views)

Yes No / partial

Projection and measurement based on scanning TMSA-technology

Shadowing effects based on conventional 3D measurement technology

NEW TECHNOLOGY

CONVENTIONAL TECHNOLOGYStructured light source

Camera

Assembled PCB

Page 3: OptiCon 3D-AOI - GÖPEL electronicOptiCon 3D-AOI Conventional 3D-AOI-systems True 3D measurements x/y/z-values according to real topography Limited, dependent on PCB topography Independence

Profile of chip component with faulty solder joint

Technology and key benefitsOptiCon 3D-AOI

3D measurement values of assembled PCB (based on TMSA-technology)

Snapshot of Telecentric Multi Spot Array (TMSA) at assembled PCB

Real picture of corresponding PCB area

Technical specification

Measuring technology Scanning Telecentric Multi Spot Array (TMSA)

Projection direction Orthogonal and telecentric

Measuring direction Orthogonal and telecentric

Inspection speed Up to 70cm2/s

x/y-resolution Selectable between 10µm and 30µm

z-accuracy <5µm

Field of view size 44mm x 32mm

Measuring functions (3D-AOI)

Solder joints: volume, wetting angle, shorts Components: height, coplanarity, position

Inspection functions (standard AOI)

Solder joints: soldering, shortsComponents: position, polarity, presence, OCR, colorOther: fiducials, barcode, 2D-code

Page 4: OptiCon 3D-AOI - GÖPEL electronicOptiCon 3D-AOI Conventional 3D-AOI-systems True 3D measurements x/y/z-values according to real topography Limited, dependent on PCB topography Independence

ISO 9001 certified

Authorised Distributor:

[email protected] [email protected] [email protected] [email protected] [email protected]

GOEPEL electronic GmbH

Goeschwitzer Str. 58 /60

07745 Jena /Germany

Phone: +49 (0) - 3641 -6896 -0

Fax: +49 (0) - 3641 -6896 -944

Email: [email protected]

Web: www.goepel.com

AOI/ E / 05-2014

OptiCon PILOT 6.0 - AOI taking control and flexibility to a new dimension!• Convenient operation concept• Effortless, user friendly and clear structured test program generation• Minimizing the currently required parameters • Immediate provision of parameters for particular application• 3D visualization of the components contained in the library and of the generated test

program

SmartGuideClear user guidance from data import to test program

Test program generation with SmartGuide

3D visualization of generated test program

SmartGuide - The revolutionary test program generation!Generation of test programs as simple as handling your smartphone…

• Particularly easy and fast generation of test programs without prior knowledge, e.g. at the start of production of a new assembly during night shift

• Clear and well-arranged user guidance• Full touch screen operation

3D Sensor Module