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PDR IR-E3 EvolutionBGA Rework System
PDRs Focused IR SMT/BGA Rework Systemfor Ultimate Performance in
BGA Rework
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PDR IR-E3 Evolution BGA Rework Systemwww.pdr-rework.com
Advanced features available
FocusedIRcomponentheating PDRspatentedtool-freeIRtechnology
QuartzIRPCBpreheater Largearea2000wIRheating
Optional750w,1600wor2400w
AdvancedPrecisioncomponent pickandplacement
Liftfromcomponentnestpluslowforcelanding androtation
Componentnest/fluxapplicationfacility
Usingfluxdiptrayorcomponentprintframe
PrecisionX/YPCBtable Macro-Micromovementandmicrometer
adjustment
Auto-profileprocesscontrolpackage
WithPDRsThermoActiveV4+softwaresuite
BGA/BGAalignment Highmagnification,CCTV/prismbasedsystem
AuxiliaryProcessCamera(Optional)
Highmagnification,CCTV/prismbasedsystem
Non-contactcomponent temperaturesensing
Realtimemeasurementofcomponent temperatures
PrecisionPCBtemperaturesensing
Contactornon-contacttemperaturesensors
AutoLiftPick-Up(Optional) Automaticremovalofcomponent
PCBCooling(Optional) ForfastcoolingofLED-Freeassemblies
BGAreworkwithoutthecomplications
ThePDRIR-E3SMT/BGAreworksystem,usingPDRspatentedFocusedIRtechnology,hasbeenspecificallydesignedtocopewiththechallengesofrepairingtodaysPCBassemblies.
Thesystemistoolfree,gasfree,instantly/preciselycontrollable,clean,modular,upgradeableandproduces100%yieldBGAreworkwithoutanycomplications.Itprovidestheextremelyhighlevelsofprofilingandprocesscontrolnecessaryfortheeffectivereworkofeventhemostadvancedpackages,includingSMDs,BGAs,CSPs,QFNs,Flipchipsandisreadyfor0201andlead-freeapplications.
TheIR-E3canbeeasilyconfiguredtoyourrequirements,withagoodrangeofadvancedfeaturestochoosefrom,allowingtheoperatortoquicklyandsafelyreworkalltypesofcomponentswithoutoverheatingthecomponent,adjacentsorthePCB.ItusesalltheprovenattributesofPDRsFocusedIRtechnology,firstintroducedin1987andnowusedworldwidebyover4000customers.
SimpleBGAreworkprocedure
BGAreworkposestheproblemofaccessinghiddeninterconnectsinahighdensityenvironment.Consequently,itrequiresasystemthatisabletoaccessthehiddenjointswithoutaffectingneighbouringcomponents.Asystemthatissafe,gentle,adaptableand,aboveall,simpletooperate.TheIR-E3issuchasystem.ItissoeasytooperatethattechniciansareabletoinstantlyachieveexcellentprocesscontrolforBGA/SMTreworkwithoutthecomplexitiesandfrustrationsnormallyassociatedwithhigh-endreworksystems.
Paste-Place-Reflow
Withtheaidofexcellentmechanics,opticsandcontrol,operatorscansimplypickupthefluxedBGAfromthenest,alignit,placeitontothePCBspadsandthenreflowwiththesystemsaccuratePCbased,closedloopcomponentandPCBtemperaturecontrol.
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PDR IR-E3 Evolution BGA Rework Systemwww.pdr-rework.com
AdvancedFocusedIRcomponentheating
150W,lensbasedFocusedIRheatingwithadjustableimagesystem
PDRlensattachmentswithIRimagefrom4to70mmdiameter
ReworksallSMDs/BGAsincluding0201s+leadfreeapplications
QuartzIRPCBpreheating Highpower,mediumwavequartzIR
Standard2000W,2x1000Wzones(240mmx240mmarea)
Optional750W,singlezone(120mmx120mmarea)
Optional1600W,2x800Wzones(240mmx240mmarea)
Optional2400W,2zones,800w+1600W(240mmx360mmarea)
PDRlensattachments F150(4-18mmspotsize)optional
F200(10-28mmspotsize)optional F400(12-35mmspotsize)optional
F700(25-70mmspotsize)standard
AdvancedProfessionalvacuumplacementsystem
Withprecisepickandplaceaction,Y/Zaxismovementand
rotationsoftcomponentlandingandZ-axisstopforplacement inpaste
Interchangeablepick-upheadsfordifferentapplications
Componentnestforprecisioncomponentpick upandFluxapplication
Withcomponentprintframe,diptray,orministencilpaste-head
facilityforfluxandsolderpasteapplication
Precisionmacro-microX/YPCBtable
Precisionmicrometer(micro)X/Yandmicrorotationcontrol
+/-10microns(.0004)movementinX/Ydirections
MacrooverridefacilityinX/Ydirections
Upto12X18(300mmX450mm)capacitywith lockableX/Yaxis
Componenttemperaturesensing Non-contact,IRsensor
Manuallyadjustable,K-typenon-contactIRsensor
Realtimemonitoringofcomponenttemperature throughoutprocess
PCBtemperaturesensing Contactoroptionalnon-contactsensors
Manuallyattached,K-typethermocouplecontactprobe,or
manuallyadjustable,K-typenon-contactIRsensor
RealtimemonitoringofPCBtemperaturethroughoutprocess
Detailsandspecificationsofadvancedfeaturesavailable
Autoprofileprocesscontrolwith PDRThermoActivesoftwaresuite
Type5,digitalcontrollerwithmultifunctionalfeatures
Advanced,WindowsXP/Vista/NTThermoActiveV4+softwaresuite
Twochannel,realtime,closedloopcomponentandPCB temperaturecontrol
Auto-profiletemperatureprofilinganddatalogging
MultiK-typethermocouple(x4)capacityfortemp/timetesting
CCTV/prismbasedBGA/uBGAalignmentsystem
Splitbeamprismsystemforsimultaneous PCB/componentviewing
BGA,CSPandleadlesscomponentalignment
IntegralLEDlightingsystemwithilluminationlevelcontrol
Fullcolour1/2CCTVcameraand17TFT/LCDFlatscreen colourmonitor
HighqualityzoomlenswithuptoX50magnification
PreciseX/Yaxismountingsystem
Auxiliaryprocessobservationcamera(optional)
IntegralLEDlightingsystemwithilluminationlevelcontrol
Fullcolour1/2CCTVcameraand17TFT/LCDFlatscreen colourmonitor
HighqualityzoomlenswithuptoX40magnification
BenchTopRequirementsTopheatpower 150WIR
Backheaterpower 750W,1600W,2000Wor2400WIR
Voltage/frequency 220-240volts50/60Hz,upto2.6KW
Typicalcomponents
CSPs,BGAs,uBGAs,QFNs,QFPs,PLCCs,SOICs,smallSMDs
Bencharea 1400mm(w)x600mm(d)
Weight 65Kg
Theabovefeaturesaremostlyoptionalandalso,PDRreservestherighttoimproveorchangespecificationswithoutgivingnotice.
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PDR IR-E3 Evolution BGA Rework Systemwww.pdr-rework.com
PDRPioneersofFocusedIRtechnology
In1986,PDRpioneeredtheuseofFocusedInfra-
Redtechnologyforreworkapplications.Today,
over4000systemshavebeeninstalledaroundthe
worldatOEMsandEMSprovidersactiveinthe
defence,aerospace,automotive,avionics,telecoms
andcomputerindustries.Companiessuchas
NASA,Boeing,Nokia,Alcatel,Sony,Motorola,
Philips,Dell,IBMandEADS,tonamebutafew,
relyeverydayonPDRsFocusedIRtechnology
todeliversimple,safeandrepeatablerework.
Withtheevolutionofincreasinglycomplex
boards,theongoingminiaturisationof
componentsandlead-freesolders,PDRsFocused
IRtechnologyisrapidlysupersedinghotgas
astheplatformofchoiceforOEMsandEMS
providers.Highlevelsofprofilingandprocess
controlmakeFocusedIRtheperfectchoiceto
handlethenarrowerprocesswindowoflead-
freeanddeliverthe100%yieldmanufacturers
demand.
PDRsFocusedIRdelivers100%yieldBGArework
PDRsFocusedIRreworksystemsprovide
highqualityresultsonbothstandardand
fine-pitchcomponents,arraypackagesand
alllead-freedevices.FocusedIRisable
topinpointthesmallestcomponentina
high-densityenvironmentandprovidethe
operatorwithaclearviewofboththe
PCBandthecomponentthroughoutthe
process,makingthisthebestchoiceforall
reworkapplications.
PDRsprocessinvolvespre-heatingthePCBfrombelowwithaback
heaterandthenheatingthecomponentfromabove.Thisreducesthe
timeandenergyrequiredfortopsideheating,therebyminimisingthe
potentialfordamagetothecomponent,thePCBoradjacentdevices.
PDRsclosedlooptemperaturemonitoringsystem,withanon-contact
IRsensor,makestheprocesshighlycontrollableandrepeatable,
producinghighqualitysolderjointseverytime.
PDRsystems-flexible,modularandupgradeable
PDRsversatilesystemsrangefromaFocused
IRhandtoolrightthroughtosemi-automated,
advancedreworkstations.Theyalsoinclude
systemsdesignedspecificallyforsmalltolarge
applications.EachFocusedIRsystemoffers
anexcellentlevelofstandardfeatures,plus
optionstosuiteverybudget.PDRssystems
aremodularandeasilyupgraded,allowingyou
toaddtheextrafunctionalityyouneedasyour
requirementschange.
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PDR IR-E3 Evolution BGA Rework Systemwww.pdr-rework.com
TheadvantagesofFocusedIR
FocusedIRcomponentheatingPrecisecomponentheatingeliminatestheriskofdamagetothePCB/adjacents
Nonozzles,focushoodsorshieldsAsimpleturnofthelensallowsforeasyreworkofanysize/shapecomponent
LowcostofownershipCompetitivesystempricingandnearlyzerofollow-oncosts
ModularandupgradeablesystemsEasilyconfiguredtomeetanyrequirementsasyourdemandsexpand
ExcellentcontrolsoftwareNon-contact,componenttemperaturesensingandautomaticthermalprofiling
Easytoset-upanduseClean,simpleandsafe.Easeofusedelivers100%yield
ThebestBGAreworksystemsintheworld
Forovertwentyyearswehavecontinuallypushedtheboundariesofrefinedreworksystems.Ourcleanandintuitiveheatingtechnologycombineswithitsunmatchedcontrolandsolderingability,tobecomeoneofthemosteffectiveinnovationsinourindustry.
AnotherdevelopmentfromPDRisourhighresolutionCCTV/splitbeamprism-basedBGAalignmentoption,whichallowstheoperatortoviewthePCBandcomponentsimultaneouslywithacolourvideomonitorandzoomlens.
AddtothisPDRssuperbprecisionmechanics,whichprovideoperatorswithvacuum-operatedpickup,macro-microZaxis,360componentrotationandmicrometercontrolforsoftcomponentlanding,andyouhaveunbeatablereworksystemsthatprovide100%yieldonallSMT/BGAreworkapplications.
Leading-edgecontrolsoftware
AmajoradvantageinchoosingPDRsFocusedIRreworksystemsistheThermoActiveV4+autoprofilingsoftwaresuite.Ithasbeendesignedtobeasuser-friendlyaspossible,withexcellentgraphicsandsimple,logicalcontrols.
TheoperatorsetsthetemperaturetargetandtheThermoActiveV4+softwaremanagestheheatingprocess,ensuringthattheheatappliedtothePCBandcomponentisprecise.Particularlybeneficialforthedemandsoflead-free,thermalprofilesfordifferentassembliescanbeautomaticallycreatedwithinminutesandstoredforfutureuse.
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PDR
PDR-DesignandManufacturingUnit3StanleyCentre,KelvinWayCrawley,WestSussex,RH109SE,England
T:+44(0)1293614000F:+44(0)1293613600E:[email protected]
PDR America - Sales/Support Center
3869DividendDrive,ShingleSprings,CA95682,USAT:(530)6766262F:(530)6766265E:[email protected]
PDRsproductsareavailableworldwideviaourinternationaldistributors,allofferingprofessionalsalesandsupport.Forcontact,productandcompanydetailspleasevisitwww.pdr-rework.com
www.pdr-rework.com
