Department of Electrical and Computer Engineering

Center for High Performance Power Electronics

Power Electronics and Electric Machines

Sept 19th , 2014

Dr. Jin Wang

Leading Faculties

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Dr. Longya Xu

Professor

Electric Machine/Power Electronics

Dr. Jin Wang

Associate Professor

Power Electronics/High Voltage

Dr. Fang Luo

Research Assistant Professor

Power Electronics/Device

Packaging/EMI

Dr. Mahesh Illindala

Assistant Professor

Power Electronics/Microgrid

Evolution of Power Devices

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Dr. kamel Madjour, Silicon Carbide Market Updates, PCIM May 2014

Application of SiC

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Dr. kamel Madjour, Silicon Carbide Market Updates, PCIM May 2014

GaN Application Outlook

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Facility Overiew

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High Performance Power Electronics Lab an Air

Force, the State of Ohio, and industry sponsored

research center with a single focus of development

and implementation of wide bandgap based power

devices; the center has a vertically integrated team

with expertise spans from material growth to system

integration and 6 million dollar worth new

equipment and facility;

High Voltage Laboratory a 3600 square feet

facility that hosts the biggest arcs and sparks in the

U.S. universities;

Distributed Real Time Simulation Platform a

DoE sponsored real time simulation platform for

power electronics applications, featured in the New

York Times on Dec. 30 2010.

Facilities: High Speed Dynamometer

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• 30,000 RPM

• 350 kVA

• Vehicle and aerospace applications

High Voltage Facility

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The 3600 Square Foot Facility for Spark and Arc

DC sources up to 150,000

volts

AC sources up to 250,000

Vrms,

Surge voltage up to 1,000,000

volts, and

a Tesla transformer up to 3

million volts.

Test capabilities include withstand, partial discharge and breakdown tests on

gases, liquids and solids, electric and magnetic field tests, reduced-scale model

tests and shielding and attenuation experiments.

Facilities: Power Circuit and System Labs (Cont.)

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High Power Test Area (Up to 20 kV, 360 kVA)

Student Lounge

One of the Low Power Test Benches

Device Evaluation Bench

Real-time Teaching/Research Facility

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The Fully Equipped Teaching/Research Platform

One Simulation Tower with Surrounding

Benches.

Real Time Simulation: Executing a computer

model of a physical system at the same rate as

actual "wall clock" time. For example, if a

process takes 100 microsecond to finish in the

real-world, the simulation would take less or

equal to 100 microsecond.

System Introduction

4 Real Time Simulators;

8 CPUs with Totally 48 Cores: Intel Xeon Six-

Core, 3.33 GHz;

1 Hardware-in-the-Loop Box;

5 User Programmable FPGAs : 4 Spartan-3

and 1Virtex-6 ;

512 Digital IO and 256 Analog IO;

Dolphin Real Time Communication Link:

Latency as low as 0.2 us.

Project Examples: Quasi-Switched Capacitor

Resonant Converter

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Specifications:

Features:

Full soft switching with both types of

resonance achieved;

An 8-layer PCB with the planar transformer

integrated (designed with FEA tools)

100 V eGaN FETs (EPC2016) for all

switches;

A flat efficiency curve with a peak value of

96% at 0.7 MHz.

A 90-W, 88 V/19 V, 700-kHz QSC resonant

dc/dc converter

Item Descriptions

Rating Vin=88 V, Vout =19 V, Pout=90 W, fs =700 kHz

Transformer N=3:2:2, Lm=16 µH, Ls=25 nH

Capacitors C2=C3=C4=2 µF

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Two Recent WBG based Circuit Prototypes

Modular Switched Capacitor

Circuit

A Quasi-Switched Capacitor based

Isolated DC/DC Converter for EV/HEV

A 500 W GaN based Module.

290 mm

120 m

m

Secondary-side

Circuit

Primary-side

Circuit

Total Height:

38 mm

Planar Inductors &

Planar Transformer

Bidirectional

Power Flow

14 V power net

(9 ~ 16V)

HV dc bus

(200 ~ 450 V)Isolated DC/DC

converter

500 kHz

893 kHz

1 kW with

natural

convection

High Voltage and High Power Converters

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Coupled Inductor

Film capacitors Six Pack IGBT & Gate Drive

Single IGBT & Gate Drive

Heatsink, 10" by 10"

Bus Bars

3D Layout Design

85 kVA quasi Z-Source traction drive

300 kW Inverter for

the Integration of

Renewable Energy

30 kW SiC JFET based

Inverter

Electric Machines

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Strength:

Advanced electric machine design and control

Full test capability for control strategies

Selected ongoing projects and activities:

High speed machine for integrated starter and generator;

Two mechanical port machine for hybrid electric vehicle

powertrain;

Dual Excitation Brushless Reluctance Generator for Wind

Power.

Integrated starter and

generator

Double-fed machine for wind power without

permanent magnets and brushes/slip rings Dual Mechanic port machine

for hybrid electric vehicles

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The Vertical Integrated Diode Module

Capacitor

DC -

Heat Spreader

Heat Spreader

Diode

DC +

Capacitor

Diode

Diode Diode

TIM

TIM

Vertical diode module: packaging structure

Front view

Side view

Isotropic view

Input: A

Input: BDC +

DC -

Wireless connection

Improved EMI performance

Optimized parasitic

Potential for improved thermal

management

Research Directions: Circuit Topology

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Si-WBG Hybrid Circuit

Topologies

Inductorless or

capacitorless circuits

High voltage and high

power circuits

1. Modular

2. Multifunction

3. Multi-input and multi-output

Identifying brand new circuit topologies is becoming

more and more challenging;

but with WBG devices and new circuit techniques,

traditionally less popular circuit topologies could

outperform dominant circuit topologies;

also, brand new circuit topologies can be once again

expected.

Fact: Thousands of papers are presented each year in power electronics conferences, e.g. 534 papers

were presented in APEC 2014; But in the last two decades, only a handful new circuit topologies have

been widely accepted by academia; even fewer have been implemented by industry, e.g., LLC and

MMC.

Research Direction: Packaging and Integration

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• Packaging become the bottle-neck for the new WBG devices

• EMI and passive components build the barrier for higher performance and high-

density converter

• Reliability and packaging material system is also important for PE researchers

High-

Temperature

Packaging

High-

Frequency

Packaging

Passive

Packaging and

Integration

Improved Wirebond

Structure for EMI

and Hi-Rel

Wireless Structure

Integrated Filters

EMI-Less HDP

Converter

Module

Hi-Rel Converter

Module

Multi-Physcis

Modeling of HPD

Module

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Research Direction: Packaging and Integration

• Packaging Facilities

• Basic Packaging-Shop

• Manual Equipment

• Fits better for wirebond

structure

• Void-free process

• Semi-auto process

capability

• Wireless interconnection

• Reliability Testing and

Modeling

• Fine pitch process

• In-module passive

integration

• Advanced Thermal

Management

Facility/Equipment Development

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Existing

Voltage

Power

600 V 1200 V 1000 kV

100 VA

1000 VA

100 kVA

1 MVA

100 V 15 kV

Device Evaluation, HIL, Circuit Prototyping and testbed

Capability

300 kVA

Under Development

Future Development (CHIL

for MMC, MVA testing, etc.)

Needed Equipment:

30 kV device test platform

30 kV, 1 MW high power cycler

FPGA based large scale real-time simulation for Modular

Multilevel Converter and Multi-terminal DC (MTDC)

network

Department of Electrical and Computer Engineering

Center for High Performance Power Electronics

Questions

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