Poweredge t610 Technical Guidebook

Dell™ POWeReDGe™ T610 Technical GuiDebOOkinsiDe The POWeReDGe T610

Dell™ PowerEdge™ T610 Technical Guidebook

inTRODucTiOn 6

secTiOn 1. sysTem OveRvieW 7

A. Overview / Description 7

B. Product Features Summary 7

secTiOn 2. mechanical 9

A. Chassis Description 9

B. Dimensions and Weight 10

C. Front Panel View and Features 10

D. Back Panel View and Features 11

E. Power Supply Indicators 12

F. NIC Indicators 12

G. Side Views and Features 12

H. Internal Chassis Views 13

I. Rails and Cable Management 13

Rails 14

CMAs 14

J. Fans 14

K. Control Panel/LCD 15

L. Security 16

I. Cover Latch 16

II. Bezel 16

III. Hard Drive 16

IV. TPM 16

V. Power-Off Security 16

VI. Intrusion Alert 16

VII. Secure Mode 16

M. USB Peripherals 16

N. Battery 16

O. Field Replacement Units (FRU) 16

secTiOn 3. elecTRical 17

A. Volatility 17

B. ePPID (Electronic Piece Part Identification) 17

secTiOn 4. POWeR, TheRmal, acOusTic 17

A. Power Efficiencies 17

B. Power Supply Specifications 18

C. Environmental Specifications 19

D. Power Consumption Testing 20

E. Maximum Input Amps 20

TABLE OF CONTENTS


F. EnergySMART Enablement 20

G. Acoustics 20

secTiOn 5. blOck DiaGRam 22

secTiOn 6. PROcessORs 24


B. Features 24

C. Supported Processors 25

D. Processor Configurations 25

secTiOn 7. memORy 27


B. DIMMs Supported 27

C. Speed 28

D. Supported Configurations 30

E. Slots/Risers 31

F. Sparing 31

G. Mirroring 31

H. RAID 31

secTiOn 8. chiPseT 32


The Intel 5520 Chipset 32

IOH QuickPath Interconnect (QPI) 32

Intel Direct Media Interface (DMI) 32

PCI Express Generation 2 33

Intel I/O Controller Hub 9 (ICH9) 33

secTiOn 9. biOs 33


B. Supported ACPI States 34

C. I C (Inter-Integrated Circuit) 34

secTiOn 10. embeDDeD nics 35


secTiOn 11. i/O slOTs 35


B. Boot Order 38

secTiOn 12. sTORaGe 38


B. Drives 38

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C. RAID Configurations 40

D. Storage Controllers 41

I. SAS 6/iR Description 41

II. PERC 6/i Description 41

E. LED Indicators 42

F. Optical Drives 43

G. Tape Drives 43

secTiOn 13. viDeO 44


secTiOn 14. auDiO 44


secTiOn 15. Rack infORmaTiOn 44


B. Cable Management Arm (CMA) 45

C. Rails 45

secTiOn 16. OPeRaTinG sysTems 46


B. Operating Systems Supported 46

secTiOn 17. viRTualizaTiOn 47


secTiOn 18. sysTems manaGemenT 48


B. Server Management 48

Dell Systems Build and Update Utility 48

OpenManage Server Administrator 48

Management Console 48

Active Directory Snap-in Utility 48

Dell Systems Service Diagnostics Tools 48

eDocs 48

Dell Management Console DVD 48

Server Update Utility 48

C. Embedded Server Management 49

I. Unmanaged Persistent Storage 49

II. Lifecycle Controller / Unified Server Configurator 49

III. iDRAC6 Express 50

IV. iDRAC6 Enterprise 50


secTiOn 19. PeRiPheRals 52

A. USB Peripherals 52

B. External Storage 52

secTiOn 20. DOcumenTaTiOn 53

A. Overview, Description, and List 53

secTiOn 21. PackaGinG OPTiOns 53

aPPenDix a: Technical Specifications 54


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The Dell™ POWeReDGe™ T610The Dell PowerEdge T610 server is a key data center building block for IT professionals seeking the highest level of performance, availability, and expandability in a 2-socket server. Ideally suited for small and medium businesses and remote office customers, the T610 delivers enhanced virtualization, improved design, and energy efficiency in a design engineered to address current and future business needs.

strong iT foundationA solid IT foundation is critical for business success. The Dell PowerEdge T610 contributes to that foundation by offering many of the virtualization, system management, and usability capabilities you need while providing impressive power and thermals for overall energy efficiency. This mainstream two‑socket Intel®‑based tower server includes a rack‑mount option and supports mission‑critical applications and data processing. Built for reliability, this workhorse server helps deliver peace of mind and excellent value.

Purposeful DesignThe PowerEdge T610 takes advantage of Dell’s system commonality. Once your IT managers learn one system, they understand how to manage next‑generation Dell servers. Logical component layout and power supply placement also provide a straightforward installation and redeployment experience. Inspired by IT professionals, the PowerEdge T610 is built to simplify daily operations and maximize uptime.

energy-Optimized TechnologyUsing the latest Energy Smart technologies, the PowerEdge T610 helps reduce power consumption while increasing performance capacity over previous generations of Dell towers. Enhancements include efficient power supply units right‑sized for system requirements, effective system‑level design efficien‑cy, policy‑driven power and thermal management, and highly efficient standards‑based Energy Smart components. These features are designed to maximize energy usage across our latest core data center servers without compromising performance.

advanced virtualizationFeaturing Intel® Xeon® 5500 Series Processors, embedded hypervisors, 100% integrated I/O, and up to 100% more memory capacity than the previous server generations, the Dell PowerEdge T610 delivers better overall system performance and greater virtual machine‑per‑server capacity than ever before. With optional factory‑integrated virtualization capabilities, you get tailored solutions – built with the latest industry‑standard technologies from Dell and our trusted partners – which allow you to streamline deployment and simplify virtual infrastructures. Choose your hypervisor from market leaders such as VMware®, Citrix®, and Microsoft®, and enable virtualization with a few mouse clicks.

simplified systems managementGain control with the next‑generation Dell OpenManage™ suite of management tools. These tools provide efficient operations and standards‑based commands designed to integrate with existing systems for effective control. Dell Management Console (DMC) simplifies operations and creates stability by shrinking infrastructure management to one console. This console delivers a single view and a common data source into the entire infrastructure management. Built on Symantec® Management Platform, it has an easily extensible, modular foundation that can provide basic hardware management all the way up to more advanced functions, such as asset and security management. DMC is designed to reduce or eliminate manual processes enabling you to save time and money for more strategic technology usage. Secure, efficient, and more user friendly than its predecessors, the Dell Unified Server Configurator (USC) delivers “Instant On” integrated manageability through a single access point. You get quick, persistent access to the tool because it is embedded and integrated into the system for significant flexibility and Dell PowerEdge T610 Server capabilities. The USC is a one‑stop shop for deploying operating systems with built‑in driver installations, firmware updates, hardware configuration, and issue diagnoses.


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secTiOn 1. sysTem OveRvieW

a. Overview / DescriptionThe PowerEdge T610 will lead Dell's 11th Generation PowerEdge portfolio in key areas of differentiation, primarily: •Virtualization •Power,thermal,andefficiency •Systemsmanagement •Usability

b. Product features summary

feaTuRe DeTails

ProcessorSingle or Dual Intel® 5500 series (Nehalem EP) Xeon® ProcessorSupport for 60W, 80W, 95W processors

Front Side Bus Intel® QuickPath Interconnect (QPI) links @ maximum of 6.4 GT/s

Number of Processors 2S

Number of Cores 2 or 4 cores

L2/L3 Cache 4MB and 8MB

Chipset Intel® 5520 Chipset

DIMMs/Speed

12 RDIMM or UDIMM DDR3 – 800, 1066, 1333 MHz

Memory module capacities of 1GB and 2GB UDIMMs; and 2GB, 4GB, or 8GB RDIMMs

Min/Max RAM 1GB / 96GB

Hard Drive Bays

Supports 2.5" or 3.5" HDD form factors

Hot-plug HDDs

Up to eight 3.5" or 2.5" SAS or SATA hard drives

SAS/SATA mixing with two 2.5" SAS hard drives and up to six 2.5" SATA hard drives

SAS/SATA mixing with two 3.5" SAS hard drives and up to six 3.5" SATA hard drives

Hard Drive Types SAS, SATA, Near-line SAS, and SSD

Ext Drive Bay(s)External USB floppyOptional SATA half-height optical drives such as DVD-ROM or DVD+/-RW Optional SATA or SCSI half-height (or full-height) tape back-up drive

Int. Hard Drive Controller SAS6iR or PERC6i

Opt. Hard Drive Controller PERC 5/E and PERC 6/E

BIOS 4MB flash for system and Video BIOS


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feaTuRe DeTails

Video Integrated Matrox G200 , 8MB shared video memory

AvailabilityHot-Plug Hard Drives, Hot-Plug Power; Memory SDDC, ECC, Control Line Parity, Optional redundant cooling

Server Management Dell™ Embedded Server Management provides IPMI 2.0 compliance

I/O Slots

5 PCIe Gen2Two full-height, full-length x8 link (slot 2 and 3)Three full-height, half-length x4 link (slot 1,4 and 5)

Note: All slots support up to 25W, but a maximum of two 25W cards and three 15W cards may be installed at any time, regardless of the slots they are installed in

The storage controller card has a dedicated slot (PCIe x4) apart from the available 5 PCIe slots

RAID PERC 6/I, SAS 6iR and PERC 6/E

Embedded NIC2 x TOE BRCM 5709C (Dual-port Broadcom 5709C Gigabit network controller with iSCSI hardware key option)

USBTotal: 9 , USB 2.0 compliant6 in the back, 2 in the front, 1 internal

Power Supplies

Hot-plug redundant PSUs

2 x 570W (Energy Smart PSU ) (or) 2 x 870W (High Output PSU)

Voltage is 90–264 VAC, auto ranging, 47-63HzHeat dissipation – 2968.6 BTU/hr maximum (High Output), 1944.9 BTU/hr maximum (Energy Smart)

Maximum inrush current – May reach 55A per power supply for 10ms or less

Front Panel

The system control panel is located on the front of the system chassis to provide user access to buttons, display, and I/O interfaces

LCD on front panel for error messaging

System ID

System ID switch with LED indicator at rear side and LCD indication at front side

128x20 pixel LCD with controls on front panel for system ID and error messaging

LCD panel allows orientation for tower or rack horizontal screen view

System ID for the PowerEdge T610 is 0x0237

Fans Optional Redundant Cooling. (Rear cooling fans with redundancy option)

Chassis Tower or 5U rack mount


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secTiOn 2. mechanical

a. chassis DescriptionThe PowerEdge T610 is a Tower or 5U rack‑mount chassis. The updated design includes a new LCD, bezel and hard‑drive carriers. Additional changes include tool‑less rack latches, Embedded NIC 0/iDRAC MAC address labels; support internal persistent storage (internal USB and SD card slots); and updated efficient power supplies.

PowerEdge T610 Tower Chassis

PowerEdge T610 Rack Chassis


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b. Dimensions and WeightRack: Height 21.77cm (8.57") Width 48.25cm (19.00") (includes left & right rack latches) Depth 62.10cm (24.40") (includes PSU with bezel) Weight (maximum config) 35 kg (77 lbs) Weight (empty) 20.2 kg (44.53 lbs)

Tower: Height 44.10cm (17.40") (with feet) Width 27.40cm (10.80") (with feet) Depth 62.10cm (24.40") (includes PSU with bezel) Weight (maximum config) 35 kg (77 lbs) Weight (empty) 20.2 kg (45.30 lbs)

c. front Panel view and features

The following components and connectors are located on the front of the PowerEdgeT610: •Poweronindicator,powerbutton •USBconnectors.ConnectsUSBdevicestothesystem.Two4-pin,USB2.0compliant •LCDmenubuttons.AllowsyoutonavigatethecontrolpanelLCDmenu •LCDpanel.ProvidessystemID,statusinformation,andsystemerrormessages •Non-maskableInterrupt(NMI)button •Ambienttemperaturesensor •Systemidentificationbutton •Opticaldrive(optional) •Harddrives


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The following components and connectors are located on the rear panel of the PowerEdge T610: •NIC:TwoRJ-45forintegrated10/100/1000MbpsEthernet •Serialconnector:9-pin,DTE,16550compatible •USB:Six4-pin,USB2.0compliant •Video:15-pinVGA •OptionalexternalVFlashcard:OneoptionalflashmemorycardslotwithiDRAC6Enterprise •RearsystemIDbutton •OptionalRJ-45MEAconnector •Rearsystemstatus/IDblue/amberLED

D. back Panel view and features


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f. nic indicators

e. Power supply indicatorsThe PSUs on the PowerEdge T610 have one status bi‑color LED: green for AC power present and amber for a fault.

leD POWeR suPPly sTaTus

AC Power is not present

AC Power is present

Fault of any kind is detected

DC Power is applied to the system

PSU mismatch (when hot-added/swapped)

Table: Power Supply Indicator

inDicaTOR inDicaTOR cODe

Link and Activity indicators are off The NIC is not connected to the network

Link indicator is green The NIC is connected to a valid network link at 1000 Mbps

Link indicator is amber The NIC is connected to a valid network link at 10/100 Mbps

Link indicator is green blinking Network data is being sent or received

G. side views and features


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h. internal chassis views

i. Rails and cable managementRack installation components such as rails are provided with the PowerEdge T610 Rack Kit. The rack installation components are with sliding rack mount with latest generation Cable Management Arm (CMA). The PowerEdge T610 features slam latches to offer easier removal from the rack.

When the system is installed in a rack, only Dell‑approved CMAs should be installed behind the chassis.


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J. fans

Two or four 92mm single‑rotor fans are in a module that is installed in the cooling shroud – fan connectors blind mate into the planar when the cooling shroud is installed. Each fan has a single wire harness that plugs into the planar fan connectors (FAN1 through FAN4). In a non‑redundant configuration, the two fans that need to be installed are the ones that are closest to the rear of the chassis.

The iDRAC6 controls and monitors the speed of the fans. A fan speed fault or over‑temperature condition results in a notification by iDRAC6.

The PowerEdge T610 Power Supply Units have integrated fans. They are cooled by fans in the front section. The system requires a blank module in place of the empty power supply slot.

All system fans are PWM fans. Redundant cooling (optional) is supported with one fan failing at a time.

Rails •Enablethereplacementofthumbscrewswithslamlatchesonthechassisforeasierstowingin

the rack. •Includethenew,simple,andintuitiveReadyRail™tool-lessrackinterfaceforsquare-holeand

round‑hole racks. •Providesignificantlyimprovedcompatibilitywithnon-Dellracks. •StaticrailsfortheR610&R710fitinalltypesoffour-postandtwo-postracksavailableinthe

industry including four‑post threaded hole racks.

CMAs •ProvidemuchlargerventpatternforimprovedairflowthroughtheCMA. •IncludeacommonsupporttrayforeliminatingCMAsag. •Replacedtiewrapswithhookandloopstrapstoeliminateriskofcabledamageduringcycling. •Maintainkeyfeatureofbeingfullyreversiblewithnoconversionrequired.


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k. control Panel/lcDThe system control panel is located on the front of the system chassis to provide user access to buttons, display, and I/O interfaces.

Features of the system control panel include: •ACPI-compliantpowerbuttonwithanintegratedgreenpowerLED(controlledbyESM) •128x20pixelLCDpanelwithcontrols •Twonavigationbuttons •Oneselectbutton •OnesystemIDbutton •Non-MaskableInterrupt(NMI)button(recessed) •Ambienttemperaturesensor •TwoexternalUSB2.0connectors

The LCD panel is a graphics display controlled by the iDRAC6, unlike the 9G panel which had its own CPLD. Error codes can be sent to the display by either iDRAC6 or BIOS.

The BIOS will have the ability to enter a "Secure Mode" through setup, which will lock the power and NMI buttons. When in this mode, pressing either button has no effect but does not mask other sources of NMI and power control.

Figure: PowerEdge T610 LCD Panel


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l. securityI. Cover LatchA tooled latch is integrated in the side cover to secure it to the tower chassis. A locked bezel secures the cover latch.

II. BezelA metal bezel is mounted to the chassis front to provide the Dell ID. A lock on the bezel is used to protect unauthorized access to system hard drives and the system cover. System status (via the LCD) is viewable when the bezel is installed.

The bezel is standard for both the PowerEdge T610 tower and rack system.

III. Hard DriveThe front bezel of the system contains a lock. A locked bezel secures the system hard drives.

IV. TPMThe TPM is used to generate/store keys, protect/authenticate passwords, and create/store digital certificates. TPM can also be used to enable the BitLocker™ hard drive encryption feature in Windows Server® 2008.

V. Power-Off SecurityThere is a setting in the CMOS setup that disables the power button function such that the power switch cannot be accidentally activated.

VI. Intrusion AlertA switch located on the cooling shroud is used to detect chassis intrusion. When the cover is opened, the switch circuit closes to indicate intrusion to ESM. When enabled, the software can provide notification to the customer that the cover has been opened.

VII. Secure ModeBIOS has the ability to enter a secure boot mode via setup. This mode includes the option to lock out the power and NMI switches on the control panel or set up a system password. See the PowerEdge T610 BIOS Specification for details.

m. usb PeripheralsThe PowerEdge T610 system supports the following USB devices: •DVDdrive(bootable;requirestwoUSBports) •USBKey(bootable) •Keyboard(onlyoneUSBkeyboardissupported) •Mouse(onlyoneUSBmouseissupported)

n. batteryA replaceable coin cell CR2032 3V battery is mounted on the planar to provide back‑up power for the Real‑Time Clock and CMOS RAM on the ICH.

O. field Replaceable units (fRu)The planar contains a serial EEPROM to store FRU information including Dell part number, part revision level, and serial number. The backplane SEP and the power supply microcontroller are also used to store FRU data.


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secTiOn 3. elecTRical

a. volatilitySee Appendix A of this Technical Guidebook.

b. ePPiD (electronic Piece Part identification) ePPID is an electronic repository for information from the PPID label that is stored in non‑volatile RAM. The BIOS reports the ePPID information using SMBIOS data structures. ePPID includes the following information: •Dellpartnumber •Partrevisionlevel •Countryoforigin •SupplierIDcode •Datecode(dateofmanufacture) •Uniquesequencenumber

cOmPOnenT DescRiPTiOn sTORaGe lOcaTiOn

bOaRDs

Planar PWA, PLN, SV, DELL, T610 iDRAC FRU

8" x 2.5" Backplane PWA, BKPLN, SV, T610, 2.5SASX8 SEP

8" x 3.5" Backplane PWA, BKPLN, SV, T610, 3.5SASX8 SEP

POWeR suPPlies

870W PowerEdge™ PSUPWR SPLY, 870W, RDNT, ASTEC PSU Microcontroller

PWR SPLY, 870W, RDNT, DELTA PSU Microcontroller

570W Energy Smart PSUPWR SPLY, 570W, RDNT, ASTEC PSU Microcontroller

PWR SPLY, 570W, RDNT, COLDWATT PSU Microcontroller

sTORaGe caRDs

PERC 6/i Integrated ASSY, CRD, PERC6I-INT, SAS, NOSLED FRU

PERC 6/E External PWA, CTL, PCIE, SAS, PERC6/E,ADPT FRU

SAS 6/iR Integrated PWA, CTL, SAS, SAS6/IR, INTG FRU

secTiOn 4. POWeR, TheRmal, acOusTic

a. Power efficienciesOne of the main features of the 11th generation of PowerEdge servers is enhanced power efficiency. The PowerEdge T610 achieves higher power efficiency by implementing the following features:

•User-selectablepowercap(subsystemswillthrottletomaintainthespecifiedpowercap) •Improvedpowerbudgeting •Largerheat-sinksforprocessorsandchipset •Accurateinlettemperature

Table: ePPID Support list


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•PSU/VRefficiencyimprovements •Switchingregulatorsinsteadoflinearregulators •Closedloopthermalthrottling •Increasedrearventing/3Dventing •PWMfanswithanincreasednumberoffanzonesandconfiguration-dependentfanspeeds •UseofDDR3memory(lowervoltagethanDDR2,UDIMMsupport) •CPUVRdynamicphaseshedding •Randomtimeintervalforsystemstartingallowinganentireracktopoweronwithout

exceeding the available power •Allowsanentireracktopoweronwithoutexceedingtheavailablepower •BIOSPower/Performanceoptionspage •BIOS-basedCPUP-statemanager(powermanagementinavirtualizedenvironment) •Abilitytoslowdownorthrottlememory •AbilitytodisableaCPUcore •Ability to turn off items not being used (i.e., USB ports, Embedded NICs, unused PCIe lanes, etc.) •OptiontorunPCIeatGen1speedsinsteadofGen2

b. Power supply specificationsThe base redundant system consists of one hot‑swap 570W Energy Smart power supply in a 1+1 configuration. An 870W High Output power supply is also available.

The power supplies connect indirectly to the planar via the Power Distribution Board (PDB). There is a power cable that connects between the PDB and the backplane. Another cable also connects the PDB to the optical and/or tape drives. The PS bay sheet metal is formed as key to prevent unsupported power supply from being installed in a PowerEdge T610 system.

Starting with this generation of Dell servers, the power supplies no longer have a FRU (Field Replaceable Units) EEPROM; FRU data is now stored in the memory of the PSU Microcontroller. Additionally, the PSU Firmware can now be updated by the iDRAC over the PMBus. Power is “soft‑switched,” allowing power cycling via a switch on the front of the system enclosure, or via software control (through server management functions). The power system is compatible with industry standards, such as ACPI and the Microsoft® Windows Server® H/W Design Guide.

In a single power supply configuration, the power supply is installed in PS1 location and a blank module (metal cover) is installed in PS2 location for factory consistency. Electrically, the system can operate with a single power supply in either bay.

Figure: PowerEdge T610 Power Supply


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ac POWeR suPPly (PeR POWeR suPPly)

Wattage870W (high output)

570W (Energy Smart)

Voltage 90-264 VAC, autoranging, 47-63Hz

Heat Dissipation2968.6 BTU/hr maximum (high output)

1944.9 BTU/hr maximum (Energy Smart)

Maximum Inrush CurrentUnder typical line conditions and over the entire system ambient operating range, the inrush current may reach 55A per power supply for 10ms or less

c. environmental specifications

TemPeRaTuRe

Operating 10° to 35°C (50° to 95°F)

Note: For altitudes above 2950 feet, the maximum operating temperature is de-rated 1ºF/550 ft.

Storage –40° to 65°C (–40° to 149°F)

RelaTive humiDiTy

Operating 20% to 80% (non-condensing) with a maximum humidity gradation of 10% per hour

Storage 5% to 95% (non-condensing) with a maximum humidity gradation of 10% per hour

maximum vibRaTiOn

Operating 0.26 Gms (10 to 350Hz) for 5 mins. in operational orientations

Storage 1.54 Gms (10 to 250Hz) for 10 mins. in all orientations

maximum shOck

Operating Half sine shock in all operational orientations of 31G plus or minus 5% with a pulse duration of 2.6ms plus minus 10%

Storage Half sine shock on all six sides of 71G plus or minus 5% with a pulse duration of 2ms plus minus 10%

alTiTuDe

Operating –16 to 3048 m (–50 to 10,000 ft)

Note: For altitudes above 2950 feet, the maximum operating temperature is de-rated 1ºF/550 ft.

Storage Storage: –16 to 10,600 m (–50 to 35,000 ft)


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e. maximum input ampsMax input current (High Output): 12A @ 90 VAC and 6A @ 180 VAC

Max input current (EnergySmart): 7.8A @ 90 VAC and 3.9A @ 180 VAC

f. energysmaRT enablementThe 11G family implements aspects of Dell’s new Energy Smart strategy.Major differences include: •DiscontinuingEnergySmartbrandedserverswithlimitedconfigurationsandinsteadoffering

Energy Smart components on a portfolio level, such as high capacity and Energy Smart power supplies

•Allowingcustomerstoordereitheralowestpowerfootprintconfigurationorabest performance‑per‑watt configuration

•OfferingEnergySmart-selectedcomponentssuchasDIMMsorharddrives,butnot"cherry picking" or screening individual manufacturer’s components based on energy consumption

G. acousticsThe acoustical design of the PowerEdge T610 reflects the following: •AdherencetoDell’shighsoundqualitystandards.Soundqualityisdifferentfromsoundpower

level and sound pressure level in that it describes how humans respond to annoyances in sound, like whistles, hums, etc. One of the sound quality metrics in the Dell specification is prominence ratio of a tone, and this is listed in the table below.

•Officeenvironmentacoustics.ComparethevaluesforLpAminthetablebelowandnotethatthey are much lower than ambient measurements of typical office environments.

•Configurableforminimumnoise.Dell’sadvancedthermalcontrolresultsintheabilityoftheacoustically sensitive user to configure for minimum noise. Some of the perhaps less intuitive but potentially important decision‑making configuration examples are listed below.

feaTuRe eneRGy smaRT Psu hiGh OuTPuT Psu

Dimensions L-206.4 mm1 x W-67.5 mm x H-76.5 mm

Status Indicators 1 x bi-color Light Emitting Diode

Integrated Fans 1 x 60 mm

Fixed Input Plug IEC-C14

AC Cord Rating 15 Amps @ 120 VAC, 10 Amps @ 240 VAC

Input Voltage 90 – 264 VAC

Auto-ranging Yes

Line Frequency 47 – 63Hz

Maximum Inrush Current 55 Amps per supply for 10 ms or less

Hot-Swap Capability Yes

Output Power 570 Watts 870 Watts

Maximum Heat Dissipation 1944.9 BTU per hour 2968.6 BTU per hour

Efficiency (20% - 100% Load)

86.9 – 90.5% @ 115 VAC88 – 92% @ 230 VAC

85 – 88% @ 115 VAC87 – 90% @ 230 VAC

1. Does not include the power supply handle or ejection tab

D. Power consumption Testing


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•Fanspeedhencenoiselevelfortheredundantfanconfiguration(fourfans)isslightlylower (~2 dBA) than that for the nonredundant fan configuration (two fans).

•Noiselevelsforthe2.5”chassisaregenerallylower(~2 dBA) than those for the 3.5” chassis.

•Inthe3.5”chassis,fanspeedshencenoiselevelsarelower(~3 dBA) when fewer than three Hard Disk Drives are installed.

•Lower speed Hard Disk Drives (e.g., 10k) are generally quieter (~1‑2 dBA) than 15k drives. •Mosttypicalconfigurationswillperformaslistedinthetablebelow.However,someless

typical configurations and components can result in higher noise levels. Some specific examples are configurations with greater than three PCI cards, a 10Gb/E card, or a Perc6/E card.

•(PleasenotethatdBAvaluesarenotadditive,e.g.,incorporatingachangefor2dBAreduction and another change for 3 dBA will not generally produce a 5 dBA reduction.)

•Noiserampanddescentatbootup.Fanspeedshencenoiselevelsrampduringtheboot process in order to add a layer of protection for component cooling in the case that the system were not to boot properly.

The PowerEdge T610 with redundant fan configuration (4x RK388 fans), redundant power configuration (2x 870W FU096 power supplies), 2x CPUs (2.40 GHz, Quad‑Core E5530), 5x 2GB DIMMs, 1x DVD drive, 2x 2‑Port X3959 NIC cards, Perc 6i card, and 4x hard disk drives described below:

POWeReDGe T610 – 2.5" chassis WiTh 4x hDDs. The maximum values fROm TWO DiffeRenT cOnfiGuRaTiOns TesTeD (4x 10kRPm 147Gb xk112 sas hDDs; 4x 15kRPm 76Gb RW675 sas hDDs) aRe lisTeD.

cOnDiTiOn in 23+- 2° c ambienT lwa-ul, bels lpa, dba TOnes

Standby 3.0 15 No prominent tones

Idle 5.2 36 No prominent tones

Active Hard Disk Drives 5.3 36 No prominent tones

Stressed Processor 5.3 36 No prominent tones

POWeReDGe T610 – 3.5" chassis WiTh 4x 15kRPm 300Gb GP880 sas hDDs.

cOnDiTiOn in 23+- 2° c ambienT lwa-ul, bels lpa, dba TOnes

Standby 3.0 15 No prominent tones

Idle 5.5 38 No prominent tones

Active Hard Disk Drives 5.6 39 No prominent tones

Stressed Processor 5.5 38 No prominent tones

DefinitionsStandby: AC Power is connected to Power Supply Units but system is not turned on.Idle: Reference ISO7779 (1999) definition 3.1.7; system is running in its OS but no other specific activity.Active Hard Drives: An operating mode per ISO7779 (1999) definition 3.1.6; Section C.9 of ECMA‑74 9th ed. (2005) is followed in exercising the hard disk drives.


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Stressed Processor: An operating mode per ISO7779 (1999) definition 3.1.6; SPECPower set to 50% loading is used.LwA-UL: The upper limit sound power level (LwA) calculated per section 4.4.2 of ISO 9296 (1988) and measured in accordance with ISO7779 (1999).LpA: The average bystander position A‑weighted sound pressure level calculated per section 4.3 of ISO9296 (1988) and measured in accordance with ISO7779 (1999). The system is placed on the floor.Tones: Criteria of D.5 and D.8 of ECMA‑74 9th ed. (2005) are followed to determine if discrete tones are prominent. The system is placed in center of ISO7779 table and acoustic transducer is at front operator position, ref ISO7779 (1999) Section 8.6.1, Position P4.

The PowerEdge T610 motherboard dimensions are 17.25" x 15". The following figure shows the main components on the PowerEdge T610 planar:

Figure: PowerEdge T610 Main Components

section 5. block Diagram

The PowerEdge T610 electrical system consists of the planar subsystem with TPM, iDRAC6 Enterprise, and iSCSI key options, PDB and power supply subsystem, control panel, SAS backplane, and storage (PERC6/i or SAS6/iR) card. The features and functions of these electrical subsystems are detailed below.


23

1. Internal SD Module (Embedded Hypervisor Optional)

2. DIMM Slots3. Intel 5520 Chipset4. Storage Card5. iDRAC6 Express / Lifecycle Controller6. PCIe Gen2 Slots

7. Heat Sink/Processor Socket 8. Embedded Network Interface Ports9. Broadcom 5709c Network Interface Chip10. iDRAC6 Enterprise (Optional)11. Dual Redundant Power Supplies (Optional)12. DIMM Slots13. Heat Sink/Processor Socket

2

3

5

6

7910 8

4

11

12

1

13


24

secTiOn 6. PROcessORs

a. Overview / DescriptionThe Intel® 5500 series 2S processor (Nehalem ‑ EP), is the microprocessor designed specifically for servers and workstation applications. The processor features quad‑core processing to maximize performance and performance/watt for data center infrastructures and highly dense deployments. The Nehalem‑EP 2S processor also features Intel’s Core™ micro‑architecture and Intel 64 architecture for flexibility in 64‑bit and 32‑bit applications and operating systems.

The 5500 series 2S processor (Nehalem EP) utilizes a 1366‑contact Flip‑Chip Land Grid Array (FC‑LGA) package that plugs into a surface mount socket. PowerEdge T610 provides support for up to two 5500 series 2S processors (Nehalem EP).

b. featuresKey features of the 5500 series 2S processor (Nehalem EP) include: •Fourortwocoresperprocessor •Twopoint-to-pointQuickPathInterconnectlinksatupto6.4GT/s •1366-pinFC-LGApackage •45nmprocesstechnology •Noterminationrequiredfornon-populatedCPUs(mustpopulateCPUsocket1first) •Integratedthree-channelDDR3memorycontrolleratupto1333MHz •Compatiblewithexistingx86codebase •MMX™support •ExecuteDisableBitIntelWideDynamicExecution •Executesuptofourinstructionsperclockcycle •SimultaneousMulti-Threading(Hyper-Threading)capability •SupportforCPUTurboMode(oncertainSKUs) •IncreasesCPUfrequencyifoperatingbelowthermal,power,andcurrentlimits •StreamingSIMD(SingleInstruction,MultipleData)Extensions2,3,and4 •Intel64TecnologyforVirtualization •IntelVT-xandVT-dTechnologyforVirtualization •Demand-basedswitchingforactiveCPUpowermanagementaswellassupportforACPI

P‑States, C‑States, and T‑States

nehalem-eP 2s PROcessOR

feaTuRes

Cache Size 32KB instruction, 32KB data, 4 or 8MB (shared)

Multi-processor Support

1-2 CPUs

Package LGA1366

Table: Nehalem-EP Features


25

mODel sPeeD POWeR cache cORes

X5570 2.93GHz 95W 8M 4

X5560 2.80GHz 95W 8M 4

X5550 2.66GHz 95W 8M 4

E5540 2.53GHz 80W 8M 4

E5530 2.40GHz 80W 8M 4

E5520 2.26GHz 80W 8M 4

L5520 2.26GHz 60W 8M 4

E5506 2.13GHz 80W 4M 4

L5506 2.13GHz 60W 4M 4

E5504 2.00GHz 80W 4M 4

E5502 1.86GHz 80W 4M 2

c. supported Processors

D. Processor configurationsSingle CPU Configuration The PowerEdge T610 is designed such that a single processor placed in the CPU1 socket will function normally, however PowerEdge T610 systems require a CPU blank in the CPU2 socket for thermal reasons. The system will be held in reset if a single processor is placed in the CPU2 socket.

Performance EnhancementsIntel Xeon® 5500 Series Processor (Nehalem-EP)

Intel® Turbo Boost Technology

Increases performance by increasing processor frequency and enabling faster speeds when

conditions allow

Higher performance on demand

All cores operate at rated

frequency

Normal

Co

re 1

Co

re 1

Co

re 2

Co

re 3

All cores operate

at higher frequency

4C Turbo

Co

re 0

Co

re 1

Co

re 2

Co

re 3

Fewer cores may operate

at even higher frequencies

<4C Turbo

Co

re 0

Co

re 1

Frequ

ency

Intel® Hyper-Threading Technology

Increases performance for threading applications delivering greater throughput and responsiveness

Higher performance for threaded workloads


26

Intel® Turbo Boost Technology

Improves application responsiveness Delivers higher processor frequency on demand

Cores / Threads

2(2 socket/HT on)

Core 0

IDLE

IDLE

IDLE

Core 0

IDLE

IDLE

IDLE

up to 10%

for 2 software threads

Benefit

up to 6%†

for 16 concurrent software threads

16(2 socket/HT on)

BASE FreqTURBO Freq

2.93 GHz

3.33 GHz

2.93 GHz

3.20 GHzCore

0

Core 2

Core 1

Core 3

Core 0

Core 2

Core 1

Core 3

OR

CPU Power Voltage Regulation Modules (EVRD 11.1) Voltage regulation to the 5500 series 2S processor (Nehalem EP) is provided by EVRD (Enterprise Voltage Regulator‑Down). EVRDs are embedded on the planar. CPU core voltage is not shared between processors. EVRDs support static phase shedding and power management via the PMBus.

mODel sPeeD POWeR cache cORes

X5570 2.93GHz 95W 8M 4

X5560 2.80GHz 95W 8M 4

X5550 2.66GHz 95W 8M 4

E5540 2.53GHz 80W 8M 4

E5530 2.40GHz 80W 8M 4

E5520 2.26GHz 80W 8M 4

L5520 2.26GHz 60W 8M 4

E5506 2.13GHz 80W 4M 4

L5506 2.13GHz 60W 4M 4

E5504 2.00GHz 80W 4M 4

E5502 1.86GHz 80W 4M 2


27

secTiOn 7. memORy

a. Overview / DescriptionThe PowerEdge T610 utilizes DDR3 memory providing a high performance, high‑speed memory interface capable of low latency response and high throughput. The PowerEdge T610 supports Registered ECC DDR3 DIMMs (RDIMM) or Unbuffered ECC DDR3 DIMMs (UDIMM).

Key features of the PowerEdge T610 memory system include: •Registered(RDIMM)andUnbuffered(UDIMM)DDR3technology •Eachchannelcarries64dataandeightECCbits •Supportforupto96GBofRDIMMmemory(with8GBRDIMMs) •Supportforupto24GBofUDIMMmemory(with2GBUDIMMs) •Supportfor1066/1333MHzsingleanddualrankDIMMs •Supportfor1066MHzquadrankDIMMs •SingleDIMMconfigurationwithDIMMatsocketDIMMA1 •SupportODT(OnDieTermination) •Clockgating(CKE)toconservepowerwhenDIMMsarenotaccessed •DIMMswillenteralow-powerself-refreshmode •I2CaccesstoSPDEEPROMandthermalsensors •SingleBitErrorCorrection •SDDC(SingleDeviceDataCorrection–x4orx8devices) •MultiBitErrorDetection •SupportforClosedLoopThermalManagementonRDIMMsandUDIMMs •SupportforAdvancedECCmode •SupportforMemoryOptimizedmode •SupportforMemoryMirroring •NosupportforMemorySparing

b. Dimms supportedThe DDR3 memory interface consists of three channels, with up to two RDIMMs or UDIMMs per channel for single/dual rank and up to two RDIMMs per channel for quad rank. The interface uses 2GB, 4GB, or 8GB RDIMMs; only 1GB or 2GB UDIMMs are supported. The memory mode is dependent on how the memory is populated in the system: •ThreechannelsperCPUpopulatedidentically •Typically,thesystemwillbesettoruninMemoryOptimized(IndependentChannel)

mode in this configuration. This mode offers the most DIMM population flexibility and system memory capacity, but offers the least number of RAS (reliability, availability, service) features.

•Allthreechannelsmustbepopulatedidentically.

•ThefirsttwochannelsperCPUpopulatedidenticallywiththethirdchannelunused •Typically,twochannelsoperateinAdvancedECC(Lockstep)modewitheachotherby

having the cache line split across both channels. This mode provides improved RAS features (SDDC support for x8‑based memory).

•ForMemoryMirroring,twochannelsoperateasmirrorsofeachother—writesgotoboth channels and reads alternate between the two channels.

•OnechannelperCPUpopulated •ThisisasimpleMemoryOptimizedmode.Nomirroringorsparingissupported.

The PowerEdge T610 memory interface supports memory demand and patrol scrubbing, single‑bit correction and multi‑bit error detection. Correction of a x4 or x8 device failure is possible through the


28

Advanced ECC mode and the SDDC code. Correction of a x4 device failure is possible through Memory Optimized mode.

•If DIMMs of different speeds are mixed, all channels will operate at the fastest common frequency. •RDIMMsandUDIMMscannotbemixed. •Ifmemorymirroringisenabled,identicalDIMMsmustbeinstalledinthesameslotsacrossboth

channels. The third channel of each processor is unavailable for memory mirroring. •The first DIMM slot in each channel is color‑coded with white ejection tabs for ease of installation. •TheDIMMsocketsareplaced450mils(11.43mm)apart,center-to-centerinordertoprovide

enough space for sufficient airflow to cool stacked DIMMs. •The PowerEdge T610 supports up to 12 DIMMs. DIMMs must be installed in each channel starting

with the DIMM slot farthest from the processor. Population order is identified by the silkscreen designator and the System Information Label (SIL) label located on the cooling shroud.

•Independent:{1,2,3},{4,5,6} •LocksteporMirrored:{2,3},{5,6} •QuadRankorUDIMM:{1,2,3},{4,5,6}

c. speedThe memory frequency is determined by a variety of inputs: •SpeedoftheDIMMs •SpeedsupportedbytheCPU •ConfigurationoftheDIMMs

NOTE: For Quad Rank DIMMs mixed with Single‑ or Dual‑Rank DIMMs, the QR DIMM needs to be in the slot with the white ejection tabs (the first DIMM slot in each channel). There is no requirement for the order of SR and DR DIMMs


29

Dimm TyPe Dimm 0 Dimm 1 Dimm 2 numbeR Of Dimms 800 1066 1333

UDIMM

SR 1

DR 1

SR SR 2

SR DR 2

DR DR 2

RDIMM

SR 1

DR 1

QR 1

SR SR 2

SR DR 2

DR DR 2

QR SR 2

QR DR 2

QR QR 2

SR SR SR 3

SR SR DR 3

SR DR DR 3

DR DR DR 3

Note: For QR mixed with a SR/DR DIMM, the QR needs to be in the white DIMM connector. There is no requirement in the order of SR and DR DIMMs.

NOTE: For Quad Rank DIMMs mixed with single- or dual-rank DIMMs, the QR DIMM needs to be in the slot with the white ejection tabs (the first DIMM slot in each channel). There is no requirement for the order of SR and DR DIMMs

Supported

Not Supported


30

memORy mODe

RDimmmemORymODule

size

memORy sOckeTs

sinGle PROcessOR Dual PROcessOR

1 2 3 Physical memORy

(Gb)

available memORy

(Gb)

Physical memORy

(Gb)

available memORy

(Gb)4 5 6

OPT

imiz

eR

2GB

x 2

All

4

All

x x 4 8

x x x x 6 12

x x 4 8

x x x x 8 16

x x x x x x 12 24

4GB

x 4

All

8

All

x x 8 16

x x x x 12 24

x x 8 16

x x x x 16 32

x x x x x x 24 48

8GBa

x 8

All

16

All

x x 16 32

x x x x 24 48

x x 16 32

x x x x 32 64

x x x x x x 48 96

aD

van

ceD

ec

cb O

R

miR

RO

Rin

G 2GB Nonex x 4 2 8 4

x x x x 8 4 16 8

4GB Nonex x 8 4 16 8

x x x x 16 8 32 16

8GB Nonex x 16 8 32 16

x x x x 32 16 64 32a When availableb Requires x4‑ or x8‑based memory modules

D. supported configurations

Table: RDIMM Memory Configurations (Each Processor)


31

memORy mODe

memORy mODule

size

memORy sOckeTs

sinGle PROcessOR Dual PROcessOR

1 2 3 Physical memORy

(Gb)

available memORy

(Gb)

Physical memORy

(Gb)

available memORy

(Gb)4 5 6

OPT

imiz

eR

1GB

x 1

All

2

All

x x 2 4

x x x 3 6

x x x x 4 8

x x x x x x 6 12

2GB

x 2

All

4

All

x x 4 8

x x x 6 12

x x x x 8 16

x x x x x x 12 24

aD

van

ceD

ec

ca

1GBNone x x 2

All All Allx x x x 4

2GBNone x x 4

All All Allx x x x 8

miR

RO

Rin

G

1GBNone x x 2 1 4 2

x x x x 4 2 8 4

2GBNone x x 4 2 8 4

x x x x 8 4 16 8

a Requires x4‑ or x8‑based memory modules

Table: UDIMM Memory Configurations (Each Processor)

e. slots / RisersThe PowerEdge T610 has 12 DIMM slots for memory. It does not have any riser cards for DIMM population.

f. sparingThe PowerEdge T610 does not support memory sparing.

G. mirroringThe PowerEdge T610 supports memory mirroring in certain configurations, refer to embedded memory matrix spreadsheet in section 9‑H for supported configurations.

h. RaiDThe PowerEdge T610 supports memory mirroring.


32

secTiOn 8. chiPseT

a. Overview / DescriptionThe PowerEdge T610 planar incorporated the Intel 5520 chipset for I/O and processor interfacing. Intel 5520 Chipset is designed to support Intel's 5500 series processors (code named Nehalem‑EP), QPI interconnect, DDR3 memory technology, and PCI Express Generation 2.

The Intel 5520 Chipset The planar uses the Intel® 5520 chipset to provide a link between the 5500 series 2S processor (Nehalem EP) and I/O components. The main components of the IOH consist of two full‑width QuickPath Interconnect links (one to each processor), 36 lanes of PCI Express Gen2, a x4 Direct Media Interface (DMI), and an integrated IOxAPIC.

IOH QuickPath Interconnect (QPI) The QuickPath Architecture consists of serial point‑to‑point interconnects for the processors and the IOH. The PowerEdge T610 has a total of three QuickPath Interconnect (QPI) links: one link connecting the processors and links connecting both processors with the IOH. Each link consists of 20 lanes (full‑width) in each direction with a link speed of up to 6.4 GT/s. An additional lane is reserved for a forwarded clock. Data is sent over the QPI links as packets.

The QuickPath Architecture implemented in the Chipset and CPUs features four layers. The Physical layer consists of the actual connection between components. It supports Polarity Inversion and Lane Reversal for optimizing component placement and routing. The Link layer is responsible for flow control and the reliable transmission of data. The Routing layer is responsible for the routing of QPI data packets. Finally, the Protocol layer is responsible for high‑level protocol communications, including the implementation of a MESIF (Modify, Exclusive, Shared, Invalid, Forward) cache coherence protocol.

Intel Direct Media Interface (DMI) The DMI (previously called the Enterprise Southbridge Interface) connects the Intel 5520 Chipset with the Intel I/O Controller Hub (ICH). The DMI is equivalent to a x4 PCIe Gen1 link with a transfer rate of 1 Gb/s in each direction.


33

PCI Express Generation 2 PCI Express is a serial point‑to‑point interconnect for I/O devices. PCIe Gen2 doubles the signaling bit rate of each lane from 2.5 Gb/s to 5 Gb/s. Each of the PCIe Gen2 ports are backwards‑compatible with Gen1 transfer rates.

In the Intel 5520 Chipset, there are two x2 PCIe Gen2 ports (1Gb/s) and eight x4 PCIe Gen2 ports (2 Gb/s). The x2 ports can be combined as a x4 link; however, this x4 link cannot be combined with any of the other x4 ports. Two neighboring x4 ports can be combined as a x8 link, and both resulting x8 links can combine to form a x16 link.

Intel I/O Controller Hub 9 (ICH9) ICH9 is a highly integrated I/O controller, supporting the following functions: •Sixx1PCIeGen1ports,withthecapabilityofcombiningports1-4asax4link •TheseportsareunusedonthePowerEdgeT610 •PCIBus32-bitInterfaceRev2.3runningat33MHz •UptosixSerialATA(SATA)portswithtransferratesupto300MB/s •ThePowerEdgeT610featurestwoSATAportsforoptionalinternalopticaldriveand/or

tape backup •SixUHCIandtwoEHCI(High-Speed2.0)USBhostcontrollers,withuptotwelveUSBports •ThePowerEdgeT610haseightexternalUSBportsandoneinternalUSBport.Referto

the Whoville Hardware/BIOS Specification for the USB assignments for each platform •Powermanagementinterface(ACPI3.0bcompliant) •PlatformEnvironmentalControlInterface(PECI) •IntelDynamicPowerModeManager •I/Ointerruptcontroller •SMBus2.0controller •LowPinCount(LPC)interfacetoSuperI/O,TrustedPlatformModule(TPM),andSuperVU •SerialPeripheralInterface(SPI)supportforuptotwodevices •ThePowerEdgeT610’sBIOSisconnectedtotheICHusingSPI

secTiOn 9. biOs

a. Overview / DescriptionThe PowerEdge T610 BIOS is based on the Dell BIOS core and supports the following features: •IA-32Nehalem-EP2SSupport •SimultaneousMulti-Threading(SMT)support •CPUTurboModesupport •PCI2.3compliant •Plugn’Play1.0acompliant •MP(Multiprocessor)1.4compliant •Bootfromharddrive,opticaldrive,iSCSIdrive,USBkey,andSDcard •ACPIsupport •DirectMediaInterface(DMI)support •PXEandWOLsupportforon-boardNICs •Memorymirroring •SETUPaccessthrough<F2>keyatendofPOST •USB2.0(USBbootcodeis1.1compliant) •F1/F2errorlogginginCMOS •VirtualKVM,CD,andfloppysupport •UnifiedServerConfiguratorsupport •PowermanagementsupportincludingDBS,PowerInventoryandmultiplePowerProfiles


34

The PowerEdge T610 BIOS does not support the following: •EmbeddedDiags •BIOSlanguagelocalization •BIOSrecoveryafterbadflash(butcanberecoveredfromiDRAC6Express)

Refer to the PowerEdge T610 BIOS Specification document for information related to BIOS.

b. supported acPi statesAdvanced Configuration and Power Interface – A standard interface for enabling the operating system to direct configuration and power management.

The Nehalem processor supports the following C‑States: C0, C1, C1E, C3, and C6. The PowerEdge T610 will support all of the available C‑States.

The PowerEdge T610 will support the available P‑States as supported by the specific Nehalem processors:

Table: Nehalem P-State Projections

c. i2c (inter-integrated circuit)What is I2C? A simple bi‑directional 2‑wire bus for efficient inter‑integrated circuit control. All I2C‑bus compatible devices incorporate an on‑chip interface which allows them to communicate directly with each other via the I2C‑bus. This design concept solves the many interfacing problems encountered when designing digital control circuits. These I2C devices perform communication functions between intelligent control devices (e.g., microcontrollers), general‑purpose circuits (e.g., LCD drivers, remote I/O ports, memories) and application‑oriented circuits.

The PowerEdge T610 BIOS accesses the I2C through the ICH9 (Intel I/O Controller Hub 9). There are two MUXes on ICH9’s I2C bus.

The clock chips, USB hub, iSCSI key and TPM device addresses are located on the ICH9 I2C bus.

PROc numbeR qfD # fRequency sTanDaRD

TDP lfm TDP P-sTaTe nOTes

1.60 Pmin+1

1.73 Pmin+1

E5502 Q1G8 1.86 80 75 Pmin+2 D-0

E5504 Q1GM 2.00 80 75 Pmin+3 D-0

L5506 Q1HG 2.13 60 52 Pmin+4 D-0

E5506 Q1GL 2.13 80 75 Pmin+4 D-0

L5520 Q1GN 2.26 60 52 Pmin+5 D-0

E5520 Q1GR 2.26 80 75 Pmin+5 D-0

E5530 Q1GK 2.40 80 75 Pmin+6 D-0

E5540 Q1G2 2.53 80 75 Pmin+7 D-0

X5550 Q1GJ 2.67 95 75 Pmin+8 D-0

X5560 Q1GF 2.80 95 75 Pmin+9 D-0

X5570 Q1G9 2.93 95 75 Pmin+10 D-0


35

secTiOn 10. embeDDeD nics

a. Overview / DescriptionDual‑port Gigabit Ethernet Controller with TCP offload Engine (TOE) support

A dual‑port LAN controller with support circuitry is embedded on the PowerEdge T610 system board as independent Ethernet interface device. The device is Broadcom 5709C Gigabit Ethernet controller.

The following information details the features of the LAN device: •x4PCIExpressGen2capableinterface •ThePowerEdgeT610operatesthiscontrolleratGen1speed •MACandPHYintegrated •3072x18Bytecontextmemory •64KBreceivebuffer •TOE(TCPOffloadEngine) •iSCSIcontroller(enabledthroughanoptionalhardwarekey) •RDMAcontroller(RNIC)(enabledpostRTSthroughanoptionalhardwarekey) •NC-SI(NetworkController-SidebandInterface)connection •Wake-On-LAN(WOL) •PXE2.0remoteboot •iSCSIboot •IPv4andIPv6support •Baremetaldeploymentsupport

secTiOn 11. i/O slOTs

a. Overview / DescriptionThe PowerEdge T610 planar provides five PCI Express expansion slots and one dedicated slot, as follows: •Twox8PCIeGen2slotsforfull-heightfull-lengthcards,andconnectedtotheIOH •Threex4PCIeGen2slotforfull-heighthalf-lengthcards,andconnectedtotheIOH •Onex4PCIeGen1slotfordedicatedstoragecontrollercard,andconnectedtotheIOH •Systemsupports25WmaximumpowerforthefirsttwoPCIecardsand15Wforthe3rd,4th,

and 5th PCIe cards •Thelowerpowersupportonthe3rd,4th,and5thcardsisduetosystemthermallimitations

instead of system power requirements •ThePowerEdgeT610doesnotsupporthot-swappingofPCIecards

The PowerEdge T610 planar incorporates six 164‑pin PCI Express‑style x8 connectors for connectivity to the PCIe cards.

POWeReDGe T610

PCI Express Gen2 Slots

Slot 1: Half-Length (6.6" Factory Installation) / Full-Height (x8 connector), x4 link width

Slot 2: Full-Length (12.2" Factory Installation) / Full-Height (x8 connector), x8 link width

Slot 3: Full-Length (12.2" Factory Installation) / Full-Height (x8 connector), x8 link width




36

POWeReDGe T610

Category Card Priority Description Dell PN PCIe Link

WidthSlot

PriorityMax

Cards

Internal Storage (Integrated Slot)

1 Dell™ PERC 6/i Integrated (Sled)T95 4J

Gen1 x8 Integrated 1

Internal Storage (Integrated Slot)

2 Dell SAS 6/iR Integrated (Sled)YK8 38

Gen1 x8 Integrated 1

External Storage Controller

3*Dell PERC 5/E Adapter

(Test only, no factory install)GP2 97

Gen1 x8 Slot 4, 51 22



(512MB)J15 5F Gen1 x8

Slot 3, 2, 5, 4, 1

22



(256MB)F98 9F

Gen1 x8Slot 3, 2,

5, 4, 122

10Gb NIC 6*Intel 10GBase-T Copper Single

Port NIC (Copperpond)XR9 97

Gen1 x8Slot 4, 5, 1,

2, 32

10Gb NIC 7*Broadcom BCM57710

10GBase-T Copper Single Port NIC (Quiver)

RK3 75


2, 32

10Gb NIC 8Intel® 10GBase-SR Optical

Single Port NIC (BelleFontaine)RN 219


2, 32


9 *Dell SAS 5/E AdapterM7 78G

Gen1 x8Slot 3, 2,

4, 5, 122

Internal Tape Controller

10Dell SAS 5/iR Adapter (for internal tape only)

UN 939

Gen1 x8Slot 3, 2,

4, 5, 122

Fibre Channel 8 HBA

11Emulex LPe12002 FC8

Dual-Channel HBAC85 6M


2, 35

Fibre Channel 8 HBA

12Emulex LPe12000 FC8 Single-Channel HBA

C85 5M


2, 35

Fibre Channel 4 HBA

13Emulex LPe11002 FC4

Dual-Channel HBAKN1 39


2, 35

Fibre Channel 4 HBA

14Emulex LPe1150 FC4 Single-Channel HBA

ND 407


2, 35

1Gb NIC 15Intel Gigabit VT Copper

Quad-Port NIC (Springport)YT6 74


2, 35

Fibre Channel 4 HBA

16QLogic QLE2462 FC4

Dual-Channel HBADH 226


2, 35

Fibre Channel 4 HBA

17QLogic QLE2460 FC4 Single-Channel HBA

PF3 23


2, 35

SCSI HBA 18LSI Logic LSI2032 SCSI HBA

(Sasquatch)NU 947


2, 32


37

POWeReDGe T610

Category Card Priority Description Dell PN PCIe Link

WidthSlot

PriorityMax

Cards

Fibre Channel 8 HBA

19QLogic QLE2562 FC8

Dual-Channel HBAG44 4C


2, 35

Fibre Channel 8 HBA


G42 5C


2, 35

Fibre Channel 4 HBA


YY0 04


2, 35

1Gb NIC 22Intel PRO/1000PT Gigabit

Copper Dual-Port NIC (Redwater)

X39 59


2, 35

1Gb NIC 23

Broadcom BCM5709C IPV6 Gigabit Copper Dual-Port NIC with TOE and iSCSI Offload

(Dragonfly)

F16 9G


2, 35

1Gb NIC 24Broadcom BCM5709C IPv6

Gigabit Copper Dual-Port NIC with TOE (Dragonwing)

G21 8C


2, 35


1 Thermal testing to determine if the PERC5 can be installed in other slots is pending.

2 A maximum of 2 nternal/external storage controllers (Dell PERC and SAS cards) are allowed in the system in addition to the integrated storage controller.

Note: The PowerEdge T610 supports up to 25W maximum power for the first two cards and up to 15W for the third, fourth, and fifth PCIe cards regardless of which slots are populated (does not apply to the Internal Storage Slot). This restriction applies to any PCIe cards that have a maximum power over 15W. PCIe cards that are affected by this restriction are noted in the table above by an asterisk.

This list was generated based on thermal, mechanical, and performance inputs. Generally speaking, thermal requirements were a priority for any card over 15W (PERC and most 10G NIC cards). Performance considerations (e.g., matching link width to slot width) were factored in once both thermal and mechanical constraints were met. In some cases, the performance considerations took priority over thermals – this was done after consulting with the thermal team.


38

b. boot OrderPCIe scan order (from the BIOS HW spec v1.0)IOH port 1,2 (PCI Express Gen1 x4) – BCM5709C Embedded NIC #1IOH port 3 (PCI Express Gen1 x4) – Slot 5IOH port 9 (PCI Express Gen1 x4) – Slot 1IOH port 7/8 (PCI Express Gen2 x8) – Slot 2IOH port 5/6 (PCI Express Gen2 x8) – Slot 3IOH port 4 (PCI Express Gen1 x4) – Slot 4IOH port 10 (PCI Express Gen1 x4) – PERC6i

secTiOn 12. sTORaGe

a. Overview / DescriptionThe PowerEdge T610 has an eight‑drive backplane for 2.5" drives and an eight‑drive backplane for 3.5" drives. There are eight hot‑swap capable Serial Attached SCSI (SAS) or Serial ATA (SATA) slots with two LED indicators per slot, two Mini‑SAS cable connectors for connecting the backplane to the integrated SAS 6/iR or PERC 6/i, a 10‑pin planar signal connector and an 8‑pin PDB power connector.

For SATA/SAS mixing, two SAS drives are supported with the 2.5" or 3.5" backplane. In this configuration, one pair of drives will be SAS and the remaining six drives will be SATA.

b. DrivesThe PowerEdge T610 supports 2.5" and 3.5" hard drive carriers. These carriers implement new industrial design to match the front bezel. Legacy carriers are not supported on the PowerEdge T610.

cOnsTRainTs

Thermal

PERC 5/E–slot order must be Slot 4,5

PERC 6/E – there is sufficient thermal margin to allow for a 3,2,5,4,1 order

10Gb NICs – slot order must be 4,5,1,2,3

SAS 5/E and 5/iR – there is sufficient thermal margin to allow for a 3,2,4,5,1 order

Rest of the PCIe cards – recommended slot order is Slot 4,5,1,2,3

Mechanical

Slot 1 – Half-length (6.6"), full-height

Slot 2 – Full-length (12.2"), full-height

Slot 3 – Full-length (12.2"), full-height



Performance

Slot 1 – PCIe Gen2 x4






39

For the slots that are not occupied by drives, a carrier blank is provided to maintain proper cooling, maintain a uniform appearance to the unit, and provide EMI shielding.

The PowerEdge T610 does not support diskless configuration.Each disk drive carrier has two LED indicators visible from the front of the system. One is a green LED for disk activity and the other is a bicolor (green/amber) LED for status information. The activity LED is driven by the disk drive during normal operation. The bicolor LED is controlled by the SEP device on the backplane. Both LEDs are used to indicate certain conditions under direction of a storage controller.

The PowerEdge T610 system supports up to eight 2.5" or 3.5" hard disk drives. •Supportfor10,000and15,000rpm2.5"SASdrives •Supportfor15,000rpm3.5"SASdrives •Supportfor7200rpm3.5"NearLineSASdrives •Supportfor7200rpm2.5"EnterpriseSATAdrives •Supportfor7200rpm3.5"EnterpriseSATAdrives •Supportfor2.5"SolidStateDrives(SSD) •SSDsrequirethePERC6/iIntegratedstoragecontrollerandcannotbemixedwithany

other type of hard drive •UptoeightSASORuptoeightSATAdrivesaresupported •ForSAS/SATAmixing,twoSASanduptosixSATAdrivesarepossible •ApairofSASdrivesmustbeinstalledinslots0and1 •Onemixed2.5"and3.5"harddriveconfigurationisallowed: •Apairof2.5"10krpmSASdrivesmustbeinstalledwithanadapterina3.5"harddrive

carrier in drive slots 0 and 1 •Theremainingharddrivesmustbe3.5"harddrivesandmustbeeitherallSASor

all SATA

3.5 hDDs

Support for 3.5" Enterprise SATA 7.2K 160GB, 250GB, 500GB, 750GB, and 1000GB

Support for 3.5" Enterprise SATAu 7.2K500GB SATAu, 750GB SATAu, and 1000 GB SATAu

Support for 3.5" Green Enterprise SATA 5.4K 1000GB

Support for 3.5" Near Line SAS 7.2K 500GB, 750, and 1000GB

Support for 3.5" SAS 15K HDs 146GB, 300GB, and 450GB

Table: PowerEdge T610 supported HDD matrix

2.5 hDDs

2.5" Enterprise SATA 7.2K HDs 160GB, 250GB, and 500GB

2.5" SAS 10K HDs 73GB, 146GB, and 300GB

2.5" entry 10K SAS in 3.5" HDD carrier 73GB and 146GB

2.5" SAS 15K HDs 73GB and 146GB

Enterprise SATA SSD 25GB, 50GB, and 100GB

2.5" SSD 25GB and 50GB


40

POWeReDGe T610

Platforms 4

All 2.5" HDD SAS (or) SATA 4

All 3.5" HDD SATA (or) SATA 4

Mixed SAS/SATA* 4

2.5" SAS in 3.5" HDD Carrier (RTS+) 4

2.5" SAS HDD in 3.5" HDD Carrier + 3.5" SAS HDDs (Mixed SAS) 4

2.5" SAS HDD in 3.5" HDD Carrier + 3.5" SATA HDDs (Mixed SAS/SATA) 4

c. RaiD configurationsPowerEdge T610 Factory Configuration Summary

cOnfiG TyPe cOnfiGs DescRiPTiOn

nOn-mixeD DRives, all

saTa OR all sas

mixeD sas/ saTa min 2xsas+1xsaTa

2.5": max 2xsas + 6xsaTa 3.5": max 2xsas + 6xsaTa

min hDD

max hDD

min hDD

max hDD

SAS/SATA (No RAID) 0 MSS

Integrated SAS/SATA No RAID

(SAS 6/iR)

2.5"=13.5"=1

2.5"=83.5"=8

SAS/SATA (RAID)

1 MSSR0Integrated

SAS/SATA RAID 0 (SAS 6/iR, PERC6/I)

2.5"=1*3.5"=1*

2.5"=83.5"=8

N/A

2 MSSR1Integrated

SAS/SATA RAID 1 (SAS 6/iR, PERC6/I)

2.5"=23.5"=2

2.5"=23.5"=2

N/A

3 MSSR5Integrated

SAS/SATA RAID 5 (PERC 6/i)

2.5"=33.5"=3

2.5"=83.5"=8

N/A

4 MSSR6Integrated


2.5"=43.5"=4

2.5"=83.5"=8

N/A

5 MSSR10Integrated


2.5"=4 3.5"=4

2.5"=83.5"=8

6 MSSR1R1

Integrated SAS/SATA RAID

1/RAID 1 (SAS 6/iR, PERC 6/i)

2.5"=2+23.5"=2+2

2.5"=2+23.5"=2+2

7 MSSR1R5Integrated

SAS/SATA RAID 1/RAID 5 (PERC 6/i)

2.5"=2+33.5"=2+3

2.5"=2+63.5"=2+6

Table: Supported HDD/SSD Matrix


41

* Minimum of 1 hard drive for PERC6i ; and minimum of 2 for SAS6iR.


nOn-mixeD DRives, all

saTa OR all sas

mixeD sas/ saTa min 2xsas+1xsaTa

2.5": max 2xsas + 6xsaTa 3.5": max 2xsas + 6xsaTa

min hDD

max hDD

min hDD

max hDD

SAS/SATA (No RAID) 8 MSS-X

Integrated SAS/SATA No RAID

(SAS 6/iR)

2.5"=33.5"=3

2.5"=63.5"=6

SAS/SATA (RAID)

9 MSSR1R1- X


1/RAID 1 (SAS 6/iR, PERC 6/i)

2.5"=2+23.5"=2+2

2.5"=2+23.5"=2+2

10 MSSR1R5-X


1/RAID 5 (PERC 6/i)

2.5"=2+33.5"=2+3

2.5"=2+63.5"=2+6


nOn-mixeD DRives, all ssD

mixeD ssD/ sas min 2xssD+1xsas

2.5": max 2xssD + 6xsas

min hDD

max hDD

min hDD

max hDD

SSD (RAID)

11 MSSR1Integrated SSD

RAID 1 (PERC 6/i)2.5"=2

3.5"=N/A2.5"=2

3.5"=N/AN/A


RAID 5 (PERC 6/i)2.5"=3

3.5"=N/A2.5"=

3.5"=N/AN/A


RAID 10 (PERC 6/i)2.5"=4

3.5"=N/A2.5"=8

3.5"=N/AN/A

SSD/SAS (RAID) 14 MSSR1R5-X

Integrated SSD/SAS RAID

1/RAID 5 (PERC 6/i)

2.5"=2+33.5"=N/A

2.5"=2+63.5"=N/A

D. storage controllersI. SAS 6/iR DescriptionThe integrated SAS 6/iR HBA is a half‑length expansion card that plugs into a dedicated PCIe x8 storage slot (only wired for x4). It incorporates two four‑channel SAS IOCs for connection to SAS/SATA hard disk drives. It is designed in a form factor that will allow the same card to be used in the PowerEdge T610, R710, and R610.

II. PERC 6/i DescriptionFor customers who need a more advanced hardware RAID solution, the PERC 6/i is an option. The PERC 6/i uses the LSI 1078 ROC (RAID on Chip) processor with a PCI Express host interface and DDR2 memory. A battery is also available for backup. For details of that card, see the PERC 6 Hardware Specification.


42

sTORaGe caRD usaGe POWeReDGe

T610 suPPORT slOT Pcie cOn

Pcie bRackeT

i/O cOn RaiD bbu

PE

RC

SA

S/S

ATA

PERC 6/i Integrated

Internal Backplane

Storage (HDD, SSD)

Yes, Max 1Storage

slotx8 No

x4 int x4 int

0, 1, 5, 6, 10,

50, and 60

BBU

PERC 6/E Adapter

External SAS/SATA

Storage

Yes, Max 2 (MD1000

Pompano & MD1020

Ridgeback)

PCIe slot

x8 Yesx4 ext x4 ext

0, 1, 5, 6, 10,

50, and 60

TBBU

PERC 5/E Adapter

External Legacy Storage

Yes, Max 2 (MD1000

Pompano only)

PCIe slot

x8 Yesx4 ext x4 ext

0, 1, 5, 10,

and 50TBBU

SA

S H

BA

SA

S/S

ATA SAS 6/iR

Integrated

Internal Backplane

Storage (No tape or SSD

support)

Yes, Max 1Storage

slotx8 No

x4 int x4 int

0, 1 No

SAS 5/iR Adapter

Internal SAS Tape

Yes, Max 2 PCIe slot x8 Yes x4 int n/a No

SAS 5/E Adapter

External SAS

(DAS, Tape)Yes, Max 2 PCIe slot x8 Yes

x4 ext x4 ext

none No

ICH

SA

TA

On Planar via chipset

Internal SATA

Optical/Tape

(No HDD)

Yes, 2 ports for Optical and/or

Tapen/a n/a n/a x1 int n/a n/a

LS

I S

CS

I

LSI 2032 Adapter

Internal/ External

SCSI Tape or Ext

legacy SCSI storage

Yes, Max 2 PCIe slot x4 Yesx1 int x1 ext

n/a n/a

NOTE: A maximum of 2 external storage controllers (Dell PERC and SAS cards) are allowed in the system in addition to the integrated storage controller.

e. leD indicatorsEach disk drive carrier has two LED indicators visible from the front of the system. One is a green LED for disk activity and the other is a bicolor (green/amber) LED for status information. The activity LED is driven by the disk drive during normal operation. The bicolor LED is controlled by the SEP device on the backplane. Both LEDs are used to indicate certain conditions under direction of a storage controller.


43

T610 suPPORTeD Tbus

Internal Tape

Catfish Internal (RD1000 Half-Height SATA)

LTO2L (Legacy, Half-Height, SCSI)

LTO3-060 & LTO3L-060 (Half-Height SCSI)

LTO4-120 (Half-Height, Low-Cost, SAS)

DAT72 Half–Height SCSI

Internal Tape Drive Bays

One 3.5" half-height tape drive bay (Catfish)

One 5.25" half-height tape drive bay (LTO4, 3, 2 value)

External TBU

Catfish External (RD1000 USB)

LTO-2L (Legacy, SCSI)

LTO-3-060 (SCSI)

LTO-3 (Legacy, SCSI)

LTO-4-120 (Half-High SAS)

2U external TBU (Hammerhead – PV114T)

DAT72 Half–Height SCSI

External TBU/ Automation

Shadow 4U SAS, SCSI, iSCSI, and FC

Shadow 2U SAS, SCSI, iSCSI, and FC

ML6000 Family SAS, SCSI, and FC

2U external TBU (Seabass – PV124T) Legacy SCSI

Table: PowerEdge T610 supported TBUs

f. Optical DrivesSATA optical drives are optional in all PowerEdge T610 systems and connect to the planar via the SATA interface to ICH9. IDE (PATA) optical drives are not supported.

The following internal optical drives are available on the PowerEdge T610: DVD‑ROM and DVD+/‑RW.

If the optical drive is not ordered with the system, a blank is installed in its place. In the absence of tape drive, an optional second SATA optical drive is installed in the bay adjacent to the first optical drive.

G. Tape DrivesA tape backup unit (TBU) is optional in all PowerEdge T610 systems and connects to the planar SATA, SCSI controller card, or SAS controller card. An IDE tape drive is not supported.

The PowerEdge T610 supports a maximum of one half‑height or one full‑height TBU. A full‑height TBU would take up both drive bays and would prevent an optical drive from being installed.

The following tape drives are available for usage on the PowerEdge T610: internal SATA, SCSI, and SAS drives; external SCSI and SAS drives. Internal SCSI tape drives connect through the LSI 2032 PCI Express SCSI adapter card. SAS TBUs connect through the SAS5iR card.

If the tape drive is not ordered with the system, a blank is installed in its place.


44

secTiOn 13. viDeO

a. Overview / DescriptionThe PowerEdge T610 system Integrated Dell™ Remote Access Controller 6 (iDRAC6) incorporates an integrated video subsystem, connected to the 32‑bit PCI interface of the ICH. This logic is based on the Matrox G200. The device only supports 2D graphics. The integrated video core shares its video memory with the iDRAC6’s 128MB DDR2 application space memory. This memory is also used for the KVM buffer.

The PowerEdge T610 system supports the following 2D graphics video modes:

secTiOn 14. auDiO

a. Overview / DescriptionNo speakers supported.

Table: PowerEdge T610 Video Modes

ResOluTiOn RefResh RaTe (hz) cOlOR DePTh (biT)

640 x 480 60, 72, 75, and 85 8, 16, and 32

800 x 600 56, 60, 72, 75, and 85 8, 16, and 32

1024 x 768 60, 72, 75, and 85 8, 16, and 32

1152 x 864 75 8, 16, and 32

1280 x 1024 60, 75, and 85 8 and 16

1280 x 1024 60 32

secTiOn 15. Rack infORmaTiOn

a. Overview / DescriptionRack installation components such as rails are provided with the PowerEdge T610 Rack Kit. The rack installation components are as follows: Sliding Rack mount with latest generation Cable Management Arm (CMA). The PowerEdge T610 will feature slam latches to offer easier removal from the rack.

When the system is installed in a rack, please observe the following guidelines: •Nothingshouldbelocatedwithin12"ofthefrontoftheunitthatwouldrestricttheairflowinto

the system. •Nothingshouldbemountedorplacedbehindthechassisthatwouldrestrictairflowfrom

exiting the system. Only Dell approved CMAs can be placed behind the chassis. All other objects should be located at least 24" away from the rear of the chassis.

When 2 systems are placed back to back, the separation between the units should be at least 24" if the exit airflow is equivalent for the two chassis. This will allow the exit air to escape without creating an extreme back pressure at the rear of one of the chassis.


45

b. cable management arm (cma)CMA to support the following cable load:•2Powercables•10SAScables•2CAT6•1statusindicator•1KVMdongle(mountedinternaltoCMAbasket)

c. RailsSupport for tool‑less installation in CEA‑310‑E compliant square hole 4‑post racks including: •SupportforDellRacks(4220,2420) •SupportforDellRacks(4210,2410) •SupportforDellRacks(4200,2400) •SupportforHP/Compaq9xxx&10xxxSeriesRacks •Supportfortool-lessinstallationinCEA-310-Ecompliantroundhole4-postracks •Supportfullextensionofthesystemoutoftheracktoallowserviceabilityofkeyinternal

components

The POWeReDGe T610 Rack suPPORTs The fOllOWinG

Support for Dell 4210 & 2410 racks

Support for Dell 4200 & 2400 racks without CMA

Support for HP/Compaq 10XXX series racks

Support for HP/Compaq 9XXX & 7XXX series racks without CMA

The POWeReDGe T610 Rail suPPORTs The fOllOWinG:

Support for tool-less installation in CEA-310-E compliant square hole 4-post racks including:

Support for Dell 2410 24U Rack

Support for Dell 4210 Rack

Support for HP/Compaq 10xxx series

Support for tooled or tool-less installation in CEA-310-E compliant round hole 4-post racks (tool-less preferred)

Full extension required (to allow serviceability of key internal components)


46

secTiOn 16. OPeRaTinG sysTems

a. Overview / DescriptionThe PowerEdge T610 supports Windows®, Linux, and Solaris™ operating systems.

b. Operating systems supportedWindows® support:

x86 OR

x64insTallaTiOn facTORy

insTallaTiOnlOGO

ceRTificaTiOn scheDule TesT/ valiDaTe suPPORT

Windows® Small Business Server 2008 and Essential Business Server 2008

x64Standard/ Premium

Yes

Windows Hardware

Quality Labs - Windows 2008

Shipping Yes Yes

Windows Server® 2008 (x64 includes Hyper-V™)

x64

Standard

Yes

Windows Hardware


Shipping Yes YesEnterprise

Datacenter

Windows Server® 2008

x86Standard

Yes

Windows Hardware


Shipping Yes YesEnterprise

Windows® Web Server 2008

x86 and x64

Web Yes

Windows Hardware


Shipping Yes Yes

Windows Server® 2008, SP2 (x64 includes Hyper-V™)

x64

Standard

Yes

Windows Hardware


Available in August - October

2009

Yes YesEnterprise

Datacenter

Windows Server® 2008, SP2

x86Standard

Yes

Windows Hardware



2009

Yes YesEnterprise

Windows® Web Server 2008, SP2

x86 and x64

Web Yes

Windows Hardware



2009

Yes Yes


47

Red Hat® Enterprise Linux 4.7

x86 and x64

ES/ASAvailable in June 2009

N/AAvailable in June 2009

Yes Yes

Red Hat Enterprise Linux 5.2

x86 and x64

Standard/AP Yes N/A Shipping Yes Yes

Red Hat Enterprise Linux 5.3

x86 and x64

Standard/APAvailable in June 2009


Yes Yes

Novell® SUSE® Linux Enterprise Server 10 SP2

x64 Enterprise Yes N/A Shipping Yes Yes

Novell SUSE Linux Enterprise Server 11

x64 EnterpriseAvailable in June 2009


Yes Yes

Solaris™ 10 05/09

x64 Enterprise Drop in the box N/AAvailable in June 2009

Yes Yes

Linux support:

Windows Server® 2008, R2, (x64 includes Hyper-V™)

x64

Standard

Yes

Windows Hardware


Release 2

Available in November

2009 - January

2010

Yes YesEnterprise

Datacenter

x86 OR

x64insTallaTiOn facTORy

insTallaTiOnlOGO

ceRTificaTiOn scheDule TesT/ valiDaTe suPPORT

secTiOn 17. viRTualizaTiOna. Overview / DescriptionSupported embedded hypervisors: •Microsoft® Windows Server® 2008 Hyper‑V •VMware® ESXi Version 4.0 and 3.5 update 4 •Citrix® XenServer 5.0 with Hotfix 1 or later


48

secTiOn 18. sysTems manaGemenT

a. Overview / DescriptionDell is focused on delivering open, flexible, and integrated solutions the help our customers reduce the complexity of managing disparate IT assets. We build comprehensive IT management solutions. Combining Dell PowerEdge Servers with a wide selection of Dell‑developed management solutions, we provide customers choice and flexibility – so you can simplify and save in environments of any size.

To help you meet your server performance demands, Dell offers Dell OpenManage™ systems management solutions for: •Deploymentofoneormanyserversfromasingleconsole •Monitoringofserverandstoragehealthandmaintenance •Updateofsystem,operatingsystem,andapplicationsoftware

We offer IT management solutions for organizations of all sizes – priced right, sized right, and supported right.

b. server managementA Dell Systems Management and Documentation DVD and a Dell Management Console DVD are included with the product. ISO images are also available. The following sections briefly describe the content.

Dell Systems Build and Update Utility: Dell Systems Build and Update Utility assists in OS install and pre‑OS hardware configuration and updates.

OpenManage Server Administrator: The OpenManage Server Administrator (OMSA) tool provides a comprehensive, one‑to‑one systems management solution, designed for system administrators to manage systems locally and remotely on a network. OMSA allows system administrators to focus on managing their entire network by providing comprehensive one‑to‑one systems management.

Management Console: Our legacy IT Assistant console is also included, as well as tools to allow access to our remote management products. These tools include: Remote Access Service, for iDRAC, and the BMC Management Utility.

Active Directory Snap-in Utility: The Active Directory Snap‑in Utility provides an extension snap‑in to the Microsoft Active Directory. This allows you to manage Dell specific Active Directory objects. The Dell‑specific schema class definitions and their installation are also included on the DVD.

Dell Systems Service Diagnostics Tools: Dell Systems Service and Diagnostics tools deliver the latest Dell optimized drivers, utilities, and operating system‑based diagnostics that you can use to update your system.

eDocs: The section includes Acrobat files for PowerEdge systems, storage peripheral and OpenManage software.

Dell Management Console DVD: The Dell Management Console is a Web‑based systems management software that enables you to discover and inventory devices on your network. It also provides advanced functions, such as health and performance monitoring of networked devices and patch management capabilities for Dell systems.

Server Update Utility: In addition to the Systems Management Tools and Documentation and Dell Management Console DVDs, customers have the option to obtain Server Update Utility DVD. This DVD has an inventory tool for managing updates to firmware, BIOS and drivers for either Linux or Windows varieties.


49

c. embedded server managementThe PowerEdge T610 implements circuitry for the next generation of Embedded Server Management. It is Intelligent Platform Management Interface (IPMI) v2.0 compliant. The iDRAC6 (Integrated Dell Remote Access Controller) is responsible for acting as an interface between the host system and its management software and the periphery devices. These periphery devices consist of the PSUs, the storage backplane, integrated SAS HBA or PERC 6/i and control panel with display.

The iDRAC6 provides features for managing the server remotely or in data center lights‑out environments.

Advanced iDRAC features require the installation of the iDRAC6 Enterprise card.

I. Unmanaged Persistent StorageThe unmanaged persistent storage consists of two ports: •oneinternalUSBport •oneinternalSDModule

The internal port is for an optional USB key and is located inside the chassis. Some of the possible applications of the USB key are: •Usercustombootandpre-bootOSforeaseofdeploymentordisklessenvironments •Storage of custom logs or scratch pad for portable user‑defined information (not hot‑pluggable)

The Internal SD Module is dedicated for an SD Flash Card with embedded Hypervisor for virtualization. The SD Flash Card contains a bootable OS image for virtualized platforms.

II. Lifecycle Controller/Unified Server ConfiguratorEmbedded management is comprised of several pieces which are very interdependent. •LifecycleController •UnifiedServerConfigurator •iDRAC6 •vFLASH

Lifecycle controller is the hardware component that powers the embedded management features. It is integrated and tamperproof storage for system‑management tools and enablement utilities (firmware, drivers, etc.). It is flash partitioned to support multiple, future use cases.

Dell Unified Server Configurator is a 1:1 user interface exposing utilities from Lifecycle Controller. Customers will use this interface to configure hardware, update server, run diagnostics, or deploy the operating system.ThisutilityresidesonLifecycleController.ToaccesstheUnifiedServerConfigurator,press<F10>key within 10 seconds of the Dell logo display during the system boot process. Current functionality enabled by the Unified Server Configurator includes:

feaTuRe DescRiPTiOn

Faster O/S Installation

Drivers and the installation utility are embedded on system, so no need to scour DELL.COM

Faster System Updates Integration with Dell support automatically directed to latest versions of the Unified Server Configurator, iDRAC, RAID, BIOS, NIC, and Power Supply

Update RollbackAbility to recover to previous “known good state” for all updatable components


50

III. iDRAC6 ExpressThe iDRAC6 Express is the first tier of iDRAC6 upgrades. In addition to upgrading the system with a Lifecycle Controller, the iDRAC6 Express offers the following key features: •Graphicalwebinterface •Standard-basedinterfaces •ServerSensormonitoringandfaultalerting •Secureoperationofremoteaccessfunctionsincludingauthentication,authorization,

and encryption •Powercontrolandmanagementwiththeabilitytolimitserverpowerconsumptionand

remotely control server power states •Advancedtroubleshootingcapabilities

For more information on iDRAC6 Express features see the table below.

IV. iDRAC6 Enterprise The optional iDRAC6 Enterprise card provides access to advanced iDRAC6 features. The iDRAC6Enterprise connects directly to the T610 planar and is mounted parallel to the planar with stand‑offs.

Key features for the iDRAC6 Enterprise include: •ScriptingcapabilitywithDell’sRacadmcommand-line •Remotevideo,keyboard,andmousecontrolwithVirtualConsole •RemotemediaaccesswithVirtualMedia •Dedicatednetworkinterface

Additionally, the iDRAC6 Enterprise can be upgraded by adding the vFlash Media card. This is a 1GB Dell branded SD card that enables a persistent 256MB virtual flash partition. In the future, vFlash will be expanded to include additional features.

A more detailed feature list for iDRAC6 Enterprise and vFlash is included in the table below.

feaTuRe DescRiPTiOn

More Comprehensive Diagnostics Diagnostic utilities are embedded on system

Simplified Hardware Configuration

Detects RAID controller and allows user to configure virtual disk and choose virtual disk as boot device, eliminating the need to launch a separate utility. Also provides configuration for iDRAC, BIOS, and NIC/LOM.

feaTuRe bmc iDRac6 exPRess

iDRac6 enTeRPRise

vflash meDia

Interface and Standards Support

IPMI 2.0 4 4 4 4

Web-based GUI 4 4 4

SNMP 4 4 4

WSMAN 4 4 4

SMASH-CLP 4 4 4


51


iDRac6 enTeRPRise

vflash meDia

Racadm command-line 4 4

Conductivity

Shared/Failover Network Modes 4 4 4 4

IPv4 4 4 4 4

VLAN tagging 4 4 4 4

IPv6 4 4 4

Dynamic DNS 4 4 4

Dedicated NIC 4 4

Security & Authentication

Role-based Authority 4 4 4 4

Local Users 4 4 4 4

Active Directory 4 4 4

SSL Encryption 4 4 4

Remote Management & Remediation

Remote Firmware Update 4 4 4 4

Server power control 4 4 4 4

Serial-over-LAN (with proxy) 4 4 4 4

Serial-over-LAN (no proxy) 4 4 4

Power capping 4 4 4

Last crash screen capture 4 4 4

Boot capture 4 4 4

Serial-over-LAN 4 4 4

Virtual media 4 4

Virtual console 4 4

Virtual console sharing 4 4

Virtual flash 4

Monitoring

Sensor Monitoring and Alerting 4 1 4 4 4

Real-time Power Monitoring 4 4 4

Real-time Power Graphing 4 4 4

Historical Power Counters 4 4 4


52


iDRac6 enTeRPRise

vflash meDia

Logging Features

System Event Log 4 4 4 4

RAC Log 4 4 4

Trace Log 4 4 4

secTiOn 19. PeRiPheRals

a. usb PeripheralsThe PowerEdge T610 supports the following USB devices: •DVD(bootable;requirestwoUSBports) •USBKey(bootable) •Keyboard(onlyoneUSBkeyboardissupported) •Mouse(onlyoneUSBmouseissupported

b. external storage

exTeRnal sTORaGe

SAN Support

EMC's AX Arrays (SCSI, FC, and iSCSI)

EMC's CX Arrays (SCSI, FC, and iSCSI)

EqualLogic's PS5XXX Arrays (iSCSI)

SAS Management SW for xBOD

OMSS X.X for MD1000

OMSS X.X for MD1020

OMSS X.X for MD3000

OMSS for MD3000i

PV NASAttachment to PV NX1950 including iSCSI and clustering support

Attachment to NF100, NF500 & NF600

PV NAS Attachment to EMC NS500G (S&P)

PV DAS

MD1000 JBOD

MD3000 RBOD

MD1120 2.5 SAS/SATA JBOD

MD1100 3.5 SAS/SATA JBOD

PV SAN MD3000i iSCSI RAID array

EqualLogic™PS5000 family

PS5500 family

SAS xBOD SW OpenManage Storage Manager


53

secTiOn 20. DOcumenTaTiOn

a. Overview, Description, and listThe PowerEdge T610 uses the new enterprise documentation set. The following is a summary of some of the documents slated for the PowerEdge T610 product. For the complete list of documents, including language requirements and delivery scheduling, refer to the Documentation Matrix and the Documentation Milestones in the InfoDev Functional Publications Plan. • Getting Started Guide: This guide provides initial setup steps, a list of key system features, and

technical specifications. This document is required for certain worldwide regulatory submittals. This guide is printed and shipped with the system, and is also available in PDF format on the Dell support site.

• Hardware Owner’s Manual: This document provides troubleshooting and remove/replace procedures, as well as information on the System Setup program, system messages, codes, and indicators. This document is provided to customers in HTML and PDF format at the Dell support site.

• System Information Label: The system information label documents the system board layout and system jumper settings and is located on the system cover. Text is minimized due to space limitations and translation considerations. The label size is standardized across platforms.

• Information Update: This is a PDF document that provides information on late changes and issues having significant customer impact which were discovered after document signoff.

• General System Information Placemat: This is a paper document that is provided with every system. The document provides general information about the system, including software license agreement information and the location of the service tag.

• Rack Placemat: This is a paper document that is provided with the rack kits. The document provides an overview of procedures for setting up the rack.

• Tower-to-Rack Conversion Guide: This is a PDF document available on the Dell support site that provides instructions on how to convert PowerEdge T610 from a tower configuration to a rack configuration.

secTiOn 21. PackaGinG OPTiOns

PackaGinG PROviDe PackaGinG TO suPPORT sysTem

Packaging should incorporate keyboard, mouse, bezel, Doc, CDs, rails

• Will not bag the server in outbound pack• Multi‑pack rails targeted to go in a box within the

multi‑pack but investigation underway for a separate box for ease of customer staging

• Accessory tray needs a cover and icon showing contents • Doc Box – separate box within the main box containing

import documentation and software (OS, OM, etc.)


54

aPPenDix aT610 Volatility Chart.

nOn- vOlaTile Ram

vOlaTile Ram

RefeRence DesiGnaTOR qTy size TyPe [e.g., flash PROm,

eePROm]:

PlanaR, POWeReDGe T610 System BIOS SPI Flash Y U6A1 1 4MB Flash EEPROM (SPI interface)

LOM Configuration Data Y U15, U16 1 512KB FLASH (NOR)

iDRAC6 Controller ROM Y U_IBMC 1 4KB ROM

iDRAC6 Controller RAM Y U_IBMC 1 8KB RAM

System CPLD Y U_CPLD 1 1200 Macro cells Internal Flash EEPROM

System CPLD Y U_CPLD 1 1KB RAM

iDRAC6 Express Internal Flash Y U_EMMC 1 1GB NAND FLASH

System RAM Y

J7F6, J7F5, J7F4, F7F3, J8F3, J8F2, J5F3, J5F4, J5F1, J5F2, J4F1, J4F2

12up to 18 DIMMs *16GB

RAM

TPM ID EEPROM (Plug in module only)

Y U_SEEPROM 1 256B EEPROM

TPM Binding EEPROM (on China planar only)

Y U1H1 1 256B EEPROM

iDRAC6 SDRAM Y U_IBMC_MEM 1 128MB DDR2 RAM

iDRAC6 FRU Y U_IBMC_FRU 1 4KB EEPROM

iDRAC6 Boot Block Flash Y U_IBMC_SPI 1 2MB FLASH (NOR)

Trusted Platform Module Y N U_TPM 1 128 bytes EEPROM

chiPseTCMOS Y 1 256KB Battery backed RAM

2.5" backPlane OR 3.5" backPlane

Storage Controller Processor Y U-SEP 1 32KBEmbedded Microcontroller Flash

cOnTROl Panel

Internal USB YJ_USBKEY (connector)

1 User selectableLicense key hard set ROM or user choice

Internal SD Module YJ_SDCARD (Connector)

1User selectable - 1GB shipped

Secure Digital NAND Flash

POWeR suPPly

PSU Microcontroller Y 2Maximum supported = 2MB per PSU

Embedded microcontroller flash

PeRc 6/i inTeGRaTeDPERC NVSRAM Config Data Y U23 1 32KB Non-volatile SRAM

PERC Firmware Y U24 1 4MB FLASH (NOR)

PERC Cache RAM Y U58-61 1 256MB RAM

FRU Y U40 1 256MB EEPROM

IBUTTON Key EEPROM Y U21 1 1KB EEPROM

CPLD Y U_CPLD 1 72 macrocells Internal Flash EEPROM

SAS 6/iR Integrated

Controller Configuration Data Y U3 1 4MB FLASH (NOR)

FRU Y U4 1 256KB EEPROM

Integrated Mirroring NVSRAM Y U1 1 32KB Non-volatile SRAM

iDRAC6 Enterprise

VFlash YJ_SD (connector)

11GB @ RTS, Larger later

Secure Digital NAND Flash


55

can useR PROGRams OR OPeRaTinG sysTem WRiTe DaTa TO iT DuRinG nORmal OPeRaTiOn?

PuRPOse? [e.g., bOOT cODe]

PlanaR, POWeReDGe T610

System BIOS SPI Flash No Boot Code, System Configuration Information, EUFI environment

LOM Configuration Data No LAN on motherboard configuration and firmware

iDRAC6 Controller ROM No not utilized

iDRAC6 Controller RAM No iDRAC internal RAM

System CPLD No System-specific hardware logic

System CPLD No not utilized

iDRAC6 Express Internal FlashNo for iDRAC Operating System. Yes for Managed System Services Repository

iDRAC Operating System plus Managed System Services Repository (i.e., Unified Server Configurator, OS drivers, diagnostics, rollback versions of various programmables)

System RAM Yes System OS RAM


No BIOS Identification of TPM module


No BIOS binding of plug in module to a particulare planar

iDRAC6 SDRAM No BMC OS + VGA frame buffer

iDRAC6 FRU No Motherboard electronic product identifier

iDRAC6 Boot Block Flash NoiDRAC boot loader and configuration (i.e., MAC address), life cycle log, and system event log

Trusted Platform Module yes Storage of encryption keys

chiPseTCMOS No BIOS settings

2.5" backPlane OR 3.5" backPlaneStorage Controller Processor No Backplane firmware (HDD status, etc.)

cOnTROl Panel

Internal USB Yes as allowed by OSNormal usage is read only software license key, but not limited

Internal SD Module Yes as allowed by OSNormal usage is embedded hypervisor OS but not limited

POWeR suPPly

PSU Microcontroller NoPower supply operation, power telemetry data, and fault behaviors

PeRc 6/i inTeGRaTeDPERC NVSRAM Config Data No Stores configuration data of HDDs

PERC Firmware No Storage Controller Firmware

PERC Cache RAM No - not directly. Storage RAID controller cache

FRU NoCard product identification for system inventory purposes

IBUTTON Key EEPROM No Feature enablement encyrpted key

CPLD No HW control logic (i.e., power sequencing)

SAS 6/iR Integrated

Controller Configuration Data No Stores configuration data of HDDs

FRU NoCard product identification for system inventory purposes

Integrated Mirroring NVSRAM No Stores configuration data of HDDs

iDRAC6 Enterprise

VFlashYes - When enabled, installed, and the media does not have the write protect switch applied

Storage of logs, user images like files, drivers, OS's, etc.

T610 Volatility Chart Continued.


56

hOW is DaTa inPuT TO This memORy?


System BIOS SPI Flash

Loading flash memory requires a vendor-provided firmware file and loader program that is executed by booting up the system from a floppy or OS-based executable containing the firmware file and the loader. System loaded with arbitrary data in firmware memory would not operate. Future firmware releases may add support for recovery of a bad/corrupted BIOS ROM image via the iDRAC (administrator privilege plus specific firmware, binary, and commands)

LOM Configuration DataLoading flash memory requires a vendor-provided firmware file and loader program that is executed by booting up the system from a floppy or OS-based executable containing the firmware file and the loader. LOMs loaded with arbitrary data in firmware memory would not operate.

iDRAC6 Controller ROM N/A

iDRAC6 Controller RAM iDRAC embedded system

System CPLDLoading flash memory requires a vendor-provided firmware file and loader program that is executed by booting up the system from a floppy or OS-based executable (currently only DRMK utility support) containing the firmware file and the loader. System loaded with arbitrary data in CPLD memory would not operate.

System CPLD Not utilized

iDRAC6 Express Internal

Flash

iDRAC OS: Loading flash memory requires a vendor-provided firmware file and loader program that is executed by booting up the system from a floppy or OS-based executable containing the firmware file and the loader. System loaded without a good iDRAC firmware image yields a non-functional iDRAC. Managed Services Repository: Various partitions are loaded via vendor-provided firmware file and loader program just like iDRAC OS.

System RAM System OS


Factory load only.


BIOS only

iDRAC6 SDRAM Embedded iDRAC OS for 108MB and 8MB for VGA frame buffer

iDRAC6 FRU Factory and iDRAC embedded OS

iDRAC6 Boot Block Flash

Loading flash memory requires a vendor-provided firmware file and loader program that is executed by booting up the system from a floppy or OS-based executable or out-of-band firmware updates across the management network. Bad contents yield the iDRAC inoperable and unrecoverable in the customer environment. Note the life cycle log is automatically updated by the iDRAC as various system component FW, HW, and SW verions are changed.

Trusted Platform Module Using TPM-enabled operating systems

chiPseTCMOS BIOS control only via input such as BIOS F2 menu user configuration settings (such as boot order)


Storage Controller Pro-cessor

Loading flash memory requires a vendor-provided firmware file and loader program that is executed by booting up the system from a floppy or OS-based executable (DRMK, USC, OS DUPs utility support) containing the firm-ware file and the loader. Backplane loaded with bad firmware will not provide backplane and HDD status.

cOnTROl PanelInternal USB Either read-only license key or OS control copies

Internal SD Module Factory load, OS run time usage, and OS updates and configuration changes.

POWeR suPPly

PSU Microcontroller

Loading flash memory requires a vendor-provided firmware file and loader program that is executed by booting up the system from a floppy or OS-based executable (Unified Server Configurator) containing the firmware file and the loader. PSUs loaded with bad firmware will not provide PSU functional behavior and result in PSU system faults.

PeRc 6/i inTeGRaTeDPERC NVSRAM Config Data

Embedded storage firmware controls this data

PERC FirmwareLoading flash memory requires a vendor-provided firmware file and loader program that is executed by booting up the system from a floppy or OS-based executable (DUPs, Unified Server Configurator) containing the firmware file and the loader. Storage adapters loaded with bad firmware will not provide storage controller behavior.

PERC Cache RAM Embedded storage firmware controls the use of storage cache data.

FRU Factory only. Not customer updatable.

IBUTTON Key EEPROM Factory only. Not customer updatable.

CPLD Factory only. Not customer updatable.

SAS 6/iR Integrated



57

hOW is This memORy WRiTe PROTecTeD? hOW is The memORy cleaReD?


System BIOS SPI Flash Software write protected Not possible with any utilities or applications and system is not functional if corrupted/removed.

LOM Configuration DataNot explicitly protected but special applications are needed to communicate through the LOMs to reprogram this ROM.

Not user clearable

iDRAC6 Controller ROM Protected permanently by hardware Not clearable

iDRAC6 Controller RAM n/a iDRAC reset

System CPLD Requires special system-specific utilityNot possible with any utilities or applications and system is not functional if corrupted/removed.

System CPLD It's not accessible Not clearable


Flash

Writes are proxied through a temporary iDRAC scratchpad RAM and not directly made from an OS or OS application.

Not user clearable

System RAM OS control Reboot or power down system


HW read only Not - read only


Locked by BIOS from physical access by anyone after boot

N/A - BIOS control only

iDRAC6 SDRAM n/aAC cycle for BMC OS and reset / power off server for VGA frame buffer

iDRAC6 FRU Writes controlled by iDRAC embedded OS EPPID is not clearable

iDRAC6 Boot Block Flash

iDRAC embedded OS control of the write protection.

Not possible with any utilities or applications and iDRAC does not function as expected if corrupted/removed. Lifecycle log is clearable only in a factory environment. SEL is user clearable.

Trusted Platform Module SW write protected F2 setup option

chiPseT

CMOS N/A - BIOS only control

Planar NVRAM_CLR jumper or remove AC cord, remove cover, remove coin cell battery. Wait for 30 seconds, replace battery, cover, and then AC cord.F2 system setup option to restore defaults


Storage Controller Processor

Embedded firmware only writeable through controlled iDRAC methods

Not possible with any utilities or applications and backplane does not function as expected if corrupted/removed.

cOnTROl PanelInternal USB OS control OS control format

Internal SD Module Only by SD card write-protect switch. OS control format

POWeR suPPly

PSU MicrocontrollerProtected by the embedded microcontroller. Special keys are used by special vendor-provided utilities to unlock the ROM with various CRC checks during load.

N/A - not in-system clearable


hOW is DaTa inPuT TO This memORy?


System BIOS SPI Flash

Loading flash memory requires a vendor-provided firmware file and loader program that is executed by booting up the system from a floppy or OS-based executable containing the firmware file and the loader. System loaded with arbitrary data in firmware memory would not operate. Future firmware releases may add support for recovery of a bad/corrupted BIOS ROM image via the iDRAC (administrator privilege plus specific firmware, binary, and commands)

LOM Configuration DataLoading flash memory requires a vendor-provided firmware file and loader program that is executed by booting up the system from a floppy or OS-based executable containing the firmware file and the loader. LOMs loaded with arbitrary data in firmware memory would not operate.

iDRAC6 Controller ROM N/A


58


hOW is This memORy WRiTe PROTecTeD? hOW is The memORy cleaReD?


System BIOS SPI Flash Software write protected Not possible with any utilities or applications and system is not functional if corrupted/removed.

LOM Configuration DataNot explicitly protected but special applications are needed to communicate through the LOMs to reprogram this ROM.

Not user clearable

iDRAC6 Controller ROM Protected permanently by hardware Not clearable

iDRAC6 Controller RAM n/a iDRAC reset

System CPLD Requires special system-specific utilityNot possible with any utilities or applications and system is not functional if corrupted/removed.

System CPLD It's not accessible Not clearable


Flash

Writes are proxied through a temporary iDRAC scratchpad RAM and not directly made from an OS or OS application.

Not user clearable

System RAM OS control Reboot or power down system


HW read only Not - read only


Locked by BIOS from physical access by anyone after boot

N/A - BIOS control only

iDRAC6 SDRAM n/aAC cycle for BMC OS and reset / power off server for VGA frame buffer

iDRAC6 FRU Writes controlled by iDRAC embedded OS EPPID is not clearable

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