March

2019Roth Capital Partners 31st Annual Growth Stock Conference

Investor Presentation

2

Safe Harbor Statement

This Presentation may contain certain statements or information that constitute “forward-looking statements” (as defined in Section 27A of the

Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended). In some but not all cases, forward-

looking statements can be identified by terminology such as, for example, “may,” “will,” “should,” “would,” “expects,” “plans,” “anticipates,” “intends,”

“believes,” “estimates,” “predicts,” “potential,” “continue,” or the negative of these terms or other comparable terminology. Examples of forward-

looking statements include statements regarding Amtech System, Inc.’s (the “Company”) future financial results, operating results, business

strategies, projected costs, products under development, competitive positions and plans and objectives of the Company and its management for

future operations. Such forward-looking statements and information are provided by the Company based on current expectations of the Company

and reflect various assumptions of management concerning the future performance of the Company, and are subject to significant business,

economic and competitive risks, uncertainties and contingencies, many of which are beyond the control of the Company. Accordingly, there can be

no guarantee that such forward-looking statements or information will be realized. Actual results may vary from any anticipated results included in

such forward-looking statements and information and such variations may be material. No representations or warranties are made as to the

accuracy or reasonableness of any expectations or assumptions or the forward-looking statements or information based thereon. Only those

representations and warranties that are made in a definitive written agreement relating to a transaction, when and if executed, and subject to any

limitations and restrictions as may be specified in such definitive agreement, shall have any effect, legal or otherwise. Each recipient of forward-

looking statements should make an independent assessment of the merits of and should consult its own professional advisors. Except as required

by law, we undertake no obligation to publicly update forward-looking statements, whether as a result of new information, future events, or

otherwise.

Long-term Strategic Focus:

Delivering Profitable Growth in

Highly Selective Semiconductor Opportunities

Where We Have Distinctive Capabilities

4

A market leader in the high-end power chip market (SiC and 300mm Si HTR)

Developing and supplying essential equipment and consumables used in semiconductor industry

Premier semi brands with strong global footprint

Serving large and growing end markets in a technology-driven up cycle

Capitalize on fast growth, emerging SiC/Si power sector

Strong 12/31/18 financials

Cash of $56M

Five consecutive years of semi revenue growth

Three consecutive years of semi operating profit growth

$25M of semi backlog

Investment Highlights for 2019 and Beyond

2018 Year-end Business Review to

Reassess Long-term Objectives

6

2018 Year-end Business Review and Conclusions

State of Amtech’s solar and semi businesses at year end

Solar business weak - severely challenged by non-controllable factors; little visibility of future potential

• Solar is quickly becoming a commoditized business

• Chinese local competition has caught up technically; tools are “good enough” for commoditized industry

• Margins under intense pressure due to lower cost, “good enough” offerings by locals

• Superior technology not enough to “win” in current CAPEX constrained market environment

Semi business strong - opportunities to deliver attractive cash flow and profitable growth

Conclusion: Unlike solar, semi captures high value for our efforts and investment

Solar Semi (Power Chip)

3.7

1.0

5.5

12.2

15.5

-

2.0

4.0

6.0

8.0

10.0

12.0

14.0

16.0

18.0

2014 2015 2016 2017 2018

Operating Profit (millions)

7

Amtech Group’s Forward Plan

Solar

Stopping losses is top priority

Reduced investment in new business development

Semi Increased focus and investment in semi business to participate in fast-growing power device industry and to deliver

value-enhancing profitability and growth

Strategic Focus is on Semi Businesses

Foundational Strengths and Related Opportunities

Emerging Growth:

PR Hoffman

SiC Substrate

Consumables and

Machines

Fast emerging growth in SiC substrate and power

devices

Growth: Bruce Chip Fabrication Capitalize on Si power chip growth opportunity

Core: BTU Packaging and SMT Solid foundation with complimentary growth in backend

IC packaging and electronics SMT tracking semi

industry cycles

8

The Building of Amtech’s Thermal Process Expertise

Strategic Acquisitions

1994 2007 2010 20151996 20041983

ATMOSCAN(from Intel)

9

Now Operating in Three Semi Value Chains

Value Chain

Brand

Business Strategy Emerging Growth Growth Core Foundation

Main ProductsSubstrate lapping and polishing

consumables and machines Horizontal thermal diffusion & CVD furnaces Advanced thermal processing equipment

Key Customers Major SiC, Si, and sapphire wafer producersTop players in power chip, sensor, and analog

sectors

Chip packaging, SMT, and custom engineered

high temperature belt furnace producer

Chip Substrate Chip Fabrication Chip Packaging and SMT

10

Diverse Customer Base of Market Leaders

11

Positive Semiconductor Growth Outlook

Worldwide semiconductor market expected to grow to $570B by 2022

Over 1 trillion units shipped in 2018 between IC and O-S-D semiconductor devices

12

Highly Leveraged to SiC Growth

Premier global brand since 1938

Market share leader in SiC/GaN, Si, LED sapphire lapping and polishing consumables and machines

Strong performance and continued growth potential benefiting from serving growing markets, particularly SiC

power chip sector

Key customers: Our top 2 customers account for approximately 90% market share in SiC substrates and we are

their primary supplier

13

High Growth SiC Substrate Outlook

SiC substrate capacity projected to grow from 263K units

in 2018 to 1M units by 2023

14

Leading position in emerging 300mm thermal HTR

diffusion furnace for power chips

Serve top players in power chip, sensor, and analog

sectors, including #1 power chip producer, Infineon

(Thirty-four 300mm systems)

Upgrade cycle opportunity for 150mm (2/3rd) to

200mm (1/3rd) to 300mm wafers

Power electronics market outlook robust:

Growth in xEV and electronics content in automobiles

Need for high power applications across all segments

More companies will follow Infineon to 300mm

production

Premier Global Brand in Power Chip Fabrication Business

15

Premier Global Brand in Power Chip Fabrication Business

Semiconductor Unit Growth

Power, Sensors, Analog devices

represent ~70% of total

semiconductor unit growth

16

Global premier brand

Core semi business unit tracking industry growth cycles

Operate in three industry segments

Semi packaging

Surface mount technology (SMT) for electronics systems

Custom engineered high-temp furnaces for growing automotive and other

industrial applications

Semi Packaging

Electronics PCB

Chip Packaging and Electronics SMT a Core Business

17

Growth in Chip Packaging and Electronics SMT

Financial Overview

19

Semi Delivering Value-Driving Top and Bottom-line Growth

Revenue

Operating Profit

20

Seeing Rapid Growth in Semi Bookings

21

49

62

84

97

$0

$20

$40

$60

$80

$100

$120

2014 2015 2016 2017 2018

Bookings (millions)

Tracking Semiconductor Growth Cycles

21

Semi Delivering Value-Driving Earnings Growth

3.7

1.0

5.5

12.2

15.5

-

2.0

4.0

6.0

8.0

10.0

12.0

14.0

16.0

18.0

2014 2015 2016 2017 2018

Operating Profit (millions)

22

Operating Profit (Semi + Solar )

(13) (14)

(8)

10

2

$(15)

$(10)

$(5)

$-

$5

$10

$15

2014 2015 2016 2017 2018

Consolidated Operating Proft (millions)

23

Strong Balance Sheet

(In Millions) December 31, 2018

Cash and cash equivalents $56.0

Total assets $140.9

Total debt $7.9

Shareholders’ equity $90.3

Weighted average diluted shares outstanding 14.3

Strong balance sheet with ample

liquidity for:

Business development

Innovation

Select external opportunities

Share repurchase

Summary

25

A market leader in the high-end power chip market (SiC and 300mm Si HTR)

Developing and supplying essential equipment and consumables used in semiconductor industry

Premier semi brands with strong global footprint

Serving large and growing end markets in a technology-driven up cycle

Capitalize on fast growth, emerging SiC/Si power sector

Strong 12/31/18 financials

Cash of $56M

Five consecutive years of semi revenue growth

Three consecutive years of semi operating profit growth

$25M of semi backlog

Investment Highlights for 2019 and Beyond

Appendix

27

New Silicon Carbide Power Device Growth Market

SiC power devices have advantages

such as:

Higher temperature operation (>200°C)

Higher voltage operation (>1000V)

Higher speed operation

Faster heat dissipation

And smaller form factor compared to Si

power devices.

Fast-growing markets with increasing

power chip demand include:

Automotive (particularly EV and

increasing electronics content)

Communications (particularly 5G

infrastructure),

Industrial equipment

Renewable energy

28

SiC Power Devices

Total SiC based power devices expected to grow from $451M in

2018 to $1.5B in 2023

29

Chip Substrate Growth Outlook for

SiC Power and RF Devices

SiC device market size expected to accelerate after 2020 due to greater industry adoption, from

$685M in 2017 to $2.8B in 2023

Growth drivers in SiC expected from automotive and communications, primarily in 5G infrastructure

30

Automotive as a Power Chip Growth Opportunity

Automotive expected to hold major share of the

power electronics market between 2018 and

2023 with:

Increasing adoption of electric vehicles

An expanding charging infrastructure

Market focus on ADAS and future AD

SiC power devices address demand for higher

performance with smaller form factor

31

BTU provides equipment to the top 5

global OSAT subcontractors and OEMs

Key application opportunities

Flip chip

SiP (system in package)

Fan-out SiP

2.5 and 3D memory

Pyramax platform is a well-established

solution with sizable installed base

BTU is well positioned for

semiconductor packaging roadmap

Semiconductor Packaging Applications

32

Chip Packaging and Surface Mount Assembly

Growth Projection

Semi Packaging Electronics SMT