NovaCentrix 400 Parker Drive Suite 1110 Austin, Texas 78728 T: 512-491-9500 F: 512-491-0002 [email protected] www.novacentrix.com image or illustation TBD PulseForge® Soldering on Low Temperature Substrates in Milliseconds PulseForge® Soldering: A collaboration between NovaCentrix and the Holst Centre. PulseForge® Soldering enables the soldering of standard lead-free solder pastes on low-cost, temperature sensitive substrates such as paper and PEN in milliseconds. HOW IT WORKS • Pulses of high intensity light are used in place of a reflow oven to heat the solder to its liquidus temperature in milliseconds without damaging the underlying substrate. • Solder paste is heated indirectly through a light-absorbing layer and components. • High contrast ratio absorption between layers allows for selective heating. • High energy doses can be applied without damaging conductive tracks by protecting them with light-reflecting layers. HOW IT IS BETTER • Multiple types of components requiring different levels of heat can be soldered simultaneously. • Processing is much faster than reflow soldering and is roll-to-roll compatible. • Enables the use of standard lead-free solder pastes on temperature sensitive substrates – not possible with any other processing method. LED Ball Grid Array PulseForge Beam Utilizing PulseForge® soldering technology, we were able to solder LEDs, resistors and capacitors onto conductive ink traces in a matter of milliseconds. These were soldered using traditional solder paste SAC 305.

PulseForge® Soldering on Low Temperature Substrates in ......standard lead-free solder pastes on low-cost, temperature sensitive substrates such as paper and PEN in milliseconds

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Page 1: PulseForge® Soldering on Low Temperature Substrates in ......standard lead-free solder pastes on low-cost, temperature sensitive substrates such as paper and PEN in milliseconds

NovaCentrix400 Parker DriveSuite 1110Austin, Texas 78728T: 512-491-9500F: [email protected]

image or illustation TBD

PulseForge® Soldering on Low Temperature Substrates in Milliseconds PulseForge® Soldering: A collaboration between NovaCentrix and the Holst Centre. PulseForge® Soldering enables the soldering of standard lead-free solder pastes on low-cost, temperature sensitive substrates such as paper and PEN in milliseconds.

HOW IT WORKS

• Pulses of high intensity light are used in place of a reflow oven to heat the solder to its liquidus temperature in milliseconds without damaging the underlying substrate.

• Solder paste is heated indirectly through a light-absorbing layer and components.

• High contrast ratio absorption between layers allows for selective heating.

• High energy doses can be applied without damaging conductive tracks by protecting them with light-reflecting layers.

HOW IT IS BETTER

• Multiple types of components requiring different levels of heat can be soldered simultaneously.

• Processing is much faster than reflow soldering and is roll-to-roll compatible.

• Enables the use of standard lead-free solder pastes on temperature sensitive substrates – not possible with any other processing method.

LED Ball Grid Array

PulseForge Beam

Utilizing PulseForge® soldering technology, we were able to solder LEDs, resistors and capacitors onto conductive ink traces in a matter of milliseconds. These were soldered using traditional solder paste SAC 305.