29
METAL RELAX WITH VIBRATION REPORT WM MEASURE VOLTAGES 886

REPORT WM MEASURE VOLTAGES

  • Upload
    others

  • View
    6

  • Download
    0

Embed Size (px)

Citation preview

Page 1: REPORT WM MEASURE VOLTAGES

METAL RELAX WITH VIBRATION

REPORT WM MEASURE VOLTAGES 886

Page 2: REPORT WM MEASURE VOLTAGES

WIAP® MEMV®_WM_886_2017_7 measure voltages page 2 from 29

©

CONTENTS

1 introduction ................................................................................................................................................................ 3

2 Voltage measurement means wellbore method .......................................................................................... 3

3 Barkhausen noise ..................................................................................................................................................... 5

3.1 Barkhausen Noise Analysis......................................................................................................................... 5

3.2 Barkhausen Noise - the phenomenon .................................................................................................... 5

3.3 Barkhausen Noise - the properties .......................................................................................................... 6

3.4 Barkhausen Noise Analysis - Applications ........................................................................................... 6

4 X-ray residual stress measurement .................................................................................................................. 7

4.1 The term "residual stresses" ...................................................................................................................... 7

5 Measurement of residual stresses (sin2y method) .................................................................................... 8

6 task .............................................................................................................................................................................. 10

6.1 Cut-compliance method ............................................................................................................................ 10

7 Measurement of residual stresses .................................................................................................................. 10

8th Classification of residual stresses by field of activity and impact ..................................................... 11

8.1 Assess the impact ......................................................................................................................................... 12

9 Cut-compliance method ...................................................................................................................................... 12

10 Interim Report 2014 Topics base .............................................................................................................. 12

11 Indicator of mechanical stresses "STRESS VISION" ........................................................................... 24

12 Test method WIAP MEMV type AG shift ................................................................................................. 25

13 G declaration ....................................................................................................................................................... 27

13.1 Physical basics .............................................................................................................................................. 27

13.2 Special cases Uniform linear acceleration ......................................................................................... 27

13.3 Examples ......................................................................................................................................................... 28

14 References ........................................................................................................................................................... 28

15 Contact .................................................................................................................................................................. 29

Page 3: REPORT WM MEASURE VOLTAGES

WIAP® MEMV®_WM_886_2017_7 measure voltages page 3 from 29

©

1 INTRODUCTION

For the metal relax with vibration MEMV®

is the measurement of the components

during the process, the most important

component of the implementation. In

annealed workpieces can speak today

mainly on experience.

The WIAP has developed a method in which,

in addition to an enhanced relaxing method

also includes measuring been widely

considered.

In many places a component values are

measured and evaluated. These

measurement results are very meaningful

today. Even when annealed components we

can see exactly how the differences behave

towards non-annealed parts.

Flame-looking or other workpieces, which

normally can not be annealed, we relax with

the procedure WIAP MEMV.

For all workpieces, the measurement results

are always an important part.

The following are some measurement

methods are called, which are used to

measure voltages.

2 SPANNUNGSMESSUNG MEANS WELLBORE

METHOD

The hole drilling method is one of the most

commonly used mechanical part destructive

method with an internationally recognized

standard (AST E 837-99). In the borehole

method, the determination of the internal

stresses of the material by the strain change

occurs in the material removal. Through the

hole-free surfaces, which leads to the

release of the residual stresses and

distortion change entstehehen. The

deformation is using strain gauges, known

as strain gage rosettes registered (Figure

4.13).

Figure 4.13: Measurement setup, the hole drilling method, diagrammatic representation Observation of the drilling operation with the video microscope A gradual introduction of the bore turns at

each depth step in the vicinity of the bore, a

new state of equilibrium, since the voltages

must disappear perpendicular to the

generated load bore cylindrical surface. For

each depth slice Az the strains are

registered on the component surface in the

radial direction and plotted as a function of

depth z. In order to obtain a correlation

between the residual stress caused in the

depth R and registered on the surface

change in the strain Δε signals, a calibration

to a known, mostly homogenous state of

Page 4: REPORT WM MEASURE VOLTAGES

WIAP® MEMV®_WM_886_2017_7 measure voltages

©

tension with the aid of a standard is

necessary.

To evaluate the residual stresses Various

methods represent the most common is

probably the determination of residual

stress over a residual stress distribution,

since the gradient of the residual stress

distribution are considered over the depth.

In practice this several methods have

become established, which is to be further

only briefly on the method of Kelsey.

Kelsey leads to internal stress calculating a

proportionality factor K (Eq. (4.11)) again as

the measured strain changes Δε may be

converted during the hole-drill

not directly over the Hooke's law in

voltages. This arises because the voltages in

a depth increment Az are only partially

triggered when drilling:

With

Δε strain change

K = proportionality factor f

(Bore diameter D0,

Geometry and arrangement of

DMS, drilling depth z.

For the calculation of residual stresses after

Kelsey for the biaxial case, the following

relationship (equation (4.12) and (4.13).)

Results in consideration of the measured at

the surface at a drilling Az at a depth zi

strain increments Δε:

_WM_886_2017_7 measure voltages page 4 from

tension with the aid of a standard is

esidual stresses Various

methods represent the most common is

probably the determination of residual

stress over a residual stress distribution,

since the gradient of the residual stress

distribution are considered over the depth.

methods have

become established, which is to be further

only briefly on the method of Kelsey.

Kelsey leads to internal stress calculating a

proportionality factor K (Eq. (4.11)) again as

the measured strain changes Δε may be

drilling method is

not directly over the Hooke's law in

voltages. This arises because the voltages in

a depth increment Az are only partially

Geometry and arrangement of

For the calculation of residual stresses after

Kelsey for the biaxial case, the following

relationship (equation (4.12) and (4.13).)

Results in consideration of the measured at

drilling Az at a depth zi

Where:

μ Poisson's ratio of

material

K proportionality

In Figure 4.14 the experimental setup is

shown a borehole for examination.

Most measurement systems for logging

make it possible to examine

complex geometries and in different sizes.

Figure 4.14: Borehole procedure in the laboratory

The results of a well logging with a residual

stress depth profile of a 300 micron thick

hard chromium layer on a copper base body

are shown in Figure 4.15. Using this

principle must be observed that the optimal

penetration depth depends on the diameter

of the drill used, and from a depth of about 1

mm no reliable evaluation of the results is

possible.

Cu with hard chrome layer

Mid Pos.

Sigma X

Sigma Y

from 29

In Figure 4.14 the experimental setup is

shown a borehole for examination.

Most measurement systems for logging

make it possible to examine parts with very

complex geometries and in different sizes.

Figure 4.14: Borehole procedure in the

The results of a well logging with a residual

stress depth profile of a 300 micron thick

hard chromium layer on a copper base body

Figure 4.15. Using this

principle must be observed that the optimal

penetration depth depends on the diameter

of the drill used, and from a depth of about 1

mm no reliable evaluation of the results is

Cu with hard chrome layer

Page 5: REPORT WM MEASURE VOLTAGES

WIAP® MEMV®_WM_886_2017_7 measure voltages page 5 from 29

©

Figure 4.15: residual stress distribution at the example of a hard chromium layer determined by the incremental method borehole A significant advantage of the drilling hole

method is in a relatively simple

measurement implementation. The

measurements are performed locally with a

very high spatial resolution. Using the

incremental hole drilling method, it is

possible to measure depth distributions of

residual stresses.

The disadvantage of this method lies in the

partially destructive measuring principle,

and this must be considered depending on

the use of the component, since it only is

very small holes.

3 BARKHAUSEN NOISE

3.1 Barkhausen Noise Analysis

The Barkhausen noise analysis (BNA), also

known as magnetoelastic or micromagnetic

method based on the principle of inductive

measurements of a noise-like signal which is

generated when the magnetization of a

ferromagnetic component. After the German

scientist Professor Heinrich Barkhausen,

who explained the principle of this

phenomenon as early as 1919, the signal

Barkhausen noise is called.

3.2 Barkhausen Noise - the

phenomenon

Ferromagnetic materials have small

magnetic fields that resemble a model tiny

bar magnets and called domains, or Weiss'

districts. Each domain is magnetized along a

particular crystallographic-graphical

preferred direction. The domains are

separated from each other by boundaries,

which are known as domain walls or

domain walls. By alternating magnetic

fields, the domain walls move back and

forth. Thus, a domain wall can move the

domain must zoom in on one side of the

wall, while the domain shrinks to the

opposite side. The result is a change to the

overall magnetization of the part.

When a coil of conductive wire is placed in

the vicinity of a ferromagnetic component,

while the domain wall moves, the resulting

magnetization generates an electrical pulse

in the coil. For the first time, the electrical

considerations of the movement of the

domain wall by Professor Heinrich

Barkhausen in 1919 were made. He has

proved that the magnetization process,

which is characterized by a hysteresis curve,

not really runs steadily and continuously,

but consists of small, abrupt steps that occur

when the magnetic domains move under the

applied magnetic field. When all electrical

pulses generated by all of the domain

Page 6: REPORT WM MEASURE VOLTAGES

WIAP® MEMV®_WM_886_2017_7 measure voltages page 6 from 29

©

movements are added, a noise-like signal or

the Barkhausen noise is generated.

The Barkhausen noise has a power

spectrum, which starts at the frequency and

magnetization increases for most materials

to about 2 MHz. It is attenuated

exponentially as a function of the distance to

which it has moved in the material. This is

mainly caused by the eddy current loss,

caused by the propagating electromagnetic

fields generated by the domain walls. The

extent of damping determines the depth at

which information can be recorded

(measuring depth). The main factors

affecting this depth are

the frequency range of the analyzed

Barkhausen noise as well as

the conductivity and permeability of the test

material.

The possible measurement depths for

practical applications are 0.01 to 1.5 mm, as

a rule is only evaluated in the near-surface

region to about 0.05 mm depth to the edge

zone analysis (grinding burn).

3.3 Barkhausen Noise - the

properties

Two important material properties affect

mainly the intensity of the Barkhausen noise

signal:

One of them is the size of the sign and the

distribution of the elastic tensions in the

microstructure, which affect the selected

domains and closed in the preferential

direction of magnetization way. This

phenomenon of elastic properties, which

cooperate with the structure of the domains

and the magnetic properties of the material

is called a magneto-elastic interaction.

Compressive stresses decrease by magneto-

elastic interaction, the intensity of the

Barkhausen noise, while the tensile stresses

increase the intensity. This applies to

materials having positive magnetic

anisotropy (iron, most steels, and cobalt,

with nickel having a negative magnetic

anisotropy, the effect is reversed. ) This fact

is utilized in the measurement of the

intensity of the Barkhausen noise to assess

the residual stress state in the edge zone of

the material examined. The measurement

also determines the direction of the

principal stresses.

The second material properties which

Barkhausen noise significantly affects the

microstructure structure. This effect can be

described approximately over the

microhardness is the intensity of the noise is

reduced in the structure with greater

microhardness. So convey Bark-house noise

measurements information about

microstructural condition of the material

examined.

3.4 Barkhausen Noise Analysis -

Applications

Many surface treatments such. B. grinding,

hard turning, hardening and induction

hardening, shot peening cause significant

changes in residual stress and

microstructure structure of the edge zone

which can be characterized by means of

Barkhausen noise. The control of hard fine

machining (grinding burn test), the main

application of the method is Barkhausen.

Processes such as creep and fatigue also

change the residual stress and

microstructure and can be analyzed by

means of Barkhausen noise.

Practical applications of the magnetoelastic

Barkhausen noise method can be broadly

divided into three categories:

Page 7: REPORT WM MEASURE VOLTAGES

WIAP® MEMV®_WM_886_2017_7 measure voltages page 7 from 29

©

Evaluation of residual stresses; as long as

the micro-structure-structural variables

remain known and constant.

Review of the microstructure; as long as the

residual stresses known and remain

constant.

Testing of peripheral zones to changes in

residual stress and microstructure, which

can be affected by heat treatments and

machining processes:

* Non-destructive detection of overheating,

control of the grinding process

* Monitoring of hard turning operations

* Control of heat treatments

* Non-destructive testing of thermal damage

of the substrate by passing chromium

plating layers

* Evaluation of the surface residual stress in

rolling of steel

4 X-RAY RESIDUAL STRESS MEASUREMENT

In this experiment, the basics of X-ray

residual stress measurement are developed

and discussed the possibilities and

limitations of this measurement method

using the example of a surface hardened

sample.

4.1 The term "residual stresses"

Under residual stress is generally

understood stresses in a component to

which no external mechanical stresses

acting and subject to a constant

temperature field spatially and temporally.

The costs associated with the residual

stresses internal forces and torques in

mechanical equilibrium.

Depending on their scope residual stresses

in such a 1st, 2nd and 3rd species be divided

into:

Residual stresses 3. Type (Micro

inhomogeneous residual stresses) are

micro-scopic nature. To change the amount

and / or direction within a grain. They are

formed of a dislocation near a lattice defect,

for example.

Residual stresses 2nd type (homogeneous

microstructure residual stresses) are

constant within a grain, but may vary from

grain to grain. They are a result of the

Streckgrenzenanisotropie, ie, the yield point

of different phases in the material is

different, thereby occurs a plastic

deformation inhomogeneous. Reason for

these residual stresses can be different

thermal expansion coefficients of different

phases in multiphase materials.

Residual stresses 1. Type (macro-stresses)

extend over macroscopic areas of a

workpiece, that is, over several grains.

Residual stresses 1st kind arise, for example

during forming, mechanical machining or

during the heat treatment of metallic

materials.

Figure 1 shows the schematic course of the

voltages along a cutout structure with the

corresponding definition of the residual

stresses 1st, 2nd and 3rd type.

Page 8: REPORT WM MEASURE VOLTAGES

WIAP® MEMV®_WM_886_2017_7 measure voltages page 8 from 29

©

Figure 1: Schematic of the internal stresses along the surface of a structural detail of a metal sample

Figure 2: Effect of residual stresses 1st, 2nd and 3rd species on the peaks of X-ray diffraction pattern

As several grains are detected by the X-ray

beam in the X-ray diffraction of

polycrystalline materials in general, residual

stresses are indistinguishable 2nd and 3rd

type and superimposed on the residual

stresses 1. Art. due to a higher spread of

lattice spacings they lead to a broadening of

the peaks. Residual stresses 1st kind,

however, cause a shift of the peak maxima

to DJ, since all the reflecting lattice planes of

a lattice planes are distorted in the same

way. This is illustrated in Figure 2.

5 MEASUREMENT OF RESIDUAL STRESSES

(SIN2Y METHOD)

For the experimental determination of

residual stresses are a wide variety of

destructive and nondestructive

measurement methods. The most important

non-destructive method represent the X-ray

measurement method. This group also

includes the presented under the

experiment sin2y process.

Stresses first type lead to elastic distortion

of the unit cell. the interplanar spacing

varies due to a force acting on grid power

from D0 to D, then this leads to a change in

the position of the interference line, as

Figure 3 illustrates.

Figure 3: Bragg reflection at a stress-free (left) and a strained lattice (right)

Since the penetration depth of X-rays is low

(approximately 10-20 microns, depending

on material and radiation used) are

recognized only near-surface regions of the

sample. A possibly vorhande z component of

the stress is on the surface of the absence of

Page 9: REPORT WM MEASURE VOLTAGES

WIAP® MEMV®_WM_886_2017_7 measure voltages page 9 from 29

©

restraint is always zero. That is, to measure

under the condition that the detected

sample volume no z-voltage component is

present, a two-axis (plane) state of stress in

the sample surface.

Figure 4 illustrates the recording technique

in the X-ray voltage measurement. While in

the diffractometer recording in a

conventional beam geometry only lattice

planes for reflection come, which are

parallel to the sample surface, is achieved by

tilting of the specimen by the angle y that, in

the voltage measurement including those

power levels reflect that are not oriented

parallel to the surface.

Figure 4: recording technique in the X-ray voltage measurement

In the investigation of polycrystalline

materials multiple crystallites are detected

by the primary beam. If one measures a

sample in different directions y, we obtain

the intensity of lattice planes of different

orientation which have different interplanar

spacings D upon application of a voltage.

The result is an interference cone, as shown

in Fig. 5

Figure 5: formation of the interference cone in many crystalline materials For determining the tension in the solid

state, the combination of the measured

lattice stretching with elasticity theoretical

point is necessary.

the coordinate system shown in Figure 6

with the angles j specifies one and y based

on the relationship between the measured

strain e j, y, and the surface-parallel main

voltages S1 and S2 and the main strains e1,

e2 and e3 is:

Linking the main strains of the principal

stresses is given by Hooke's law:

.

. Thus, Equation 1 can be written as

The introduction of Voigt's elastic constants

.

ψεψϕεψϕεε ψϕ2

322

222

1, cossinsinsincos ++=

)(1

211 σσε −=E

)(1

122 νσσε −=E

)( 213 σσνε +−=E

)(sin)sincos(1

2122

22

1, σσνψϕσϕσνε ψϕ +−++=EE

ES

1

2

12

+= νE

Sν−=1

Page 10: REPORT WM MEASURE VOLTAGES

WIAP® MEMV®_WM_886_2017_7 measure voltages page 10 from 29

©

Yields the fundamental equation of the X-

ray method for determining elastic stresses

in its most common presentation:

With ,

Figure 6: Definition of the coordinate system with the angles j and y

The determination of the plane stress is thus

reduced to the determination of the lattice

strain ej, y, which can be measured by the

change in the interference line positions.

Equation 5 can be regarded as a linear

equation. Plotting const the elastic

elongations for j =., As a function of sin2y on,

the result is a straight line whose slope is

proportional to the azimuth j effective

voltage component sj and the ordinate is

determined by the sum of the principal

stresses in the surface (Figure 7) , For the

separation of the principal stresses in the

surface, it is necessary to measure in at least

three different j-directions.

Figure 7: strain distribution in the azimuth plane j = const a flat, surface-parallel-voltage condition.

6 TASK

the voltage components parallel and

perpendicular to measure X-ray to the feed

direction of the laser to a laser beam cured

sample. The evaluation is performed using

the sin2y plot.

6.1 Cut-compliance method

7 MEASUREMENT OF RESIDUAL STRESSES

One general distinction between the "non-

destructive" and "destructive measuring

methods." Nondestructive "means that the

measurement is carried out under the

voltage to be measured. The measuring

principle of" destroying "methods, however,

consists precisely measure the voltage

change due to a mechanical engagement and

from this to calculate the original own-

voltages. however, in this context it should

be noted that due to the limited space in the

appropriate test equipment and the limited

penetration of X-ray or neutron beams

without limitation "destructive" methods

are often the de facto destruction of the

component has. consequence effective "non-

)(sin2

1211

22, σσψσε ϕψϕ ++⋅= SS

ϕσϕσσ ϕ2

22

1 sincos +⋅=

Page 11: REPORT WM MEASURE VOLTAGES

WIAP® MEMV®_WM_886_2017_7 measure voltages page 11 from 29

©

destructive" therefore, only the "part-

destructive" process,in which the

component only a local, repairable damage

(borehole, surface-section Hardness

impressive) is attached.

If for measuring an antecedent cutting of the

component is necessary, thereby induced

voltage changes are important to consider.

8 CLASSIFICATION OF RESIDUAL STRESSES

BY FIELD OF ACTIVITY AND IMPACT

Depending on the field effect, a distinction

between macro and micro-stresses (or

internal stresses of the 1st, 2nd and 3rd

type, see schematic representation). Of

technical importance are the macroscopic

primarily. This can significantly influence

the fracture behavior, the life or the

dimensional stability of a component.

Deliberately introduced residual stresses

can also have a favorable impact on the

component stress and increase the life

critical.

Residual stress-related crack in a bevel gear

All the methods listed have their specific

advantages and disadvantages, and

according to their rational use areas. An

important criterion is the measured depth

and the permitted degree of destruction.

With the internationally standardized

methods (drilling method and X-ray

diffraction) to residual stresses can be

measured only on the surface. Determining

a depth profile is extremely complicated and

relatively inaccurate with these methods.

With respect to accuracy and validity in

terms of the mechanical component

behavior are often superior to the

mechanical (destroying or partially

destroying) the other methods. This is

especially true for the latest mechanical

methods that cut-compliance method (also

called crack compliance method, an ASTM

standard in preparation, see below). A more

detailed description of the mechanical

methods can be found in (PDF)Mechanical

Page 12: REPORT WM MEASURE VOLTAGES

WIAP® MEMV®_WM_886_2017_7 measure voltages page 12 from 29

©

methods for the determination of residual

stresses.

8.1 Assess the impact

The measurement of residual stresses is

usually only one part of the solution - the

other, equally important, is the assessment

of their impact on device performance.

Residual stresses particularly affect the

speed of the subcritical crack growth

(fatigue, stress corrosion cracking, and. The

like.), And thus the durability and the

resistance to fracture. In general, the

residual stresses not selectively, but act

integrally. To assess the effects are localized

voltage values therefore not sufficient -

what matters is their distribution over some

physically relevant area.

9 CUT-COMPLIANCE METHOD

With the cut-compliance (CC) method, was

instrumental in the development of Mat-Tec

(and is) the Self-voltage gradients across an

entire cross-section of a component can be

measured efficiently and reliably. For more

details, please refer to publications (PDF):

Some Steps Towards Automation of the

Crack Compliance Method to Measure

Residual Stress Distributions, ICRS5, 1997

Experimental Determination of Crack

Closure by the Cut Compliance Technique,

in: Advances in Fatigue Crack Closure

Measurement and Analysis, ASTM STP 1343,

1999

These can be determined directly the course

of the crack stress due to the internal

stresses in the form of the course of the

stress intensity factor. This is required for

fracture-mechanical fatigue and lifetime

calculations. Thus the CC method is also

suitable for determining Rissschliesseffekte

experimentally (PDF:Characterization and

assessment of the fatigue crack behavior in

the area of the threshold value),

The CC method can be traced to a certain

depth to apply (PDF as a part-destructive

method for determining residual

stresses:Near-surface stress measurement

in 2D and 2D by the cut compliance

technique, Material Science Forum, 2002),

Thus, self-voltages can be measured on

larger objects in situ. The CC method is

currently an ASTM standard being prepared

in the Drafting Committee and serves on the

Mat-Tec AG.

Example of a residual stress measurement

and determination of the resulting stress

intensity factor in a forged shaft

10 INTERIM REPORT 2014 TOPICS

BASE

NOTE: This report has been automatically translated from Vietnamese to German, so any sentence and word positions are not correct.

Page 13: REPORT WM MEASURE VOLTAGES

WIAP® MEMV®_WM_886_2017_7 measure voltages page 13 from 29

©

content I. Information and financing,

maintaining and research

II. Summary

III. conclusion

information topics

• Project Title: Research, exploitation and

use of residual voltage measuring device

based on the effect of stress Vision 2.05 on

elastic.

• Execution: 12 months (from 01/2014 to

12/2014)

• Financing: 60 million VND

• Project management: Luu Vu Nhut,

material engineering

• Unit in charge: Nondestructive Evaluation

Center Institute of Atomic Energy Huy

Vietnam

reasons

• The NDT methods traditionally used as

ultrasonic, radiographic, eddy current ...

evaluate defects in components and

recognize, but are limited to the state of

stress (residual stress) of judge.

• residual stresses are always stored in the

body after deformation and annealing,

which decreases the viscosity of the

materials, modification and reduce stress

distribution geometric stability; Vandalism

completeness of the crystal, creating cracks

in the surface structures.

• method of elastic (magneto-elastic) based

on effects of Villari (Italian physicist (1836

to 1904)) alleged Russian measurement

DIMENStest development. This is non-

destructive method for rapidly predicting

advanced position within the structure of

residual stresses and defect inspection

The goal of the subject

• Research and testing self-voltage

measurement methods to improve

concentration levels and the variability of

residual stresses in the material to be

measured and monitored. This is a very

important parameter in assessing and

predicting the lifetime of the object and in

the prevention of corrupt activities.

• Application testing methods yuan

advanced in the maintenance, repair and

periodically checks the quality of the

equipment, components, industrial

(equipment, Structural work in harsh

conditions such as load, pressure, high-

temperature devices such as pressure,

pipeline / gas bar , cranes, ...).

Important research topics

Contents 1: Research Methods

• Overview of residual stress measurement

methods used today.

• Research Methods of elastic Villari,

physical nature.

• Learning and provides equipment

management Stress Vision 2: 05th

Contents 2: calibration and testing

• construction process equipment

calibration and preparation

• survey residual stress welding test

samples before and after the heat treatment

by means of elastic (4 untreated samples

heated + 3 samples were heat treated).

• Verification Test by drilling holes (1

sample)

• Gas bottles collect samples and load tests

in position welds and heat-affected zone (2

samples) to be performed.

Contents 3: Test Process

Page 14: REPORT WM MEASURE VOLTAGES

WIAP® MEMV®_WM_886_2017_7 measure voltages

©

• construction process residual voltage test

equipment using standard stress Vision

Russia MDS 2:05 53 to 2.2004

Summary of Contents

What are charges?

Stress (MPa): Voltage is a measure of

internal resources arises in deformable

bodies is due to the effects of external

causes such as load, temperature change.

This type of physical stress

Tensile stress (that occurs when the metal

rod is drawn)

Compressive stress (which occur when the

metal rod is compressed)

Shear stress bending stress pressure (liquid

and gaseous)

When stress can the permissible exposure

limits exceeds cause destruction, damage

textures.

Thanh I ch and maintaining ng su  t pull

_WM_886_2017_7 measure voltages page 14 from

• construction process residual voltage test

ing standard stress Vision

Stress (MPa): Voltage is a measure of

internal resources arises in deformable

bodies is due to the effects of external

causes such as load, temperature change.

Tensile stress (that occurs when the metal

Compressive stress (which occur when the

Shear stress bending stress pressure (liquid

When stress can the permissible exposure

mits exceeds cause destruction, damage

Thanh I ch and maintaining ng su  t pull

Thanh I ch and maintaining

Bolts B í Â t stasis ng su compression

Thanh I ch and maintaining Thanh I ch g th e su  tu abhorrent n

Maintaining ng su  td What is u?

Stress is in parts, textures, excluding the

impact of foreign forces that are called

residual stress.

Subjected to external forces

from 29

Thanh I ch and maintaining

Bolts B í Â t stasis ng su compression

Thanh I ch and maintaining Thanh I ch g th e

Maintaining ng su  td What is u?

Stress is in parts, textures, excluding the

impact of foreign forces that are called

Subjected to external forces

Page 15: REPORT WM MEASURE VOLTAGES

WIAP® MEMV®_WM_886_2017_7 measure voltages

©

If foreign forces leave, stress concentration appears at the cracks

Stress distribution in the weld

Contents 1 Overview of the residual stress measurement methods:

Origins residual voltage

• The residual stress can be generated in the

process of processing of articles made of

blocks, to the finished product.

• The processing steps may produce

residual stresses can include: rolling,

casting, forging or cutting, bending, drawing,

machining (milling ...), the principles of

welding or during processing, the

temperature or process steel

The test procedure residual voltage

destruction, technology NDT and DT

destruction techniques: The residual stress

measurement techniques can be divided

into two groups.

_WM_886_2017_7 measure voltages page 15 from

If foreign forces leave, stress concentration

Contents 1 Overview of the residual stress measurement methods:

• The residual stress can be generated in the

process of processing of articles made of

ing steps may produce

residual stresses can include: rolling,

casting, forging or cutting, bending, drawing,

machining (milling ...), the principles of

welding or during processing, the

The test procedure residual voltage

destruction, technology NDT and DT

destruction techniques: The residual stress

measurement techniques can be divided

hole drilling

• The principle of this method is that when

the material residual voltage is present, the

principle of this method is that when the

material residual voltage is present, varying

degrees of distortion in the art will be able

to be processed, providing data

the residual stresses.

• To investigate must first into the sample

hole deep in the hole diameter and smaller

than drill the thickness of the sample (if the

depth is greater than the diameter of the

hole is very difficult to control the accu

of the authorization to ensure measure).

Measurement of the deformation of the

processing hole in different positions by

means of Moire interferometry, laser

interferometry or holographic laser.

from 29

• The principle of this method is that when

the material residual voltage is present, the

principle of this method is that when the

material residual voltage is present, varying

degrees of distortion in the art will be able

to be processed, providing data to calculate

• To investigate must first into the sample

hole deep in the hole diameter and smaller

than drill the thickness of the sample (if the

depth is greater than the diameter of the

hole is very difficult to control the accuracy

of the authorization to ensure measure).

Measurement of the deformation of the

processing hole in different positions by

means of Moire interferometry, laser

interferometry or holographic laser.

Page 16: REPORT WM MEASURE VOLTAGES

WIAP® MEMV®_WM_886_2017_7 measure voltages

©

The layout leaf shape measuring resistance according to ASTM E837-08

magnetic method

• There are two methods from the

magnetostrictive and Barkhausen noise

methods that analyze conductivity

measurements from the sensor and from

there to the movement of the domain. If

magnetostrictive materials, it w

emphasized by changing Domain: The

domain to the growth of residual stresses is

aligned pull (magnetostrictive positive) and

compressive residual stress

(magnetostrictive sound).

_WM_886_2017_7 measure voltages page 16 from

The layout leaf shape measuring resistance

• There are two methods from the

magnetostrictive and Barkhausen noise

methods that analyze conductivity

measurements from the sensor and from

there to the movement of the domain. If

magnetostrictive materials, it will be

emphasized by changing Domain: The

domain to the growth of residual stresses is

aligned pull (magnetostrictive positive) and

compressive residual stress

ultrasonic methods

• The change in ultrasonic

measured when the material is loaded, this

change mean voltage can be measured along

the shafts. The negative coefficient of

elasticity for the analysis is required, this

coefficient is determined by experiment.

Different types of waves can

most commonly used methods are

longitudinal waves. The maximum

sensitivity is obtained when the propagation

direction and the same load. The equation to

calculate the residual stress are:

V = Vo + Kϭ

Vo - speed; ϭ - stress;

K - coefficient of elasticity negative.

neutron diffraction

• neutron diffraction a non

method for the internal stresses in the

material is to determine the single crystal.

neutron know the value of the elastic

deformation component parallel to the

scattering vector, which can be be calculated

from the load. Neutron diffraction

measurements of noise components from

the changes in the crystal lattice spacing.

Lattice strain can be found from the

equation of Bragg:

2dsinθ = n lambda;

with λ = & Delta; d / d =

XRD

• This is one of the non-

for measuring residual stress most

frequently used.

• X-ray diffraction method is based on the

residual stress measurement of the angle of

diffraction defined, occurs with the greatest

from 29

• The change in ultrasonic velocity can be

measured when the material is loaded, this

change mean voltage can be measured along

the shafts. The negative coefficient of

elasticity for the analysis is required, this

coefficient is determined by experiment.

Different types of waves can be used, but the

most commonly used methods are

longitudinal waves. The maximum

sensitivity is obtained when the propagation

direction and the same load. The equation to

calculate the residual stress are:

nt of elasticity negative.

• neutron diffraction a non-destructive

method for the internal stresses in the

material is to determine the single crystal.

neutron know the value of the elastic

deformation component parallel to the

ng vector, which can be be calculated

from the load. Neutron diffraction

measurements of noise components from

the changes in the crystal lattice spacing.

Lattice strain can be found from the

= -cosθ Δθ

-destructive method

for measuring residual stress most

ray diffraction method is based on the

residual stress measurement of the angle of

diffraction defined, occurs with the greatest

Page 17: REPORT WM MEASURE VOLTAGES

WIAP® MEMV®_WM_886_2017_7 measure voltages

©

intensity when the X-shape. From this

perspective may know between the

diffraction plane distance d. Residual

stresses in the material leads to changes in

the distance between the plane (D) as the

non-existent state of tension. This change

was used to derive the elastic deformation

of the diffraction angle by the change.

Contents 1: Research methods of elastic Villari, physical nature

• Procedures for elasticity based on the

effect of Villari an NDT method extended

help is fast check residual stress and

possibly predict where defects in the

structure can connect the computer and ad

distribution 2D, 3D survey area stress, time

for a measurement point of 1

no surface preparation and the measured

depth to 12 mm.

• World methods of elastic

Vision device was used and developed more

than 25 countries: Russia, Canada, Brazil,

Australia ... the only device in Vietnam

advantages

• 1. 2s fast measurement time

• Not require the operator of 1.2 yuan

_WM_886_2017_7 measure voltages page 17 from

shape. From this

perspective may know between the

diffraction plane distance d. Residual

stresses in the material leads to changes in

the distance between the plane (D) as the

existent state of tension. This change

stic deformation

of the diffraction angle by the change.

Contents 1: Research methods of elastic

• Procedures for elasticity based on the

effect of Villari an NDT method extended

help is fast check residual stress and

possibly predict where defects in the

structure can connect the computer and ad

distribution 2D, 3D survey area stress, time

urement point of 1-2s, requires

no surface preparation and the measured

• World methods of elastic - 2.5 Stress

Vision device was used and developed more

than 25 countries: Russia, Canada, Brazil,

Australia ... the only device in Vietnam

• Not require the operator of 1.2 yuan

• Simulation 2D, 3D stress distribution map

• Check tension concentration factor

• Low Cost

• High sensitivity

• Mobile, 2.5 kg

• No high requirements for surface

preparation (color, the Government up to 4

mm can).

FUNDAMENTALS OF METHOD OF ELASTIC

hysteresis

• described as follows: if ferromagnetic

object magnetized to a magnetic field of

each, if we reduce the magnetic field and

back again in the opposite direction, it is to

return no more original magnetization

curve, but goes a different way.

• If the residual voltage is in the material,

the hysteresis curve will change, difficult to

magnetize the material. Figure parties

from 29

• Simulation 2D, 3D stress distribution map

• Check tension concentration factor

• No high requirements for surface

ration (color, the Government up to 4

FUNDAMENTALS OF METHOD OF

• described as follows: if ferromagnetic

object magnetized to a magnetic field of

each, if we reduce the magnetic field and

opposite direction, it is to

return no more original magnetization

curve, but goes a different way.

• If the residual voltage is in the material,

the hysteresis curve will change, difficult to

magnetize the material. Figure parties

Page 18: REPORT WM MEASURE VOLTAGES

WIAP® MEMV®_WM_886_2017_7 measure voltages

©

describe the process of material goods exist

if stress of 0, 40, 80 MPa.

• The relationship between the residual

stress and associated magnetic sensitivity S,

S = ∂ B / ∂σ

Stress affects the hysteresis curve

Magnetic lines of force

• magnetic lines of force form the

loop, do not cut with the same intensity and

there within and surrounding objects from

nature or from school. When this magnetic

field is applied to the ferromagnetic

material, these ferromagnetic materials will

magnetize within the line of force fr

same direction as the original lines of

magnetic force and create. When

heterogeneous materials (due to the

residual voltage) change the path of

magnetic lines of force in the interior of the

material.

homogeneous materials

_WM_886_2017_7 measure voltages page 18 from

material goods exist

• The relationship between the residual

stress and associated magnetic sensitivity S,

Stress affects the hysteresis curve

• magnetic lines of force form the closed

loop, do not cut with the same intensity and

there within and surrounding objects from

nature or from school. When this magnetic

field is applied to the ferromagnetic

material, these ferromagnetic materials will

magnetize within the line of force from the

same direction as the original lines of

magnetic force and create. When

heterogeneous materials (due to the

residual voltage) change the path of

magnetic lines of force in the interior of the

Heterogeneous materials (residual stress influence)

principle equipment

When the probe is placed on the surface of

the test object, roll charm

E1 E2 generates a magnetic field in the

material measure stimulating coils change

D1 D2 create magnetic induction Bc This

change induced electromotive power

(voltage U) in the coil voltage is to be judged

a key parameter stress state in the material.

U = K (ω2 / ω1) Bc S0 f sin β

Among them:

bc - magnetic induction (tesla);

So - Cross-covered coil;

K- Scaling factor;

f - frequency;

β - The angle between the measuring coil

ω2 and induction of B;

ω1, ω2 - Number of coils.

Structure Probe

Content 2: Test samples welding

from 29

materials (residual stress

When the probe is placed on the surface of

the test object, roll charm

E1 E2 generates a magnetic field in the

material measure stimulating coils change

D1 D2 create magnetic induction Bc This

change induced electromotive power

(voltage U) in the coil voltage is to be judged

a key parameter stress state in the material.

U = K (ω2 / ω1) Bc S0 f sin β

magnetic induction (tesla);

The angle between the measuring coil

Number of coils.

Content 2: Test samples welding

Page 19: REPORT WM MEASURE VOLTAGES

WIAP® MEMV®_WM_886_2017_7 measure voltages

©

Residual stress distribution in the weld

• Standard stress no weld plate.

• stresses after welding in three main areas:

the welds under tension, the base metal

areas emphasized background (can be

pulled or pressed together) and the

transition region under compressive stress

Content 2: Test samples welding

The test object

• welding processes: arc, sample size

150x150x10mm.

• Number of measuring points 49 to 60

points.

_WM_886_2017_7 measure voltages page 19 from

Residual stress distribution in the weld

• Standard stress no weld plate.

welding in three main areas:

the welds under tension, the base metal

areas emphasized background (can be

pulled or pressed together) and the

transition region under compressive stress

Content 2: Test samples welding

• welding processes: arc, sample size

• Number of measuring points 49 to 60

• Grid: the on the paper, the distance

measuring point x = 15 mm, y = 15 mm

• measuring methods: survey residual stress

weld 4 samples before and after hea

treatment

• Heating "Welding Science and Technology

', Md Ibrahim Khan

Preparation of the test

• caused by welding slag, dust, to clean the

stains Prior to performing the tests and

eliminate irregularities in the surface is

greater than 0.5 mm.

• The minimum size is 80 x 100 mm test.

• Who can use the network to paint directly

onto the surface of the paper check or boys

to the surface and then paste inspection.

Minimum number of measuring points grid

25, each of 5 rows x 5 columns.

from 29

• Grid: the on the paper, the distance-

measuring point x = 15 mm, y = 15 mm

• measuring methods: survey residual stress

weld 4 samples before and after heat

• Heating "Welding Science and Technology

• caused by welding slag, dust, to clean the

stains Prior to performing the tests and

eliminate irregularities in the surface is

minimum size is 80 x 100 mm test.

• Who can use the network to paint directly

onto the surface of the paper check or boys

to the surface and then paste inspection.

Minimum number of measuring points grid

25, each of 5 rows x 5 columns.

Page 20: REPORT WM MEASURE VOLTAGES

WIAP® MEMV®_WM_886_2017_7 measure voltages

©

initial experiments

ch p emplacements RT film

• RT Photography radiation is performed to

measure residual voltage 2.5 before firing

and after machine-STRESS VISION.

• The purpose of the test welds RT is the

existing patterns consist self-voltages to be

considered high if a disability? Normally, the

stress test results at the weld zone is higher

than the base metal should test all samples

welding defects, be removed.

output monitoring retention

• Sample 1: Results distribution welding

residual stress before and after the heat

treatment at temperature of 600o C, 30

minute no defect

_WM_886_2017_7 measure voltages page 20 from

• RT Photography radiation is performed to

measure residual voltage 2.5 before firing

STRESS VISION.

• The purpose of the test welds RT is the

voltages to be

considered high if a disability? Normally, the

stress test results at the weld zone is higher

than the base metal should test all samples

• Sample 1: Results distribution welding

residual stress before and after the heat

treatment at temperature of 600o C, 30

Note 1:

• The test results show that before the heat

treatment, DPMS the difference in the

of the largest is 400 units and the coefficient

of concentration load is very high 8.0, but

after a heat treatment of 600 degrees for 30

minutes, the distribution application DPMS

productivity and only significantly reduced

factor MSC stress concentra

and 3.0. At the same time the stress

distribution in the weld seam is, do not turn

the voltage spikes as high as before the heat

treatment.

from 29

• The test results show that before the heat

treatment, DPMS the difference in the load

of the largest is 400 units and the coefficient

of concentration load is very high 8.0, but

after a heat treatment of 600 degrees for 30

minutes, the distribution application DPMS

productivity and only significantly reduced

factor MSC stress concentration to 200 units

and 3.0. At the same time the stress

distribution in the weld seam is, do not turn

the voltage spikes as high as before the heat

Page 21: REPORT WM MEASURE VOLTAGES

WIAP® MEMV®_WM_886_2017_7 measure voltages

©

Form 2: Results distribution welding

residual stress before and after heat

treatment at temperature 600o C for 60

minutes - no defect

Note 2:

_WM_886_2017_7 measure voltages page 21 from

Results distribution welding

residual stress before and after heat

treatment at temperature 600o C for 60

This case is before the heat treatment DPMS

the biggest difference is 220, the largest

MSC 3.25. After the heat-

60 minutes DPMS is 170, the MSC is 2.4

units.

The test results show that before and after

heat treatment significantly reduces stress,

but the stress distribution in a uniform

weld.

Form 3: Results distribution welding

residual stress before and after the heat

treatment at temperature of 600o C, 120

minute no defect

Note 3:

from 29

This case is before the heat treatment DPMS

the biggest difference is 220, the largest

-treatment of 600 ° -

60 minutes DPMS is 170, the MSC is 2.4

The test results show that before and after

heat treatment significantly reduces stress,

but the stress distribution in a uniform

Results distribution welding

residual stress before and after the heat

treatment at temperature of 600o C, 120

Page 22: REPORT WM MEASURE VOLTAGES

WIAP® MEMV®_WM_886_2017_7 measure voltages

©

• Before the heat treatment, the difference

DPMS about 300 units, the MSC 2.8. DPSM

dropped to 180 units after the heat

treatment, the MSC 2.8.

• Similarly, in the mold 1 and 2, the uniform

distribution of stress in the solder and does

not appear to local stress concentration.

Form 4: Results distribution welding

residual stress before and after the heat

treatment at temperature of 600o C, 120

minute LOP defect

Comment 4:

_WM_886_2017_7 measure voltages page 22 from

• Before the heat treatment, the difference

DPMS about 300 units, the MSC 2.8. DPSM

dropped to 180 units after the heat

• Similarly, in the mold 1 and 2, the uniform

distribution of stress in the solder and does

stress concentration.

Results distribution welding

residual stress before and after the heat

treatment at temperature of 600o C, 120

• Before the heat treatment, the difference

DPMS about 360 units, the MSC 6.0. DPSM

fell to 280 units after heat treatment, the

MSC 2.5.

• Before and after heat treatment of the

stress distribution in the weld reduced

negligible. The reason is because the

4 with a disability do not understand

longitudinal seams. So great burden in

welded joints through after heat treatment

with the disability.

• This experimental proved capable not only

the residual stresses in welds detecting that

all defects of the device STRESS VISION 2.5.

Form 5: Sample preparation weld

ultrasonic testing UT PL15351

Comment 5:

Sample plate PL15351 UT ultrasonic

standards, 10 mm thick, defect location in

advance. In the weld seams, detect defects,

the difference in the stress DPMS is 360

units at the coordinates (3, 4), the stress

concentration MSC 5.5, as recommended by

the manufacturer, the details under stress

balance is high (in the region of 350

but still within the permissible limits and

must be checked regularly cycle 6 or 12

months

General Comments

from 29

• Before the heat treatment, the difference

DPMS about 360 units, the MSC 6.0. DPSM

fell to 280 units after heat treatment, the

• Before and after heat treatment of the

stress distribution in the weld reduced

negligible. The reason is because the sample

4 with a disability do not understand

longitudinal seams. So great burden in

welded joints through after heat treatment

• This experimental proved capable not only

the residual stresses in welds detecting that

device STRESS VISION 2.5.

Sample preparation weld

ultrasonic testing UT PL15351

Sample plate PL15351 UT ultrasonic

standards, 10 mm thick, defect location in

advance. In the weld seams, detect defects,

stress DPMS is 360

units at the coordinates (3, 4), the stress

concentration MSC 5.5, as recommended by

the manufacturer, the details under stress

balance is high (in the region of 350 -420),

but still within the permissible limits and

larly cycle 6 or 12

Page 23: REPORT WM MEASURE VOLTAGES

WIAP® MEMV®_WM_886_2017_7 measure voltages

©

• residual voltage measurement results

DPMS and MSC in 5 samples of sweat

• From the above results show that: heat

treatment is only partially effective at

reducing tensions in welds. After XLN

remaining differences in relation to suat

DPMS ranged from 170 to 200 units.

Voltages are uniformly distributed in the

weld seam and not the positions of locally

high concentration MSC appear.

• distribution curve DPMS 3D samples

appear with disabilities convex tip,

high stress concentration and heat

only a part of stress in welding defects

reduced.

• Stress test samples were found defective

device, STRESS VISION in dangerous places

of detecting where deficiencies exist and

have a very high concentration of MSC in

welds.

TEST RESULTS by voltage losses USING

Purpose of the residual stresses is checked

by drilling to verify measured by the

method of the elastic the value

Reviews:

_WM_886_2017_7 measure voltages page 23 from

• residual voltage measurement results

DPMS and MSC in 5 samples of sweat

• From the above results show that: heat

treatment is only partially effective at

reducing tensions in welds. After XLN

differences in relation to suat

DPMS ranged from 170 to 200 units.

Voltages are uniformly distributed in the

weld seam and not the positions of locally

high concentration MSC appear.

• distribution curve DPMS 3D samples

appear with disabilities convex tip, where a

high stress concentration and heat-treating

only a part of stress in welding defects

• Stress test samples were found defective

device, STRESS VISION in dangerous places

of detecting where deficiencies exist and

tion of MSC in

TEST RESULTS by voltage losses USING

Purpose of the residual stresses is checked

by drilling to verify measured by the

• Compare test results DPMS method bores

at the weld location coordinates (4,4)

MPa, and the result is measured by the

apparatus, is -69.6 2:04 STRESS VISION unit

that found:

• two measuring methods have similar

values (deviation 6.7 MPa).

• drilling as an absolute value (MPa) of

residual stresses in the dept

method and from the relative value is

obtained. So more experiments need to

check the compatibility of these two

methods.

evaluation

• Value Difference principal stress that

measuring equipment is not the absolute

value MPa, this value is

importance and present disparity voltage

distribution, there are detected areas high

stress that predict the possibility of errors

in the near future.

• Therefore, manufacturers have to assess a

number of recommendations following:

• If the principal stress difference (DPSM) to

350 units (difference highest and lowest

point), detailed work is made possible

under the conditions.

• DPSM 350-420 values

stress is acceptable but should be checked

regularly 6 to 12 months

• 420 to 450. The value DPSM very high

residual stresses, defects can be designed

replacement is recommended as soon as

possible.

• Value DPSM 450-

corrective action must be taken

immediately, even if no defects in the

material.

Conclusions

from 29

• Compare test results DPMS method bores

coordinates (4,4) -62.9

MPa, and the result is measured by the

69.6 2:04 STRESS VISION unit

• two measuring methods have similar

(deviation 6.7 MPa).

• drilling as an absolute value (MPa) of

residual stresses in the depth of wells, the

method and from the relative value is

obtained. So more experiments need to

check the compatibility of these two

• Value Difference principal stress that

measuring equipment is not the absolute

value MPa, this value is only a relative

importance and present disparity voltage

distribution, there are detected areas high

stress that predict the possibility of errors

• Therefore, manufacturers have to assess a

number of recommendations following:

the principal stress difference (DPSM) to

350 units (difference highest and lowest

point), detailed work is made possible

420 values touches, with high

stress is acceptable but should be checked

regularly 6 to 12 months cycles.

• 420 to 450. The value DPSM very high

residual stresses, defects can be designed

replacement is recommended as soon as

-500 recommends

corrective action must be taken

immediately, even if no defects in the

Page 24: REPORT WM MEASURE VOLTAGES

WIAP® MEMV®_WM_886_2017_7 measure voltages page 24 from 29

©

• Applied research equipment Vision stress

plays an important role in the inspection

and maintenance and monitoring of

structural aging equipment. Enter data in

which predict a disability and propose

timely corrective

11 INDICATOR OF MECHANICAL

STRESSES "STRESS VISION"

Indicator of mechanical stresses "STRESS

VISION" is for scanning, evaluating, and

visualizing mechanical fields (residual,

technological) designed voltages of ferritic

alloys.

Capabilities "STRESS VISION":

• processing received indications and

development of 2D and 3D maps, the

principle of principles Mechanical stresses

(DPMS), Concentration Mechanical stress-

factor (CMS) and gradient of DPMS in the

"sum of the layers," "thin 0 to 3 mm" ,

"thickness of layer 0 to 6 mm" to a depth of

12-15 mm;

• processing of indications and construction

diagrams of DPMS, gradient and

concentration of DPMS in the profiled cross-

section of the object;

• Long-term non-volatile memory;

• Software data management administration

for storing DSMS;

• the device housing, protection class IP54

from external influences;

• Optionally, housing IP64 protection class

for extreme conditions and waterproof

Performance of STRESSVISION® indicator

according to the principle of the

measurement of electro-motive Forces

(EMF), excited in measurement sensors of

the sensor by the magnetic field initiated by

exciting coil in the electromagnetic field of

the examined object. The signal of the

sensor unit received is proportional to the

difference of the major mechanical stresses

(DPMS) to the installation area of the sensor

on the surface of the monitoring object, and

in the direction indicated.

The measurement of metal by special

electromagnetic fields enables a high

reproducibility of indications and collects

information about the stress state in layers.

The measurements provide information that

is sufficient to quantify the coefficients of

the concentration of mechanical stresses

CMS, the evaluation of the level of the

difference of the major mechanical stresses

DPMS in "direction", the gradient of DPMS

and the determination of conditions for the

development of the fault in investigated

area of the object under test,

The process of data collection

• on the surface of the examined site of the

product (control zone) is placed a

rectangular coordinate grid. The minimum

size of the grid is 5 x 5 (row * column).

• pitch depending on the specific question to

be deleted from 5 mm in the examination of

a particular point CMS up to 25 cm in the

analysis of stress-strain structures.

• The probe (sensor) is consistently in the

nodes (intersections) placed a grating

Page 25: REPORT WM MEASURE VOLTAGES

WIAP® MEMV®_WM_886_2017_7 measure voltages page 25 from 29

©

region, with its constant orientation relative

to the axes of the products with the pointer

(main marker) is retained at the side edge of

the probe.

• performing a point-by-point measurement

aka as "manual scan"

• The received results (the measurement

block) are prepared and stored in non-

volatile memory in the processor device.

• After scanning is complete accumulated

results are transmitted to a laptop or

computer, where they are stored and

displayed for final processing, evaluation,

and as cartograms DPMS, CMS, etc..

• Beware of the Edge effect while scanning.

12 TEST METHOD WIAP MEMV TYPE

AG SHIFT

The present description explains a method

of measuring the residual stress of

workpieces during their vibration. When

machining workpieces made of metal, for

example during welding, are formed in the

workpiece voltages. These undesirable

stresses remain in the workpiece. Also

casting, forging or machining operations can

cause permanent tensions. These stresses

reduce the load capacity of the workpiece

and can have a negative impact, if the

workpiece to another, in particular

machining is to be subjected. In addition to

the impaired dimensional stability even

later corrosion resistance of the workpiece

may suffer.

Known and widespread is the relaxation of

workpieces by heating or annealing. But this

is time-consuming, energy-consuming and

expensive. It is also relative to the

workpiece not without problems, since both

the heating and the cooling can easily

change its dimensional stability and distort

the workpiece.

Flame-related workpieces have locally on a

state of tension, which communicates with

the environment in balance. If this

workpiece annealed posed by deformation

of a new state of tension and the workpiece

is then bent. Subsequent processing is then

do not have a great influence on the

straightness. Also formed during annealing

scale, which must be removed in a further

step back from the workpiece surface. For

example, by sandblasting, which can lead to

new tensions in the workpiece.

Decades ago, it was proposed to reduce the

residual stresses induced in the metal

through the processing by shaking or

vibration of the workpiece again. For this

purpose, the workpiece is vibrated on a

vibration table or by means of an attached

vibration device or vibrated. That may be

about 5 to 30 minutes. For larger and

heavier work tees also significantly longer

vibration times were known, but this is to

be avoided for several reasons. When

vibrating the self-voltages are brought over

the entire workpiece in a balance, not just

on the surface. The workpiece can be

processed further.

The residual stress relaxation is strongest at

the beginning of the vibration, but then the

effectiveness levels off quite quickly. This

Page 26: REPORT WM MEASURE VOLTAGES

WIAP® MEMV®_WM_886_2017_7 measure voltages page 26 from 29

©

process is often associated with several

unknowns and requires some materials and

expertise or proper instruction. Although it

has many advantages over the heat relax,

namely less time and energy, avoiding

thermal distortion and scale of

contamination of the workpiece, the use of

the vibration stress relieving is often spared.

On the basis of these findings, the object is

to provide a method of measuring the

residual stress of workpieces that can be

used in vibration relaxation, is practicable

for metal processing operations, and leads

to reliable measurement results sets.

Thanks to the obtained by the method

values with regard to the residual stress of

workpieces, can the subsequent relaxation,

that is, to perform the voltage degradation

and the shape-stabilizing of the workpieces

and better targeted.

This is especially true for the vibration

relaxation. Mainly for testing purposes, this

measuring method is also commonly used to

determine residual stresses can be used, of

course even with workpieces that have been

relaxed in other ways. It has been always

thought that a workpiece thereby vibrate

uniformly, that is, at every point of its

surface and its volume approximately equal.

Through many attempts by the present

process has been recognized, however, that

this is not the case. Actually arising in the

vibration relief regions in which the

material of the workpiece respond

differently to the induced vibration. The G-

value, corresponds to 1G = 9.81 m / s² is the

same everywhere. Rather, these shifts and

G-value on the axis of vibration is changed

variously, in accordance with the

respectively prevailing there, different

internal stresses of the respective

workpiece. this is detected accurately by the

method which can be used to significantly

better results by the relaxation vibration

relaxation. both the time and the energy

consumption can also be reduced through

targeted work.

For actual measuring method: at said

measuring points 2 - 13, a sensor is

respectively set, more specifically, an

acceleration sensor. Such acceleration

sensors are technically known under

various names, as accelerometer or G-

sensors.

the acceleration is measured. This is done

mostly by which is determined on a test

mass, here the workpiece 1, acting inertial

force. This allows to measure whether a

shift of the G value takes place.

Recorded measurement values are called

Akzelerogramm. In the present specification

is preferably measured by means of in each

case connected to a control device,

acceleration sensors simultaneously at all

measuring points. but it would also be

possible to manually define a pin-like

accelerometer sequentially at these

measurement points 2 - to put 13, of course,

there is no uninterrupted, continuous

control.

Now the device is switched to the vibration

relaxation and thus ramped up the vibration

of the workpiece. 1 The vibration is

amplified until the natural resonance of the

workpiece 1 is nearly reached. That is, there

occurs a probing to the G-value. This is

dependent on workpiece due to the

dimensional stability. This G value can be

defined in a formed as a solid body work as

follows: 1G = 9.81 m / s². The G-value can in

this measurement at any of the various

measurement points 2 - are exceeded. 13

Thanks to the measurement in a plurality of

measurement axes and multiple

acceleration sensors can be identified also

where tensions were reduced and where

not.

Page 27: REPORT WM MEASURE VOLTAGES

WIAP® MEMV®_WM_886_2017_7 measure voltages

©

13 G DECLARATION

The WIAP has a method that is

vielversperchend with the voltage

Messmethohe the G-shift.

G-force

For example, tripling the g

aircraft by flight in an upwardly curved

path

g-forces are mentioned stresses acting on

the human body, a commodity or a vehicle

due to strong changing the size and / or

direction of speed. For loads of technical

equipment such as aircraft or specifying

exposure limits and the term is used load

factor. It is at the g-force of a "force per

mass", so it has the dimension of

acceleration, and is given as a multiple of

the case acceleration g. High g

for example when driving with a roller

coaster, with missile launches or in clashes

objects.

13.1 Physical basics

A Formula 1 race car driver feels a force that

it at startup - pressed back into his seat

contrary to the direction of acceleration.

This force arises from the fact that the race

car is accelerated forward. The driver's

body would remain because of its inertness

to this acceleration, if he were not carried

away by the seat. So what the driver feels is

no actual external force that pushes him

more back in the seat, but its own inertia,

which makes itself here in the form of an

_WM_886_2017_7 measure voltages page 27 from

The WIAP has a method that is

vielversperchend with the voltage

example, tripling the g-force in an

aircraft by flight in an upwardly curved

forces are mentioned stresses acting on

the human body, a commodity or a vehicle

due to strong changing the size and / or

direction of speed. For loads of technical

nt such as aircraft or specifying

exposure limits and the term is used load

force of a "force per

mass", so it has the dimension of

acceleration, and is given as a multiple of

the case acceleration g. High g-forces occur,

when driving with a roller

coaster, with missile launches or in clashes

A Formula 1 race car driver feels a force that

pressed back into his seat -

contrary to the direction of acceleration.

the fact that the race

car is accelerated forward. The driver's

body would remain because of its inertness

to this acceleration, if he were not carried

away by the seat. So what the driver feels is

no actual external force that pushes him

seat, but its own inertia,

which makes itself here in the form of an

inertial force felt. The driver is accelerated

by the seat forward.

After the basic equation of the mechanics of

the driver's body undergoes (mass m) is the

acceleration a = F / m, when

on it. In this case, the physical concept also

mean acceleration deceleration or change in

direction depending on the direction of the

force colloquially. The driver is relative to

its vehicle alone. In physics this is called an

accelerated frame of reference. For him,

there is a balance of power between the

accelerating force F and the inertial force F

*. The inertial force is thus opposite the

same size as the external force. Therefore,

the acceleration a is to quantify the force of

inertia related to the mass. Here, the

acceleration is then often expressed as a

multiple of the acceleration due to gravity g

≈ 9.81 m / s2, because it is easy to compare

the everyday experience:

13.2 Special cases Uniform linear

acceleration

When a body on the dista

from rest to the v-Geschwin speed, then is

its acceleration:

This follows by switching from the path

time and velocity-time laws of uniformly

accelerated motion:

or.

The same formula is obtained for the

amount of acceleration

decelerates to the distance s of the speed to

zero.

from 29

inertial force felt. The driver is accelerated

After the basic equation of the mechanics of

the driver's body undergoes (mass m) is the

acceleration a = F / m, when a force F acts

on it. In this case, the physical concept also

mean acceleration deceleration or change in

direction depending on the direction of the

force colloquially. The driver is relative to

its vehicle alone. In physics this is called an

frame of reference. For him,

there is a balance of power between the

accelerating force F and the inertial force F

*. The inertial force is thus opposite the

same size as the external force. Therefore,

the acceleration a is to quantify the force of

related to the mass. Here, the

acceleration is then often expressed as a

multiple of the acceleration due to gravity g

≈ 9.81 m / s2, because it is easy to compare

the everyday experience:

Special cases Uniform linear

When a body on the distance s is accelerated

Geschwin speed, then is

This follows by switching from the path-

time laws of uniformly

The same formula is obtained for the

amount of acceleration in a body v

decelerates to the distance s of the speed to

Page 28: REPORT WM MEASURE VOLTAGES

WIAP® MEMV®_WM_886_2017_7 measure voltages page 28 from 29

©

13.3 Examples

A car driving at 30 km / h against a solid

wall, respecting the crumple zone by 50 cm

is compressed. The g-force is 7 g. Already at

50 km / h, g-force is almost 20 g.

A body falls from height of 1 m onto the

floor. The more rigid body and base are, the

higher the g force. Are the bottom and the

body by not deformed by 0.1 mm and then

remains lying, it has been braked with an

average of 10,000 g

14 REFERENCES

Int_ Nasser Kanani

http://de.stresstechgroup.com/content/de/

1041/1671/Barkhausenrauschen%20Analy

se.html

Internship Manual test - Chair Metallic

Materials

http://www.mat-

tec.ch/de/services/eigenspannungen.html

WIAP

Wikipedia

NDE

http://stressvision.com/

End report WM 886, measure voltages Hpw 31072017

Page 29: REPORT WM MEASURE VOLTAGES

WIAP® MEMV®_WM_886_2017_7 measure voltages

©

15 CONTACT

_WM_886_2017_7 measure voltages page 29 from

WIAP® AG Ltd SA

Industriestrasse 48L

CH 4657 Dulliken

Switzerland

Tel. +41 62 752 42 60

Fax .: +41 62 752 48 61

www.wiap.ch

[email protected]

from 29