Searching for Higher Ground: Unveiling NeSSI* Gen. II

IFPAC - San Diego, CA, USA - Jan. 23, 2002Rob Dubois - Peter van Vuuren - Jim Tatera .

CPC

“the best way to predict the future is to create it”

Tatera and Associates

*New Sampling/Sensor Initiative

What is NeSSI?- Activities in 2001...

An ad hoc global industry initiative, formed June, 2000 to drive permanent change in how we do Process Analytical.

Sponsored by the Center for Process Analytical Chemistry (CPAC)

2001 Activities… Focus Groups: Pittcon, ISA, IFPAC, CPAC Tutorials: ISA-Houston, INTERMAC-Tokyo Special Teams: X-Team

NeSSI Objectives

Facilitate the acceptance/implementation of... modular, miniature & smart sample system technology based on ISA SP76 standard substrate (aka footprint)

Promote the concept of... field-mounted smart sampling/analytical systems sample system integration with miniature physical sensors

Lay the groundwork for... open connectivity architecture for sensor communications

(e.g. CANbus, Ethernet, etc.) industry standard communication protocols (e.g. OPC, etc.)

Provide a technology bridge to the process for... “sensor/lab-on-a-chip” micro-analytical devices

The drivers for change...

Reduce Cost to Build Design and Engineering Manufacturing and Installation

Reduce Cost of Ownership Design Standardization Simpler, less expensive

maintenance

Enhance Reliability Validate sample, data,

communication

Market AcceptanceLower CostEase of DesignSystem Reliability

Time

So Where In the World Are We?

On the Post

AnalyzerHouse

NeSSI

What’s going on in the world?

• Fast networks; robust electronics

• Lab-on-a-chip; lasers; wireless

What does the Market Need?

• Reliable, rugged, fast analysis

What are the Critical Issues?

• Acceptability by Process Analy.

• Technical challenges

• Reasonable Cost

NeSSI Generation I

mechanical, passive components on an ISA SP76 standard substrate (SEMI roots)

Courtesy of Swagelok

Manufacturers…

• Parker-Hannifin

• Autoflow

• CIRCOR

• Kinetics

• Swagelok

NeSSI Generation I

Generation I - Industry Trends… End Users desire the conversion of today’s

proprietary stand-alone modules into a SP76 compliant configuration. (e.g. G.C. block & bleed, bypass loop & filtration, vent control, validation modules, etc.)

There will be a continual introduction of more components as End Users and Manufacturers embrace SP76.

Introducing the NeSSI Gen. II Specification

"When men got structural steel, they did not use

it to build steel copies of wooden bridges."

Ayn Rand. Atlas Shrugged. 1957.

NeSSI Generation II

“Electrified” with diagnostic sensorsIntegral substrate heating & temp.

controlSensor & actuator serial communicationElectrical components integrated with

the SAM (Sensor Analytical Manager)Smart (self-diagnostic)

Gen II - A Global, Hazardous Package

AC Power

Div/Zone 1GP. A-D, T4

NEMA 4 & IP56 RatedEnclosure- insulated

Sensors - Flow, Pressure, Temp.Encapsulated (IEC Ex m)Intrinsically Safe Bus (IEC Ex i)

Heaters: - Substrate & Enclosure- IEC Ex d by Design

AC Power

Under review by multi-functional

X-team

Gen. II “The Future is Friendly”

AC Power

- Intrinsically Safe electricalsensors and bus allow “hot”Plug & Play capabilities- NO GAS “SNIFF” PERMIT REQ. FOR MAINTENANCE

AC Power

General Enclosure; no costly X-proof bolting or flame-proof enclosure

Flexible All-Climate

Operation

- Typ. No Purge or Pressurization- Low utility req.- No need to S/D for maintenance (X-purge)

Gen. II - Serial Bus - “Au Revoir 4-20 mA?”

Flashable CANbus DeviceNet, SDS, etc.

Engineering units on board sensors

Reduces wiring loadEliminates I/ORugged, low cost

(tiny) chip

VTP

A

Gen. II“Get on the substrate (bus)!”

A

Actuator

ValveVent

Vent

Comm.

D/ASolenoid

Flow Sensor

A

A/D

Comm.

µP

Mem

ory

Pneu-trinsic “combi” valve

Gen. II“Flexible PID control”

Pressure Regulator

- spring & diaphragm

VP

Substrate

PID Control

- also temperature and flow control

Gen. II - SAM* does the repetitive jobs

Gateway to an Ethernet LAN

- OPC

Host to a…

Sensor/Actuator Bus

PDA Field Interface

- Graphical

- Wireless

-Bluetooth™

- 802.11 Wi-Fi

Software Applets for Sample System Repetitive Tasks (Appl-I)

Provides “Open” Development Space for Custom Software

SAM

*SAM = Sensor Analytical Mgr.The Bluetooth and the Bluetooth trademark are owned by Bluetooth SIG, Inc.

Gen. II - Standalone and/or Embedded SAM

Ethernet LAN

Analyzer Controller

VTP

A

CANbus

Programmable Substrate Heater

What will a Gen II system look like?

VP

A

F

Ethernet LAN

Analyzer

Controller

SAM

CANbus

PDA

Auxiliary Heating/Cooling

SubstrateT

T

Gen III - Enabling Technology for Analysis

F Vv T

A

SAM

Fiber Optic

ATOne sensor

per component“lab on a chip”

One Sensor and Multiple Analytes

A

Courtesy of CPAC

(Mass-Sensors Inc.)

Gen. III“Beam Me Up, Scotty”

Ethernet LAN

VFP

A

Sensor signal is wireless... 802.11 Wi-Fi Bluetooth

Power Supplied by... X-proof mini power bus …or IS power bus

PowerSupply Universal AC Power

Today’s NeSSI Compliant Analytical Systems

Courtesy of Panametrics & Swagelok Courtesy of Rosemount Analytical

Courtesy of Applied AnalyticsCourtesy of Panametrics & Swagelok

OXYGEN

H2O

pH

UV, VIS

Announced at IFPAC 2002...

Courtesy of Rosemount Analytical and CD Feng

Conductivity

HOT

Courtesy of Porter Instruments and the Swagelok Co.

Today’s Mass Flow Controllers

Porter (Div. 2) Unit Instruments Brooks

New

Petrochemical Plant installations...

Courtesy of a major

gulf coast petrochemical facility

Courtesy of another petrochemical facility

and Parker-Hannifin

Time (years)

03 04

NeSSI Roadmap

02

Mechanical Components e.g. filters, valves, etc.

Mechanical FieldInstallations

SP76 Substrate Available

NeSSI/CPAC Vision & Roadmap

2000

Prototype - Gen II Smart/Heating/SAM

Smart Field Installations

MechanicalGen. I

Smart/”Electrified”Gen. II

Analytical & WirelessGen. III

01 0605

Rev. 1, Dec. 2001

Analytics/Sensors (e.g. laser based)/Wireless

Simple Analyzers (H2O, O2, pH, UV/VIS, etc.)

Summary: “Higher Ground is in Sight”

Roadmap & 3 Generations OutlinedImpending Release of Gen II Spec to

NeSSI Mail-out ListGen. II prototype Spin-offs: ConnI, Appl-I, analytical, t

- sensors

Acknowledgements I

The X-Team [Team Lead] Jim Tatera Peter Pergande (ExxonMobil) Dave Lewko (Bantrel) S. Leach (Shell) A. Allen (Conoco) D. Chadwick (TotalElfFina) R. Ales (Swagelok) R Eddleman

(Measurementation) Don Long (MTL) Glen Schmidt (SAAI)

ISA SP76 Members

ExxonMobil Chemical Dan Podkulski (SP76) Jeff Gunnell John Cumbus Rajko Puzic

Dow Chemical Craig Snook Walt Henslee Bac Vu (SP76)/John Leach III C. Kleimeier/S. Bach Debbie Mack/Naim Akmal K. Elliot/D. Ponthieu

CPAC Mel Koch/Dave Veltkamp

Acknowledgements II

Doug Mitchell - Panametrics

John Wawrowski - Swagelok

Yoav Barshad - Applied Analytics

Nick van Bruggen - Porter

CD Feng - Rosemount Steve Doe - Parker-

Hannifin

Kelley Bell - ABB Bob Nickels - Honeywell Bob Farmer - Siemens Jonathan Bradford -

Rockwell Automation Gary Frank - Kinetics Rick Ales - Swagelok

Chris Towle - MTL

NeSSI Components Connectivity

Instrinsic Safety

Aurora Borealis

Yellowknife,

Northwest Territories,

Canada

NO BOUNDARIES!

Courtesy of Yellowknife Tourism