E. Frohnmeyer et al., assignors to International Business Machines Corp., Armonk, N.Y.

A method for producing a mag- netic disk comprising adjusting a dissolved oxygen content of a rins- ing liquid to a selected percentage range; rinsing a substrate with the rinsing liquid to allow the dis- solved oxygen to oxidize portions of the substrate surface to form oxide islands; sputtering a layer of metal atoms onto a surface of the substrate magnetic disk; and sputtering one or more thin films onto the surface of the substrate including a magnetic thin film.

SPUlTERING DEVICE U.S. Patent 6,203,677. Mar. 20, 2001 M. Ktinig, assignor to Leybold Systems GmbH, Hanau, Del.

A cathodic sputtering device for coating an essentially flat disk- like substrate.

PULSE REVERSE ELECTRGDEPGSITIGN FOR PLANARIZATIGN DC SEMICONDUCTOR SUBSTRATES U.S. Patent 6,203,684. Mar. 20, 2001 E.J. Taylor et al., assignors to Faraday Technology Marketing Croup LLC, Troy, Ohio

A method for depositing a smooth layer of a metal onto a microrough substrate compris- ing immersion in an electroplat- ing bath containing ions of a metal to be deposited; immers- ing a counter electrode in the plating bath; passing an electric current between the substrate and counterelectrode for an es- sentially continuous period of time until microscopic depres- sions on the microrough surface have been filled with the metal, wherein the electric current is a modulated reversing electric cur- rent.

SELECTIVE PLATING DEVICE U.S. Patent 6,203,685. Mar. 20, 2001 M. Acciai and S.L. Tisdale, assignors to International Business Machines Corp., Armonk, N.Y.

An apparatus and method for selective electrolytic metalliza- tionfdeposition utilizing a fluid

head.

FILLING APERTURES WITH REFLECTIVE METAL U.S. Patent 6,203,686. Mar. 20, 2001 U. Landau and J.J. D’Urso, assignors to Applied Materials Inc., Santa Clara, Calif

A method for electroplating cop- per onto a substrate having sub- micron feature comprising a plat- ing solution of water; copper at a molar concentration of 0.1 to 1.2,

wherein the copper ions are ob- tained from Conner sulfate. Conner

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94 Metal Finishing