E. Frohnmeyer et al., assignors to International Business Machines Corp., Armonk, N.Y. A method for producing a magnetic disk comprising adjusting a dissolved oxygen content of a rinsing liquid to a selected percentage range; rinsing a substrate with the rinsing liquid to allow the dissolved oxygen to oxidize portions of the substrate surface to form oxide islands; sputtering a layer of metal atoms onto a surface of the substrate magnetic disk; and sputtering one or more thin films onto the surface of the substrate including a magnetic thin film. SPUlTERING DEVICE U.S. Patent 6,203,677. Mar. 20, 2001 M. Ktinig, assignor to Leybold Systems GmbH, Hanau, Del. A cathodic sputtering device for coating an essentially flat disk- like substrate. PULSE REVERSE ELECTRGDEPGSITIGN FOR PLANARIZATIGN DC SEMICONDUCTOR SUBSTRATES U.S. Patent 6,203,684. Mar. 20, 2001 E.J. Taylor et al., assignors to Faraday Technology Marketing Croup LLC, Troy, Ohio A method for depositing a smooth layer of a metal onto a microrough substrate comprising immersion in an electroplating bath containing ions of a metal to be deposited; immers- ing a counter electrode in the plating bath; passing an electric current between the substrate and counterelectrode for an essentially continuous period of time until microscopic depres- sions on the microrough surface have been filled with the metal, wherein the electric current is a modulated reversing electric current. SELECTIVE PLATING DEVICE U.S. Patent 6,203,685. Mar. 20, 2001 M. Acciai and S.L. Tisdale, assignors to International Business Machines Corp., Armonk, N.Y. An apparatus and method for selective electrolytic metalliza- tionfdeposition utilizing a fluid head. FILLING APERTURES WITH REFLECTIVE METAL U.S. Patent 6,203,686. Mar. 20, 2001 U. Landau and J.J. D’Urso, assignors to Applied Materials Inc., Santa Clara, Calif A method for electroplating copper onto a substrate having sub- micron feature comprising a plating solution of water; copper at a molar concentration of 0.1 to 1.2, wherein the copper ions are ob- tained from Conner sulfate. Conner l Choice Of Ice Storage Or New Conventional Chiller Design l 0.5 to 200 Tons Capacity l Air or Water Cooled l 100% Process Water Recovery l Payback from Reduced Operating Costs Used for over 25 Years in PC& AnodizinglPating, Batch and other Manufacturing Cooling Applications APPLIED THERMAL TECHNOLOGIES, INC. HYDRO-MISER DIVISION P.O. Box 1900, San Marcos, CA 92079-1900 Ph: 800/736-5083 or 76Oi7445083 l Fax: 760/744-5031 info@ hydromiser.com WE MANUFACTURE TO SPEClFlCATlONS 66 PassaicAve. NewJersey 07004 9731226-6010 l Fax: 973-227-4155 888-484-5866 Webpage: www.hydromiser.com ALL MAJOR CREDIT CARDS ACCEPTED Circle 076 on reader card or go to www.thru.tolwebconnect CORP. MANUFACTURERSOF RACKS FIXTURES & BASKETS FOR PLATING ANODIZING P.C. BOARDS MANUAL OR AUTOMATIC SYSTEMS STAINLESS STEEL, PERFORATED & MESH BASKETS IN STOCK Srcle 085 on reader card or go to www.thru.to/webconn&t 94 Metal Finishing

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E. Frohnmeyer et al., assignors to International Business Machines Corp., Armonk, N.Y.

A method for producing a magnetic disk comprising adjusting a dissolved oxygen content of a rinsing liquid to a selected percentage range; rinsing a substrate with the rinsing liquid to allow the dissolved oxygen to oxidize portions of the substrate surface to form oxide islands; sputtering a layer of metal atoms onto a surface of the substrate magnetic disk; and sputtering one or more thin films onto the surface of the substrate including a magnetic thin film.

SPUlTERING DEVICE U.S. Patent 6,203,677. Mar. 20, 2001 M. Ktinig, assignor to Leybold Systems GmbH, Hanau, Del.

A cathodic sputtering device for coating an essentially flat disk- like substrate.

PULSE REVERSE ELECTRGDEPGSITIGN FOR PLANARIZATIGN DC SEMICONDUCTOR SUBSTRATES U.S. Patent 6,203,684. Mar. 20, 2001 E.J. Taylor et al., assignors to Faraday Technology Marketing Croup LLC, Troy, Ohio

A method for depositing a smooth layer of a metal onto a microrough substrate comprising immersion in an electroplating bath containing ions of a metal to be deposited; immers- ing a counter electrode in the plating bath; passing an electric current between the substrate and counterelectrode for an essentially continuous period of time until microscopic depres- sions on the microrough surface have been filled with the metal, wherein the electric current is a modulated reversing electric current.

SELECTIVE PLATING DEVICE U.S. Patent 6,203,685. Mar. 20, 2001 M. Acciai and S.L. Tisdale, assignors to International Business Machines Corp., Armonk, N.Y.

An apparatus and method for selective electrolytic metalliza- tionfdeposition utilizing a fluid

head.

FILLING APERTURES WITH REFLECTIVE METAL U.S. Patent 6,203,686. Mar. 20, 2001 U. Landau and J.J. D’Urso, assignors to Applied Materials Inc., Santa Clara, Calif

A method for electroplating copper onto a substrate having sub- micron feature comprising a plating solution of water; copper at a molar concentration of 0.1 to 1.2,

wherein the copper ions are ob- tained from Conner sulfate. Conner

l Choice Of Ice Storage Or New Conventional Chiller Design

l 0.5 to 200 Tons Capacity l Air or Water Cooled l 100% Process Water

Recovery l Payback from Reduced

Operating Costs

Used for over 25 Years in PC& AnodizinglPating, Batch and other Manufacturing Cooling Applications

APPLIED THERMAL TECHNOLOGIES, INC. HYDRO-MISER DIVISION

P.O. Box 1900, San Marcos, CA 92079-1900 Ph: 800/736-5083 or 76Oi7445083 l Fax: 760/744-5031

info@ hydromiser.com

WE MANUFACTURE TO SPEClFlCATlONS 66 Passaic Ave. New Jersey 07004 9731226-6010 l Fax: 973-227-4155

888-484-5866 Webpage: www.hydromiser.com ALL MAJOR CREDIT CARDS ACCEPTED

Circle 076 on reader card or go to www.thru.tolwebconnect