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Nate Brese, Marketing Fellow, and Rozalia Beica, Global Director Strategic Marketing
SiP China, October 2018
Electronics & Imaging
Presentation Outline
2
Electronic Market Trends
Automotive Trends
DuPont AHEAD™ Materials
DuPont Advanced Packaging
Electronics & Imaging
2017 Global Electronics Ecosystem
3
Equipment$56 Bn
Materials$48 Bn
Semiconductors$410 Bn
Electronic Devices$2 Tr
Source: SEMI, Prismark, Yole, IHS Markit
Global GDP: $78 Tr(3.2% Global growth in 2018;
6.7% for China)
2.5% of the world GDP
Automotive Global Sales: $2.3 Tr
3% of WW GDP
Electronics global sales
$2 Tr
Electronics & Imaging
6.9
2.1
4.0
3.1
8.8
2
0
2
4
6
8
10
12
0 5 10 15 20 25 30
CA
GR
20
16
-20
21
(%
)
Market Growth 2016-2021 ($Bn)
4
Key Semiconductor Growth Markets & Drivers
Communications$129B (2021)
Industrial$51.6B (2021)
Automotive$46.1B (2021)
Consumer$40.9B (2021)
Mil/Aerospace$4.6B (2021)
Data source: Gartner 2017 2021 Market size
Data Processing$141B (2021)
Electronics & Imaging
6.9
2.14.0
3.1
8.8
2
0
2
4
6
8
10
12
0 5 10 15 20 25 30
CA
GR
(%
)
Market Growth ($B)
3.3
1.7
4.0
10.5
10.1
2.3
5
Key Semiconductor Growth Markets & Drivers
Communications$154B (2022)
Industrial$66.5 (2022)
Automotive$64.5 (2022)
Consumer$50.3 (2022)
Data Processing$178B (2022)
Mil/Aerospace$5.84 (2022)
Data source: Gartner 2017 & 2018 2021/2022 Market size
Electronics & Imaging 6
“The car is the ultimate mobile device.” Tim Cook
Mega Trends are Transforming the Automotive Market
Energy Efficiency - Electrification Hybrid/ EV Battery Plug-in Charging infrastructure Fuel efficiency Light weight
Automation & Safety Assisted driving Lane keeping support Emergency braking Adaptive cruise control Traffic jam assist Partially to fully automated driving
Enhanced User Experience Infotainment Climate control Customization Augmented reality
Connectivity Smartphone integration Telematics Ride sharing services Predictive maintenance C2X connectivity
Electronics & Imaging
N. America
S. America
Europe
ROW
India
China
S. Korea
Japan
19%
3%
10%
5%
28%24%
4%
4%
2017 Sales by Regions
Overview of the Automotive Market
7
97.2MCAR UNITS
2017 2022107.3MCAR UNITS
2.2% CAGR
12M
ALL CARS
HEV/EV~25% CAGR
More than 70% of all vehicles sold will integrate autonomous capabilities
2045AUTONOMOUS
Source: Prismark, Frost & Sullivan, Yole Developpement, GSMA
~4MCONNECTIVITY100% cars connected 2025
Electronics & Imaging
Semiconductor Growth in Automotive
8
2017
Source: IC Insights, Gartner
8.3
Electronics & Imaging
Main Devices and Growth Drivers
9
ASIC/ASSP
32%
Microcontrollers
18%Discrete
14%
NOS
10%
Optoelectronics
9%
Analog
7%
Memory
7%
GP Logic
2%
Microprocessors
1%DSP
0%
2017
0%
5%
10%
15%
20%
25%
30%
35%
0
5000
10000
15000
2016 2017 YoY Growth
15
10
05
Se
mi
Re
ve
nu
e (
$B
)
Growth Drivers
Engine control
ADAS
Driver information systems
In vehicle networking
Source: Gartner, Amkor - 2018
Electronics & Imaging
Automotive Applications
5.24.4
2.6
7.17.6
9.8
21.3
19.9
2.9
0
5
10
15
20
25
0 2 4 6 8 10 12 14 16 18
CA
GR
20
17
-20
22
(%
)
Market Growth 2017-2022 ($B)
10
ADAS
EV/HEV
Infotainment
Chassis
Instrument Cluster
Body
Safety
PowertrainAftermarket
Increase in HEV/EV and autonomous driving
adoption will continue to transform the
automotive landscape.
Electronics & Imaging
Enabling Auto Electrification and Electronic Systems
11
CONNECTED
Electronics & Imaging
Official China Launch at Import Expo Nov 2019http://ahead.dupont.com/
12
Electronics & Imaging
AHEADTM
Products Work Together in EV Batteries
Lighter, higher range, cost effective, longer lasting
13
Thermal Management film: a)Temprion™ EIF b)Temprion™ OHS/Kapton® RS
a) Reduced operation temperatures enabling increased power
b) Provides uniform heating, Lightweight, flame barrier
Cell Separators: Nomex®/Kevlar® XF
Propagation protection (fire barriers), Thermal insulation to isolate
cells/modules
TC Preform Gap Filler: Temprion™ PGF
Conformable Sheet, Contamination free Organic solution, High
thermal conductivity, Vibration dampening
E-Motor Slot & Wire Insulation: Kapton®
Reduced operating temperatures by improved thermal
dissipation, lightweight insulation, high voltage endurance, corona resistance, increased power density
Sealant or Adhesive : BETAMATE™, BETAFORCE™, BETASEAL™
Battery pack sealing & assembly; electrical conductive (EMI),
dielectrical, structural, primerless to plastics
Dispensable TC Gap Filler: BETASEAL™ GF 2.0 TC
High thermal conductivity, vibration dampening, low thermal
resistance and enhanced elongation
Thermal Conductive Adhesive : BETAFORCE™ TC
Thermal Conductive solution, Heat cure accelerate able, high
elongation, vibration inhibitor
Battery pack housing: Zytel®
Lightweight, Recyclability, EMI shielding enabler
Integrated Stator plate Vizilon® TPc /Zytel® HTN
Smaller & Lighter (downsizing potential)
Electrical friendly injectable resin: Zytel®, Crastin® PBT, Zytel® HTN, Zytel® LCPA
Avoids electrical corrosion and facilitates high voltage resistance, downsizing potential
TP resins for electric applications: Zytel®, Crastin®PBT, Zytel® HTN
Flame retardant (V0), halogen free solutions, EMI shielding, downsizing potential, Recyclability
Materials for extruded coolant pipes: Zytel® LC
Enables cost competitive mono or bi layer extrusion,
lightweight, assembly friendly
Smart Lubrication Solutions: Molykote®
Optimizes friction & wear, free motion of adjustable components and corrosion performance. Reduces squeaks & rattles, vibration and
harshness (NVH)
Cabin Heater Solutions: Kapton®
Increase power density of high voltage air and liquid PTC heaters
by maximized heat dissipation, Lightweight
Adhesive Plastic Lubricant Films
Arc Protection: Nomex®
Papers/Fabrics/Tapes for arc protection (Electronics/busbars)
Mechanical Battery pack shield: Kevlar®
Penetration resistance, vibration dampening (NVH), Lightweight
Cable jacketing & insulations: Vamac® AEM , Hytrel
Halogen Free Flame Retardant (HFFR), low smoke
generating, meets high temperature, high voltage demands
Electronics & Imaging
Increased Functionality Enabled by 3D Packaging/SiP
14
Reliability
Performance
Chip area ↑
Speed
Thermal
Cost ↑
Time to Market ↑Time to Market ↓
Cost ↓
Performance ↑
Size ↓
Flexibility ↑
Efficiency
Power
Bandwidth
Integration
…Cost
Latency
Storage
Bio-compatibility
Size
FEOL
BEOL
FEOL
BEOL
3D Packaging/SiP
Electronics & Imaging
SiP Adoption Increases across Several Markets and Applications
RF/FEM:
Power amplifiers
Switches, Filters, Duplexers
Antenna modules
Wireless Connectivity
Bluetooth
Wifi
SSD cards
Plug-in wireless
Power Management
Power modules
Embedded passives
Controllers
MEMS Modules
MEMS integrated with ASICs
Combo systems/fusion
Sensing Modules
MEMS integrated with ASICs
Combo systems/fusion
Logic & Memory
High speed, high I/Os for CPU, ASIC, GPU
Major Benefits
Smaller form factor
Higher performance
Faster time-to-market
Lower cost
High added value
Increased flexibility
Mobile IoT & Wearables Automotive Heath care HPC / Data Centers Aerospace & Defense
Electronics & Imaging
Main Trends for Automotive Packaging
Higher performance & increased function• Faster speeds
• Higher performance processors
• Higher bandwidth and IOs (esp. to process optical, radar and lidar data)
• Higher power density
• Increased function density
• Higher frequency
• Lower parasitics
• Higher quality
• Lower cost
16
Packaging Solutions• Higher integration
• Increase use of Advanced Packaging
• Heterogeneous integration
• Advanced heat transfer solutions
• Advanced stress isolation
2016
45%
Electronics & Imaging 17
Technology Evolution: Si, Advanced Packaging & PCB
Electronics & Imaging
Automotive Packaging
18
Traditional IC
Packaging
What is changing?
Accelerated adoption of Advanced Packaging!
Source: Amkor 2017
Electronics & Imaging
PCB and Material Trends for Automotive
19
PCB designs typically are mainly 4-6L MLB => HDI and Flex are growing for Infotainment applications. Flex substrates are attractive as replacements for conventional wiring harness apps
ADAS: drives the need for monitoring systems (radar, ultrasonic, cameras), high speed and high frequency applications (e.g., low Dk, Df dielectric materials)
Power Management: thick copper, high temperature chips (SiC based)
Powertrain (engine and gearbox): multilayer substrates for high temperature environment
Thermal Management will continue to be very critical
Key Trends Features
Autonomous VehiclesADAS, driver assist, lane keeping, adaptive cruise, en route to Level 5
Connected CarMobility/Vehicle management; Entertainment; Navigation, etc.
Infotainment Interfaces
Smart HMI including speech / audio / gesture input; Device interface (Apple/ Google/ other systems)
Energy Efficiency
Engine / power management systems; HEV / EV / Fuel CellRegenerative braking, light weighting
Key Trends Features
High Current Need copper-heavy products
Heat
Management
Heatsinks and thermal management solutions
High Frequency RF - High performance materials
HDI CapabilityNeed for HDI is increased, especially for Infotainment systems
Flexible PCBsFlex and Rigid Flex for lightweighting, wiring harness
HDI
Flex
LTCC
Electronics & Imaging
DuPont Electronic Materials for Automotive
IC & Component Materials
CMP pads/ slurry
Cleaners
Photoresist
Advanced coatings
Interconnects, damascene plating
Connectors/ passives metallization
Other Materials:
Display materials
OLED materials
Quantum dots
High performance plating on plastics
In-mold electronics
Light weight materials
PCB & Substrate Materials
Interconnects: E-less & electrolytic plating (THV, MSAP, SAP, RDL, Cu Pillar, ENIPIG, etc.)
Lead-frame plating
Surface finishing
Dry film
Laminates
Ceramic substrates
Flexible circuits, polymeric and thermal materials
Packaging & Module Materials
Dielectrics
Thermal adhesives and fillers
Interconnects, plating chemistries (bumping, Cu pillars, TSV, RDL
Polymers (liquid, dry films)
Final finishes
Ag paste
Electronics & Imaging
Flex/Rigid-Flex Circuit Laminates & Adhesive Material used as a foundation
of circuit board.
Dry Film PhotoresistsMaterials to form
imaging on various
metallic surfaces.
Electroless CopperMaterials to produce an initial metallization layer
onto w hich thicker
electrolytic copper is
subsequently deposited.
Dry Film SoldermaskMaterials used to provide
environment protection
to the circuit board.
Final FinishMaterials used to apply
solderable or w ire bondable
coatings to components
attachment pads.
Electrolytic CopperMaterials to apply thick metallic
coatings to form both through
hole and micro via
interconnections.
PCB & IC Substrate: Metallization, Laminates & Industrial Films
EDTA-free E-less (V&H) for HDI, MSAP and SAP MSAP/SAP High Distribution Via Fill Nano-organic coating
Dry film Photoresists for advanced patterning Flex Laminates Polyimide films HSHF & TM filmsLTCC Substrates
Electronics & Imaging
Semiconductor Packaging Materials Portfolio
Copper
RDLCu Pillars SnAg
Bump
SnAg-
Capped
Cu Pillars
Copper
TSV
Dry Film
DielectricChem-amp
Bump
Photoresist
Low temp
In-Capped
Cu Pillars
Liquid
Photodielectric
Electronics & Imaging
Semiconductor Assembly Materials Portfolio
Photo Patternable
Permanent
Bonding
Thermal
Interface
Material
Non-Photo
Patternable
Permanent Bonding
Lid Seal
Adhesives
24
Technology:
Use high thermal conductivity Polyimide as a dielectric layer instead of ceramic (Al2O3 or AlN)
A thermally-conductive, coextruded, trilayercomposite polyimide film that can be laminated to copper
Polyimide based substrates can enable
Use of thicker copper (high current density)
Lightweight and compact design
Cost savings
Thermally Conductive Organic Direct Bond Copper (ODBC)
No thermomechanical failure after 2000 thermal shock
cycles with thick copper lamination (-55 to +200⁰C)
With the ability of using thicker copper as laminate –thermal resistance of the ODBC can be better than DBC
Advantages:
Cost effective replacement for ceramic based DBC
High temperature process replaced with lamination at relatively low
temperatures
Temprion™ Organic Direct Bond Copper creates a stress buffer providing much higher reliability to the power module.
Cu (0.8mm )/
Polyimide (ODBC-25 micron)/
Cu (0.8mm )
Electronics & Imaging
Electronic Materials Enable the Automotive Industry
25
Plating
Electrolytic copper
Electroless copper
Innerlayer bonding
Final finishes
PCB
LED LightingPowerIC / Device
Battery mgmt.
Sensors
Touch Panel
Capacitor
FPC
Connector
EMI Shielding
Thermal mgmt.
Display
Flexible Display
Polishing
CMP Pad /Slurry
Cleaners
Lithography
Photoresist
Adv. coatings
Polymer Science
Dielectrics
Encapsulants, adhesives
Display
Display materials
OLED materials
Quantum Dots
Infotainment &Telematics
Power Train & Engine Management
HV/PHV/EV/FCV
Vehicle Bus Communication
Body Electronics
Instrument Clusters
Deposition
High performance plating-on-plastics technology
Flex Circuits
Polymeric materials
Thermal materials
Electronics & Imaging
Wide Portfolio of Materials: Dow Chemical, DuPont & Dow Corning
Strong Engagement and Activities in the Automotive Market
