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Spin Physics Capability with Silicon Vertex Tracker for PHENIX Maki Kurosawa (RIKEN) for the PHENIX Collaboration BNL, CNRS-IN2P3, Columbia Univ. Nevis Labs, Ecole Polytechnique, ISU, KEK, LANL, ORNL, RBRC RIKEN, Rikkyo Univ., Stony Brook Univ., TITEC, Tokyo Met.College of Aero.Eng.,. - PowerPoint PPT Presentation
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Spin Physics Capabilitywith Silicon Vertex Tracker for PHENIX
Maki Kurosawa (RIKEN)for the PHENIX Collaboration
BNL, CNRS-IN2P3, Columbia Univ. Nevis Labs, Ecole Polytechnique, ISU, KEK, LANL, ORNL, RBRC RIKEN, Rikkyo Univ., Stony Brook Univ.,
TITEC, Tokyo Met.College of Aero.Eng.,
1. Motivation in Spin Physics with Silicon Vertex Tracker (VTX)2. Advantage of VTX3. Simulation Results of ALL for Gamma-Jet with VTX4. VTX and Beam Test5. Summary
Motivation in Spin Program with VTX
• Requirements for detector
• Heavy flavor tagging and beauty and charm separation : Good vertex resolution
• x reconstruction with recoil jet (pT(), , jet) : Large solid angle coverage
• Gluon spin structure of the nucleon
• Gluon polarization G/G with charm, beauty.
• x dependence of G/G with -jet correlations.
VTX detector satisfied these requirements
Direct pT(),
Jet (jet)Large Acceptance
VTX Detector
• Four-Layer Barrel Detector• Pixel Sensor (Inner 2 Layers) (50 x 425 m2)
required for high occupancy• Strip Sensor ( Outer 2 Layers) (80 x 1000 m2)
Pixel Layersr=5.0cm z=±10cmr=2.5cm z=±10cm
Strip Layersr=10cm z=±16cmr=14cm z=±19cm
2 for || < 1.2
• Good DCA resolution DCA~ 50 m
• Large Acceptance|| < 1.2, 2 for
Simulation
charm and beauty separation with difference of their life time
Life time (c) D0 : 125 m B0 : 464 mDCA
DCA (m)
ppD
B
e
e
Backgroundc quarkb quark
pT (GeV/c)
Subtraction ofbackground
Advantage with VTX Detector (Heavy Flavor)
By simultaneous fittingthe DCA distribution
with the expected shapes,charm and beauty are separated.
Advantage with VTX Detector (-jet Measurement)
VTX can improve xgluon determination
PHENIX Direct || < 0.35
Jet|| < 0.35|jet| < 1.2
jet
vertex
|| < 0.35
|| < 1.2
Gamma - Jet with VTX
With jet axis reconstruction, improvement of the xg reconstruction.
Jet axis was reconstructed with VTX by using PYTHIA simulationxg is calculated by the kinematical reconstruction with jet axis information
Simple Cone Algorithm (corn radius < 0.5 in eta-phi space) was used.GeVs 500
ees
pxee
s
px jetjet TT
21 s
pxxx TT
221
Without VTX With VTX
w/o jet information w/ jet reconstruction
ALL distribution as function of xg
Gamma - Jet with VTX
GeVs 5001300 pbLIntegrated Luminosity
Center of mass energy
L = 300 pb -1
g = g
g = -g
GRSV_std
PYTHIA Simulation
P = 0.7
Sensor
R/O Chip
• Pixel R/O Chip• 425m(z) x 50m()/pixel• 32(z) x 256() = 8192 pixels• Active area is 12.8 x 13.6 mm2
• 150 m thickness• Operation at 10 MHz• Power consumption is 1W/chip
32 column25
6 ro
w
425mm
50m
m
Silicon Sensor
56.72mm
13.9
2mm
- Hybrid Pixel Sensor -• Technology developed by ALICE.• Bump-bonding between R/O chip and sensor..
• Pixel Sensor• Same pixel size of R/O chip• 200 m thickness
bump bond
R/O chip wafer
Sensor wafer
VTX Detector ( Pixel )
Sensor elements:
Finely segmented detector with 80 µm 1 mm, pixels. Each pixel region has two metal strips and collect charge from sensor.
- Strip Sensor -
• Single-sided sensor with 2-D position sensitivity
• Charge sharing by 2 spirals in one pixel
• Sensor (Hamamatsu) 3.5 x 6.4 cm2
625 m thickness
• Pixels : 384 x 30 x 2 = 23k
• Strips : 384 x 2 x 2 = 1.5k
128 ch/chip8 bit ADC
VTX Detector ( Strip )
VTX Detector
10
• Pixel detector = Inner 2 layers of VTX 1st layer : 10 pixel ladders = 40 hybrid sensor 2nd layer: 20 pixel ladders = 80 hybrid sensor
pixel ladders
• Strip detector = Outer 2 layers of VTX 3rd layer : 16 strip ladders = 80 strip modules 4th layer : 24 strip ladders = 144 strip modules
strip ladders5 or 6 strip module
cooling support
strip module
2 pixel bus
4 hybrid sensor
cooling support
VTX will be installed into PHENIX in 2010
FNAL Beam Test
To confirm functionality of silicon detector and DAQ system,full chain test had been performed by using beam at FNAL (MT984)
• 20-26 Aug MTest beam line• 120GeV/c proton beam• 10 x 10 mm2 beam-focus• 3 pixel detectors and 3 strip detectors
scintillatorS1 S2 S3 S4
Beam
PIXEL 3 LAYERS STRIP 3 LAYERS
RCC 3RCC 2RCC 1
FEM
SPIRO 3SPIRO 2SPIRO 1
FEM
PHENIXDAQ
DAQ
optical cable
We perform beam test at FNAL in order tocheck the functionality of silicon pixel ladder andconfirm DAQ system works properly
beam
PIXEL 3 LAYER
STRIP 3 LAYER
FNAL Beam Test
Layer 1
Layer 2
Layer 3
colrow
Intrinsic Resolutionfor row () direction
Beam
Event Display
row [m]
Preliminary
Clear tracking
chip1 chip2 chip3 chip4
FNAL Beam Test
Red circle : clusters with ADC > 3 sigma
Beam
Layer 3
Layer 5
Layer 6
Residual Distribution
RMS=0.91
RMS=0.45( =36 m )
RMS=0.90
Event Display
Summary
• Silicon Vertex Tracker (VTX) can enhance physics capability of the PHENIX detector.
• PYTHIA simulation was performed under the condition of and . Improvement for x reconstruction with gamma-jet production. Estimation of ALL as a function of xg.
• FNAL beam test was performed to confirm the functionality of detector and DAQ system. The system worked properly.
• Preparation for mass production is under way.
• VTX detector will be installed into PHENIX in 2010.
GeVs 5001300 pbL
Back Up
Advantage with VTX Detector
Baseline detectorVTX barrel upgrade
Gluon polarization will be measured byprompt photon (+ jet)single electron (charm and bottom tagging)
VTX extend the x-range.
DCA Resolution
pT (GeV/c)
DCA
DCA2
(12r2
2 22r1
2)
(r2 r1)2
ms2 r1
2
sin2
DCA resolution is dominated most inner two layers.
Occupancy (PISA Simulation)
Occupancy of the each layers in the central Au-Au collisions
• Pixel Layer
• N_hits : hit counts on each layer• N_allpix : all pixel numbers on each layer ( 32 x 256 x 4 x 4x 10(or20) )
• Strip Layer
• N_hits : hit counts on each layer• N_x(y)strip : all strip numbers on each layer ( 768 x 5(or6) x 16(or24) )
Method
• HIJING 3.17 Au-Au 200GeV/c• with impact parameter < 2fm• no magnetic field• initial vertex is (0, 0, 0)
allpixN
hitsNOccupancy
_
_
stripyxN
hitsNOccupancy
)(_
_
Occupancy (PISA Simulation)
Results
Layer1 Layer2
Layer3 Layer4
• number of track
9600/event
with silicon hit
• no charge sharing between strips
• no ghost track
Layer 1X/X0 ~ 2%
Layer 2X/X0 ~ 2%
Layer 3X/X0 ~ 3.5%
Layer 3X/X0 ~ 3.3%
CONDITION
• -1.2 < < 1.2 (FLAT)
• 0.0 < (degree) < 360 (FLAT)
Stave Thickness 300um Stave Width 31.3mm (ROC3 ½ oz)
Cone Algorithm
1. There are remaining charged particle after applying the cut of 1.0GeV/c < pT
2. Determination of first jet axis ( and ). Momentum weighted average in the opposite azimuthal direction of gamma.
3. Make a cone around a first jet axis. Here, apply cut of R < 0.5 and 1.0GeV/c < pT.
Calculate a momentum weighted average and determine second jet axis ( and ).
5. Calculate difference between ( and ) and ( and ).
6. Iterate from 3 to 5.
The iteration continue until jet direction no longer changes.
recoil parton
gamma
cone
gamma
22)( R
221
221 )( diff
jet i pT
i
i
pTi
i
jet i pT
i
i
pTi
i
ALL distribution as function of pT()
Gamma - Jet with VTX
GeVs 5001300 pbLIntegrated Luminosity
Center of mass energy
L = 300 pb -1
g = g
g = -g
GRSV_std
PYTHIA Simulation
P = 0.7
GeVs 200
5 x 102
2 x 101