Taconic TacLED-3D

TacLED-3D

A stunning choice for “3D structuring LED Light”

- 1 -

Structure and Features

Bendable and formable for 3D LED light

Excellent heat dissipation

Ultra high thermal resistance

Superior dielectric adhesion strength on Al and Copper

Cu

Dielectric

Base Metal

Structure

Features

Grade

Dielectric

(Al2O3 filled PTFE)Available Metal

Thermal

Conductivity

(W/m·K)

Thickness

()Type

Thickness

(mm)

TacLED-3D-

10/851.0 85

Aluminium

(A-5052),

Copper

(C-106)

0.6

1.0

1.5

2.0

- 2 -

Typical Values

Properties Test Method Unit TacLED-3D-10/85

Thermal Conductivity(k) ASTM E1461 W/m∙K 1.0

Dielectric Thickness(t) - µm 85

Thermal Impedance(t/k)*1 - in2/W 0.13

Peel Strength(1oz ED Cu)IPC-TM-650 2.4.8

(Test Condition A)

kg/cm 2.0

lbs/in 11

Dielectric BreakdownASTM D149

(Test Condition A)kV(kV/mm) > 3(35.0)

Dielectric Constant @10GHzIPC-TM-650 2.5.5.5.1 mod.

- 4.2

Dissipation Factor @10GHz - 0.0016

Solder Resistance(@300) - min > 20

Surface Resistivity IPC-TM-650 2.5.17.1 Ω 1.5E+13

Volume Resistivity IPC-TM-650 2.5.17.1 Ω∙ 2.5E+12

Moisture Absorption IPC-TM-650 2.6.2.1 % < 0.05

Tg*2 - 327

CTE[α1(50~250), X=Y/Z axis] ASTM D3386(TMA) ppm/ 18/65

Flammability Rating UL-94 - On process

*1 Calculated Value, *2 Melting Point

General Properties

- 3 -

DK Thermal’s products

(WWW.DKThermal.co.uk)

Applications for 3D LED Light

- 4 -

- 5 -

Bend Hi-Pot Test ( Compare to TacLED )

√. Test Condition

- Peak Voltage : DC3000 volts and limited current 1mA

- Ramp rate to peak voltage : 1000 volts per second

- Hold time at peak voltage : 2 seconds

√. Specimen Trace lengthXwidth : 180mmX200

√. Degree of bend

90° 45° 20°

Hi-Pot Test in 3D Structure

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

no bend 90° 45° 20°

3R

4R

conventional

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

no bend 90° 45° 20°

3R

4R

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

no bend 90° 45° 20°

3R

4R

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

no bend 90° 45° 20°

3R

4R

- 6 -

Stretched Result ( Bending with dielectric on outside )

TacLED-3D 10/85 C2/Al1.5mm TacLED-3D 10/85 C2/Al1.0mm

TacLED-3D 10/85 C1/Al 0.8mm TacLED-3D 10/85 C1/Al 0.6mm

※ All specimens passed 3KV Hi-Pot test in Compressed Bending

( Bending with dielectric on inside )

- 7 -

Complex bending ( Stretched + Compressed )

Items No Bend Complex 90° Complex 45° Twist

TacLED-3D 10/85 C2/Al 1.5mm 3 KV Pass 1.670 KV 1.359 KV 1.625 KV




TacLED 10/85 C1/Al 1.5mm 3 KV Pass 0.667 KV 0.564 KV 0.661 KV

Twist Bending ( Stretched )

1 2 3 4 51 2 3 4

1 2 3 4 55

1

2

3

4

5

- 8 -

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

No Bend Complex 90° Complex 45° Twist

3D C2/Al 1.5mm

3D C2/Al 1.0mm

3D C2/Al 0.8mm

3D C2/Al 0.6mm

TacLED C1/Al .5mm

Complex bending ( Stretched + Compressed )+Twist Bending ( Stretched )

- 9 -

TacLED-3D-10/85 C2/Al1.5 TacLED -10/85 C2/Al1.5

Microcrack

in epoxyNo microcrack

in PTFE

Bending Test

- 10 -

- 11 -

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

0 1 2 3

TacLED-3D 10/85 stanfard copper

TacLED-3D 10/85 High Elongation copper

TacLED 10/85 stanfard copper

Repeated Bending with 45 degree /4x bending

K Volts

times

※ Circuit of TacLED 10/85 was opened

after twice repeated bending

- 12 -

Bending Hi-Pot Property (standard copper type vs. high elongation copper)

K Volts

times

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

No bend 90° 45° 20°

TacLED-3D 10/85 stanfard copper ( 3R)

TacLED-3D 10/85 stanfard copper ( 4R)

TacLED-3D 10/85 High Elongation copper(3R)

TacLED-3D 10/85 High Elongation copper(4R)

- 13 -

Bending Reliability Check by X-Ray

√. Specimen : -. TacLED-10/85 C2/Al1.5mm without/with solder resist ink coating

-. TacLED-3D-10/85 C2/Al1.5mm without/with solder resist ink coating

√. Bending : -. Angle : No bend -> 90 ° , 45 °, 20 ° & twist

-. Direction : Stretched , Compressed

( hard to define defect after compressed direction bending )

√. Test Equipment : X- eye SF160 model

- 14 -

No Bend 90° 45° 20° Twist

TacLED-

10/85 C2/Al

1.5mm

With solder resist coating

Without solder resist coating

With solder resist coating Without solder resist coating

※ open circuit and pad (land) lifting after bending

flexible solder

resist req.

- 15 -

No Bend 90° 45° 20° Twist

TacLED-

10/85-3D

C2/Al

1.5mm

With solder resist coating

Without solder resist coating

With solder resist coating Without solder resist coating

※ No open circuit after bending but corner of pad was slightly

lifted after 20 ° bending

Trace

Copper

(oz)

Base MetalDielectric

Thermal Conductivity

(W/m·K)

Dielectric

Thermal Impedance*1

(/W) / (in2/W)

Overall

Thermal Conductivity*2

(W/m·K)Al-5052

(mm)

Cu

(mm)

1 1.0 1 0.85 / 0.13 25.0

1 1.0 1 0.85 / 0.13 34.0

*1 Calculated Data

*2 Measured in Laser Flash in Ajou Univ. Lab. in 2010

Overall Thermal Conductivity and Dielectric Thermal Impedance

Heat Dissipation

- 16 -

Solder Float Tester (Solder Pot)

1 2 3 4 5 6 7 8 9 10 11 12

OK OK OK OK OK OK OK OK OK OK OK OK

Thermal Resistance

Specimen : 2” x 2”, n=12

Test Condition : Floating for 30min @300

Result : No Blister and No Delamination

- 17 -

A Condition

Item 1 2 3 4 5 6 7 8 9 10 AVG.

A 18.9 16.3 16.3 16.2 17.8 17.5 17.7 16.2 17.3 17.3 17.1

E-0.5/260 16.6 12.8 11.9 17.6 13.9 14.6

D-2/100 18.9 17.6 16.1 15.9 17.4 17.2

Peel Strength Tester (Instron)

E-0.5/260

D-2/100

[Unit : lbs/in]

Peel Strength

Specimen : 2oz Cu / Al 1.5mm

Test Condition :

Result :

- 18 -

Standard : 18”x24”

Available Size

How To Order

- 19 -

Documents

Taconic TacLED-3D