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Beam Pipe and Vertex Detector extraction: on Nov. 10, 2010Belle Detector Roll-out: Dec. 9, 2010End-caps, CDC, B-ACC, TOF extraction: in Jan. 2011
2/21/2011
Machine Design Parameters
parametersKEKB SuperKEKB
unitsLER HER LER HER
Beam energy Eb 3.5 8 4 7.007 GeV
Half crossing angle φ 11 41.5 mrad
# of Bunches N 1584 2500Horizontal emittance εx 18 24 3.2 5.3 nm
Emittance ratio κ 0.88 0.66 0.27 0.24 %
Beta functions at IP βx*/βy
* 1200/5.9 32/0.2725/0.3
0mm
Beam currents Ib 1.64 1.19 3.6 2.6 Abeam-beam
param. ξy 0.129 0.090 0.0886 0.081
Bunch Length z6.0 6.0 6.0 5.0 mm
Horizontal Beam Size x
150 150 10 11 um
Vertical Beam Size y 0.94 0.048 0.062 um
Luminosity L 2.1 x 1034 8 x 1035 cm-2s-
1
2/21/2011 2
e- 7GeV 2.6 A
e+ 4GeV 3.6 A
Target: L = 8x1035/cm2/s
SuperKEKB
Colliding bunches
Damping ring
Low emittance gun
Positron source
New beam pipe& bellows
Belle II
New IR
TiN-coated beam pipe with antechambers
Redesign the lattices of HER & LER to squeeze the emittance
Add / modify RF systems for higher beam current
New positron target / capture section
New superconducting /permanent final focusing quads near the IP
Low emittance electrons to inject
Low emittance positrons to inject
Replace short dipoles with longer ones (LER)
SuperKEKB and Belle II
32/21/2011
Luminosity prospect
Shutdownfor upgrade
Inte
gra
ted L
um
inosi
ty(a
b-1)
Peak
Lum
inosi
ty(c
m-2s-
1)
Milestone of SuperKEKB
9 month/year20 days/month
Commissioning startsin 2nd half of FY2014
We will reach 50 ab-1
in 2020~2021.
42/21/2011
longer lever armimprove resolution of momentum and dE/dx
Belle Belle IIinner most sense
wirer=88mm r=168mm
outer most sense wire
r=863mm r=1111.4mm
Number of layers 50 56
Total sense wires 8400 14336
Gas He:C2H6 He:C2H6
sense wire W(Φ30μm) W(Φ30μm)
field wire Al(Φ120μm) Al(Φ120μm)
Belle II CDC
normal cell
10~20 mm
18 mm10 mm
6~8 mm
small cell
Belle
Belle II
52/21/2011
Aerogel radiatorHamamatsu HAPD + readout
Barrel PID: Time of Propagation Counter (TOP)
Aerogel radiator
Hamamatsu HAPD+ new ASIC
Cherenkov photon200mm
n~1.05
Endcap PID: Aerogel RICH (ARICH)
200
Ring-imaging Cherenkov detectors
Quartz radiatorFocusing mirror
Small expansion blockHamamatsu MCP-PMT (measure t, x and y)
62/21/2011 Target: 4/K separation @ 4GeV
Belle II Construction Schedule
72/21/2011
Injector upgradeJFY2011 JFY2012 JFY2013 JFY2014 JFY2015
CommissioningCommissioning
AMDAMDCommissioningCommissioning
Study of cathode, cavity and laserStudy of cathode, cavity and laser
System at A1 used for studySystem at A1 used for study
Large aperture accLarge aperture accSystem integrationSystem integration
PF, AR injection 3-1 gunPF, AR injection 3-1 gun
Construction of HER, LER, DR Construction of HER, LER, DR
2011/2/7 8Linac Upgrade for SuperKEKB (Higo)
BPM resolution and BBABPM resolution and BBA
Total systemTotal system
ImprovementsImprovements
Emittance studyEmittance study
Conventional alignment Conventional alignment
3-2 gun 3-2 gun A-1 gunA-1 gun
Improvements in stability & intensity Improvements in stability & intensity
Higher intensityHigher intensity
Main Ring construction schedule
FY2010(H22)
FY2011(H23)
FY2012(H24)
FY2013(H25)
FY2014(H26)
MR commissioning
DR commissioning
Linac commissioning
Remove shields
Set shields
MR TunnelDisassemble KEKB
Beam Pipe
Magnet
QCS
Monitor
Floor
Survey & base plate
Installation, system check, cabling etc.Baking & TiN coating
R&D
Fabrication
alignmentInstallation, cabling
Field measurement
RF
Infrastructure
Fabrication
R&D,design Fabrication Installation, alignment
etc.Field measurement
R&DFabrication, installation
Fabrication, rearrangement etc. R&D,Prototype,test
Design Building ConstructionCooling system2/21/2011 9
Belle II Collaboration
10
13 countries/regions, 57 institutes, 384 collaborators (Jan. 2011)2/21/2011
Mechanical mockup of pixel detector
Zdeněk Doležal
Prototype DEPFET pixel sensor and readout
DEPFET matrix
DCDB
R/O chip
Switcher
control chip
A prototype ladder using the first 6 inch DSSD from Hamamatsu has been assembled and tested.
Full-length (540x570x2200) test chamber has also been made
PXD5 DEPFET matrix
DCDB readout chip, Bump bonded on interface board
Switcher control chip
TB 2009
120GeV
Array of 6 DEPFET modules
TOP Photon detector (MCP-PMT Hamamatsu 16ch MCP-PMT)
Aerogel
Hamamatsu HAPDQ.E. ~33% (recent good ones)
Test Beam setup