HFT PIXEL Progress
Face to Face
13 May-2009
Wieman
1
Sector structures
2
ladder fabrication and tooling
3
ladder fabrication and tooling
4
ladder fabrication and tooling
5finalizing mechanical designs and developing rapid production methods
ladder fabrication and tooling
6
ladder withsilicon heaterchips(50 m thick)
wire bonding 50 m silicon to flex PC
7
vacuum chuck tosecure flex and siliconflat against solid surfaceto remove bounce
Any bounce then no bond
Good Newsafter a couple of minor modifications to the vacuum chuck thewire bonding machine is happyRhonda is happy
ladder to sector tooling fixtures (4 stations)
8
Air cooling of silicon detectors – Computational Fluid Dynamics (CFD) analysis
air flow path – flows along both inside and outside surface of the sector
• Silicon power: 100 mW/cm2 (~ power of sunlight)
• 240 W total Si + drivers
9
Air cooling – CFD analysis• air flow velocity 9-10 m/s• maximum temperature rise above
ambient: 12 deg C• sector beam surface – important
component to cooling• dynamic pressure force 1.7 times
gravity
stream lines with velocity
silicon surface temperature
velocity contours
10
Full sized cooling tests
Thermal camera window not shown
> 300 CFPM air flow for verification of cooling capability
Cooling tests will begin as soon as prototype sectors completed
9 inch diameter tube mocks upISC
11dust collector for air supply
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