BGA Rework Removal

Rework and Repair of PCBs Solder/Assembly Training

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BGA Rework

I.I. Why ReworkWhy Rework

II.II. Scope of Material CoveredScope of Material Covered

III.III. BGA Rework ProcessBGA Rework ProcessA.A. RemovalRemoval

B.B. Site DressingSite Dressing

C.C. PlacementPlacement

D.D. ReflowReflow

E.E. CleaningCleaning

F.F. InspectionInspection

IV.IV. MaterialsMaterials


BGA Rework-Why Rework?

Misplaced part Part Upgrade Failed Part Do not know why


BGA Rework-A PrimerSCOPE

Plastic packages attachment of new parts using hot air as the reflow source


BGA Rework-A PrimerSCOPE

Reference DocumentsIPC-A-610IPC-7095

IPC 7711/21IPC J-STD-020IPC J-STD-033


BGA Rework-the process

Removal-controlled heat sourceObjective is to get the device off as quickly as possible without damaging the device (may need to reball and use again) or neighboring devices or the laminate


BGA Rework-the processRemoval-locating the right location


BGA Rework-the processRemoval-controlled heat source-bottom side preheat


BGA Rework-the processRemoval-bakeout if need to reball or salvage the component


BGA Rework-the processRemoval-popcorning and wire bonding damage


Removal-controlled heat source-bottom side preheat



Removal-proper board holders



Removal-controlled heat sourceShield the surrounding area



Removal-controlled heat sourceShield the surrounding area



Removal-controlled heat sourceProfile on, underneath and next to the device



Removal-controlled heat sourceTypical Removal Profile-tin lead



Removal-controlled heat sourceTypical Removal Profile- lead-free


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BGA Rework Removal