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DELIVERING QUALITY SINCE 1952.
Flex & Rigid Flex PCB’s:Applications & Cost Drivers
08/28/2015
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Flex & Rigid Flex Applications
Flex & Rigid Flex Applications:
– Present in every market segment:• Medical• Avionics• Instrumentation• Industrial Controls and Sensors• Automotive• Wearable Devices• Military• Etc.
– Applications cover both:• Static: Bend once to fit• Dynamic: Up to infinite number of bends
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Flex & Rigid Flex Applications
Laser Gun Sights
High Speed Communication Interconnects Night Vision Goggles
Hearing Aids
Defibrillators
Portable CT Scanner XRF Analyzer
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Flex & Rigid Flex Applications
Primary Factors:1. Packaging Requirement (#1)2. Reliability Improvement (#2)
– Accounts for 80%+ of all applications.
– Capabilities beyond alternate solutions:• Cable harnesses• Discrete wires• Mating connectors
– Alternate interconnect solutions, that meet your design requirements, may provide cost savings but will not achieve as high a packaging, reliability or performance level.
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Flex & Rigid Flex Applications:Packaging
Size Reduction:– Occupies down to 10% the “space” of alternate solutions.– Circuit density capability of Rigid PCBs.– Tighter bend capabilities than wires / cables.– Reduced rigid board space requirements– Reduced enclosure dimension
opportunities
Weight Reduction:– Down to 10% of alternate solutions– Improved Shock & Vibration
performance
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Flex & Rigid Flex Applications:Packaging
Added Functionality:– Increased number of available interconnects between rigid areas
Component Reduction:– Connectors:
• Rigid – Flex constructions eliminate connectors completely• ZIF Connectors:
– One part connector system.– Flex circuit direct plug in with mating connector
• Lap Joint Direct Solder – Flex Soldered directly to PCB
– Components:• Higher level of design integration
may allow for reduced componentrequirements.
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Flex & Rigid Flex Applications:Reliability
Point of Failure Reduction:– Reduced number of interconnects required:
• Connector solder joints• Mating connector interfaces• Wire / Cable crimp connections
Improved Shock & Vibration Performance– Reduced weight– Reduced number of interconnects
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Flex & Rigid Flex Applications:Additional Items
High Speed Signal Integrity:– Exceptional performance over a wide range of requirements
• Lower material DK values• Tightly controlled and uniform material thicknesses• Homogenous flex core construction
Improved Heat Dissipation:– Thinner materials and constructions– Greater surface area to volume ratios
Assembly Cost Reduction:– Fewer assembly steps
Assembly Errors Reduction:– “One way only” assembly
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Flex & Rigid Flex Cost Drivers: Part Size
Production Panel Manufacturing Process:– Multiple individual parts arranged within a larger format production
panel (Same as traditional rigid boards)– Applies to Roll to Roll manufacturing
Material Quantity Requirements:– Number of panels required to yield required number of parts.– Higher quantity of parts per panel reduces total material
requirements and lowers per unit cost
Design Configuration:– Excessive levels of integration may lead to large part
configurations
Part Length:– May not match “well” with available production panel sizes
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Flex & Rigid Flex Cost Factors: Part Shape
Design Configuration:– Technology allows for many unique configurations and shapes.– Part shape / size combination may limit ability to “nest” parts within
a production panel decreasing material utilization: • Circular or U shapes with empty center sections• Non-rectangular configurations with unique angles and or extensions
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Flex & Rigid Flex Cost Factors: Manufacturing Process
Manufacturing Process Requirements:– May dictate specific part orientations thus reducing parts per panel
• Rigid or rigidized areas toflex areas relationship
• Stiffeners
• PSAs (Double Sided Adhesives)• Breakaway tabs
– assembly arrays
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Flex & Rigid Flex Cost Factors: Layer Count & Construction
Flex Layer Count:– Additional more costly materials– Added Flex layer lamination process(s)
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Flex & Rigid Flex Cost Factors: Layer Count & Construction
Flex Layer Count (continued)
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Flex & Rigid Flex Cost Factors: Layer Count & Construction
Flex Layer Configuration:– Air Gap Vs Single Stack Construction
• Added Coverlay materials & Coverlay lamination process for each flex layer pair
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Flex & Rigid Flex Cost Factors:Technology Requirements:
Blind & Buried Vias:– Added drilling, plating and lamination cycle(s)– May also require more costly materials
Via Fill:– Required for Via in Pad component & fine pitch BGA applications
Flex Only Area Plated Holes:– Added drilling & plating cycle(s)
• Sequential build process
Flex Area Stiffeners:• Added material(s)• Added lamination cycle(s)
Epoxy Strain Reliefs:– Applied to rigid to flex transitions if required
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Summary
Applications:– Wide variety of applications throughout all market segments– Applications driven by packaging and reliability requirements
which alternate solutions cannot support.
Cost Drivers:– Multiple factors create a variety of combinations which impact the
final part cost.
Your supplier can assist and support in the following areas to ensure the highest degree of project success:– Application Review– Design Requirements– Cost factors.
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Our Products
Battery Packs Flex & Rigid-Flex PCB’s User Interfaces
Fans & Motors Cable Assemblies Printed Circuit Boards
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Design Centers & Technical Support
Battery Pack & Power Management – Denver, CO User Interfaces – Largo, FL Fans & Motors – Wales, UK PCB’s – New Bedford, MA & Shenzhen, China Flex & Rigid Flex – Toronto, Canada Cable Assemblies – New Bedford, MA
Our Engineering and Design teams are ready to help our customers create world class and cost effective product solutions.
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Q&A
Questions?– Enter any questions you may have
in the Control Panel
– If we don’t have time to get to it, wewill reply via email
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Thank YouCheck out our previous webinars at www.epectec.com.
For more information email [email protected].
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