CAM-I Scalable Flexible Manufacturing Initiative NGMS Task 6.1

CAM-I Scalable Flexible Manufacturing Initiative

NGMS Task 6.1

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Vision

Our vision is E-manufacturing where we haveSeamless, scalable and robust evolution of

products from design to manufacturing (and possibly to delivery and service)

Computer tools (such as simulators, rule-bases, visualizing environments) to rapidly plan, validate and deploy manufacturing instructions

Flexible manufacturing systems for simultaneous production of multiple products and minimum system change over

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Broad Goals

Manufacturing evaluation and deployment of emerging standards (STEP 203 and 210, possibly 220)

Development of environments for manufacturability analysis of designs

Manufacturing process planning and simulation environments

Simulation and control for flexible manufacturing of board assemblies

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Immediate Goals

Implementation of visualization and translation tools for STEP AP210 (Generate 3-D models of assembly from AP210 descriptions)

Computer implementation of Rockwell’s DFM rule base to function with AP210 description of boards

Simulators for placement processes and machines (HSP and GSM simulators)

Development of capabilities to ‘virtually’ produce a board (AP210 ‘as produced’ view of board assembly)

Generation of (HSP) machine input files from AP210 model

Present flow

Physical Constraintsand Functions

Design andDrafting

MFG. Review(DFM Checks)

Design Release

Trial&ErrorProduction

Proposed Flow

Production

Design Release

VirtualEnvironment

Physical Constraintsand Functions

EngineeringDesign

Design For Manufacturing

Computer Integrated Manufacturing

Optel - Manufacturing Execution System

Enterprise Resource Planning

Virtual Environment

Process Planners

Simulator

Manufacturing Execution Systems

DesignsRules Resources

ProcessPlans Virtual

ProductsMachinePrograms

ManufacturingAnalysis

Visualizers

RuleInferenceEngines

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Product Enclosure

ExternallyVisible Connectors

Printed Circuit Assemblies

Die

Package

Packaged Part

InterconnectAssembly

Printed Circuit Substrate

Die

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Typical 2-D design of a PCB

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PCB Manufacturing Process

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Why STEP?

Emerging standardMillion seats of AP-203 presently

deployed Simulation tool to be used across

manufacturing facilities and vendors e-manufacturing

E-Business applications of STEP are being enabled by the STEP and W3C committees working together.

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What is STEP?

ISO standard (ISO 10303): to share and exchange digital

technical information Set of common data structures Application Protocols - Domain

specific usage of data structuresAP 203 (3D solid Models)

AP210: Electronic Assembly,Interconnect and Packaging Design

Technology

Physical• Component Placement• Bare Board Design• Layout templates• Layers non-planar, conductive & non-conductive• Material product

• Geometrically Bounded 2-D• Wireframe with Topology • Surfaces• Advanced BREP Solids • Constructive Solid Geometry

Part• Functionality• Analysis Support • Shape 2D, 3D • Package• Material Product• Properties

Configuration Mgmt• Identification• Authority • Effectivity • Control• Requirement Traceability• Analytical Model• Document References

Product Structure/Connectivity

• Functional• Packaged

• Fabrication Design Rules• Product Design Rules

Requirements• Design• Allocation• Constraints• Interface• Rules

• Geometric Dimensioning and Tolerancing

Geometry

Design Control

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AP 210

Several product models in electromechanical domain.

Supports Multidisciplinary library data. Scope is “as required” & “as designed”

product information. Sharing across several levels of supply

base. Ability to Integrate with other

engineering domains. Ability to integrate external services

coherently.

Flow Diagram

DFM Rule Checker

DFM Rule files

AP 210 file (3D)

AP 210 file (2D)

Assembly configuration

file

Placement Sequence (OPTEL)

Visualizer(STEP OIV)

Machine library

Simulator

Design Facts

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2D to 3D converter

ECAD translators generate AP 210 files containing 2D Geometry

Simulate 3D view of the assembly board Converter

Input : AP 210 file (2D geometry)Extrudes them into solids (Advanced

BREP)Output:

AP 210 file (2D + 3D geometry)AP 203 files

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2D to 3D converter

Ap203 files Individual

packages Board

These files then converted into Open Inventor formatInventor:

Graphics package used for rendering

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Typical 2-D design of a PCB

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AP-210 Viewer

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DFM We are adapting a system

originally developed by Boeing for use at Rockwell Developed on PreAMP and

TIGER project. RDF syntax Inputs

AP-210 Design File Rule Files

Configuration ManagementSchema User

Interface

Rule DefinitionSoftware

Rule Execution Software

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DFM Rule Facility

Subset of Rockwell Collins DFM rules were chosen for implementation.

Relevant facts extracted from the AP-210 file during preprocessing.Rule Inference engine insulated from intricacies

of STEPDifferent facilities can easily plug in their DFM

modules.

Interface to the simulatorDFM rules which were violatedComponents which violated these rules.

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Assembly Data

Establish an assembly usage viewComponents

Organization by package / part family

Part numbers, versionConfiguration management data Location, orientation Reference Designators

Integrated with OPTELMagazine SetupOptimized placement sequence

210 / 203 translator

Electrical Domain Mechanical Domain

Simulator

Feeder information

Component information

Placement Sequence

Geometric Models

Placement Simulator

Virtual Board

DFM RuleCheck

Components violating

DFM rules

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Simulator

ConfigurableKinematics – accepts

a mechanism graphGraphics –

Geometric Models of machine components

Next stepsMachine LibraryAdding functionality

Nozzle compatibility

Placement timing

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Project timeline

Year 1

Year 3

Year 2

Process Planning

Production & Setup Planning

Shop Floor Controller

• STEP Basics• Machine Simulator• DFM Checking

• Process Planning Modules• Development of SFM Controller• Capacity Planning & Simulation

• Standardization• Deployment• Process Simulation

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Work done

Accepting an AP210 2D design file Manufacturability analysis Extracting component information Generating 3D models of components and

assemblies Simulation using Universal HSP and GSM Generating

“as designed” view “as simulated” view

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Work done (cont.)

Simulation Double sided boards Multi Panel Boards GSM Multiple stage simulation

Testing Update of DFM Rules Development of ‘Fact Extraction’ software

AP210 Viewer Full 3-D assembly model of board Association between Graphical entities and AP210 entities Ability to display properties

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Future Work

DFT Bare Board testing In-circuit test: fixtures for the test

Manufacturing systems planning Generating stencils for printed circuit substrates Explore transition from Line concept to Cell concept

Capacity planning and simulation Describing production facilities (AP-220)

Deployment