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Compact Integrated Receivers Using Custom and Commercial MMIC Technology. Matt Morgan 9/7/2006. Compact Integrated Receivers. 1. critical for focal plane arrays beam spacing field of view 2. lower mass more efficient cryogenics tighter temperature control - PowerPoint PPT Presentation
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Compact Integrated Receivers UsingCustom and Commercial MMIC Technology
Matt Morgan9/7/2006
Compact Integrated Receivers
1. critical for focal plane arrays beam spacing field of view
2. lower mass more efficient cryogenics tighter temperature control reduced mechanical load
3. fewer connectors and cables greater reliability reduced VSWR effects reduced gain slopes fewer entry points for RFI
MMIC Modules are More Compact, Lightweightand Manufacturable than Conventional Assemblies
Multi-Chip Module
Assembly of IndividuallyPackaged Components
Many MMICs available Commercially
Most things below 50 GHz are available off-the-shelf for less than $50Exceptions include:
balanced port configurations non-standard impedance some wide IF-Band mixers
Some things in the 50-100 GHz range can be found in commercial productlistings, but
sparse frequency coverage usually narrow-band, targeted for specific applications
(communication and radar bands, etc.) some exotic functions not supported (compound switches, etc.)
Finally, there is a large pool of proven custom designs to draw from,designed by NRAO and our collaborators (JPL, ATA, universities,foundry IRAD designs, etc.)
Some Examples: W-Band Signal Source
2.5 cm
Some Examples: Compact Water Vapor Radiometer
All Commercial MMICs!
Some Examples: ALMA Active Multiplier Chain
Some Examples: DSN Array Ka-Band Downconverter
Working Toward an All-MMIC Receiver
1. Once a design is set, MMIC components and assemblies can be mass-produced with exceptional repeatability especially in the cm-wave range, where most MMICs are
commercially available – chips are screened by the manufacturerand their specs guaranteed.
module assembly is insensitive to small variations – bondwires are used for 50 interconnects, not for tuning!
2. Repairs are relatively easy to diagnose and repair because of the inherent uniformity in performance, device failure is
usually apparent from the DC bias alone. when it isn't, the chips are cheap enough to simply replace them one
at a time until the culprit is found.
It is therefore reasonable to think about implementing even very sophisticatedfront-ends in a single module using all MMIC technology.
no internal connectors! no internal cables! only 1 block to machine small, lightweight, manufacturable
Shall we take integration a step further:Receiver-on-a-Chip?
I would say no... LNAs, mixers, and multipliers have all been demonstrated on common
semiconductor technologies, but with compromised performance – betterto pick the right MMIC process for the right chip
even if it works, the yield is too low on III-V semiconductors for large-scaleintegration
a lot of expensive wafer real estate is wasted on passives can no longer take advantage of commercial components – have to design
it all from scratch no opportunity for chip reuse Microwave substrates are thin! A large, floppy chip would be too hard to
handle and mount without damaging it.
Could We Put the Whole Receiver in OneModule and Cool Everything?
Not if it is a heterodyne receiver, because LO generation dissipates too much power for cryogenics IF components are usually Silicon, which will not function cold
However, special-purpose direct detection receivers could occupya single cold module
even more compact better sensitivity better temperature stability better component lifetime
Another Problem: Why are those bias boards so big?
Because we put a lot on them! linear regulators potentiometers for tuning and gain
control digital logic for configuration switching
and channel selection Op-Amps for gate servo loops and
monitor points IF circuitry
It makes for a user-friendly module, butif we're serious about compactness,particularly for focal plane arrays, then wemust find a way to trim this part down.
Option #1: Develop Common Bias Blocks in Die Formor Integrated SMT Packages
Two external resistorsset the desired drainvoltage and current.
Probably very expensive!(unless we buy millions of them)
Not suitable for cooling if donein Silicon.
Option #2: Limit DC inputs to analog bias voltages
Put nothing in the block exceptbasic EMI and over-voltageprotection.
All current control, monitoring,and tuning functions can beimplemented in a central M&Cunit (more efficiently, in fact...)
Option #2: continued...
With all monitor functions in one place, some parts can be shared.
What About LNAs?
more compact easier to integrate in large
multi-function modules easy to replicate module assembly can be
done commercially
Pros
MMIC LNAs MIC LNAs
higher-Q passive components allows pre-selection of active
devices for optimumperformance
larger development cost
Cons
difficult to transfer assembly"know-how" to commercialmanufacturers.
A "Nearly Monolithic" LNA
Maybe we can compromise between optimum performance and large-scalemanufacturability by using a hand-picked first-stage discrete device followedby a MMIC.
Discrete stageMMIC stage
Case Study: Ka-Band All-MMIC Receiver
Calculated Performance: noise temperature = 10 K gain = 60 dB P1dB = -45 dBm (input) LO = 2 mW (6-9 GHz) power dissipation = 150 mW (cold part), 3.5 W (warm
part)
BPFBPF
BPF x2
26-40 GHz2-4 GHz
VelociumALH369TRW
HCA4200P
TriquintTGL-4203
VelociumALH369
Mimix BBXM1001
24-36 GHz
x2
Mimix BBXX1000
HittiteHMC205
6-9 GHz12-18 GHz
BPF
AvagoHMMC-5618
COLD MODULE WARM MODULE
BPF
26-40 GHz
VelociumALH369TRW
HCA4200P
TriquintTGL-4203
VelociumALH369
SirenzaSBB-5089
Mimix BBXM1001
Anaren11306-3
BPF
Anaren11306-3
2-4 GHz
SirenzaSBB-5089
TriquintTGL-4203
2-4 GHz
2-4 GHz
26-40 GHz
26-40 GHz
All-MMIC Cold Receiver Module
RF inputsLO input (underneath)
IF outputs
IF hybrids
MMICs
All-MMIC Cold Receiver Module
The size of a well-designed MMIC module is typicallydominated by connectors and waveguide flanges.
MMIC-Based Cold Receiver Assembly
OMT
LO IFIF
MMICModule
Bias/M&C
Cooled Focal Plane Array
Backup slides follow
If the entire receiver is cooled anyway, should we considerusing superconducting passive elements (couplers, filters, etc)?
I don't think so excellent LNA performance can be achieved at ~20K, but a good
microwave superconductor would force you to much lowertemperatures (~5K)
not really a commercial process – your passive elementscould be more expensive than the MMICs!
you lose the ability to test it at room temperature not much to gain anyway? – superconductors are not lossless
at high frequency, and cooled copper may be competitive if it isreasonably pure
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