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Development of GaN-based Power Electronics for PV Inverters
----an important BoS cost driver
Umesh K MishraUC Solar co-Director and Professor ECE, UC Santa Barbara
Chairman and CTO, Transphorm Inc., (a UCSB Start-up)
UC Solar Review, October 7, 2016
“Moore’sLaw”ofPowerElectronics
GaN is the next significant semiconductor alongside Silicon
3
• GaN has a direct and large bandgap • Enormous and growing photonics market which develops a large eco-system
of infrastructure and human resources
• GaN is a lucky semiconductor; it performs reliably (in photonics and electronics) • Even while being an imperfect material (high dislocation density)
• In electronics it can also serve a large market • From KHz (power conversion) to GHz (RF amplification and communication)
• It has been proven reliable in both power conversion and RF applications• It is market ready
• GaN has a clear roadmap to lower cost and higher performance• Necessary for mass adoption
• Vertical GaN-on-GaN devices• Attractive for high power applications (>50kW)
Proprietary&Confidential
FormandfunctionisdrivenbyfrequencyHomeSatelliteCommunication
C-Band4-8GHz Ku-Band
12-18 GHz
http://www.satsig.net/pointing/dish-pointing-images.htm
Widespreaddistributionenabledbyhigherfrequency
Proprietary&Confidential
WithHighEfficiencyatHighFrequencyTransphorm’s EZ-GaNDisruptsPVInvertersbyProvidingEnhancedEfficiencyand
ReducedSizeatReducedCost
HighEfficiency– ReducesMechanicalSize
HighFrequency–ReducesElectricalSize
SystemSizeGaN,
2520in3
72%
Saved,1000in3
28%
SystemCostGaN,$586.791%
Saved,$54.779%
WithGaN
Analysisdoneforoneclassofinverters,willapplytootherinverterclassesingeneral
Proprietary&Confidential
CurrentInverterTechnology(20kHz)TopCostDrivers
Mechanical ElectricalHeatsink,$50.36,24%
Enclosure$63.5330%
SwitchBox$36.5117%
Other,$61.71,29%
BoostInductor$47.0219%
InverterInductor$72.1029%
ElectrolyticCapacitors$35.5214%
CommonModeChokes$12.485%
Other$84.5333%
Proprietary&Confidential
Transphorm’s EZ-GaN ProvidesHighEfficiencywithSimpleTopology:ReducesSizeandCost
Enables:• ShrinkingofHeatsink• ShrinkingofEnclosure System
SizeGaN,
2520in3
72%
Saved,1000in3
28%
Efficiency(%) 96.8 97.5(Current) 98.5(2013)
Heatsinkininches
Length 12 8.4 5.5
Width 12 7.2 3.3
Height 3 2.5 2.0
WithGaN
WithGaN 15%systempricereduction
Breakdown of PV system costs for a residential system
8
TheAdvantageofGaN-on-SiforPowerConversion
• GaNenablesincreasedoutputpowerdensity• Higherefficienciesathigherpowerandhigherfrequencies
• PVinverter:4.5kW>98%efficiencyat50KHz(Yaskawa)• 10L(50%ofYaskawa’s SiIGBT-basedproduct)
• 1Userversolution:2.2kWat98%efficiency• Today’scurrentdesignis1.2kW
Si-IGBT-basedsystem
GaNFET-basedsystem45%smaller
99
94
93
Efficie
ncy
(%)
Power (W)
98
97
96
95
500 1000 2000 3000 4000 4500
GaNIGBT
1500 2500 3500
9
10
HVGaNHEMTLVSi
FET
G
DNormallyoffNormallyon
Advantage:o Robusto Highperformanceo Compatiblewith
SidriversDisadvantageo Two-chipsolution
Substrate(SiC orSi)
GaN Buffer
AlGaN BarrierSource Insulator Drain
Gate
DeviceCellCross-section
2DEG
Cascode Approachtoachievenormallyoff
GD
S
EffectiveCKT
Normallyoff
Cascode HEMTimplementation
HighTemperatureOperatingLife
Circuit:Boostconverter• InputVoltage:200V• OutputVoltage:400V• Operatingfrequency:300kHz
06
3000
9.5
Time (hrs)
Loss
(W
)
1500
8.5
7.5
6.5
9
8
7
750 2250
High Temperature Operating Life Test
Reference device (Si)
GaN FETs
Operating conditions:200/400V converter operation@ 175oC/300kHz/410W Tested in hard-switched boost converter
• OperatingTemperature:Tcase =150°C
• OutputPower:410W
• Testtime:3000hours
6
QualityandReliability
• TransphormhasdemonstratedJEDEC-qualified650VGaNdevices• ExtendedreliabilitytestingaboveandbeyondJEDEC• Establishedintrinsiclifetimefor650VratedGaNpowerchips
Over 1500 V breakdown voltage
With little dynamic R(on) collapse
Stable switching up to 1000 Volts
7
ProprietaryandConfidentialInformation13
Current,Temperature:HighTemperatureDCTestingVoltage:HighVoltageOff-StateTesting
TemperatureandCurrentAcceleration§ Devicestestedat“high”rangeofnominalcurrentlevels§ Tj rangedfrom330to380°C§ Resultsconsistentwithreporteddata
§ Ea =1.84eV§ Lifetimeat150°C>1X108hrs
Testsprovidescredibleandgoodlifetimeprojections
125⁰C175⁰C 150⁰C
VoltageAcceleration§ Cascode(product)devicestested§ HighVoltagesrangedfrom1000to1300V
§ MTTFat1050V=6800hrs§ Higherthanexpectedvoltagespikesduringoperation
§ Nominaloperatingtemperature=82°C§ Lifetimeat600V>1X108hrs
Updated 8/6/15
20 years
MTTF
600V 480V
14
High-voltagePowerTechnology Transitions
$0 M
$50 M
$100 M
$150 M
$200 M
$250 M
$300 M
2016 2017 2018 2019
1200 V
900 V
Broad Industrial
Consumer
Automotive
Motor Drive
PV Inverters
Servers
SignificantinflectionpointinCY18/CY19 timeframe forreliable>650VGaN-on-Siproduct
10
GaN-on-Sibasedpowerconversionisready
Bottoms-up GaN ServableMarket – Near Term
Bottoms-up GaN ServableMarket – Medium Term
$0 M
$150 M
$300 M
$450 M
$600 M
$750 M
$900 M
2019 2020 2021 2022
2014/15WorldWideVehicleSalesbyRegion
• Europeisthefastestgrowing:9.2%growth• Threelargestmarkets:DE,UK,FR,(Nor,SE,NLgov’tprogramssupportingEV’s)
• Chinaisthelargest:9.1%growth• Reducedtaxesonvehicleswithlessthan1.6literengines
• Japancontractedby10.1%
0%5%
10%15%20%25%30%35%
Russia India Brazil Japan Europe USA China
Units(M
)
Region
2014(59.9Mu) 2015(61.7Mu)
-
Source:VDC
-7.8%
-25.6%
-10.3%
9.2%
5.7%
9.1%
WhyisGaNTargetingAuto
http://www.automotive-eetimes.com/content/lateral-gan-transistors-%E2%80%93-replacement-igbt-devices-automotive-applications
GaN’sValueProposition
HigherEfficiency
BridgelessTotemPolePFC
HigherFrequencyIncreasedPower
Density
LowerSystemCost
650V/SMD&TOpackagesAEC-Q101
Transphorm’sSales
Strategy
ValueofGaNisRealizedinDifferentTopologies
Topology HigherPerformance HigherPowerDensity LowerSystemCost
Standardboost PFC XInterleavedboostPFC XBridgelesstotem-
polePFC X X X
GaNValueShownViaCustomerSolution• Project:1.2kWpowersupply• Competition:Superjunction(silicon)• Result:Higherefficiency,lowerBOMcost
• Reductioninpartcount,magnetics,EMIfilter
ParameterResults InterleavedPFC BridgelessTotemPolePFC
Efficiency 97.8% 98.7%Totalcost 100% 93.7%
SiFET
SiFET
SiC Diodes
GaNValueShownViaCustomerSolution• Project:3.3kWpowersupply• Competition:Superjunction(silicon)• Result:Higherefficiency,lowerBOMcost
• Reductioninpartcount,magnetics,EMIfilter
ParameterResults InterleavedPFC BridgelessTotemPolePFC
Efficiency 98.5% 98.7%Totalcost 100% 60%
GaNFET
GaNFET
SiFET
SiFET
SiFET
SiFET
SiC Diodes
SiFETs
Vertical design advantages over lateral design
2
-Grow thick GaN layers: High BV >> 1200V
-Realize high current (>> 20A) devices
-Normally-off operation
-Reduced number of defects: Improved Reliability, Large EC
-Breakdown occurs in bulk Avalanche capability
-GaN on GaN takes less chip area àLowers die cost
*KIZILYALLI et al.: VERTICAL POWER p-n DIODES BASED ON BULK GaN
State of the art vertical devices: CAVET
CAVET (UCSB, ASU, Avogy, Toyota, UC Davis)
Best Performance:- 1.5 kV, 2.2 mΩ.cm2 (Avogy)3
Best Performance:- 380 V, 1.5 mΩ.cm2 (UCSB)
UCSB Data
RON = 2.5 mΩ.cm2
VBR = 990 V
Vertical GaN in a simple device topology is attractive for 1200V markets soon
GaN is the next significant semiconductor alongside Silicon
25
• GaN has a direct and large bandgap • Enormous and growing photonics market which develops a large eco-system
of infrastructure and human resources
• GaN is a lucky semiconductor; it performs reliably (in photonics and electronics) • Even while being an imperfect material (high dislocation density)
• In electronics it can also serve a large market • From KHz (power conversion) to GHz (RF amplification and communication)
• It has been proven reliable in both power conversion and RF applications• It is market ready
• GaN has a clear roadmap to lower cost and higher performance• Necessary for mass adoption
• Vertical GaN-on-GaN devices• Attractive for high power applications (>50kW)
Sustained funding from UC Solar for both the PV module and the PV Inverter will Drive higher performance lower cost systems in the coming decades
Conclusion
Yes we GaN!
26
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