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Design of a Test System and Packaging of SOI-MEMS Resonators for High Temperature Characterization. Electrical Engineering Department Presenter: Robert MacKinnon Jr. Advisor: Professor Mustafa Guvench Coauthor: Joshua Ward. MEMS Test Setup : HP 54504A Digital Oscilloscope - PowerPoint PPT Presentation
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Micro-Electro-Mechanical-Systems (MEMS) devices bring some of the
miniaturization that was portrayed in the 1966 classic film “Fantastic Voyage” to
reality. These tiny machines are being used as pumps, motors and sensors for a
variety of different applications. USM Electrical Engineering Professor Mustafa
Guvench has recently designed and fabricated a MEMS resonator for use in gas
sensing and frequency control applications. Ordinarily these types of devices can
be tested utilizing micro-manipulated electro-probing, however given the unique
and varied environmental conditions of the potential applications; a new means of
testing will need to be developed as part of chip research and development.
The scope of this project is the packaging and testing of the resonator at high
temperatures and under exposure to different gases and concentrations of gases.
Once successful tested under these conditions, the MEMS resonators will provide a
very inexpensive, reliable and miniature means of testing and monitoring
atmospheric conditions. Potential uses may include many health and safety uses,
as well as space exploration and defense applications.
Micro-Electro-Mechanical-Systems (MEMS) devices bring some of the
miniaturization that was portrayed in the 1966 classic film “Fantastic Voyage” to
reality. These tiny machines are being used as pumps, motors and sensors for a
variety of different applications. USM Electrical Engineering Professor Mustafa
Guvench has recently designed and fabricated a MEMS resonator for use in gas
sensing and frequency control applications. Ordinarily these types of devices can
be tested utilizing micro-manipulated electro-probing, however given the unique
and varied environmental conditions of the potential applications; a new means of
testing will need to be developed as part of chip research and development.
The scope of this project is the packaging and testing of the resonator at high
temperatures and under exposure to different gases and concentrations of gases.
Once successful tested under these conditions, the MEMS resonators will provide a
very inexpensive, reliable and miniature means of testing and monitoring
atmospheric conditions. Potential uses may include many health and safety uses,
as well as space exploration and defense applications.
Electrical Engineering Department
Presenter: Robert MacKinnon Jr. Advisor: Professor Mustafa Guvench
Coauthor: Joshua Ward
Electrical Engineering Department
Presenter: Robert MacKinnon Jr. Advisor: Professor Mustafa Guvench
Coauthor: Joshua Ward
Frequency Response of a
SOI-MEMS Resonator
Magnitude(yellow) & Phase(blue)
MEMS wire bonding diagram
SOI- MEMS chip, size 5 mm x 5 mm wire
bonded to a 44-pin J-LDCC gold package
MEMS Test Setup:
HP 54504A Digital Oscilloscope
HP 5335A Universal Counter
HP 4194A Spectrum Analyzer
KI 213 Programmable Source
Virtual temperature controller
Wire bonding machine
Design of a Test System and Packaging of SOI-MEMS Resonators for Design of a Test System and Packaging of SOI-MEMS Resonators for High Temperature CharacterizationHigh Temperature Characterization
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