GUANGDONG SHENGYI SCI - Hitech Circuits Co., Ltd. · ≥10 6 ≥ 103 ≥ 104 ≥ 103 ≥ 60 ≥ 40...

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! UV Blocking and AOI compatible, so as to Increase productivity.! Good thermal resistance performance .! Good dimensional stability.! Excellent mechanical and electrical properties.

FEATURES APPLICATIONS

Computer, Instrumentation, VCR,Communication equipment, Electronic game machine, Automobil,Aviation,etc.

Tg

Test Item

Flammability

Volume Resistivity

Surface Resistivity

Arc ResistanceDielectric Breakdown

Dissipation Factor(1MHz)

Dielectric Constant(1MHz)

ThermalStress

UnetchedEtched

DSC

Treatment Condition

C-48/23/50E-24/125

E-24/125After moisture resistance

E-24/125D-48/50+D-0.5/23

C-24/23/50

D-48/50+D-0.5/23

C-24/23/50

288 ,20s℃

Unit

-

M -cmΩ

SKV

-

-

-

SPEC

Property Data

≥130

V-0

6≥10

3≥10

4≥10

3≥10≥60≥ 40

≤ 5.4

≤ 0.035

No delamination

140

Typical Value

V-0

No delamination

PeelStrength

1ozCu. Foil

FlexuralStrength

LWCW

Water Absorption

288 ,10s℃

125℃

A

D-24/23

N/mm

%

≥1.05≥ 0.70≥ 415≥ 345≤ 0.35 0.15

5006001.61.8

0.015

4.6

60120

65×10

75×10

65×10

85×10

GENERAL PROPERTIES

S1141 (ANSI:FR-4)UV Blocking

GUANGDONG SHENGYI SCI.TECH

! UV Blocking 和 AOI兼容,可提高PCB生产效率。! 优良的耐热性。! 优良的尺寸稳定性。! 优秀的机械性能和电性能。

特点 应用领域

电脑、仪器仪表、摄像机、通讯设备、电子游戏机、汽车、航空等。

After moisture resistance

MPa

TMACTEZ-axis

Before Tg

After Tg TMA

--

65300

广东生益科技股份有限公司

μm/m℃μm/m℃

-13-

Specimen Thickness:1.6mm

C = Humidity conditioning;D = Immersion conditioning in distilled water;E = Temperature conditioning.

The figures following the letter symbols indicate with the first digit the duration of thepreconditioning in hours, with the second digit the preconditioning temperature in ℃ and with the third digit the relative humidity.

Explanations:

VIEC60112 Method - 200CTI

4 Other sheet size and thickness could be available upon request.

1,020×1,220mm (40″× 48″ )1,070×1,220mm (42″× 48″ )

915×1,220mm (36″× 48″ )Standard SizeCopper foil

12 mμto 105 mμ

Thickness

0.05mmto 3.2mm

PURCHASING INFORMATION

+ Water absorption at pressure cooker + Flexural strength

00.5

11.5

22.5

25 50 75 100 125

Pe

el s

tre

ng

th (

N/m

m)

Temperature (℃ )

+ Peel strength + Dielectric constant

0.0

0.2

0.4

0.6

0.8

1.0

1.2

0.5 1 2 3 4 5

Condition time (hr)

Ratio(%)

3.0

4.0

5.0

6.0

1 5 10 50 100

MHz

Dk

S1141 (ANSI:FR-4)UV Blocking

GUANGDONG SHENGYI SCI.TECH广东生益科技股份有限公司

-14-

0

100

200

300

400

500

600

23 50 100 150

LW

CW

Fle

xu

ral s

tre

ng

th (

MP

a)

Temperature (℃ )

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