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ISS: 108x80m 420T 86KW 400km AMS: 3x3x3m 6T 2.3+KW 3+ years. AMS-02 Avionics FSR-II (21 May 2007) Mike Capell Avionics Lead Senior Research Scientist. Subdetector Requirements: Summary. 7 Gbit/sec >> 2 Mbit/sec ⇒ Restrict Rate & Size. - PowerPoint PPT Presentation
Citation preview
Mike Capell / Jan ‘04 AMS-02 Electronics 1
AMS-02 AvionicsFSR-II (21 May 2007)
Mike CapellAvionics Lead
Senior Research Scientist
ISS: 108x80m 420T 86KW 400km AMS: 3x3x3m 6T 2.3+KW 3+ years
Mike Capell / May ‘07 AMS-02 Electronics 2
Subdetector Requirements: SummarySubdetector Req’ments Channels Raw Kbits
U: TRD Gas gain 5,248 84S: ToF+ACC 100 ps 48*4*8 49T: Tracker few fC 196,608 3,146 R: RICH Single g 680*16*2 348E: ECAL 1:60,000 324*(4*2+1) 47 Raw Kbits/event 3,674* Event Rate ≤ 2 Khz= Total Raw Data Rate ~7 Gbit/sec
7 Gbit/sec >> 2 Mbit/sec ⇒ Restrict Rate & Size
Specify, design, develop, produce: High Speed, High
Capacity, Low Power, Low Weight,
Reliable Signal & Data Processing
ON ORBIT !
Mike Capell / May ‘07 AMS-02 Electronics 3
• Subdetector specific front ends (5 types, 1600 units)
• Common DAQ nodes (1 type, 300 units)• General purpose computers with
specialized interfaces (4x redundant)• Trigger system to meter data flow.
Data Acquisition & Trigger Scheme
DAQIntermed.
DAQDAQDigitizationPreperationSignal
TriggerFast Level
-1 -3Level
Detector Front EndOutput
Buffer &Top Level
Mike Capell / May ‘07 AMS-02 Electronics 4
NASA AMS Electrical Interfaces on ISSPower:
109-124VDC2KW max
LRDL1553B Bus1 Kbit/s in 10 Kbit/s out10 B/sec CHD
HRDLTaxi F/O
<2Mbit/s>orbitxRDL: Duty cycle ~50-70%
Ensure AMS side of interfaces conform to NASA requirements
& C
omm
and
Mon
itorin
g
Eve
ntD
ata
Earth
TDRS
LRD
LH
RD
L
UMAEVA
International Space Station
M&C
Pow
er
Subsystems
Power & Thermal
DAQ & TriggerMonitor & Control
ElectricalInterfaces
AMS
POCC
Mike Capell / May ‘07 AMS-02 Electronics 5
Electronics Designed for Low Earth OrbitChallenges:Static loads: 40+10+10gVibration: 6.8g rmsDepressurization: 1 to 0 atmosphere in 2 min.0 g & Vacuum: No convection, outgassing (evaporation)Operational Range: -20 to +50 C operationalIonizing Radiation: ~ 1 Krad/yearHeavy Ions (SEE): latch ups, bit flipsAtomic O, Solar UV: Etching & AgingMM/OD(Space Junk): ImpactElectromag. Compat: with ISS, within AMSAMS Magnetic Field: several hundred GaussNO ACCESS: 3+ years
Mike Capell / May ‘07 AMS-02 Electronics 6
Electronics Designed for Low Earth OrbitChallenges: Solutions:Static loads: Mechanical DesignVibration: Mechanical DesignDepressurization: Mechanical Design0 g & Vacuum: Materials, Thermal ManagementOperational Range: Components, Thermal ManagementIonizing Radiation: Component SelectionHeavy Ions (SEE): Comp Sel, Beam Tests, ProtectionAtomic O, Solar UV: MaterialsMM/OD(Space Junk): Mechanical DesignElectromag. Compat: Shielding, GroundingAMS Magnetic Field: Selection & TestNO ACCESS: Redundancy, Reliability,
TEST, TEST, TESTProcess validated with AMS-01 electronics
Mike Capell / May ‘07 AMS-02 Electronics 7
AMS-01 Electronics: Qualification
Mike Capell / May‘07 AMS-02 Electronics 8
AMS-01 Electronics: Typical board
Mike Capell / May ‘07 AMS-02 Electronics 9
Process to transform electronics from High Energy Physics for use in Low Earth Orbit
PrototypePrototypePrototype
EM
QM1
QM2
FM, FS (==QM2)
functional
+ Vibration, Thermal
+ Thermal-Vacuum,
EMC, Prod.
All (min level)
Models TestingComponents Performance, Beam Test
Mike Capell / May ‘07 AMS-02 Electronics 10
GSI Heavy Ion Beam Test Setup: Main Computer components
CPC 700 Bridge
PPC 750 CPU
Ion BeamDirection
GSI Heavy Ion Accelerator
Mike Capell / May ‘07 AMS-02 Electronics 11
Reliability Thermal requirements (-40 to +85 C) testSpace use heritage, fabrication process technologySingle lot procurement & ScreeningTotal dose (600 Rad/year) testSingle Event Effects – Latch-ups & Upsets: test
Design modified for some components for: retestLatch-up & Bit flip protection.
AMS-02 Electronics Component Selection
Date Location Ions LETMeV/mg/cm2
Test/Pass
Nov’00 GSI, Darmstadt Xe, Au, U 6-59 21 / 11 Nov’01 GSI, Darmstadt Kr, Au 3-40 19 / 18Dec’01 GSI, Darmstadt U 19-30 7 / 4May’02 GSI, Darmstadt U 16 - 59 33 / 29Feb’03 LNS, Catania Kr 27 - 39 6 / 5May’05 GSI, Darmstadt Au 12 - 33 37 / 32Sep’05 Indiana p 1 - 14 11 / 5
Mike Capell / May ‘07 AMS-02 Electronics 12
AMS Custom/Common Readout Unit
Cust/Comm power supplies w/high efficiency.Cust/Comm monitor & control interfaces.Cust/Comm processing unit, software, links.
DSP (ADSP-2187L), Gate Array (Actel A54SX-2A), SRAM (Samsung K6R-016V1C), Flash (AMD Am29LV004), LVDS Tx/Rx (TI SN65LVD-39-), etc.
M.Capell Jan 04GlobalPower 120V
Detector ADCMUX
DataReduction
(H)V Detect. Vdd(Digital)
Subd. Power
28 V
Digitization& HoldSample
DC-DC Converters(28 -> 5,3.3,+-2)
(High Efficiency) 28V Filter (I/O)
CustomASIC
LinReg
Vdd (Analog)
DSP
Memories
Gate
Slave M&C
GA
DSP
Mem
Trigger
LRS
AMSWireMAINDATA
HRDL
LRDL
2x CAN
Array
CDDC Command Distrib, Data Collect.
AmsW
Global DAQSubdetector DAQ
CDDC
AmsW
Gate BusySequence
Trigger Input
Comp
PartDigital
CDP: Common
Mike Capell / May ‘07 AMS-02 Electronics 13
Data Acquisition Tree(parallel, independent tree for trigger)
TrackerTOF&ACC
TRDTracker
Tracker
TOF&ACCTRD
Tracker
TrackerTOF&ACCTracker
TrackerTOF&ACCTracker
RICH
RICH
ECAL
ECAL
CDDCSDR
CDDCCDDC
CDDC
SDRCDDC
CDDC
CDDCSDR
CDDC
CDDCSDR
CDDC
CDDC
CDDC
CDDC
CDDC
JLV1
12
6 x 2
6 x 212
244 x 2
24
24
4 x 224
24
24
24
24
4 x 2
4 x 2
6 x 2
6 x 2
CDDC
2
2
2
2
2
24
JMDC
Lowest-LevelCDDC(JINF)
Top-LevelCDDC(JINJ)
MainDAQ
Computers
CDDC =
CommandDistributorand
DataConcentrator
JT Crate J Crate
JPD = Power Supplyfor J and JT
JINJJINJJINJJINJ
JLV1JLV1
JTBX
JINJJINJJINJJMDC
JHIF
JLIF
x4 redundant
10 MB/s serial links
Mike Capell / May ‘07 AMS-02 Electronics 14
JT-Crate Connects about ~ 200 signal cables.
Mike Capell / May ‘07 AMS-02 Electronics 15
Data Reduction (UDR2, TDR2) Boards
70 types of boards454 boards total
Where to put them ?
Mike Capell / May ‘07 AMS-02 Electronics 16
Electronics Mechanics– Crates & Boxes on Radiators 1. Keep heat away from Magnet2. Temp range of
electronics >> detectors3. Shortest path to radiators
Mike Capell / May‘07 AMS-02 Electronics 17
Ram Radiator (~4m2) Electronics ~ 750W“xPD”
“x-Crate”
28VDC to LV
readout &monitoring
Each type of box optimized for weight vs. thermal vs. structural performance.
Design and test supported by NSPO, Taiwan x=E,J,S,T,TT,U,UG,…
Mike Capell / May ‘07 AMS-02 Electronics 18
Electronics Production & Quality Assurance
• Designed by Academia Sinica, CSIST & MITAdapted for particular subdetectors by Aachen,
Geneva, Perugia, Bologna, Madrid, Annecy, Pisa, …
• Most electronics produced at CSIST:High Reliability (Mil Spec) infrastructure,Qualification: Vibration, Thermal, EMC on siteTeam of 25 engineers and 40 techniciansQuality assured by NASA & AMS team reviews every
3 months.
• Testing & Qualification by board designers
Mike Capell / May ‘07 AMS-02 Electronics 19
Recent Board Tests at CSIST
Jesus & Antonio test DC-DC(July)
Lucio testing TBS & TPSFE (July)
Sylvie & Nadia testing EIB (July)
Daniel testing TDR2 (June)
Sandor testing DCDC with Wang & Liu(June)
Mike Capell / Jan ‘07 AMS-02 Electronics 20
Thermal Stress Screening
Mike Capell / Jan ‘04 AMS-02 Electronics 21
J-Crate Scheme & test setup4* Main Computer + Interfaces
J-Crate
CompactPCI Bus Backplane
AMS Specific Backplane (ASB) Signals and Power
JSBCLocal Bus
SDRAM Flash PROM
PPC 750 CPC 700
PCI Agent
DPRAM
Registers
JIM-CAN
PCI Agent
DPRAM
Registers
JIM-AMSW&15
53
PCI Agent
DPRAM
Registers
JIM-HRDL/422
JBU
FPGA
JHIF
x4JLIF
JPD USC M
AMSWx4
CANx2
Front Panel ConnectorsHRDL
x2RS422
x21553
x2Power
x1
CANx2
CDDCCDDCCDDCCDDCx4
EVA PanelROEU Panel
Mike Capell / Jan ‘04 AMS-02 Electronics 22
J-Crate in Thermal Chamber
Thermal Qualification Operating: -15, +60CNon-Oper: -40, +90
Mike Capell / Jan ‘04 AMS-02 Electronics 23
J-Crate inside EMI Chamber
Mike Capell / May ‘07 AMS-02 Electronics 24
J-Crate in Thermal Vacuum Tests
Thermal Balance Phase
Pump Down
Chamber Environments: Pressure≦ 1.0x10-5 mbar
Return To Ambient
Ambient
Hotnon-operation
(+85oC)
Temperature(Proto-flightTest Level)
Thermal Cycling Phase
HotOperation(+55oC)
Coldnon-operation
(-45oC)
ColdOperation
(-25oC)
A B C D E F G H I J K L M
2 hrsHot soak
Hot Balance
Cold Balance
Transient Cool-Down
1 hr
1 hr 1 hr
1 hr
1 hr
Operation (on)
Non-operation (off)1 hr 1
hr Turn offTurn on
2 hrsHot soak
2 hrscold soak
2 hrscold soak
N O P Q
Thermal Balance Phase
Pump Down
Chamber Environments: Pressure≦ 1.0x10-5 mbar
Return To Ambient
Ambient
Hotnon-operation
(+85oC)
Temperature(Proto-flightTest Level)
Thermal Cycling Phase
HotOperation(+55oC)
Coldnon-operation
(-45oC)
ColdOperation
(-25oC)
A B C D E F G H I J K L M
2 hrsHot soak
Hot Balance
Cold Balance
Transient Cool-Down
1 hr
1 hr 1 hr
1 hr
1 hr
Operation (on)
Non-operation (off)1 hr 1
hr Turn offTurn on
2 hrsHot soak
2 hrscold soak
2 hrscold soak
N O P Q
Mike Capell / May ‘07 AMS-02 Electronics 25
NASA AMS Electrical Interfaces on ISSPower:
109-124VDC2KW max
LRDL1553B Bus1 Kbit/s in 10 Kbit/s out10 B/sec CHD
HRDLTaxi F/O
<2Mbit/s>orbitxRDL: Duty cycle ~50-70%
Ensure AMS side of interfaces conform to NASA requirements
& C
omm
and
Mon
itorin
g
Eve
ntD
ata
Earth
TDRS
LRD
LH
RD
L
UMAEVA
International Space Station
M&C
Pow
er
Subsystems
Power & Thermal
DAQ & TriggerMonitor & Control
ElectricalInterfaces
AMS
POCC
Mike Capell / May ‘07 AMS-02 Electronics 26
AMS-02 HRDL InterfaceISS is Zero Fault Tolerant for Payloads
UMA
B/HEVA
Tx F/O Rx Tx F/O Rx
RS422Cu
CuRS422
to ISS/APS
AMS Data Acquisition
EVA Cross strap
Tx RS422 4x1 MUXAux. 4x1 MUXPrim. 4x1 MUX
STS/KUSP, T0
PEDS
TAXICu
F/OTAXI
JMDC 0 JMDC 1 JMDC 2 JMDC 3
ROEU
Mike Capell / May ‘07 AMS-02 Electronics 27
Practicing EVA cable swap at in Neutral Buoyancy Lab
Mike Capell / May ‘07 AMS-02 Electronics 28
Ku
Ku
~70% D.C.
To POCC
To POCC
"DISKS"
"DISKS"
BUFFER
DAQ
"DISKS"
WSGC
MSFC
TDRS
STATUS
Express Rack
CMDS(AMS)STATUSCMDS(AMS)
CMDS(NASA)
"DISKS""DISKS""DISKS"
46 Mbit/s
but only 4 outputs to HCOR)APSHCORHRFMHRMISPR
High Rate Frame MultiplexerHigh Rate Modem
NASAHighrate Com. Outage Recorder
International Standard Payload Rack (Containing Express Rack)
Automated Payload Switch (1 of 2, each 20 programable interconnects,
POCC
AMSACOPPOCC
Alpha Magnetic Spectrometer Payload
Payload Operations Control Center
High Rate Fiber Optic Line(0, 0.5 to 100 Mbit/sec on Cmd)
AMS Crew Operations Post (in Express Rack Drawer)
M.Capell/Oct 00
UMA
MRD
L Up
grad
e ?
Crew Inter
face
AMS
ISPR
ACOP
AMS HIGH RATE DATA FLOW
HCORAPSAMSHRFM/HRM
High Rate Data Link Data Flow
Ku
Ku
~70% D.C.
To POCC
To POCC
"DISKS"
"DISKS"
BUFFER
DAQ
"DISKS"
WSGC
MSFC
TDRS
STATUS
Express Rack
CMDS(AMS)STATUSCMDS(AMS)
CMDS(NASA)
"DISKS""DISKS""DISKS"
46 Mbit/s
but only 4 outputs to HCOR)APSHCORHRFMHRMISPR
High Rate Frame MultiplexerHigh Rate Modem
NASAHighrate Com. Outage Recorder
International Standard Payload Rack (Containing Express Rack)
Automated Payload Switch (1 of 2, each 20 programable interconnects,
POCC
AMSACOPPOCC
Alpha Magnetic Spectrometer Payload
Payload Operations Control Center
High Rate Fiber Optic Line(0, 0.5 to 100 Mbit/sec on Cmd)
AMS Crew Operations Post (in Express Rack Drawer)
M.Capell/Oct 00
UMA
MRD
L Up
grad
e ?
Crew Inter
face
AMS
ISPR
ACOP
AMS HIGH RATE DATA FLOW
HCORAPSAMSHRFM/HRM
Ku
Ku
~70% D.C.
To POCC
To POCC
"DISKS"
"DISKS"
BUFFER
DAQ
"DISKS"
WSGC
MSFC
TDRS
STATUS
Express Rack
CMDS(AMS)STATUSCMDS(AMS)
CMDS(NASA)
"DISKS""DISKS""DISKS"
46 Mbit/s
but only 4 outputs to HCOR)APSHCORHRFMHRMISPR
High Rate Frame MultiplexerHigh Rate Modem
NASAHighrate Com. Outage Recorder
International Standard Payload Rack (Containing Express Rack)
Automated Payload Switch (1 of 2, each 20 programable interconnects,
POCC
AMSACOPPOCC
Alpha Magnetic Spectrometer Payload
Payload Operations Control Center
High Rate Fiber Optic Line(0, 0.5 to 100 Mbit/sec on Cmd)
AMS Crew Operations Post (in Express Rack Drawer)
M.Capell/Oct 00
UMA
MRD
L Up
grad
e ?
Crew Inter
face
AMS
ISPR
ACOP
AMS HIGH RATE DATA FLOW
HCORAPSAMSHRFM/HRM
Mike Capell / Jan ‘07 AMS-02 Electronics 29
PIT: Preliminary Interface Test - JSC - Jun 2003
Mike Capell / Jan ‘07 AMS-02 Electronics 30
Mike Capell / Jan ‘07 AMS-02 Electronics 31
ISIL Testing – July ’05 at JSC
Mike Capell / Jan ‘07 AMS-02 Electronics 32
AMS-02 Magnet & CryogenicsElectronics
Vacuum vessel
TMPs ΔT = 0.01K
4 types of Valves
Many sensors Passive Phase
SeparatorΔT = 0.001KSFHe tank
Mike Capell / May ‘07 AMS-02 Electronics 33
M.CapellApr 04
SwitchesPower
Cryo
cool
er
Cryo
cool
er
Cryo
cool
er
Cryo
cool
er
Valves,Heaters,Sensors
Valves,Heaters,Sensors
dV
CryomagnetAvionics Box
Quen
ch H
eate
rs (2
* >77
J)
Ctrl
SC C
oils
(48
H)
CAB
CCSC
QuenchSensors
Self Protection
CCS Current Source Cryomagnet
Control & SignalConditioning
1500 W
CSP
1875W Peak
2x CANCCEB
Powe
r Dis
tribu
tion
Syst
emDump Diodes
CDD-P, -S
Pers
iste
nt S
witc
h
AMS-02 CRYOMAGNET AVIONICS
UPSx2
>21V
Busbar
disconnectMechanical
FEED A"120" VDC
100+0 W nominal
x4
Dual 28 VDC Feeds
M&C Link
Feed A or B 120VDC 460W
I to 459.5 A
B
"120"-LV DC-DC
JMDC
(12) 3-Majority Sense
(2) 150 ms pulse(50) V,T,P Readings(10) 15 to 25 VDC
(15) 15 to 25 VDC(70) V,T,P Readings
5.5KV Isolation Barrier
5.5KV Iso.
PrecisionShunt
28Ah
DOWNRAMPAUTO
Detect,Quench
DC-AC
BMS
Protect
DC-DC
targetI
V < 10 V
P < 1875W
t < 2 hr
I < 459.5A
M.CapellApr 04
SwitchesPower
Cryo
cool
er
Cryo
cool
er
Cryo
cool
er
Cryo
cool
er
Valves,Heaters,Sensors
Valves,Heaters,Sensors
dV
CryomagnetAvionics Box
Quen
ch H
eate
rs (2
* >77
J)
Ctrl
SC C
oils
(48
H)
CAB
CCSC
QuenchSensors
Self Protection
CCS Current Source Cryomagnet
Control & SignalConditioning
1500 W
CSP
1875W Peak
2x CANCCEB
Powe
r Dis
tribu
tion
Syst
em
Dump DiodesCDD-P, -S
Pers
iste
nt S
witc
h
AMS-02 CRYOMAGNET AVIONICS
UPSx2
>21V
Busbar
disconnectMechanical
FEED A"120" VDC
100+0 W nominal
x4
Dual 28 VDC Feeds
M&C Link
Feed A or B 120VDC 460W
I to 459.5 A
B
"120"-LV DC-DC
JMDC
(12) 3-Majority Sense
(2) 150 ms pulse(50) V,T,P Readings(10) 15 to 25 VDC
(15) 15 to 25 VDC(70) V,T,P Readings
5.5KV Isolation Barrier
5.5KV Iso.
PrecisionShunt
28Ah
DOWNRAMPAUTO
Detect,Quench
DC-AC
BMS
Protect
DC-DC
targetI
V < 10 V
P < 1875W
t < 2 hr
I < 459.5A
2100W peak
Mike Capell / May ‘07 AMS-02 Electronics 34
Cryomagnet Current Source under test (460A)
TRD TEMP SENSORS
TRACKER TEMP SENSORS
CRYOCOOLER TEMP SENSORS
GLOBAL TEMPSENSOR NET
S-Crate1LV
SPD1 S1-P,S2-R
SHV1 HV
R
N
ACC-RULRDL
HRDL RS422
ISS STS1553
N
RUG-Crate
LV
UGPDManif.
UGB-S, -C
RICH
W,S
ECAL
W,P
LV
LV
E-Crate0
RICH Elec
N
R
ERPD
0
HV
HV
HV
HV
HV
RHV0.1RHV0.0
EHV0.0EHV0.1EHV0.2
LVS-Crate2LV
SPD2 S3-P,S4-W
SHV2 HV
R
N
ACC-WD
LV
TPD4 T-Crate4 TrackerW,P,D
LV
TPD1 T-Crate1 TrackerW,S,U
S-Crate0LV
SPD0 S1-W,S2-SACC-WU
SHV0 HV
R
NLV
TPD5 T-Crate5 TrackerW,S,D
LV
TPD2 T-Crate2 TrackerR,S,U
S-Crate3LV
SPD3 S3-S,S4-RACC-RD
SHV3 HV
R
N
DISTRIBUTIONSYSTEM (PDS)
POWER
LV
UPD1 U-Crate1
TRDRam
LV
UPD0 U-Crate0
TRDWake
1A
5 AI
20A
20A
20A
20A
120V-28V
DC-DCV 5 A
10 A
5 A5 A5 A
5 A
10 A
5 A5 A5 A5 A5 A5 A5 A120V-28V
DC-DCV
I
5 A
10 A
5 A5 A5 A5 A5 A5 A5 A120V-28V
DC-DCV
10 A
5 A5 A5 A5 A5 A5 A5 A120V-28V
DC-DCV
5 A
RAMSTARJ112
WAKEPORT
J111
RAMPORT
J113
T
CCS (CAB) CCEB(4*Cryocooler)
TT
TT
Main Rad. Wake+CAB
LV
TPD6 T-Crate6 TrackerR,S,D
TTT T
Main Rad. Ram - Set#1
TTT T
2x Cryocooler Starb.
TTT T
2x Cryocooler Port
TTCB-P TTCB-S
LV
TPD0 T-Crate0 TrackerW,P,U
N
RM-Crate
LV
MPD AST, GPSLAS
TT
TT
2E-Crates+10HVs
TT
TT
ECAL
WAKEJ103
Tracker Rad. Wake
Zenith WS
Zenith WP
Tracker Rad. Ram
V,I
TT
TT
RICH+Lower TOF
N
R
TT
JT-Crate
J-CrateJPDLV
CAN (A,B)
R
NTT-Crate
5A3A3A
3A
3A3A3A
3A3A
3A7.5A
I10A
Zenith RS
Zenith RP
Baseline"Parallel-32"
M.Capell / K.S.Kim 07 Dec 05
J120
T
20A
20A
20A
I5 A
10 A
5 A
5 A5 A5 A5 A5 A
10 A
5 A5 A5 A5 A5 A5 A5 A
10 A
5 A5 A5 A5 A5 A5 A5 A
120V-28V
DC-DCV
120V-28V
DC-DCV
10 A
5 A5 A5 A5 A5 A5 A5 A120V-28V
DC-DCV
120V-28V
DC-DCV
20A
RAMSTARJ212
WAKEPORT
J211
WAKESTARJ110
J213 RAMPORT
J220
5A
3A3A
7.5A3A
3A3A
3A3A3A3A
I10A
120V Out
WAKEJ203
RAMJ204
J202
LV
TPD3 T-Crate3 TrackerR,P,U
RICH
R,P
ECAL
R,S
LV
LV
E-Crate1
RICH Elec
ERPD
1
HV
HV
HV
HV
HV
RHV1.1RHV1.0
EHV1.0EHV1.1EHV1.2
LV
R
N
T
EMI
TT
TT
UG
T96W
T96W
T19.2W+75.8WLocal Heaters
T
T
T
J201
T
EMI V,I
T
T
T
T
T
T
Local Heaters19.2W+75.8W
96W
96W
J200
120V Input Section
T0(pad)
IFP
A
(flight)APCU
120V-LV
(A+B)MonitorControl+Nominal
CAN BUSInterface
(A+B)MonitorControl+Redund.
120V-LV
CAN BUSInterface
PVGF
Pri.
Sec.
EBCS
P9
P12
TTT T
Main Rad. Ram - Set#2
RAMJ104
J100
J101
EVA
UMA
P121
P122
Rad
USS
(bonding)
PAS
J102
20 A
A-Side
WAKE Side
RAM Side
Port
Starb.
Port
Starb.
ISS
ARM
ISS
BA
TSPD3
TSPD6
TSPD4
TSPD1
TMPD2
PT1000, DallasTemp Sensor
(OOR, COR)Thermostats
Default Active1A Fuse
Switch, status
Current Telemetry5A Circuit Breaker,
TelemetryVoltage, Current
V,I
28V Output
120V Out
WAKE Side
120V Input Section
B-Side
28V Output
LV
TPD7 T-Crate7 TrackerR,P,D
STS
ROEU
CABN
R
STARWAKEJ210
DTS DTS DTS
DTS
DTSDTS DTSDTS
DTS
DTS
DTS
DTS
DTS
DTS
DTS
DTS DTS DTS
DTS
DTSDTSDTS
DTSDTSDTS
DTS DTS DTS
DTS
DTSDTSDTS
DTSDTSDTS
DTS DTS DTS
DTS
DTSDTS
DTS
DTSDTS
DTS
P TS
DTS
J R
S1 RER0 RU0
T5
T0T4ER0 N
UG R
ER1 NT2
S3 NM NU1S2 NCAB R
T6
T3
TT R
J NS1 NUG NS0 RT1
T7
M RS3 R
S2 RCAB N
ER1 R
S0 N
TT N
DTS DTS
DTSDTSDTS
DTS
DTS
DTS
DTS
DTS
P TSDTS P TS DTS
DTSDTSDTS
DTSDTS DTS
P TS
P TS
P TS
P TS
DTS
DTS
DTS
DTS
DTS
DTS
DTS
DTS
P TS
P TS
DTS
J R
S1 RER0 RU0
T5
T0T4ER0 N
UG R
ER1 NT2
S3 NM NU1S2 NCAB R
T6
T3
TT R
J NS1 NUG NS0 RT1
T7
M RS3 R
S2 RCAB N
ER1 R
S0 N
TT N
DTSDTSDTS
DTS
DTS
DTS
DTS
DTS
DTS
DTS
DTSDTSDTS
DTS
AMS-02: Power System (PDS) for ISS+SSRMS+STS
Mike Capell / May ‘07 AMS-02 Electronics 36
AMS ElectronicsAdapted particle physics capabilities to
work in low Earth orbit.
Key stepsComponent selection & beam testing,Thermo-mechanical design,Quality assurance & Hi-rel processing, High Power (PDS), High Current(CAB) units produced by “space rated firms”, Continuous oversight/interaction with NASA/(Lockheed/LM/JS/Jacobs).
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