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Flexible Hybrid Sensor Integration: Combining Sensors with Flexible Electronics
Sensor Technology and Systems Integration for Human Performance & Health Devices Workshop
October 17, 2014 Northeastern University
©2014 American Semiconductor, Inc. All rights reserved.
Printed & Silicon: Strengths and Weaknesses
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Flexible Development Has Focused on Printed Technology
Printed is great for displays and sensors!
However…
Printed transistors are too big for ICs Printed transistor dimensions are measured in microns; semiconductors are measured in nanometers
Printed transistors are not dense Dense printed transistors are measured in tens or hundreds; ICs are measured in millions
Printed transistors are not fast
Printed transistors are not low power
Traditional Semiconductors Are Not Compatible with Printed/Flexible
ICs are great for processors, memory, and SoCs
However…
Packaged ICs are relatively large ICs are thick and too big for flexible systems
Packaged ICs do not bend or conform ICs are not designed for flexible electrical or mechanical connections
ICs are not flexible Silicon IC die are fragile and not physically flexible
ICs are not suitable for large areas The cost per area of silicon is high
©2014 American Semiconductor, Inc. All rights reserved.
Physical Sensor
Display
Bio Sensor
Comm
ADC µCtrl
Data Bus or Wireless
Flexible Hybrid Systems Span Multiple Markets
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Flexible Hybrid System “Combination of flexible printed materials and
flexible silicon-based ICs to create a new class of flexible electronics.”
Printed Electronics Low Cost, R2R, Large
Format
Flexible FleX ICs High Performance, High Density
Automotive/Aerospace: − Conformal − Structural Integration − Sensors − Fly-by-Feel Smart Cards:
− SIM/PIV/CIV − Identity − Finance − Contacted − Contactless
Consumer: − Tablets − Phones − Wearable − TVs − Gaming − Toys
Bio Medical: − Body Worn − Monitoring − Health & Safety
Printed Electronics • Sensors & Displays • Low Cost • Large Format • Roll-To-Roll or Screen Print
FleX-ICs • Logic, Memory, Signal Processing,
Communications • Physically Flexible CMOS • High Performance • High Density • Compatible with Printed Electronics
©2014 American Semiconductor, Inc. All rights reserved.
LG Chem has curved batteries in production, ready for 'phones, watches and glasses' LG Chem, a leading battery manufacturer, is ready to unveil batteries that have not existed before. The types of LG Chem's future batteries can be categorized as the following. Stepped Battery, Curved Battery and Cable Battery.
Smartphone Makers Race to Build Flexible Screens Samsung Electronics Co. and LG Electronics Inc. released curved-screen smartphones within weeks of one another, raising one obvious question: why would anyone want curves on their phone? The answer, it turns out, doesn't seem to matter much to the two South Korean technology giants themselves, who see curved-screen phones as a steppingstone to the real prize: mobile and wearable devices with completely bendable screens...
LG confirms production of 'bendable and unbreakable' smartphone displays "The flexible display market is expected to grow quickly as this technology is expected to expand further into diverse applications including automotive displays, tablets and wearable devices.,“said Dr. Sang Deog Yeo, Executive Vice President and Chief Technology Officer of LG Display.
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The Ecosystem for Flexible Devices Exists Now!
©2014 American Semiconductor, Inc. All rights reserved.
FleXform™ Development Kit Market release scheduled Dec 2014
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FleXForm: Flexible development hardware – FleX-MCU on a flexible demo board – Standard connectors for interfacing to
PC and prototyping boards – Flexible, printed display and buttons – Voltage regulators – Serial EEPROM
FleXform: Software & Documentation
– C-compiler and assembler – Product specifications – User’s guide – Data sheet – Demonstration software
PRODUCTS are what our industry needs Products require concept demonstrations Capability is needed to enable product development FleXform is a kit platform for product developers
New Technology: FleXform
©2014 American Semiconductor, Inc. All rights reserved.
FleXform™ Development Kit
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User Printable
Sensor Region
User Flexible Display Region
FleX-MCU
7
Ribb
on C
able
ZIF
Conn
ecto
r
Connections to printed pads made by user or ASI. Software and Documentation
C-compiler & Assembler EEPROM Programming
User’s Guide & Specifications
User prints or applies flexible sensors and/or
displays.
54 mm
85 mm
50 mm
User makes connections to from user device to existing printed pads.
FleX-MCU 5mm X 5mm
8-bit RISC CPU 8KB SRAM, 2KB ROM
UART, SPI, I2C 18 I/O – 2.5V CMOS
Prototyping Board PC interface
EEPROM for User Code
Voltage Regulators
FleX ADC
FleX-ADC 8-bits
8 input channels 100ksps
I2C comm to MCU
Support for this work has been provided by AFRL FA8650-14-C-5010
©2014 American Semiconductor, Inc. All rights reserved. 8
User are for IO intensive devices and flexible displays
User area for sensors and I2C devices
FleXform™ Development Kit
Support for this work has been provided by AFRL FA8650-14-C-5010
©2014 American Semiconductor, Inc. All rights reserved.
FHS (Flexible Hybrid System) Manufacturing Demonstration
9
The industry SOTA development for hybrid systems is focused on die attach and electrical interconnect for printed and conventional materials.
American Semiconductor & Soligie have successfully demonstrated a solution using anisotropic adhesive to mechanically adhere die to substrate as well as make electrical connections to printed substrate traces
Printed Substrate • Physical dimension: 6” x 0.85” • Material: PET • Thickness: 5mil (127um) • Traces: Silver nanoparticle ink • Dielectric overcoat (green) • ZIF Connectors
Die (Mechanical Test Die) • Replica of FleX-MCU • Physical dimension: 5mm x 5mm • Thickness/material: 2mil (51um) PET • Number of pads: 68 (17 per side) • Pad size: 200um x 200um • Pitch: 260um
Rainbow™ Hybrid Test Coupon (AS_MEC4001.FHS)
Support for this work has been provided by AFRL FA8650-14-C-5010
©2014 American Semiconductor, Inc. All rights reserved.
“Rainbow™” FHS Assembly
BOM: FleX test die FleX-MCU – flexible IC Flexible printed circuits Rainbow demonstrator
Rainbow Demonstrator: Development tool Fully flexible demonstration Electrical verification of
assembly methods Verification/demonstration of
MCU capability
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Rainbow demonstrator for Flexible Hybrid System (FHS) demonstration
of FleX-MCU™
Purpose: Assembly Technology Development (demonstrate FHS manufacturing)
©2014 American Semiconductor, Inc. All rights reserved.
FleX-RFIC™ Demonstration Proprietary Information 11
Product Overview • IP-X™ TTO protocol • Programmable via 2-wire I2C
interface • 860-960MHz (UHF) • 64-bit unique identification
(UID) including 16-bit CRC • 0.1m–10m read range • 64kpbs or 256kpbs • Anti-collision protocol
©2014 American Semiconductor, Inc. All rights reserved.
FleX-IC™ and FHS Product Roadmap
12
FleX-MCU™ 8-bit RISC, 1.2V core, 2.5V I/O, 8K SRAM, UART, I2C, SPI; Sampling 2014
FleX-MCU™ With FleX-ADC and FleX-NVM onboard
FleX-ADC™ 8-bit Analog-to-Digital Converter 100k samples/s, I2C, 2.5V; Sampling 2014
FleX-RFIC™ 860-960MHz (UHF) IP-X™ TTO RFID 64-bit UID, 0.1m–10m range, Sampling 2014
FleX-LNA™ Low Noise Amplifier
FleX-NVM™ Non-Volatile Memory
In Process In Development Planning
FleX-ASIC Custom IC
Chipset for flexible product demonstration
FleXform 1
FleXform 2
Flexible Hybrid System Development Kit FleX-MCU, FCB, User Sensor and Display Connectivity, Sampling 2014
Flexible Hybrid System Development Kit FleX-MCU, FleX-ADC, FleX-RFIC, FCB, User Sensor and Display Connectivity, Sampling 2014
2
3
4
5
6
©2014 American Semiconductor, Inc. All rights reserved.
FleX Operational Amplifier 13
Product Overview • 2.5V CMOS Operational Amplifier • TowerJazz 180nm SOI CMOS with FleX option • High impedance CMOS inputs • Internally compensated for unity gain stability • >60dB gain • Adjustable bias input FleX-OpAmp Physical Specifications • Die Size: 2.4mm X 2.4mm • Pin Count: 6 • Pad Openings 160um X 160um • Pad Pitch 300um • Thickness 24-60um • Flexible Yes • Conformal Yes • Mass ~0.23mg Suggested Applications • Basic amplification and filtering of flexible printed sensor signals • Comparator for threshold or button detection
+
-
Bias
In+ Out
In-
©2014 American Semiconductor, Inc. All rights reserved.
Flexible Electronic Products and Services
14
Corporate Headquarters – Boise, Idaho, USA Engineering – Design, Process, Modeling FleX™ Silicon-on-Polymer™ Mfg and Assembly Test & Characterization Cleanroom Sales, Marketing, Administration
Process Engineering Center – Santa Clara, CA
Manufacturing – pilot FleX operations
Small Business Privately Held Founded November, 2001
Product Lines FleX™ – IC, SoP, FHS (Flexible ICs) Custom Wafer Fabrication (TowerJazz & Cypress) IC Design Services – Conventional & Flexible
14
2007 Supplier of the Year
DoME 45nm CMOS
This work is sponsored by the Air Force Research Laboratory)
FleX™ CMOS
Rainbow™ CMOS
FHS
ASI is moving!
Thank You
American Semiconductor, Inc. 3100 South Vista Avenue, Suite 230
Boise, ID 83705 Tel: 208.336.2773 Fax: 208.336.2752
www.americansemi.com
© 2014 American Semiconductor, Inc. All rights reserved. American Semiconductor Inc., the American Semiconductor logo, Flexfet, FleX, and the Flexfet logo are trademarks of American Semiconductor, Inc. All other trademarks are the property of their respective owners.
RichChaney@AmericanSemi.com 208.336.2773
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