Power Choke PresentationMajor Applications for Power Choke UMPC / NBPC Cell Phone / PDA Graph Cards...

Power Choke Presentation

Shenzehn Maji Dianzi Youxiain Gongsi

Suzhou Somotil Elec-tech Co,Ltd

Outline

• Applications for Power Choke

• Principles of Inductors and Magnetic

Materials

• Characteristics Design

• Inductor Introduction

• MJC Power Choke

SMD Power Inductor

Dip Inductor

SMD Chip Inductor

Dip Bead Inductor

SMD Chip Bead

Dip Bead

Classifying

Major Applications for Power Choke

UMPC / NBPC

Cell Phone / PDA

Graph Cards

Server Systems

Lap Top

PS3

Desk Top / LCD Monitor POL

EMS

PC/IT Others Communications Consumer

Retail Market、Consumer Market

Brands、Traders

Supply Chain of IT

Up

stream

Middle

stream

Down

stream

Brands

Market

Raw materials

R&D Co,. Parts Modules Equipment Vendor

Mechanical Parts Passive Active

Electronic

Components

What is the Inductor?

• Coil stores energy with magnet field is called inductance, the coil as the

inductor.

• The symbol for inductance is L.

• The unit is Henry (H)

1mH = 10-3H

1μH = 10-6H

1 nH = 10-3μH = 10-6mH

• V = L ×（di/dt）

Ohm inductive theorem

V = L ×（di/dt）

V: Induced voltage

L=:inductance

di/dt: Current rates of change

Inductor Charge and Discharge

PWM (Pulse Width Modulation) Circuit

An integral part of PWM Circuit

(VRM ：Voltage Regulator Module)

• PWM IC (Controller)

• MOSFET

• Inductor (Choke)

• Capacitor

Electric Circuit of Power Supply

Circuit Classifying

Choke Application in Buck Circuit

In Buck Circuit (Vin > Vout):

△I=(Vin-Vout)/L*(Vout/Vin)/Frequency

△I: Ripple Current, L: Inductance

Copper Loss: I2 × Rdc

Core Loss:

Hmax

Bmax

Hmin

Bmin

Choke Application in Boost Circuit

In Boost Circuit (Vout > Vin):

△I=(Vout-Vin)/L*(Vin/Vout)/Frequency

△I: Ripple Current, L: Inductance

Core Loss:

Hmax

Bmax

Hmin

Bmin

Copper Loss: I2 × Rdc

* Example: Choke Selection for Heavy Load Application

(100 kHz, 12 Vin, 5 Vout)

Core Loss Dominated Copper Loss Dominated

Customer Selected

MJC Suggested

(100 kHz, 12 Vin, 5 Vout)

Core Loss Dominated Copper Loss Dominated

Customer Selected

MJC Suggested

* Example: Choke Selection for Heavy Load Application

Outline

• Applications for Power Choke

• Principles of Inductors and Magnetic

Materials

• Characteristics Design

• Inductor Introduction

• MJC Power Choke

磁性材料簡表

D.磁性材料

Ferrite

Mn-Zn : 優點: 導磁率高,低能量轉換損耗,飽和磁束密度高.

缺點:電阻值低,導磁率公差較大,熱敏感度高.

Ni-Zn : 優點: 電阻值高,價格低,容易加工…..

缺點: 飽和磁束密度低,熱敏感度高.

D.磁性材料

B-H curve introduction

Different density AC B-H curve T-core fabricated by 緯格

• 100 kHz AC B-H curve measurement by IWASU

• Test core ：6mm*3mm*1mm (OD/ID/H)

JMC JRM40LG B-H curve

0

50

100

150

200

250

300

350

400

450

500

0 500 1000 1500 2000

Hm (A/m)

Bm

(m

T)

100kHz

Outline

• Applications for Power Choke

• Principles of Inductors and Magnetic

Materials

• Characteristics Design

• Inductor Introduction

• MJC Power Choke

Simulation capability • B/H Field • Core-Loss • Inductance • Saturation Current

Function analyzer • LCR / DCR Meter • Efficiency system • Power loss system • Failure analysis

Material research • Magnetic powder • Insulated coating • Binder system

Coil • Coil winding • Pressing electrode

Inter connection • Laser welding • Spot welding • Soldering

MJC Power Choke Technology Platform

Packaging • Powder molded • Powder injected • Assembled

Small choke

0.29

2.12

0.31

0.5 1.33

2.64

0.398

0.1

0.9

Unit：mm

1.15

線徑

圈數

長度

DCR

R=ρ* L/A

ρ= 0.021992664 mΩ-mm

名詞參數

1.靜態電感值 L0 ( Inductance ) :

在無任何外加電流負載情況下的起始電感值,一般使用

LCR Meter測試.

B.名詞參數

2.測試頻率 f ( Frequency ) :

使用LCR Meter 測試時的頻率條件.其頻率輸出為一無

負載之正弦波訊號.

3.測試電壓 V ( Voltage ) :

使用LCR Meter 測試時的電壓條件.

Bpk = Vrms / 4.44ANf

環型線圈磁束密度計算公式

4.電感值公差 ( Inductance Tolerance ) :

標準電感值公差一般以英文字母表示如下表:

B.名詞參數

5.額定電流 Irms ( Rate Current ) :

泛指電感線圈通過電流負載時,因銅線阻抗所造成的溫昇達

到額定溫度時的電流值,決定銅線溫昇的主因為直流損耗及

高頻集膚效應.

Letter Tolerance Letter Tolerance

J ± 5% M ± 20%

K ± 10% N ± 30%

L ± 15%

W = I² x DCR

銅線損耗計算

B.名詞參數

6.飽和電流 Isat ( Saturation Current ) :

當電流上升而導致電感值下降的現象稱之為磁飽和,電感的

飽和電流會隨著製造廠的定義有所不同,常見為導致靜態電

感達到80%為標準.下圖為磁飽和示意:

B=Ø /A

B: 磁束密度

Ø: 磁力線數

A: 磁體截面積

H=NI / l

H: 磁場強度 N: 銅線圈數

I: 電流 l:平均磁路徑 L = μN²A/ l

7.銅線阻抗 DCR ( DC Resistance ) :

靜態測試時的銅線阻抗,可藉由DCR值的大小來判定電感的額

定電流值是否正確.

B.參數定義

8.導磁率 µ ( Permeability ) :

導磁率是以描述材料被磁化之難易程度,亦即導通磁力線之

能力.對相同材料而言,導磁率並非一個定常數,其與外加磁

場強度(H)及磁通密度(B)之比例有關。

9. AL值 :

由於使用透磁率換算電感值時需要冗長的計算程序，所以

供應商都會提供比較容易執行換算的AL值.

B.名詞參數

L = AL x Nx

AL公式應用(μ×Ae)

10. Core Loss :

磁性材料在磁電能量轉換當中,會有能量轉換的功率損耗,

通常耗功以熱能方式表現,可分類如下:

a.磁滯損耗 (低頻影響大)

b.渦流損耗 (高頻影響大)

c.剩餘損耗 (一般忽略不記)

Outline

• Applications for Power Choke

• Principles of Inductors and Magnetic

Materials

• Characteristics Design

• Inductor Introduction

• MJC Power Choke

電感分類

由於電感的形成乃是由導電體繞過磁性體後,形成一

環狀迴路稱之為線圈,而其形式更是複雜多變,大致上可以

依下列所示區分:

1.SMD 表面黏著式.

1.1積層式晶片電感: 常用於抑制電子迴路上的低

功率高頻雜訊.各式應用皆能發現其蹤跡.

QT,QTL SERIES QHL SERIES

C.電感分類

1.2 繞線式晶片電感:提供高電流特性的晶片電感.

常見應用實例如: LCD Monitor, DVD Recorder,

xDSL, Cable Modem, Mother Board, VGA Card,

Notebook PC…………..

CML SERIES

QPI SERIES

開放型磁路

開放型磁路

C.電感分類

1.3開磁路SMD功率電感:適用於各式DC/DC儲能

電感運用.

QPC SERIES

SPT SERIES

開放型磁路

開放型磁路

C.電感分類

1.4閉磁路SMD功率電感:適用於各式DC/DC儲能

電感運用.

QPCR SERIES

QPCRH SERIES

C.電感分類

封閉型磁路

封閉型磁路

2.DIP 插件式.

2.1色碼電感:

AL SERIES

DR SERIES

2.2 開磁路工字型電感

開放型磁路

開放型磁路

C.電感分類

DRR SERIES

2.2 閉磁路工字型(加磁套)電感

C.電感分類

2.3 開磁路棒型電感:

R SERIES

開放型磁路

封閉型磁路

M SERIES

2.4閉磁路環型電感:適用於各式大電流電源儲

能電感運用.

常見應用實例如:主機板、伺服器、電源供應

器、多功能事務機、直流轉換器 ……..

封閉型磁路

C.電感分類

Outline

• Applications for Power Choke

• Principles of Inductors and Magnetic

Materials

• Characteristics Design

• Inductor Introduction

• MJC Power Choke

Schematic diagram of the internal structure

winding

绕 线

Pressing

裁 切

welding

點銲

Molded/ Injected

粉末成型

Forming

電極成型

Tapping

包 装

Powder

造 粉

Electrodes Coil Powder

Function test

测 试

Power Choke Process Flow

P

r

o

c

e

s

s

P

r

o

d

u

c

t

Function

test/Tapping

Power Choke Process Flow

Winding Welding Pressing Molding Forming V/C

Stripping

copper wire

& winding

the wire as

a coil

Joint the

coil & lead

frame

together by

laser or

spot

welding

Cut off the

lead frame

as a single

piece of coil

by pressing

Inserting

the coil into

powder by

molding

Bending the

leads which

are out of

powder

body as

electrodes

To visual

check the

appearance

of all

products

Testing

inductance,

DCR, then

packaging

to a reel by

tapping

machine

Pressing 6~8 ton/cm2

Construction Forming

Insulated powder

Coil

Excellent power dissipation

Magnetic Technology in Power Choke

Strength:

- High saturated current

- Low eddy current

- High power density

Constraint:

- Low inductance

Process Technology: Molding

Major Competitor: Cyntec, Vishay-Dale,

Tokin, Panasonic, …

Applications: POL, VRM, DC/DC converter

MJC’s winding patent:

Start outside, end outside

- Approved: China

- In process: China, USA, Japan

MJC’s v.s. Vishay’s winding patents

Vishay’s winding patent:

Start inside, end outside

MJCC powder MJCB powder

SEM 3000x SEM 200x

Know How of Powder Materials

MJC owned Know How: 1. Material combination for performance requirements

2. Insulated coating technology

3. Binder system

Capability of Simulation:

B/H Field simulation

Core-loss simulation

Inductance simulation

Saturation current simulation

Choke Simulation Capability

1.Draft 3D Model

Software : Ansoft Maxwell

2. Measure Material Property

by IWATSU B-H/u Analyzer

3. Input Material Property

into Software

Magnetic Flux Simulation

Magnetic Flux Simulation

B Field of

Modeling Type

Power Choke

B Filed of

Assembly Type

Power Choke

Magnetic flux checked at 8 A

• Isat = 11.2 A

1.275 mm

2.465 mm

9.6 mm

3.62 mm

1 mm

方柱

Core-loss Simulation

Core-loss with 30 Amp.,

200 kHz AC input.

Saturation Current Simulation VS Experiment

The differences between experimental and simulated results

for 220 and 150 nH Power Choke are less than 5% !!

MJCB Power Choke Series

Size:

• 4x4x2 mm

5x5x3 mm

6x6x1.8/ 6x6x2.4/ 6x6x3/ 6x6x4/ 6x6x5 mm

10x10x3/ 10x10x4/ 10x10x4.5 mm

• 5~70A applications

• High permeability material • Low DC resistance

• Low temperature rise

Features:

MJCC Power Choke Series

Features:

Size:

• 6x6x3 mm

10x10x4 mm

13x13x3.5/ 13x13x5 mm

• 3.8~75A applications

• Low permeability • High saturation current

• Low inductance drop

Low Profile Molded Type Power

Choke Features:

Low Profile

High Current

Size:

• MJC: 4x4x2 mm, 6~45A

7x7x1.8mm, 6~45A

7x7x2.4mm, 10~70A

8x8x1.1m

• MJC: 5x5x3mm, 3.8~11A

Benchmark between Assembly and Molding Type

-

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0 10 20 30 40 50 60

DC Bias Current (A)

Ind

uc

tan

ce

(u

H)

0

20

40

60

80

100

120

Te

mp

era

ture

Ris

e (

K)

MJC1250T-R68

Matsushita 13x13x6 R60

Inductance Change & Temp. Rise

Introduction of Low Profile Injected

Chokes

For All Low Current, Compact

size Applications:

LCD Monitor/ Mobile Phone/ DV/

HDD/ PDA/ UMPC

Low profile Injected Power Choke

Features:

• Compact size

• Low current

• Low profile

• Applications: GPS, LCD panel,

Smart phone,

MP3 player application

Size:

3x3x0.8~2.0mm, 0.45~1.6A

4x4x0.8~2.0mm, 0.6~1.8A

Comparison of MJC Low Profile Chokes

Molding Type:

• Iron powder material

• Low inductance: 0.1~2.2μH

• Low profile: 1.1~2.4 mm

• Low DCR: < 52 mΩ

• High Current Applications: > 5 A

Benchmark : Vishay-Dale

Injection Type:

• Ferrite core material

• High inductance: 1.5 ~10μH

• Low profile: 0.8~ 2.0 mm

• Low DCR: < 500 mΩ

• Low Current Applications: < 1.9 A

Benchmark : TDK

Molding Type Choke 4x4x2.0 mm benchmark

MJC(MJC0402H) Vishay-Dale(IHLP1616BZ-11)

Inductance (uH)

DCR(mΩ) Isat(A) DCR(mΩ) Isat(A)

0.1 3.5 22 4.1 12

0.22 6 12.5 6.5 9

0.47 12.5 9.5 14.5 7

1.0 24 7 24 5

2.2 52 5 61 3.25

Injection Type Choke 4x4x1.2 mm benchmark

MJC（MJC0412B） TDK(VLF4012)

Inductance (uH)

DCR(mΩ) Isat(A) DCR(mΩ) Isat(A)

1.5 52 1.9 69 1.8

2.2 61 1.57 76 1.5

3.3 98 1.35 100 1.3

4.7 140 1.16 140 1.1

6.8 191 1.0 200 0.96

10 285 0.84 300 0.8

Reliability Test by Category

High temperature storage life

Low temperature storage life

High temperature resistance

Humidity resistance

Thermal shock

Vibration

Solderbility

Thanks for your attention.

End Mail:sales@szmaji.com