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_________________________________________________
RFP for
Fabrication, Assembly and Testing of
Tile Control Units (TCU)
__________________________________________________
This document contains proprietary information of SAC/ISRO, Ahmedabad and is protected by copyright laws and international treaties.
Unauthorized copy or reproduction of this document in whole or in part without the prior written consent of SAC/ISRO is strictly forbidden
and constitutes a copyright infringement.
SAC/ISRO reserves the right to alter this information at any time without notice.
© Copyright 2016, by SAC/ISRO, Ahmedabad
Contents
1.0 Introduction ............................................................................................................................ 4
1.1 General overview ................................................................................................................... 5
1.2 Scope of Work ........................................................................................................................ 6
1.2 SAC Responsibilities .............................................................................................................. 13
1.3 Vendor’s Responsibilities ..................................................................................................... 13
1.4 Deliverables by the vendor ................................................................................................... 16
1.6 Details to be provided with the proposal ................................................................................ 16
1.7 Inspection of Vendor’s Facilities by SAC Team ..................................................................... 18
1.8 Other Terms and Conditions / Important Guidelines ........................................................... 18
ANNEXURE A1: Product Assurance Requirements ............................................................................... 21
ANA1-1.0 Introduction .................................................................................................................. 21
ANA1-2.0 Applicable Documents .................................................................................................. 21
ANA1-3.0 Reliability .................................................................................................................. 21
ANA1-4.0 Environmental Specifications ....................................................................................... 22
ANA1-5.0 Parts .............................................................................................................................. 23
ANA1-6.0 Materials ....................................................................................................................... 27
ANA1-7.0 Storage of Hardware, Parts, & Materials ..................................................................... 28
ANA1-8.0 Processes ...................................................................................................................... 28
ANA1-8.1 Verification of Process Quality (VOPQ) ........................................................................ 29
ANA1-9.0 Process Identification Document (PID) ........................................................................ 29
ANA1-9.1 Fabrication Documentation .......................................................................................... 29
ANA1-9.1 Fabrication Sequence ................................................................................................... 29
ANA1-10.0 QUALITY CONTROL (QC) ................................................................................................. 30
ANA1-11.0 QA AUDIT .................................................................................................................. 30
ANA1-12.0 MARKING AND IDENTIFICATION .............................................................................. 31
ANA1-13.0 TRANSPORTATION .................................................................................................... 32
ANA1-14.0 TEST PROGRAMME ................................................................................................... 33
ANA1-14.2 TEST PLAN: ................................................................................................................ 34
ANA1-15.0 TESTS......................................................................................................................... 36
ANA1-16.2 MINOR NC: ..................................................................................................................... 46
Annexure A2 : Technical Details of TCU ............................................................................................... 55
AN A2.0 Introduction to Tile Control Unit . .................................................................................. 55
AN A2.1 Bill of Materials for TCU..................................................................................................... 55
AN A2.3 Power Supply Requirement of EPC of TCU module .......................................................... 57
AN A2.4 TCU Interface Signals ........................................................................................................ 57
AN A2.5 Typical test set for TCU ..................................................................................................... 60
Scope of Work and General Guidelines
1.0 Introduction
Indian Space Research Organization (ISRO) is currently engaged in the development of a number of
remote sensing satellites for various land and ocean applications. A number of digital electronic sub-
systems are under various stages of development for the payloads of these satellites. It has been
ISRO’s policy to involve Indian Industries for the production of existing proven designs and fabrication
technology as per project requirements and realize the space qualified systems, components and
hardware, indigenously.
For the Flight Model production, ISRO proposes to involve qualified vendors from the industry for
fabrication and testing of these sub-systems. The selected vendor will have to assume full
responsibility for the delivery of Flight Worthy modules after qualification, ready for integration with
the other units of the payload on a turn-key basis. In this context, the Indian Space Research
Organization requests the Indian industries having the capability and experience in the above field
with past heritage, to submit a detailed proposal for the Hi-Rel Space grade component procurement,
Fabrication, Assembly, Testing and Qualification of Hi-Rel Space Qualified Sub-systems.
This Request For Proposal (RFP) document provides the details of the work involved, delivery schedule
etc. apart from the relevant product assurance details. The details identified may undergo some
changes due to the on-going refinement of the requirements. The process and flow given in this
document are also indicative in nature and may undergo revision after the preliminary review with
the vendor.
It is very important for our evaluation of your offer that your proposal should include sufficient
technical details of the proposed approach. It should be clearly understood that these are on-board
systems for space usage, where highest quality and reliability are expected to be built in to the system.
For this purpose, the vendor shall follow all necessary guidelines for on-board fabrication practiced
by ISRO / MIL. The quality assurance requirements are provided in the annexure to this RFP and
further details will be provided at appropriate time during the execution of the contract. It shall be
the objective of the vendor to ensure the fabrication and delivery of reliable sub-systems / modules
for Space Application.
The terms supplier, vendor and Contractor have been used interchangeably throughout this
document and they all mean one and the same.
This RFP consists of:
1. General overview
2. Technical specifications
3. Scope of Work
4. Responsibilities of Vendor / SAC
5. Deliverables, Time Schedule
6. Terms & Conditions
7. Typical sequence of events & guidelines to vendors for submitting the offer.
8. Reliability & Quality Assurance requirements
1.1 General overview
The RISAT-1A antenna has a distributed hierarchically control system. Payload controller (PLC) is at
the first level followed by Tile control unit and then TR module controller (TRC). Tile Control Unit (TCU)
is at 2nd level of controller hierarchy of RISAT-1A, it gets inputs from PLC and generates serial
commands for TRC.
Major Specifications of the Tile Control Unit (TCU)
Reference Clock 3.90625MHz ( input )
Serial Interface with PLC Dual RS-485 serial interface with PLC
(10172 baud rate, 8 data bits, 1 stop bit, no parity)
EPC Clock 200 KHz Frequency and 10% duty cycle
PCPU On/ Off signals 100 ms pulse width
24 On and 24 OFF pulses generation in staggered way (without overlap)
Timing Signals for TRC RS422 Interface
PCB Details 380 mm X 75 mm X 2.4 mm , 10 layers
TCU Tray size 395mm X 80mmX 37mm
Weight ~600gms
The block diagram of Tile Control Unit (TCU) is as shown in the figure-1. A TCU package contains both
main and redundant TCU units. The main and redundant units have separate power supply (EPC) and
at any time only one of them is powered ON. The TCU contains custom ASIC, 32KB OTP PROM, RS-422
receivers, RS-422 transmitters, RS-485 Tran receivers etc. TCU receives input control signals over RS
422 interface. The serial data is through half duplex RS-485 interface. The ASIC in the TCU module
uses this serial data information along with the mode of operation, which are available as additional
inputs to do a Look up table search in the data which is stored as a part of code in the PROM. A
readout of the Look up table results in output of 96 words per TRC corresponding to that of Amplitude
and phase for both V and H polarization. The ASIC generates ON/OFF Pulsed signals to control power
supplies of each TRCs. TCU generates output control signals over RS 422 interface which are interfaced
to TRCs. The ASIC of TCU contains an 8051 micro-controller IP core operates at a maximum frequency
of about 4 Mhz. The clock signal for the TCU module is fed as an input from PLC.
1.2 Scope of Work
The sub-systems addressed in this RFP is Tile Control Unit (TCU). This unit is implemented using mostly
digital electronic circuits. This RFP is intended for carrying out the component procurement as per
SAC R & QA requirement listed in Annexure A1, Fabrication, Assembly and Testing / Qualification
Figure 2: Photo of final assembled FM TCU of RISAT-1
395mm X 80mm X 37mm
Figure 1: Block Diagram of TCU
including environmental testing of Tile Control Unit (TCU). The total work quantum described above
in the realization of the unit can be typically divided in following stages,
(A) Mechanical and Electronic Fabrication
(B) Procurement of parts and inspection
(C) Components mounting, assembly and packaging
(D) Functional Testing
(E) Data review by SAC
(F) Acceptance/Qualification level environmental testing
These fabrication activities are to be carried out by vendor as per SAC/ISRO qualified processes and
by SAC approved vendors, with quality control at each step, as per the SAC approved fabrication and
test documents.
Activities in detail are given as below,
A) Mechanical and Electronic Fabrication
SAC will supply PCBs and AutoCAD/Gerber/DXF files of all mechanical Housing.
Mechanical fabrication includes the following:
i) Fabrication of aluminum packages and cover plates.
ii) Black-anodization and Chromatization (Surface Treatment) of aluminum packages
as per ISRO requirements.
iii) Jigs and mounting accessories required for fabrication and testing
iv) Fabrication of Dummy companion package of TCU (i.e. EPC package) for vibration
testing.
Post-fabrication compatibility check is performed to ensure the mechanical compatibility of
package with PCB.
B) Procurement of parts and inspection
i) Procurement of Space grade electronic components as mentioned in Annexure- AN
A2.1
ii) Procurement of mechanical hardware, All components as per the requirements given
in this document
iii) Incoming inspection of parts and materials. Datapack and COC of received
components shall be provided for SAC review.
C) Component mounting, assembly and packaging
Mounting of all components including the components provided by SAC as Free-Issue
Material (FIM).
Following processes are involved,
i) Mounting of through hole components like connectors on PCB
ii) Mounting of discrete SMD components like chip capacitors, resistors, active devices
on PCB
iii) Lead forming, cutting, tinning and soldering of 256 pin CQFP OBC-ASIC.
iv) Dam and fill of 256 pin CQFP ASIC.
Fabrication sequence may be modified depending upon approved fabrication
processes
D) Functional Testing
Unit testing is carried out in following phases:
i) Assembling of TCU with FM EPC (Electronic Power Conditioner) supplied by SAC.
OR
Fabrication of dummy EPC package and assembling with TCU package (in case
of non-availability of FM-EPC units).
ii) Functional Testing using EPC (FM/QM/DVM) supplied by SAC
iii) Verification of performance of the sub-system over given temperature range.
E) Data Review by SAC
Data review for QM will be done as below,
i) All electrical measurement.
F) Acceptance/Qualification level environmental testing
1. Qualification Testing
The QM assembly will go through qualification level test. Qualification testing is a set of tests
carried out on one unit to qualify the fabrication with a given set of part process and material.
This also demonstrates the available performance margins of the unit under given operating
conditions. It includes various tests such as Burn-in, EMI/EMC/ESD tests, vibration/Shock test,
thermal vacuum test, Life test etc as per list and details included in annexure –A1, Tests
section of this RFP.
Acceptance test on FM units shall be started only after review & clearance of Qualification
tests results by SAC.
2. Acceptance Testing
Each FM unit shall go through acceptance level test. Acceptance testing is a set of tests carried
out on each unit to verify the workmanship and performance of the unit under given
operating conditions. It includes various tests such as Burn-in, EMI/EMC tests, vibration test
and thermal vacuum test etc as per list and details included in annexure –A1, Tests section of
this RFP.
The units are required to undergo the above tests successfully, meeting all the specifications, before
delivery to SAC.
Vendor should have capability in terms of fabrication facility, storage facility and test facility as well
as necessary technical expertise to build, optimize, test and deliver the high reliability product.
In order to perform the above mentioned tasks, the various activities to be performed by the vendor
are described in the following paragraphs. The basic flow of activity is given in Fig 3. The detailed
Process Flow is depicted in Figs 4 to 6. The Product Assurance requirements are given in Annexure A1
and Brief Description, Bill of Material and preliminary package details are given Annexure A2.
Tendering Process Leading to award of the
Contract to selected Vendor(s)
Initial Technical Deliberations Leading to a draft
Process Identification Doc for the job
Prototype Production Leading to 1. Finalization of PID 2. Complete Process Acquaintance for the Vendor(s) 3. Clearance for FM fabrication
Qualification Program Leading to Qualification of the Design and Process
FM Production Leading to Supply of Requisite Hardware for Payload Assembly / Integration
Figure. 3 The Basic Flow of Activity
VENDOR RESPONSIBILITIES (DEVELOPMENT PHASE)
Draft PID Generation
Draft PID Review
SAC RESPONSIBILITIES
First Batch Mechanical Housing
Fabrication
Incoming Inspection
(Visual)
Forming & Soldering of
PROM
Dam&Fill and Conformal Coating
Compatibility Checks with
Connectors mounted and
Temporary Assembly
Forming of Components As per ISRO Guidelines
Populating PCBs
Go / No-GoTesting @ Room Temperature
Proto Test
ProgrammeAsPer Annex.
1 and Documentation
Review of Processes and
Prototype Test Results
PID Finalization
Drawing
Finalization
Followed by
Subsequent
Fabrication
G1
Prototype Start
G2
Procurement of Required material
/Component including
consumables
PROM programming by
SAC & Return to Vendor
for Soldering
GCU & EPC
Figure. 4 Detailed Process Flow for the Job (Part-I)
Send unformed
PROMs to SAC for
programming
Placement Diagram and
related information if
any
Award of Contract
Initial Technical Inputs
and Requirements
SAC Participation in PID
Evaluation
Mechanical Package
drawings and
Fabrication Related
Information
Partial Components and
PCBs and Guidelines For
Storage And Handling
Details and Guidelines
for forming of
Components
QA Audit
Monitoring, Quality Audit, Online
Course Corrections; Components
and PCBs
VENDOR RESPONSIBILITIES (QUALIFICATION PHASE) SAC RESPONSIBILITIES
G1 G2
Start of Qualification Phase
Execution of the Qualification
Programme as per the finalized
PID and Test Details of Annexure
1
Review of the Results
Qualification Complete
Mechanical Enclosures Ready for at least the First Batch of FM Production, work in progress for further batches of production.
Fabrication of Mechanical
Housings for Qualification
phase
Figure. 5 Detailed Process Flow for the Job (Part 2)
Review of First Batch Results
Start of FM Production Phase
FM Production as per Details in
Annexure 1 and the finalized PID
Completion of Production Activity
Continued
Mechanical
Fabrication of
Housings for FM
Review of Overall LAT Results
Supply of All Deliverables
Lot Accept-ance Tests
1.2 SAC Responsibilities
The end user (SAC) will provide the following inputs to the Vendor, during different stages of the work
execution:
1. SAC will issue OBC-ASIC (Flight Model) component and flight model PCBs in required nos. for
use in these modules as “Free Issue Material” to the vendor against the Bank Guarantee.
Rest of the components from Bill of Material has to be procured by Vendor as per details given
in Annexure AN A2.1. Strict QA guideline as per Annexure A1 for procurement of components
has to be followed and screening results of these components has to be submitted to SAC for
review.
2. Approved Schematics and Component Placement diagram
3. Programming of OTP PROM.
4. Graphical User Interface (GUI) and Ground Check-out Units (GCUs) for testing of the TCUs will
be provided by SAC.
5. Providing DVM/QM/FM Electronic Power Conditioners (EPC) unit for integrated unit testing.
6. Approved Mechanical package fabrication drawings and list of accessories. Package
dimensions are given in Annexure A2.
7. The fabrication drawings of the companion unit of TCU (of similar to TCU dimensions but
mirrored) necessary for vibration testing will also be provided. The fabrication drawings of
the cover plate.
8. The specifications of the material, methodology, and qualification requirements for performing the “dam and fill” procedure for the CQFP devices.
1.3 Vendor’s Responsibilities
The Vendor will be responsible for carrying out the following activities and also for actions arising out
of non-conformances at various stages.
The major activities include:
1. Procurement of all electronic and mechanical fabrication materials including all the required
consumables (which need to be used for electronics & mechanical realization, and
environmental testing). All electronic components have to be procured by Vendor as
indicated in Annexure AN A2.1 Bill of Material; except OBC-ASIC and PCBs, which is free issue
material against Bank guarantee.
2. Incoming inspection of all components including electronic components, PCBs and fabrication
materials like solder, flux, epoxy etc. as detailed in Annexure A2. Apart from environmental
controls of temperature and humidity, the electronic storage area shall meet class 100,000
cleanliness requirements as a minimum and shall have all the ESD safety precautions
implemented. The work area shall meet the requirements of ISRO-PAX-300.
3. SAC QA approved Fabrication drawing of mechanical housing (trays) will be provided by SAC.
Fabrication of the mechanical housing shall be entrusted to a vendor only after obtaining prior
approval from SAC. For the TCU modules the choice of materials is Aluminum Alloy 6061 for
the enclosure and SS for the fasteners.
4. Surface treatment of the enclosure needs to implemented which includes Black-anodization
and Chromatization as per ISRO requirements. Incoming inspection and quality control of
these packages are also to be performed by qualified and experienced inspectors.
5. Forming of components (wherever necessary especially for the fine pitch 256 pins CQFP
devices) as per the land patterns on the PCB. The vendor should be in possession of the
necessary equipments, tools, jigs etc. The forming process also must have to be qualified.
6. Compatibility checks between the mechanical package and the PCB and mounting of
connectors on the package and soldering of the same.
7. Populating the PCBs with all the other devices as per the layout and placement diagrams
provided. The devices consist of fine pitch CQFP devices of 256 pins (0.5 mm pitch) as well as
flat pack / DIP devices. This activity has to be carried out at a fabrication facility qualified /
approved by ISRO for Flight Model fabrication work.
8. The power supplies to be used for testing during initial bench as well as environmental testing
have to be procured by the vendor. The details of the power supply requirements are given
in annexure A2.3. These supplies have to be very reliable with all in-built protections and
procured from only reputed manufacturers. Set of general purpose test equipment required
for testing of these digital sub-systems e.g. Logic Analyzer, Oscilloscopes, Pattern Generator
etc. are expected to be available with the vendor.
9. Before these packages are subjected to the environmental tests, it is necessary that the CQFP
devices are protected by the “dam and fill” procedure and the PCBs conformally coated. The
vendor should have trained and qualified manpower for performing this activity.
10. Assembly of PCBs in its housing ( “tray” )
11. Testing of the populated boards for compliance with the specifications as per details given.
12. Fabrication of the required handling fixtures, jigs etc. in adequate numbers necessary for
performing all the internal fabrication and environmental testing (e.g. vibration testing). The
fabrication drawings for these have to be generated by the vendor.
13. Fabrication of dummy mechanical package(s) as per the designs provided by SAC, for the
companion units of each TCU (i.e. Dummy EPC) and assembling it with the TCU.
14. Performing full environmental testing including vibration, thermovac, EMI/EMC etc. tests for
TCU. The sequence and the levels for each of these tests for all the phases are provided in
Annexure A1.
15. Generation of PIDs for the above activities as applicable as per ISRO guidelines and getting
approval by SAC Quality Assurance.
16. Fabrication of the containers for transporting these modules outside the vendor’s premises
any time in between or at the end of the contract.
17. Generation and supply of the test data in predefined format.
18. Generation of all the other deliverables identified in this RFP
Sr.
No.
Activity Responsibility Remarks
SAC Vendor
1)
Fabrication document ( SAC approved mechanical
drawings, components list, assembly details and
fabrication sequence)
2) Testing Procedures (To be prepared by Vendor and to be
reviewed and approved by SAC).
3) To get SAC QA approval of procurement of Space grade
electronic components
4)
Procurement of components as per Bill of Material
(Annexure –A2) and their incoming inspection & batch
acceptance tests / COC
5) OBC ASIC and PCB for TCU
6)
Mechanical Hardware Fabrication for TCU and its
companion Unit (i.e. dummy EPC) including all surface
treatments
7) OTP PROM Programming
8) Cutting forming for CQFP 256 pin ASIC, Dam and Fill
9) Electrical Hardware Fabrication and QC (Including DC
harness)
10) Assembly and packaging of TCU
11) R & QA audit at various stages
12) Calibrated Test Equipments & Facilities
13) Issuing Electronic Power Conditioner (FM/QM/DVM)
14) Ground Checkout Unit for testing TCU
15) Functional testing of TCU using GCU
16) Functional testing
17) RTV and araldite application
18) Rework and re-optimisation, if required at any stage
19) T&E
20) Documentation of test results & compliance chart
21) Shipment clearance
22) Delivery of Fabricated units to SAC in ESD safe container
1.4 Deliverables by the vendor
Units and Documentation to be supplied by Vendor for review and approval by SAC at appropriate
stage of execution:
1. Assembled, packaged and qualified units as per the order
2. Documentation as per Annexure- A1
3. All spare unconsumed components
4. Data pack of the all the procured components
1.5 Delivery Schedule
A tentative schedule is provided below :
Acceptance of Purchase Order by Vendor : T0
Finalization of draft PIDs : T0 + 4 months
FM production Phase : T0 + 4 months- T0 + 12
months
The vendor shall provide a detailed Development Plan along with his proposal. This plan should
give the detailed schedule, implementation plan, expected man power deployment, major
milestones etc. The delivery schedule shall be presented in a bar chart form showing sequence
and time of all important activities e.g. fabrication, testing etc. including reviews.
1.6 Details to be provided with the proposal
The prospective vendors should bring out full details of their technical competence for undertaking
project of this nature, in the technical part of their proposal document. A preferable format is
provided in the following table. The vendor is encouraged to provide any relevant additional
information.
Sr. No. DESCRIPTION DETAILS
1 Year Of Establishment
2 Vendor’s Area Of Core Competence / Activities
3 Infrastructure Details (Area, Facilities Etc.)
4 Annual Turnover in the last two financial years
5 Contribution of Hi-Rel fab / testing activity to the annual turnover of the
company Value of major orders currently being executed with client’s
name, Address etc.
6 Value of major orders currently being executed with client’s name,
Address etc.
7 Number Of Technical Manpower with breakup of Engineers,
Technicians, Tradesman etc.
8 Capability of Hi-Rel fabrication and testing in terms of no. of products
completed, manpower experience profile etc.
9 List of in house facilities with qualification Status (Clean room facilities
with area, relevant test equipments and environment test facilities etc.
…….)
10 Any tie-ups with relevant / specialized companies proposed for this
activity and list of their facilities with qualification Status
11 No. of Skilled and ISRO certified technicians for fabrication and
inspection of Hi-Rel assembly work and testing
12 expected man power deployment for this work (including number and
level of experience )
13 Quality Certification (ISO-9000 Etc.) and Internal QC procedures followed
14 Details Of Customer Base In India
15 Details of such major orders executed / currently in progress especially
for organizations like ISRO, DRDO, DAE etc. Sample reports with
customer’s / project details may be attached.
Vendor should submit their offer in two parts
Part1: “Detailed Technical Proposal” giving all details as per RFP.
Part2: “Commercial Details” giving cost, payment terms and other financial details in separate sealed envelope.
Technical proposal should also include all the details given in commercial proposal without prices (Prices should be masked).
The prospective vendors should provide the pricing information with the following break-up in the
price bid part of their proposal document.
Item Charges(in slabs) Remarks
TCU Component
procurement &
Fabrication Charges
TCU Testing charges
including all
environmental tests
Mechanical Housing
(Tray) Fabrication
Charges for TCU and
dummy companion
packages using Al alloy
and SS fasteners
As per
drawing
supplied by
SAC
The vendor should provide Quotation for One QM-TCU and FM TCU for a quantity slab 1-9, 10-14, 15 and above.
1.7 Inspection of Vendor’s Facilities by SAC Team
The vendor should allow inspection of their facilities by a SAC team, if found necessary, for an on the
spot assessment of their capabilities, prior to placement of order or at any later date during execution
of the contract. The vendor should be in a position to present and explain in detail sample products
manufactured earlier at his site to ascertain their capabilities.
1.8 Other Terms and Conditions / Important Guidelines
1. The Vendor is to examine the RFP thoroughly and offer point by point compliance for complete
RFP supported by technical documents. The quotation should be given in Indian rupees only
2. All vendors may be called for a pre-bid meeting / technical discussions and should be prepared to
attend the same at short notice. Vendors should make sure that competent technical personnel
attend the same.
3. Any deviations in any requirement in any of the item must be clearly mentioned along with the
offer
4. The vendor is required to clearly state in his proposal, all the assumptions made while finalizing
the proposal. If the vendor proposes to subcontract any part of the work to other Companies,
then the relevant details must be mentioned in the bid.
5. It is mandatory that the vendor should have their fabrication lines certified by ISRO and should
have prior experience of assembly, testing and qualification of Hi-Rel Digital subsytems.
Accordingly, vendor is required to submit the relevant documents along with their offer, without
which their offer shall not be considered. The criteria for the selection of vendor in terms of their
financial and technical capabilities are as below. a) Should be an Indian company with their design, fabrication and test facilities in India.
b) It is mandatory that the vendor’s PCB assembly lines as well as manpower should have ISRO’s certification, valid at time of bidding. Vendor is required to submit details of the available ISRO certified manpower with their total work experience for ISRO on-board projects.
c) Vendor is required to submit the complete details of contracts executed in last 5 years for the development of space qualified Digital products for on-board usage. Vendor should also provide the details like, customer reference, contact details, value of the contract as well as total time taken in executing each of such project/s from the date of award of the contract.
d) Vendor should have sufficient technical capabilities in terms of fabrication and handling test equipments. Vendor is required to provide the details of the available test equipments like, make, brief specifications, year of procurement, number of equipments, etc.
e) It is preferable that vendor should have all the test facilities required for the environmental testing of mentioned subsystems. Vendor is required to provide the details of the available test facilities like, number of equipments/chambers, capacity, etc. In case any of the facility is not available, please clearly mention the same and provide details of the outside facilities where the testing will be carried out. It is to be noted that SAC will not provide any of the test facilities for environmental testing. However, following special test facilities will be offered without any charge to vendor, executing this contract.
1. Mechanical Shock Test Facility
2. Outgassing Test facility for materials if required, as outlined in QA requirement Annexure ANA1.5.3.2 and ANA1-6.0
The availability of the above test facilities is subject to SAC internal work load. The responsibility of design and fabrication of required fixtures for mechanical shock test lies with Vendor.
f) Based on the details provided by the vendor, SAC will assess the capability of the vendor to take up this work. Decision of SAC will be final in this regard.
6. The vendor has to comply with the specified attached delivery schedule.
7. The vendor should provide schedule break-up in as much detail as possible.
8. The vendor is required to submit undertaking regarding Confidentiality / Non-Disclosure
Agreement (NDA) and Intellectual Property Rights (IPR). The TBD specifications, if any, will be
finalized before placing the order.
9. SAC reserves the right to review the progress of work at any time in addition to milestones
specified by the vendor.
10. The electrical and mechanical specifications mentioned in RFP are tentative and may change. Final
electrical and mechanical specifications shall be provided at the time of ordering. In case of any
modification to be incorporated during development it should be mutually discussed and agreed
upon before implementation.
11. On receiving the proper quotation and details from the vendor, SAC may hold detailed discussions
at SAC and negotiation also at SAC, if required.
ANNEXURE A1: Product Assurance Requirements
ANA1-1.0 Introduction
This document describes the Reliability and Quality Assurance requirements to be followed by Vendor
during fabrication, assembly and testing of ordered subsystems.
ANA1-2.0 Applicable Documents
Following reference documents are applicable during realization of the hardware.
ISRO-PAS-206
Issue-4, Nov 2012
Qualification requirements for Thick Film Hybrid Micro Circuits
ISRO-PAS-207 Storage, Handling and Transportation requirements for Electronic
Hardware
ISRO-PAX-300
Issue-5, Nov 2012
Workmanship Standards for the Fabrication of Electronic
Packages
ISRO-PAX-301
Issue-3, April 2013
Design Requirements for Printed circuit Board Layout
ISRO-PAX-303 Design requirement for Multi Layer Printed Circuit Board Layout and artwork
ISRO-PAS-502 Procurement Specifications for Austenitic stainless steel Bolts and Screws
MIL-STD-202G Test Method Standard Electronic and Electrical Component Parts
MIL-STD-461E Requirements for the control of Electromagnet Interference
Characteristics of Subsystems and Equipment
MIL-STD – 883 Test Method Standard for Microcircuits
ANA1-3.0 Reliability
The unit is designed by SAC, for space use with a minimum design life of 7 years.
ANA1.3.1 Life:
a) The unit shall meet all the fabrication requirements for use onboard spacecraft with a minimum
life of 7 years.
b) Additionally unit shall be capable of meeting all the functional requirements at various stages
of spacecraft assembly and storage as follows:
- 3 years storage and life at various levels of spacecraft assembly
- 5 years in controlled environmental conditions.
The vendor shall inform recommended method for storage and re-test criteria, in case of longer
storage.
ANA1.3.2 Operating condition for Active Components:
The electrical designs are made compliant to the SAC derating requirements for space payloads.
Material selection and packaging shall be such that junction/ channel temperatures of all solid-state
devices shall not exceed +110ºC under worst case environmental conditions.
ANA1-4.0 Environmental Specifications
ANA1.4.1 Non-Operating Environment:
The units shall be capable of withstanding following environmental conditions:
a) Temp. Range : - 30oC to +75oC
b) Pressure : Ambient and hard vacuum better than 10-5torr.
c) Relative Humidity : Max. 95% non condensing at +40oC
(Applicable for storage on ground only)
ANA1.4.2 Operating Environment:
The units shall meet all the performance requirements as given in electrical specifications under the
following environmental conditions:
a) Temp. Range:
i) FM : -10C to +60oC
ii) QM : -15oCto +65oC
b) Pressure: The unit shall be capable of operating and compliant to the specifications at ambient
pressure as well as vacuum level of 10-5torr and hard vacuum of the order of 10 -13torr.
Note: All temperatures are referred to the base plate. Temperature up to +75oC of base plate should
not affect the life, operation and performance of the unit.
ANA1.4.3 EMI / EMC:
Fabricated unit shall meet EMI / EMC requirements of MIL-STD-461E
ANA1.4.4 Space Radiation:
The units shall operate without any degradation in performance or life for the following radiation
environment:
a) 1.0 X 106Rads ionising dose absorbed in silicon (TID).
b) Parts shall be ELDRS free
c) 6.0 X l014 elec./cm2 (3 MeV bulk damage equivalent)
d) Immunity against SEL / SEU (Single Event Effect / Single Event Latch-Up/ Single Event Upset):
LET 80 MeV /mg/cm2
All the parts selected as per SAC supplied parts list for realizing the TCUs meets the radiation
environment requirements.
Localized shielding requirements shall be calculated and submitted for review and approval by
SAC.
ANA1.4.5 VIBRATION / SHOCK / ACCELERATION:
The units shall be designed and fabricated to meet the vibration (Sine and Random) and mechanical
shock requirements as per the test plan given in this exhibit.
ANA1-5.0 Parts
The parts and materials list consisting of following details (as a minimum) shall be submitted to SAC along with deliverables
Part / material name Quality level
Part / material number Name of manufacturer
Package style (applicable for parts) Qualification / approval status
ANA1.5.2 QUALIFICATION (QM) / FLIGHT MODEL (FM) PARTS QUALITY:
For QM/ FM the following criteria shall be applicable for procurement of parts:
Table-1: Parts Quality Level
Device Family Applicable specification and Quality Level of the parts
Microcircuit
Device &
Packaged
(Digital)
- Qualified to MIL-PRF-38535, Class R/V/S or ESCC 9000 Level B3.
The device shall meet;
TID requirements of 100 KRAD(Si) min.
Single Event LatchUp LET 80 Mev/mg/cm2 min.
Microcircuit
Device &
Packaged
( Linear)
- Qualified to MIL-PRF-38535, Class R/V/S or ESCC 9000 Level B3.
- The device shall meet TID requirements of 100 KRAD(Si) min.
- ELDRS Free part with QML R level is preferred.
Discrete
Semiconductor
Device &
Packaged
(Diode /
Transistor )
- Qualified to JANS quality level of applicable MIL-PRF-19500
specification OR Qualified to applicable ESCC specification, Level B3
- Equivalent to JANS quality level of applicable MIL-PRF-19500
specification OR as per applicable ESCC specification, with Lot
Validation Test (only when Device are not JANKC qualified).
- The Device shall be Radiation hardened to 100K Rad(Si).
- ELDRS Free part is preferred.
Discrete
Semiconductor
Device
(MOSFETs)
- Qualified to JANS quality level of applicable MIL-PRF-19500
specification OR Qualified to applicable ESCC specification, Level B3
- Equivalent to JANS quality level of applicable MIL-PRF-19500
specification OR as per applicable ESCC specification, Level.
- The Device shall be Radiation hardened to 100K Rad(Si) and SEE
immunity upto LET of 80 Mev/mg/cm2 min.
Chip Resistors
- Qualified to applicable MIL specification, ER Failure rate level ‘S’
OR Qualified to applicable ESCC specification, Level B3
- Qualified to applicable MIL specification, ER Failure rate level ‘R’
(only when no S failure rate level qualification)
- Manufactured, processed to and tested as per the applicable
MIL/ESCC/GSFC specification with screening & QCI inspections.
(only when neither S nor R failure rate level qualification).
Device Family Applicable specification and Quality Level of the parts
Chip Capacitors
- Qualified to applicable MIL specification, ER Failure rate level ‘S’
OR Qualified to applicable ESCC specification, Level B3
- Qualified to applicable MIL specification, ER Failure rate level ‘R’
(only when no S failure rate level qualification)
- Manufactured, processed to and tested as per the applicable
MIL/ESCC/GSFC specification with screening & QCI inspections.
(only when neither S nor R failure rate level qualification).
All 50 volt rated ceramic capacitors from MIL qualified line shall be
subjected to BMLT test as per MIL-PRF-123
Chip Capacitors
(Tantalum, Solid)
- Qualified to MIL-PRF-55365, Failure rate Weibull ‘C’ & surge
current test option C OR Qualified to applicable ESCC specification,
Level B3
Chip Inductors - Qualified to MIL-PRF-83446 OR Qualified to applicable ESCC
specification, Level B3
Multi-pin
Connectors
- Level-B of relevant ESSC specification
- NASA-GSFC approved.
Micro-D Multi-pin
connectors
- Qualified to MIL-DTL-83513
- NASA-GSFC requirements
- Qualified to ESCC 3401 level-B
Procurement specifications for components shall be generated by the vendor and submitted for
review & approval to SAC. Components shall be procured as per the requirements of SAC approved
procurement specifications. Also the components shall be procured with COC of the manufacturer
and necessary data pack.
Non-standard parts, wherever used, shall also have sufficient space flight history and the quality
level equivalent to the above mentioned parts. Wherever applicable, destructive physical analysis
(DPA) and verification of quality (VOQ) testing shall be carried out by the vendor to gain sufficient
confidence in the parts.
ANA1.5.3 Inspection of parts:
ANA1.5.3.1 Electronic parts:
All the active and passive electronic parts (packaged) shall be subjected to incoming inspection. Traceability shall be maintained for parts, from incoming inspection to the final units including batch acceptance report of PCB / MIC. (Lot No, Batch No, Date code etc). ). All the procured device datapack along with CoC shall be submitted to SAC for review. ANA1.5.3.2 Mechanical parts:
All the mechanical parts & materials procured by the vendor shall undergo Incoming inspection / testing including measurement of critical physical, chemical & mechanical properties including
Outgassing properties of specified materials. Wherever the Outgassing test results with the
compliance certificate are supplied by the manufacturer along with material batch test results, out
gassing test is not required.
The vendor shall carry out the fabrication of mechanical parts as per SAC approved drawings.
Dimensional measurements and visual inspection of packages, boxes, covers, clamps etc. shall be
carried out by the vendor on 100% basis. The mechanical parts shall also be inspected on 100% basis
from plating / thermal painting workmanship point of view. All the bought out mechanical
components including fasteners, spring, plain washers, nuts etc. shall be procured by the vendor in
accordance with procurement specifications approved by SAC. Incoming screening of fasteners shall
include review of Manufacturer’s Test Report (MTR) & Certificate of Compliance (CoC), as well as
inspection on 100% basis GO/NO-GO gauge inspection, and dimension inspection on sampling basis
by the vendor.
Declared Material List (DML) & Declared mechanical parts List (DMPL) used shall be prepared and
sent to SAC for review and acceptance. List shall contain following minimum details.
a) Material designation
b) Material details (i.e Heat Treatment, Finish, Mix ratio, Cure Time etc.)
c) Applied specification, conditions
d) Manufacturer and/or Vendor name,
e) Application area in UNITs
f) Heritage
Following traceability information shall be maintained by the vendor for records & SAC audit purpose.
a) Raw material identification details, relevant in-house incoming inspection & test reports.
b) Materials batch/lot Nos. information
c) Parts identification records
d) QC inspection and clearance reports of the vendor for both bought out & in-house fabricated
hardware.
e) Process documentation like process log, applicable process documents etc.
f) Certificate Of Compliance (CoC) supplied by sub-vendor/manufacturer for bought out items.
ANA1-6.0 Materials
Vendor shall ensure to use of ISRO approved / qualified materials. Procurement of all the mechanical
and electronic fabrication materials shall be in accordance with Approved Materials List (AML) given
in document No. SAC/QACMG/MQAD/GEN/05/ APRIL-2012 followed by incoming inspection. Any
other materials, which are not available in AML shall first be qualified as per SAC test plan & cleared
by SAC prior to their use. All inspection and clearance records for the materials shall be maintained
by the vendor. Only approved and cleared materials shall be used.
Technical specification of other materials to be used in the hardware which are not included in the
above documents shall be submitted to SAC for review and clearance before procurement. Non-
compliance of specifications for any bought out or in-house fabricated materials shall be intimated to
SAC for necessary review and clearance.
Materials list consisting of the name of vendor, shelf life, qualifying agency, location of application in
the sub-systems shall be submitted to SAC for approval. Only Space qualified Printed Circuit Boards
(PCBs), approved photo mask, patterned MICs etc. shall be used during fabrication of hardware. All
PCBs / MICs shall be procured from ISRO qualified vendor.
All the materials shall be used within their shelf life. Life limited materials may be considered for use
only after appropriate re-testing and approval as defined by SAC.
Ferrous and non-ferrous material used shall be of corrosion resistance type or suitably treated to
resist corrosion caused by atmospheric conditions existent in storage or normal operational
conditions. Only non-magnetic materials shall be used; except where use of magnetic materials are
essential. Materials, which are nutrients for fungus, shall not be used.
Organic and inorganic materials shall be stable under atmospheric and high vacuum conditions. These
materials shall have a Total Mass Loss (TML) of less than 1% and Collectable Volatile Condensable
Materials (CVCM) of less than 0.1% when subjected to a test condition of +125ºC and 1x10-06torr
pressure for 24 hours. Only space qualified epoxies, potting materials, etc. shall be used, within their
shelf life and with cure schedule as specified by the vendor. However, their use shall be restricted and
failure due to these shall be recorded and analysed as and when detected. Wherever the Outgassing
test results with the compliance certificate are supplied by the manufacturer along with material
batch test results, out gassing test is not required.
The selection and use of dissimilar materials shall be avoided, wherever it is impractical to avoid
dissimilar materials in direct contact with each other, suitable protection shall be provided by space
proven coatings / plating etc.
ANA1-7.0 Storage of Hardware, Parts, & Materials
Vendor shall ensure that all the parts and fabricated hardware are stored under controlled
environment in a Bonded-Store till their actual use. Storage of fabricated hardware, parts & materials
shall be done as per ISRO-PAS-206. Manufacturer instruction for storage & handling of parts shall
strictly be followed during the storage. Preferably dry Nitrogen purged packaging and storage cabinets
shall be used for storage of bare dice and oxygen sensitive items like PCBs / mechanical hardware.
ANA1-8.0 Processes
Only qualified process shall be used and no new process qualification requirement is addressed for
this programme. The unit shall be built to the standards normally associated with long life satellite
hardware. ISRO-PAX-300 / 305 Workmanship standards for fabrication of electronic packages shall be
followed for the fabrication work. All electronic fabrication processes like Etching of PCB laminates,
Wiring of components, Wiring & assembly of circuits and box, Packaging and assembly etc. shall be
ISRO qualified. Similarly the processes used for surface treatment of the box like plating and coating
in realizing the hardware shall also be ISRO qualified. All the processes shall be carried out in
accordance with PIDs reviewed & approved by SAC.
In case of processes qualified by other agencies, process qualification reports shall be submitted to QA SAC for review. After review of previous qualification plan, SAC will decide for requirement of full qualification / delta qualification of such processes. However, right for decision on feasibility of such a qualification activity will be retained by QA SAC. Particular attention shall be paid, as a minimum, in respect to the following:
a) All the processes used should be qualified for space use
b) All components including torroidal / bead inductors / coils shall be suitably supported on
PCB/Substrate by RTV etc.,
c) All connections through wire (insulated / Cu magnet) from feed-through to circuit shall have
adequate Stress relief loop, maintaining minimum possible length.
d) Wherever wires are attached to casing for grounding etc., a higher melting point solder than that
used for lid soldering, shall be used.
e) The input/output connections on pins shall also be made with high melting point solder to avoid
detachment of these connections while soldering the pins to external system using SN 63 solder.
f) The marking and plating etc. shall be permanent and should not get damaged during normal
cleaning process using Isopropyl alcohol or other recommended cleaning solvents.
g) In case where consistent poor workmanship is observed, Verification of the Process Qualification
(VOQ) shall be carried out at the discretion of SAC-QA.
Vendor should prepare and submit list of processes required for this programme with qualification
status, alongwith technical proposal. Vendor shall also submit the standard process average for
rejections / reworks for major fabrication activities.
ANA1-8.1 Verification of Process Quality (VOPQ)
Witness samples shall be prepared & processed along with each batch of patterned Substrate, PCB (DSB, MLBs) and plated, painted / coated mechanical parts& components as per the requirements defined as part of process qualification certification. This witness samples shall be subjected to Batch acceptance testing, as per the SAC defined acceptance test plan.
Any deviations observed on these samples shall be a cause for rejection of fabricated lot and a final
disposition shall be taken after discussion with SAC regarding their impact on unit functioning and
reliability. Corrective action shall be taken to ensure quality.
Items only from accepted batches will be cleared for use in FM fabrication.
ANA1-9.0 Process Identification Document (PID)
All the activities involved for realisation of space QM/CTQ/PFM/FM units shall be addressed in the
top level PID. Vendor shall prepare such top level document, identifying all the activities, methods /
procedures, inspection check points with reference to applicable documents that will be followed for
realisation and delivery of the units. The copy of PID shall be sent to SAC for review. Only SAC
approved PIDs shall be followed for production of subsequent units.
ANA1-9.1 Fabrication Documentation
For the fabrication activity, a fabrication traveller / fabrication history sheet shall be maintained for
each unit, where-in all the fabrication steps and QC inspection comments are logged. This shall include
any non-conformance reported by QC and its close out. This shall also include the specific serial nos.
of devices used for fabrication of units.
ANA1-9.1 Fabrication Sequence
A generalized fabrication sequence detailing each step of fabrication and QC inspection shall be
worked out and provided to SAC before start of fabrication. SAC approved fabrication sequence shall
only be implemented. This is to ensure smooth flow of the assembly activity and avoiding rework /
rejection. This shall be clearly understood and agreed upon. The assembly flowchart shall include the
following:
a) Flow of fabrication activities
b) Approved drawing nos.
c) Name of processes and PID numbers.
d) Intermediate electrical testing (at module level)
e) Handling instructions
f) Permanent/Temporary torque values.
g) Specific instructions, caution notes etc.
h) Any environmental test which is a part of fabrication process or for electrical performance
check and selection TBD component values
i) Marking & Identification of unit.
ANA1-10.0 QUALITY CONTROL (QC)
Vendor’s in-house Quality Control (QC) shall carry out 100% inspection of all the fabricated /
processed units as well as on-line inspection during the electronic fabrication activity. Non-destructive
bond-pull test (NDT) on wire/ribbon shall be carried out on 100 % basis, prior to sealing / cover closing
of the units.
All fabrication and inspection work shall be carried out by ISRO certified fabricators / inspectors of
vendor. Online inspection of all the fabricated hardware and witness samples shall be carried out by
QC of the vendor. These data can be used to monitor the process health. Required process control
documents are to be generated and maintained by the vendor, which will be reviewed by SAC during
QA audit.
The hardware for Flight shall be inspected by vendor’s QC and shall be accepted after successful
inspections & clearance of witness samples. These include etching of printed circuits on substrates
(PCB, Alumina etc), their soldering and the assembly of the package with fabricated mechanical parts.
The mechanical units shall be inspected for dimensional compliance, finish and surface quality on
100% basis.
ANA1-11.0 QA AUDIT
The purpose of the QA audit is to ensure that all fabrication and assembly activities are carried out as
per approved documents & ISRO guidelines to determine effectiveness of quality systems at vendor’s
facilities. Also compliance to all planned Product Assurance activities is ensured. The QA audit shall
be carried by QA/ SAC from both electronic & mechanical point of view. Following may be noted.
The frequency for QA audit shall be decided by SAC and intimated to the Vendor.
All the fabricated PCBs / Packages shall be first inspected and accepted by QC/QA of the vendor
and proper records shall be generated. Audit by QA/SAC shall be carried out on QC accepted
hardware. Audit by SAC shall cover Electronic & Mechanical aspects for the following,
a) PFT Substrate / PCB
b) Machined package/ cover etc.
c) Surface finishing (plating / painting)
d) Wired Substrate / PCB
e) Packaging & fixing of cards/ substrates/ connectors & internal harness
f) Audit for integrated package level.
g) Test setup and unit level testing.
SAC shall audit/ inspect all related facilities, activities which the vendor will carryout to realise the
hardware. Fabrication processes, cleanliness records, QC inspected hardware, process log
books/history records, overall documentation, parts & material evaluation/test reports, facilities,
procedures followed etc. shall be followed as per ISRO guidelines.
The audit report will be generated by QA/SAC. The Vendor shall generate close outs on the
discrepancies observed during audit by taking appropriate corrective actions and submit the same
to SAC for review and acceptance.
The disposition on the non-conformances on actual hardware, if any, which cannot be closed by
the auditee, shall be closed through vendor’s NCRB, with approval from SAC, after reviewing the
impact of the non-conformance on reliability of the non-conformed hardware for intended use.
The corrective actions implemented by the vendor shall be documented after necessary review
and approval by QA/SAC.
Based on the compliance to ISRO guidelines and closeouts for audit observations by the vendor,
stage wise clearance shall be given by QA/SAC.
Virtual Audit (Photographic): Based on confidence level build-up on fabricated hardware, SAC
may opt for virtual audit of hardware, provided vendor facility, process line, their quality system,
etc found satisfactory. For this, vendor is required to submit related documents like, High
resolution images of the hardware, History sheets, compatibility sheet, box dimensional report,
Torque wrench calibration certificate, NCR details, plating / coating clearance report and other,
if required.
ANA1-12.0 MARKING AND IDENTIFICATION
The units shall be identified by assigning unique serial number (may be assigned by SAC) on the
exterior surface of both package & cover by a suitable process applicable for space use. Marking shall
not degrade the performance and quality of the unit. In addition to functional markings like input /
output, frequency etc. following marking shall appear on each unit.
Unit Name Unit Number
Specification Number / Contract Number Serial Number
Name of the Manufacturer Date of Manufacture
Recommended Part No.: TCU-XX-ZZ-(QM/FM)-WWYY
Where XX: Type, ZZ: Sr. No., WWYY: Week and Year code
The permanency of the marking shall be sufficient to withstand the specified environmental
conditions and normal cleaning operations using Isopropyl Alcohol and other cleaning solvents. The
marking method to demonstrate the same shall be specified by the manufacturer.
ANA1-13.0 TRANSPORTATION
Suitable packing shall be provided for the transportation of the unit by air or road without any
degradation / damage. Each unit shall be packaged in individual ESD protective packaging. This
package shall protect the unit from environmental conditions encountered during transportation, like
heat, humidity & dust. This individual container shall then be placed in a transportation container.
More than one individual unit may be placed in the transportation container. The transportation
container shall protect the units from heat, humidity, dust, mechanical shock & vibrations during
transportation.
The individual unit packages and transportation containers shall be clearly marked with following instructions along with other mandatory markings.
“ESD sensitive units”
“To be opened only under clean environment with ESD precautions”
“High reliability space usage systems”
ANA1-14.0 TEST PROGRAMME
Final production tests shall be carried out just prior to submitting the units for the formal test phase,
to ensure that units meeting the functional requirements. As a part of final production test it is
recommended that Temperature cycling over the acceptance temperature limits should be carried
out.
ANA1-14.1 MODEL PHILOSOPHY:
During the programme following Models shall be fabricated and tested as per the requirements of
this RFP:
Qualification Model (QM)
Flight Model (FM)
Proto Flight Model (PFM), if applicable – see point (d) below.
a) Qualification Model (QM) :
The design of the QM units shall be same as that for the FM units. Materials, parts, and component
to be used shall be as that for FM. Similarly same processes as FM shall be used to realize QM. QM
shall be subjected to the Qualification level tests as per Table-3. After completion of QM unit testing,
the test report shall be submitted to SAC for review. Fabrication of FM units shall commence only
after clearance from SAC of the QM test results.
b) Flight Models (FM) :
The FM units represent the final electrical & mechanical design and configuration using screened Hi-
Rel parts, material and processes of qualified standard and workmanship. All the flight model TCUs
shall be subjected to Flight Acceptance Level Tests.
c) Proto Flight (PFM) level testing :
For this programme, PFM units are not applicable and will not be ordered.
However, In following cases, vendor will be required to conduct PFM level testing on one FM unit
(a) Corrective action implemented based on deviation observed during QM level testing
(b) In case of number of deviations during fabrication and assembly exceeds standard process
average
(c) Performance deviation observed in consistently three units during FM level testing
(d) Depending on the final order quantity and delivery schedule, one unit per year.
Requirement of PFM level testing due to above cases will be decided by SAC after thorough review of
the technical performance details of each of the applicable case.
ANA1-14.2 TEST PLAN:
The vendor shall submit to SAC the detailed test plan document for the functional & environmental
tests to be conducted on QM and FM (including PFM level testing, wherever applicable) units,
whenever applicable, for approval by SAC. This includes the detailed test procedure for conducting
each test consisting of test method, test conditions, test equipments etc. Only approved test plan
shall be implemented. The environmental level severity for the test to be performed on different units
should be as listed in the following Table.
Table – 2 Test Severity Levels
Model Type Levels
QM Qualification
FM Acceptance
PFM Qualification
TCUs shall be tested in accordance with Table 3 given below. The tests shall be performed in the listed
sequence.
Table – 3 : Tests applicability
Sr. No. Test QM PFM FM
1. Physical Measurements X X X
2. Visual Inspection X X X
3. Initial Bench Test (IBT) X X X
4. Burn-in Test (168 Hrs.) X X X
5. Post Burn-in electrical tests X X X
6.
Storage tests
a) Cold Storage test X - -
b) Hot Storage test X - -
c) Humidity Storage test X - -
7. Temp. operational test X X -
8.
EMI / EMC (MIL-STD-461E)
CS114, CS115 & CS116 (DATA LINES), RS103 X - -
RS103 X X
9. Sine Vibration X X -
10. Random Vibration X X X
11. Thermo-Vacuum test X X X
12. Mechanical Shock X - -
13.
ESD test
Radiated Field (7 KV, 1pps, 30 pulses) X - -
Single Point Discharge (5 KV, 30 pulses, 1 pps) X - -
Structural Current (5KV, 1pps, 30 pulses) X - -
14. Life Test X - -
15. Final Bench Tests (FBT) X X X
16. Final Visual inspection X X X
Notes:
1. ‘X’ denotes applicability of test.
2. At the end of each environmental / mechanical test and electrical performance check shall be
carried out.
3. For PFM level testing, burn-in, temp. operational and Thermovac testing shall be carried out at
qualification temperature level.
4. Suitable buffer connectors shall be used to protect input / output connectors of the device from
wear and tear due to mating / de-mating with other connectors during testing. Record of number
of time mating / de-mating of connectors shall be maintained.
ANA1-14.3 Failure :
Deviation from the agreed electrical specifications shall be treated as non-compliance, and may be as
cause to reject the units. Any failure observed at any stage shall be reported to SAC immediately. This
shall be followed by detailed failure analysis by Vendor, clearly identifying the cause of failure as
random or design related. Any modifications required in electrical, mechanical or process related
aspects shall be approved by SAC. In case of mechanical or electrical design related failures; a retest
plan or modification in the test plan may be necessary. Based on the failure analysis, such retest plan
/ modified test plan shall be decided and implemented after approval by SAC. This may include
requalification of process or the unit / Proto flight level testing.
ANA1-15.0 TESTS
All the specification requirements shall be verified by testing. Vendor is required to generate test
procedure, clearly showing test set-up and connection details including groundings. This test
procedure shall be sent to SAC for review & clearance. Testing shall be done as per SAC approved test
procedure using calibrated test & measuring instruments. It is preferred that cable types used by the
vendor for harnessing during testing shall be similar or very close to cable type to be used in
harnessing of FM unit in the Space craft.
Acceptance of the test set-up shall be done jointly by SAC and vendor before the testing of the QM
and FM units. This shall also be audited, during the testing activity. Vendor shall inform the readiness
of the test set-up as well as the schedule well in advance. Representatives from SAC may participate
in the testing.
(a) Test setup calibration and accuracy:
The test instruments used during testing shall have valid calibration status. Test instruments shall have
adequate measurement accuracy. These shall be verified and the shall be stated in the test plan and
procedures document submitted by the vendor.
(c ) Maximum Allowable Tolerance In Test Conditions :
Parameter Tolerance
Temperature
1C Amb. Pressure
3C under vacuum
Atmospheric Pressure
Greater than 0.1 Torr
Below 0.1 Torr
5%
50%
Relative Humidity 5%
Acceleration
10%
Vibration Frequency 2% above 25 Hz
0.5 Hz below 25 Hz
Sine Vibration
Amplitude
Frequency
Sweep rate
Time
10%
± 2% above 25 Hz &
0.5 Hz below 25 Hz
5%
± 1%
Random Vibration
Power Spectral Density
Overall (g-rms)
Duration
± 1.5 dB for 20-300 Hz &
±3 dB for 300-2000 Hz
10%
+ 10% / - 0%
Shock Response Spectrum Test
Amplitude
-3dB / +6dB
ANA1-15.1 Test condition & details:
Following paragraphs give details of various tests to be performed on units. Electrical test shall be
carried out within 96 hours after completion of each environmental test.
The test parameters to be measured during / after each of following test shall be defined in Test plan
document for QM, PFM and FM units.
ANA1-15.1.1 Physical Measurement:
All the units shall be examined for
- Mass, Dimensions & Flatness
ANA1-15.1.2 Visual Inspection :
ANA1-15.1.2.1 Internal Visual Inspection (Pre-Cap) :
After completion of all fabrication activities, internal visual inspection at suitable magnification of the
units shall be carried out to detect any workmanship related deviation and non-conformance w.r.t
respective ISRO standards. SAC may participate / audit the pre-cap visual inspection. Vendor shall
inform the schedule of sealing / cover closing of QM / FM / PFM units.
ANA1-15.1.2.2 External Visual Inspection :
All the units shall be examined visually at 10 X magnification before and after each environmental
test. The units shall be inspected for surface finish, plating, mechanical and workmanship related
defects.
ANA1-15.1.3 Pre Burn-in Electrical Test (IBT) :
This test shall be performed to verify compliance to all the electrical parameters and will be taken as
reference for all subsequent tests. Electrical parameters to be as per approved test plan.
ANA1-15.1.4 Burn-In Test :
Units shall undergo burn-in at maximum Operating Temperature in power ‘ON’ condition. The
duration of Burn-in shall be 168 hrs for all units. Data log for Time-Temperature shall be kept for
verification.
ANA1-15.1.5 Post Burn-in Electrical Test:
This test shall be conducted at ambient temperature. Electrical parameters shall be measured during
Post burn-in functional tests as per approved test plan.
ANA1-15.1.6 Temperature storage test :
Temperature storage test is applicable to QM units only. The units shall be subjected to minimum
storage temperature for 24 hours. After this storage, electrical and visual inspection shall be
performed. The test shall be repeated for maximum storage temperature for 24 hours. Units shall be
in non-operating conditions for the storage duration.
Visual inspection shall be performed after the test. Pre and post electrical measurements shall also
be carried out outside the chamber on the unit.
ANA1-15.1.7 Humidity Test :
This test shall be conducted on QM units as per the following conditions :
Humidity : 95 % RH
Temperature : 40 0C
Duration : 24 Hrs.
After the humidity test, units shall be visually inspected. There shall be no visual defect like,
degradation of plating/coating, discoloration, patches, etc. Parameters shall be measured after the
test.
ANA1-15.1.8 Operational temperature test :
This test shall be performed to check the performance specifications of the units at the specified
Lowest and Highest operating temperatures. The units shall be placed in a suitable thermal chamber,
and connected with the external test set-up. Dwell time at temperature extreme shall be at least 6
hours. Parameters to be measured during this test shall be as per approved test plan.
ANA1-15.1.9 EMI / EMC Test :
The units shall be subjected to EMI / EMC tests as per MIL-STD-461E. Test applicability is shown in
Table-3. Any additional tests, if required by SAC, shall also be carried out by the vendor. Plots taken
during all the tests shall be kept for verification.
ANA1-15.1.10 Vibration Test :
Sine / Random vibration tests shall be carried out on applicable QM / PFM /FM units. Visual &
electrical measurement shall also be performed after each Sine & Random vibration test. Vibration
levels given below are tentative. Levels may change latter, depending upon mechanical configuration.
ANA1-15.1.10.1 Resonance Search :
Pre & Post Vibration, resonance search shall be carried out in all the three axes as per following levels.
Natural resonance frequency (Fn) shall be greater than 100 Hz and drift in pre & post vibration ‘Fn’
shall be within 10%.
Frequency (Hz) Amplitude
10 - 2000 0.5 g
Sweep rate 2 Oct / Minute
ANA1-15.1.10.2 Sine Vibration :
Sine vibration test shall be conducted only on QM and PFM units. The unit shall be in non-operating
condition for the duration of vibration test. One Sweep in each axis shall be performed.
Normal to mounting plane (z-axis) Parallel to mounting plane (x & y axes)
Frequency (Hz) Amplitude Frequency (Hz) Amplitude
5-20 12.4 mm (0 to
peak) 5-20 9.3 mm (0 to peak)
20-50 20g
50-70 15g 20-70 15g
70-100 8g 70-100 8g
Sweep rate
QM
PFM
2 Oct./minute
4 Oct./minute
Sweep rate
QM
PFM
2 Oct./minute
4 Oct./minute
ANA1-15.1.10.3 Random Vibration:
Units shall be subjected to random vibration tests with levels as given below in passive mode.
Frequency verses PSD plots shall be obtained and shall be kept along with the test results for
verification. For QM/ PFM units :
Frequency (Hz)
Power spectral density
Normal to mounting plane
(z-axis)
Parallel to mounting plane
(X & Y axes)
20-100 + 3 dB/octave + 3 dB/octave
100-700 0.30 g2/Hz 0.10 g2/Hz
700-2000 -6 dB/octave -3 dB/octave
Overall RMS 18.1 g 11.8 g
Duration
QM
PFM
120 sec.
60 sec.
120 sec.
60 sec.
For FM units:
Frequency (Hz)
Power spectral density
Normal to mounting plane
(z-axis)
Parallel to mounting plane
(X & Y axes)
20-100 + 3 dB/octave + 3 dB/octave
100-700 0.13 g2/Hz 0.044 g2/Hz
700-2000 -6 dB/octave -3 dB/octave
Overall RMS 12.1 g 7.9 g
Duration 60 sec. 60 sec.
ANA1-15.1.11 Thermo vacuum Test:
QM / FM / PFM units shall be subjected to thermo-vacuum test as per the test profiles shown in
following figure.
Following points shall be considered before starting thermo-vacuum test :
It shall be ensured that the parameters of the thermo vacuum chamber i.e. temperature, air
pressure measuring device, etc are properly calibrated prior to the start of the test.
It should be ensured that the temperature sensors are mounted at pre-determined locations for
monitoring base plate and package temperatures as defined in test plan.
Electrical measurements shall be carried out at the points mentioned in test profiles. Time-
Temperature and Pressure data shall be logged along with electrical results for verification. Crtical
parameters (mutually agreed) shall be logged/monitored continuously during operating temperature
cycles.
ANA1-15.1.11.1 Thermo Vacuum Test Profile:
VACUUM ≤ 1 X 10 -5 TORR
T2 0C
T3 0C
T4 0C
TEM
PER
ATU
RE
2Hrs
2Hrs 2Hrs 2 Hrs
2Hrs
2Hrs
2Hrs 2Hrs 2 Hrs
T1 0C
TIME
AMBIENT
LAB. UNIT ON
T3 0C
24 Hrs
24 Hrs
AMBIENT LAB.
UNIT
ON
UNIT OFF
UNIT OFF
Indicates slot for measurement
Pressure better than 1 10-05torr
T1: MAX STORAGE TEMPERATURE
T2: MIN STORAGE TEMPERATURE
T3: MAX OPERATING TEMPERATURE
2Hrs
T3 0C
T4 0C
T4 0C
UNIT ON
UNIT OFF
ANA1-15.1.12 Mechanical Shock Test:
QM unit shall be subjected to mechanical shock test as per the following test levels in all the 3 axes.
Number of shocks in each axis shall be 2 and Shock levels specified with Q = 10.
Frequency (Hz) SRS
100-1000 +12 dB / Oct.
1000-5000 1000g
(levels are tentative)
ANA1-15.1.13 ESD Test
ESD tests shall be conducted on QM unit. Electrical measurements shall be carried out after ESD tests as
per test plan
ANA1-15.1.13.1 Radiated field Test
The unit (EUT) shall not exhibit any degradation of performance when subjected to the radiated fields of
less than or equal to 7 kV ESD, simulated at 30 cm from all critical points identified by SAC. Discharge rate
shall be 1 discharge per second for a period of 30 seconds at each point. The test set up is as shown in
figure below.
ANA1-15.1.13.2 Single point Discharge Test
The Unit (EUT) shall not exhibit any degradation of performance when subjected to discharges equal to
or less than 5 kV with discharge current return wire in close proximity, applied to subsystem surface
directly at critical points to simulate the discharge and local flowing of arc currents. Discharge rate shall
be 1 discharge per second for a period of 30 seconds at each point. The test set up is as shown in Figure
below.
ANA1-15.1.13.3 Structural current test
The Unit (EUT) shall not exhibit any malfunction, degradation of performance or deviation from the
specifications when subjected to contact discharges of less than or equal 5 kV, simulating structural
current transients, with discharge current return wire at diagonally opposite corners, to simulate blow-
off discharge currents. Discharge rate shall be 1 discharge per second for a period of 30 seconds at each
point.
ANA1-15.1.14 Life test:
Life test shall be carried out during qualification testing. The unit shall be subjected at maximum operating
temperature for 2000 hours, with DC biasing applied at maximum power dissipation condition. During
this test, electrical measurement of critical parameters shall be carried out periodically after 240 hours,
500 hours, 1000 hours, 1500 hours and 2000 hours. The critical parameters of the unit under test shall be
monitored continuously during testing. However, the parameters to be monitored, duration and interval
for monitoring of parameters (typically 24 hours) shall be mutually agreed between SAC and vendor.
Acceptance criteria and parametric drift shall be decided later. For PFM level testing the life test duration
shall be 500 hrs.
ANA1-15.1.15 Final Bench Test (FBT) :
The final bench test shall be conducted for measurement of electrical parameters as given in test matrix.
The test shall be conducted at ambient temperature. All the test results shall be recorded and any
performance deviation with respect to Initial Bench Test shall be evaluated and shall be within specified
limits.
ANA1-15.1.16 Final Visual Inspection :
The unit shall be inspected for plating, surface, finish, mechanical deviations, corrosion and workmanship
related defects. No visual degradation shall be allowed after completion of tests.
ANA1-16.0 NON-CONFORMANCE MANAGEMENT
Effective non-conformance management mechanism shall be established. e.g. a Non-Conformance
Review Board / Material Review Board may be set-up constituting representatives from design,
fabrication, quality, procurement and testing departments. Major non-conformance at any stage, which
affects the quality & reliability or the fabrication process of entire lot, shall be reported to SAC
immediately with photographs, nature of non-conformance observed, etc. However, for all the minor
non-conformances, approval from SAC is not mandatory, and shall be reviewed and discussed by the
vendor’s NCR board. Major and Minor Non-conformances are broadly defined as follows.
ANA1-16.1 MAJOR OR CRITICAL NC :
Major non-conformances are those which have an impact on the contract requirements. These non-
conformances, of the contractual end item which cannot be completely eliminated by rework or repair
using standard repair procedures so that it could be categorised as a major NC. Major non-conformance
at any stage, which affects the quality & reliability or the fabrication process of entire lot, shall be reported
to SAC immediately and further action shall be taken only after clearance from SAC. In general Major NC
is considered when the following properties are adversely affected:
Functional performance
Interchangeability
Interface requirements
Reliability / Maintainability / Availability
Predicted life time
Qualification status of parts, materials and processes
Safety of personnel or equipment
EEE parts failure, in case of :
Lot/batch rejection during manufacturing, screening or testing at the manufacturer’s facilities.
Failures detected during any inspection or test which affect form, fit or function and cannot be
considered as random failures, where no risk for lot-related reliability or quality problem exists.
ANA1-16.2 MINOR NC:
Any non-conformance other than major, are categorized as Minor NCs. Minor NCs shall be compiled and
reported to SAC at agreed intervals.
All minor non-conformances, shall be reviewed and discussed by the NCR board. Non-conformance report
shall be generated by the concerned agency and shall be reviewed and discussed by the NCR board.
Any non-conformance affecting the fabrication and/or inspection procedure shall be reported to SAC.
Changes in related documents shall be implemented and revision number of the document shall be
updated. This shall be followed by updating all the documentation (fabrication, inspection, and test).
All the non-conformances with the disposition given by the NCR board shall be compiled and reported to
SAC periodically. This shall be followed by report of close out action completion, if any. For all the non-
conformance report, SAC representative shall be the focal person.
ANA1-17.0 CONFIGURATION CHANGE CONTROL
The manufacturer shall follow an effective configuration change control procedure during the fabrication
stages. Plans for both non-conformance and configuration change control shall be made for submission
to SAC for review and approval before initiation of manufacturing activities.
ANA1-18.0 DOCUMENT TO BE SUPPLIED
ANA1-18.1 Following document shall be supplied along with quote :
a) Pont by point compliance to all the requirements of this document.
b) Details to be provided as per QA check list given in Annexure- ANA1-18.5.
ANA1-18.2 The following documents shall be supplied during the contract :
a) Parts & Materials List to be used for the fabrication of units, detailing their quality level,
procurement specifications, traceability information, out gassing specifications etc.
b) CoC, screening (at Vendors / sub-vendors) reports, incoming inspection report, batch acceptance
test reports of Parts & Materials.
c) Record of Bias conditions of identifying the channel / junction temperatures of all the active
devices if applicable.
d) Interface control drawing (AutoCAD soft copy)
e) Details of design modifications (wherever applicable) with respect to the given details.
f) Process Identification Documents along with standard process average for rejection rate for major
fabrication activities.
g) Test procedure/plan documents for QM & FM tests with test conditions, procedures, list of
equipments and their calibration status, for review & approval by SAC.
h) All documents, including various Analyses as per the requirements of this document.
i) Non-conformance management plan.
j) Configuration change control plan.
k) Program management plan
ANA1-18.3 Following documents shall be supplied during the programme with respect to relevant
activity.
a) Status report for the fabrication activity and test schedule.
b) Schedule for Cover closing of the units
c) Details of test set-up and readiness
d) Non-conformance report at agreed intervals
e) Failure Report; as and when failure occurs
ANA1-18.4 Following detailed documents shall be supplied for each unit along with deliverables, in
Hard copy as well as in soft copy.
a) T & E report of each unit containing detailed test results, test history, conformance matrix, TBD
values etc.
b) CoC of the deliverable units
c) CoC of parts & materials Including screening report
d) All fabrication details supplied by SAC for fabrication
e) Non- Conformance reports with close-outs
ANA1-18.5 Vendor to provide complete details of following with relevant certificates for
following QA check list.
QA Check List
Sr.
No
Details of information required Vendor response
1 Point by Point compliance provided ? Yes / No
2 List each applicable process (ISRO qualified) at your / sub-
vendor’s facility, their qualification status & attach qualification
certificate.
Process Name Facility Certi. No.
a) Patterned substrates : Alumina
PCB
b) Fabrication facilities : HMC
PCB
c) Component mounting & Assembly process
on, HMC
PCB
d) Plating / Surface treatment (type wise)
e) Details of other ISRO qualified processes
available
6 Details of ISRO certified fabricator and Inspector for both MIC
and PCB work
7 Location of test facilities likely to be used for following tests shall
be provided (whichever applicable). SAC facilities will not be
offered except mechanical shock test facility and outgassing test
facility (If needed and requested), which is offered without charge
a) Physical Measurements
b) Visual Inspection (internal & external)
c) Electrical measurements
d) Burn-in
e) Temperature tests : Storage temperature test, Humidity
Storage and Temp. operational test
f) EMI / EMC & ESD
g) Vibration test (sine & Random)
h) Thermo-Vacuum
i) Mechanical Shock
j) Life Test
TEST MATRIX FOR QM/FM TCU
Sr.
No
.
Parameter
IB
T
B
urn
-in
Po
st
Bu
rn-in
ele
ctr
ica
l
Po
st
co
ld s
tora
ge
Po
st
hot
sto
rag
e
Po
st
Hum
idity s
tora
ge
Tem
p. o
pe
ratio
na
l te
st
EM
I/ E
MC
sin
e v
ibra
tio
n
Ra
nd
om
vib
ratio
n
The
rmo
vac
Po
st m
echa
nic
al sh
ock
ES
D
Life
te
st
FB
T
1 TCU Power On Reset Test √ √ √ √ √ √ √ √ √ √ √ √ √ √ √
2 Physical ID Test √ √ √ √ √ √ √ √ √ √ √ √ √ √ √
3 Self ID Test √ √ √ √ √ √ √ √ √ √ √ √ √ √ √
4 PCPU Power On Test √ √ √ √ √ √ √ √ √ √ √ √ √ √ √
5 PCPU Power Off Test √ √ √ √ √ √ √ √ √ √ √ √ √ √ √
6 EPC Sync Clock Test √ √ √ √ √ √ √ √ √ √ √ √ √ √ √
7 TRC Operation Mode Test √ √ √ √ √ √ √ √ √ √ √ √ √ √ √
8 Configuration Command
Test √ √ √
9 TRC Correction Data Test √ √ √
10 Isolation Command Test √ √ √
11 Timing Signal Verification
Test √ √ √
Note: Temperature limits and vibration/mechanical shock levels mentioned are tentative and final
values would be communicated to vendor during PID finalization.
Annexure A2 : Technical Details of TCU
AN A2.0 Introduction to Tile Control Unit .
The Tile Control Unit (TCU) is required to control, command and coordinate the activities of an individual tile containing 24 nos. of Transmit Receive Controllers (TRCs) and other electronics. This is a full digital implementation. The board receives a number of timing and control signals consisting of various timing windows, a clock etc. (on RS422), and a serial command (on RS485). TCU is a digital subsystem which operates at clock frequency of 4MHz. TCU will utilize the beam configuration related information received from on-board payload controller (PLC) to provide beam forming parameters for the relevant TR module Controllers. The testing of this card involves checking the input-output relations for integrity and conformance to expected patterns. A Ground Checkout Unit (GCU) will be developed as per configuration decided by SAC and it will be delivered to Vendor for testing TCU. Graphical User Interface (GUI) for the GCU will be provided by SAC. GCU will integrate into the testing environment and provide user friendly operator interface.
The unit comprises a single PCB of dimensions 380 X 75 X 2.4mm having all electrical interfaces
through six 51 pin micro-D connectors. This is to be housed in an Aluminium tray or enclosure of the
size 395mm X 80mm X 37mm. The bill of materials of the card and power supply details are given
below.
AN A2.1 Bill of Materials for TCU
Note : For all components, except Sr. No.-2, mentioned in table below, Additional 20% quantity over
and above required quantity has to be procured by vendor. For SR.No.-2 (DATA PROM 197A807-244T)
additional, 35% quantity has to be procured by vendor.
Sr.
No.
TYPE SPACE QLFD PART DETAIL QTY.
PER
PACK
AGE
Free
Issue
Mater
ial
PART NO MANUF. PACKAGE
1 OBC ASIC 5962R99B0109V
4C Aeroflex CQFP-256 2 Yes
2 DATA PROM
32K x 8 (45nS) 197A807-244T BAE Systems
28 LEAD FLAT
PACK 2 No
3 RS-422 CMOS RX 5962F9568901VX
C INTERSIL USA
16 CERPACK Flat
pack 4 No
4 RS-422 CMOS TX 5962F9666301VX
C INTERSIL USA
16 CERPACK Flat
pack 16 No
5 RS-485 TRANS
RECEIVER 5962F8961501V
HA
NATIONAL
SEMICONDUCT
OR
10 pin ceramic
SOIC 4 No
6 Micro-D 51 pin
Socket / FeMale
Connector (Right
Angled PCB
Mount)
Micro-D 51pin
Socket (Rt.)
340102902B-
51S-FR136
ITT CANON Rt.Angle PCB
Mount(FR136) 6 No
7 Mounting
Accessories for
FR136 Rt. Angle
PCB Mount with
Package wall
thickness 1.6mm
mounting
Accessories for
FR136. 3401 032
11B(115366-
9205C) * For
1.6mm Panel
Thickness.
ITT Canon 3401 032 06B
(115366-9205C) 6 Pairs No
8 Mating Male 51-
pin Straight
Harness
Connector
compatible to Sr.
No.6 with
prefabricated 4
mt. pigtail wire
Space Grade
compatible to
Sr. No.6
ITT Canon - 6 No
9 CHIP CAPACITOR
(0.1UF)
0.1uF,
100V
KEMET/AVX CDR-35 18 No
10 CHIP CAPACITOR
(10uF) 10Uf
35V/25V
VISHAY
SPRAGUE
AVX
CWR-09 6 No
11 CHIP CAPACITOR
(0.01UF) 0.01uF/100V KEMET/AVX CDR-31 44 No
12 SWITCHING
DIODE JANS1N6642US
Micro
Semi/Aeroflex CHIP SMD 100 No
13 CHIP RESISTOR 100 (250mW,
5%, 25ppm)
DALE/ IRC
State of Art RM1206 2 No
14 CHIP RESISTOR 120 (250mW,
5%, 25ppm)
DALE/ IRC
State of Art RM1206 105 No
15 CHIP RESISTOR 680 (250mW,
5%, 25ppm)
DALE/ IRC
State of Art RM1206 32 No
16 CHIP RESISTOR 100K (250mW,
5%, 25ppm)
DALE/ IRC
State of Art RM1206 4 No
17 CHIP RESISTOR 4.7k (250mW,
5%, 25ppm)
DALE/ IRC
State of Art RM1206 124 No
18 CHIP RESISTOR 10K (250mW,
5%, 25ppm)
DALE/ IRC
State of Art RM1206 2 No
19 FM PCB - - - 1 Yes
AN A2.3 Power Supply Requirement of EPC of TCU module
Power Supply Requirements
for the EPC unit (EPC Provided
by SAC)
Power per Unit 3 Watt
Supply Voltage +70 V (600mA)
Line regulation ±0.05%(70 V DC)
Load Regulation ±1%
Ripple 20 mV(P-P)
Overshoot at Turn ON 10% max
AN A2.4 TCU Interface Signals
Signal Direction
wrt TCU
Interface
Type
Signal
Type
No. of
Lines Description
Serial_Data Output RS422 UART Data 2 Telecommand
Tx_Pre_Sel Output RS422 Timing Signal 2 Active Low pulse of
58us @PRF of 5KHz
TX_Pulse Output RS422 Timing Signal 2
Active High pulse of
22us-48us @PRF of
5KHz
Data_Win Output RS422 Timing Signal 2
Active High pulse of
40us-110us @PRF of
5KHz
Tx_Beam_Ini Output RS422 Timing Signal 2
Active Low pulse of
58us @n PRF where n is
integer
Tx_beam_Hop Output RS422 Timing Signal 2
Active Low pulse of
58us @m PRF where m
is integer
TR_Reset Output RS422 Reset 2 Active Low pulse of 5us
TRC_Clock_Ref Output RS422 Clock 2 Clock of 3.90625 MHz
PCPU-ON1-24 Output CMOS Pulsed 24 PCPU1-24 On
PCPU-OFF1-24 Output CMOS Pulsed 24 PCPU1-24 OFF
RS485_TC_PLC_A_M Input RS485 UART Data 2 Telecommand-LineA
Main
RS485_TC_PLC_B_M Input RS485 UART Data 2 Telecommand-LineB
Main
RS485_TC_PLC_A_R Input RS485 UART Data 2 Telecommand-LineA
Red.
RS485_TC_PLC_B_R Input RS485 UART Data 2 Telecommand-LineB
Red.
Tx_Pre_Sel_PLC_M Input
RS422 Timing Signal 2 Active Low pulse of
58us @PRF of 5KHz
TX_Pulse_PLC_M
Input
RS422 Timing Signal 2
Active High pulse of
22us-48us @PRF of
5KHz
Data_Win_PLC_M
Input
RS422 Timing Signal 2
Active High pulse of
40us-110us @PRF of
5KHz
Tx_Beam_Ini_PLC_M
Input
RS422 Timing Signal 2
Active Low pulse of
58us @n PRF where n is
integer
Tx_beam_Hop_PLC_M
Input
RS422 Timing Signal 2
Active Low pulse of
58us @m PRF where m
is integer
TCU_Reset_PLC_M Input RS422 Reset 2 Active Low pulse of 5us
TCU_Clock_Ref_PLC_M Input RS422 Clock 2 Clock of 3.90625 MHz
Tx_Pre_Sel_PLC_R Input
RS422 Timing Signal 2 Active Low pulse of
58us @PRF of 5KHz
TX_Pulse_PLC_R
Input
RS422 Timing Signal 2
Active High pulse of
22us-48us @PRF of
5KHz
Data_Win_PLC_R
Input
RS422 Timing Signal 2
Active High pulse of
40us-110us @PRF of
5KHz
Tx_Beam_Ini_PLC_R
Input
RS422 Timing Signal 2
Active Low pulse of
58us @n PRF where n is
integer
Tx_beam_Hop_PLC_R
Input
RS422 Timing Signal 2
Active Low pulse of
58us @m PRF where m
is integer
TCU_Reset_PLC_R Input RS422 Reset 2 Active Low pulse of 5us
TCU_Clock_Ref_PLC_R Input RS422 Clock 2 Clock of 3.90625 MHz
EPC_Clock_M Output CMOS Pulsed 1 Clock 195KHz 10% Duty
Cycle
EPC_Clock_R Output CMOS Pulsed 1 Clock 195KHz 10% Duty
Cycle
+5V Supply Main Input DC Supply 1 +5V DC
+5V Supply Red. Input DC Supply 1 +5V DC
AN A2.5 Typical test set for TCU
cPCI based Ground Checkout Unit (GCU) will be provided by SAC for testing TCU. Ground Checkout
Unit (GCU) has capability of testing 4 numbers of TCU simultaneously. Either of main and redundant
section of TCU has to be powered ON at a time.
Figure 2: Block Diagram of TCU and TCU-GCU Interconnection
Figure 3: Photo of TCU and TCU-GCU Interconnection
Recommended