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Wafer Bonding Machines & Services
www.aml.co.uk MEMS, IC, III-Vs….
AML
AML Corporate Presentation
Sept 2012
www.aml.co.uk
Wafer Bonding Machines & Services
www.aml.co.uk MEMS, IC, III-Vs….
OXFORD, ENGLAND
1HR FROM LONDON
Applied Microengineering Ltd (AML) I
• Privately owned SME by two founders Rob Santilli, CEO & Tony
Rogers, Technical Director. No other shareholders.
• AML is an independent private company established in 1992. 20
years old this year
• AML manufactures unique in-situ aligned wafer bonding machines &
provides services based around wafer bonding in its state-of-the-
art multi-million $ BONDCENTRE facility in Oxfordshire.
• AML’s unique Aligned Wafer Bonder machines, the only machines
capable of in-situ alignment, activation & bonding on the market, are
particularly suited to the bonding requirements of MEMS, IC, & III-V
industries. The machines have the flexibility for R&D and the
throughput and automation for volume production as well as the
lowest cost of ownership & first class support.
• The unique platform allows processes not possible on other
machines e.g. iCAB in-situ Chemistry Align & Bond
Wafer Bonding Machines & Services
www.aml.co.uk MEMS, IC, III-Vs….
Applied Microengineering Ltd (AML) II
• AML’s machines & services are sold worldwide via agents &
distributors: China, Hong Kong, USA, India, Israel, Europe, Canada,
Japan, Korea, Taiwan, Singapore, Egypt, Russia and Australia.
• AML’s comprehensive BONDCENRE provides services from the
development of bonding processes to a commercial bonding service
– one off to volume. Associated services include CMP, powder
blasting, electroplating, screen printing & metrology, a ‘One Stop’
wafer bonding service
• AML’s BONDCENTRE offers the perfect venue for those involved in
device fabrication, 3D integration, TSV and Wafer Level Packaging.
Wafer Bonding Machines & Services
www.aml.co.uk MEMS, IC, III-Vs….
Wafer Bonding Machines & Services
www.aml.co.uk MEMS, IC, III-Vs….
AML History I
• Company founded 1992 - Private SME
• One of the first Companies in the world formed to exploit Design & Manf of MEMS devices; Field emitters (Nano-tips), Cap P sensors Sun sensor, Electro-chemical, “nose” substrates.. Founders also made first in-situ Aligner-Wafer Bonder in 1985 for in-house use.
Glass
Silicon
Insulator
Pressure
Au electrode
How it started –
Capacitive Pressure
sensors in 1985
Capacitance gap 0.5 µm
Wafer Bonding Machines & Services
www.aml.co.uk MEMS, IC, III-Vs….
AML History II
• Also Design house for Bosch, Tronics,
Onstream & SensorNor
• High Risk low return - Goodbye Mr. Chips
• Easier to make $ building machines!
• Last 12 years AML moved to equipment
manufacturer & service provider centred
around WAFER BONDING
• Worldwide installed base of machines
Wafer Bonding Machines & Services
www.aml.co.uk MEMS, IC, III-Vs….
Products
• Aligned Wafer Bonding machines
Services - BONDCENTRE
• Commercial Wafer Bonding service
• Bonding process development, tech transfer & training
• Associated Processes: cleaning, activation, structuring e.g. Powder blasting (holes) Deposition; Glass frit, Eutectic Electroplating (e.g.vias), CMP & wafer characterisation; Profile, TTV, Ra, & inspection; SAM, IR..
Wafer Bonding Machines & Services
www.aml.co.uk MEMS, IC, III-Vs….
Wafer bonding has found many applications in
field of MST, MEMS, III-V, ICs & Optical devices:
• MEMS devices - Pressure Sensors, Accelerometers, Microfluidics
• Vacuum encapsulation (absolute pressure, IR detectors…)
• 1st Level Packaging to isolate package induced stresses.
• Wafer scale Packaging – MEMS & IC
• III-Vs e.g. high performance LEDs bonded reflector - heat sink
• 3D Interconnects
• Temporary bonds for handle wafers (interlayer & direct)
• Advanced bonded substrates e.g. Si on Glass (SOG), GaAs on Si…
• Layer transfer - Smart cut
Front
End
Back
End
Bonded
Substrates FAB
WLP
3D Starting material Packaging & Int
Device construction
Wafer Bonding Machines & Services
www.aml.co.uk MEMS, IC, III-Vs….
Manual Load
Fully
automatic
Robot Wafer
Load
Fully
automatic
Wafer Bonding Machines & Services
www.aml.co.uk MEMS, IC, III-Vs….
BONDCENTRE Wafer bonding services to the MNT community:
Wafer Bonding Machines & Services
www.aml.co.uk MEMS, IC, III-Vs….
BONDCENTRE SERVICES OFFERED
• Development of Wafer Bonding & associated Processes e.g. for many novel materials; silicon, glass, sapphire, strained silicon, InP, GaAs,…>25 years MEMS experience
• Wafer Bonding process selection & design for your application
• Commercial Wafer Bonding Service prototype to production & products e.g substrates
• Wafer Bonding Technology Transfer (inc Equipment) & Training
• Associated Processes (Pre & Post Bond)
• Applications knowledge for:
MEMS Smart cut layer transfer
Advanced Substrates Wafer Level Packaging
3D integration Vacuum Encapsulation
Temporary Bonding LEDs
Recognised experts & Funded by UK Government to provide services to Industry
Wafer Bonding Machines & Services
www.aml.co.uk MEMS, IC, III-Vs….
• WAFER ALIGNER BONDERS 4 machines in Class 10
• Wafer METROLOGY; AFM, Ra, PROFILE, TTV
• WAFER CLEANING MEGASONIC & Activation
• NEW ‘RAD’ dry ACTIVATION
• INSPECTION: ACOUSTIC MICROSCOPE (SAM) & IR
• ELECTROPLATING: e.g. VIAS in Au, In, Cu & Ni
• SCREEN PRINT - GLASS FRIT/ADHESIVE
• Structuring e.g. Holes via POWDER BLASTING
• CMP
Also access via long term collaboration with CMF @ Rutherford to: • PHOTOLITHOGRAPHY DEPOSITION- PVD & CVD & FURNACES
• Standard ETCHING – DRY & WET
• WAFER SAW WIRE & BUMP BONDING
• METROLOGY: THIN FILM, LINE WIDTH, SEM
Pre & Post Bonding Services & Equipment
Wafer Bonding Machines & Services
www.aml.co.uk MEMS, IC, III-Vs….
There are many wafer bonding processes, different
material combinations and methods of bonding..
Summary
• MEMS design & fabrication history
• Changed direction ~ 12 years ago to
exclusively focus on manufacturing
Aligned Wafer Bonding machines &
providing wafer bonding services
• Wafer bonding machines are supported
with extensive wafer bonding process
knowledge via BONDCENTRE
Wafer Bonding Machines & Services
www.aml.co.uk MEMS, IC, III-Vs….
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